JP2013102016A - 部品実装装置 - Google Patents
部品実装装置 Download PDFInfo
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- JP2013102016A JP2013102016A JP2011244231A JP2011244231A JP2013102016A JP 2013102016 A JP2013102016 A JP 2013102016A JP 2011244231 A JP2011244231 A JP 2011244231A JP 2011244231 A JP2011244231 A JP 2011244231A JP 2013102016 A JP2013102016 A JP 2013102016A
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- 230000002093 peripheral effect Effects 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 85
- 238000004904 shortening Methods 0.000 abstract description 5
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 230000002452 interceptive effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000011143 downstream manufacturing Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】ノズル20aにより吸着した部品4を上下反転させる反転ヘッド20が、昇降自在な移動ベース21dに設けられた平板状の基部31、この基部31に設けられた複数のベアリング32によって弧状の外周面41aが支持されて水平面内での揺動が自在なノズルホルダ支持部材33及びこのノズルホルダ支持部材33によって水平軸CX回りに回転自在に支持されて側面にノズル20aを保持したノズルホルダ34を有して成る。
【選択図】図3
Description
2 基板
3 電極部(部品装着対象部位)
4 部品
14 基板位置決め部
20 反転ヘッド
20a ノズル
21d 移動ベース(移動部材)
23 装着ヘッド
31 基部
32 ベアリング
33 ノズルホルダ支持部材
34 ノズルホルダ
41a 弧状の外周面
51 ノズルベース
53 ノズル係止部材
54 固定部材
72 ノズルベース内真空路(真空路)
86 回転駆動部
94 揺動駆動部
CX 水平軸
Claims (2)
- 基板の位置決めを行う基板位置決め部と、
部品供給位置に供給された部品をノズルにより上方から吸着して上下反転させ、その上下反転させた部品を基板位置決め部により位置決めされた基板上の部品装着対象部位の上方に移動させる反転ヘッドと、
前記部品装着対象部位の上方に移動された部品を反転ヘッドから受け取り、反転ヘッドが前記部品装着対象部位の上方から退去した後に部品を下降させて前記部品装着対象部位に装着する装着ヘッドとを備えた部品実装装置であって、
反転ヘッドは、
昇降自在な移動部材に設けられた平板状の基部と、
前記基部に設けられた複数のベアリングにより弧状の外周面が支持されて前記基部に対する水平面内での揺動が自在なノズルホルダ支持部材と、
前記ノズルホルダ支持部材に両端が支持されて水平方向に延び、水平軸回りの回転が自在であるとともに側面に前記ノズルを保持したノズルホルダと、
前記ノズルホルダを水平軸回りに回転させて前記ノズルの向きを上下に切り替える回転駆動部と、
前記ノズルホルダ支持部材を前記基部に対して水平面内で揺動させて上方又は下方に向けた前記ノズルの水平面内での向きを変化させる揺動駆動部とを備えたことを特徴とする部品実装装置。 - 前記ノズルホルダは、
前記ノズルホルダ支持部材に両端が支持されて水平方向に延び、内部に真空路が形成されたノズルベースと、
前記ノズルを前記ノズルベースの前記側面に係止して前記ノズルと前記ノズルベース内の前記真空路とを連通させるノズル係止部材と、
前記ノズルベースの両端部の外方から前記ノズルベースの両端部にスライド装着されて前記ノズル係止部材を前記ノズルベースに固定する一対の固定部材とを備えたことを特徴とする請求項1に記載の部品実装装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011244231A JP5845409B2 (ja) | 2011-11-08 | 2011-11-08 | 部品実装装置 |
US13/990,810 US9357685B2 (en) | 2011-11-08 | 2012-09-11 | Component mounting apparatus |
PCT/JP2012/005764 WO2013069182A1 (ja) | 2011-11-08 | 2012-09-11 | 部品実装装置 |
KR1020137017029A KR20140086923A (ko) | 2011-11-08 | 2012-09-11 | 부품 실장 장치 |
CN201280004453.0A CN103283317B (zh) | 2011-11-08 | 2012-09-11 | 元件安装设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011244231A JP5845409B2 (ja) | 2011-11-08 | 2011-11-08 | 部品実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013102016A true JP2013102016A (ja) | 2013-05-23 |
JP5845409B2 JP5845409B2 (ja) | 2016-01-20 |
Family
ID=48288959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011244231A Active JP5845409B2 (ja) | 2011-11-08 | 2011-11-08 | 部品実装装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9357685B2 (ja) |
JP (1) | JP5845409B2 (ja) |
KR (1) | KR20140086923A (ja) |
CN (1) | CN103283317B (ja) |
WO (1) | WO2013069182A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021158204A (ja) * | 2020-03-26 | 2021-10-07 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014118610A1 (de) * | 2014-12-15 | 2016-07-21 | Endress + Hauser Gmbh + Co. Kg | Bauteilversorgungsstation für einen Bestückungsautomaten |
CN110842496B (zh) * | 2018-08-21 | 2021-08-27 | 鸿富锦精密电子(天津)有限公司 | 安装装置 |
CN115674120B (zh) * | 2022-10-13 | 2024-05-17 | 中国航发四川燃气涡轮研究院 | 位移机构水平装配工装车 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001156497A (ja) * | 1999-11-29 | 2001-06-08 | Sanyo Electric Co Ltd | 部品実装装置 |
JP2001210994A (ja) * | 2000-01-27 | 2001-08-03 | Sanyo Electric Co Ltd | 電子部品装着装置 |
JP2002329752A (ja) * | 2002-04-30 | 2002-11-15 | Matsushita Electric Ind Co Ltd | 電子部品のボンディング装置 |
WO2004051731A1 (ja) * | 2002-12-02 | 2004-06-17 | Matsushita Electric Industrial Co., Ltd. | 部品供給ヘッド装置、部品供給装置、部品実装装置、及び実装ヘッド部の移動方法 |
JP2005347321A (ja) * | 2004-05-31 | 2005-12-15 | Yamaha Motor Co Ltd | 部品供給装置およびそれを備えた実装機 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000068327A (ja) | 1998-08-20 | 2000-03-03 | Matsushita Electric Ind Co Ltd | 部品の実装方法と装置 |
CN1228673A (zh) * | 1998-12-28 | 1999-09-15 | 四川长虹电子集团公司 | 卧式元件的插件方法和专用于该方法的自动插件机的插件头 |
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2011
- 2011-11-08 JP JP2011244231A patent/JP5845409B2/ja active Active
-
2012
- 2012-09-11 US US13/990,810 patent/US9357685B2/en active Active
- 2012-09-11 KR KR1020137017029A patent/KR20140086923A/ko not_active Application Discontinuation
- 2012-09-11 CN CN201280004453.0A patent/CN103283317B/zh active Active
- 2012-09-11 WO PCT/JP2012/005764 patent/WO2013069182A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001156497A (ja) * | 1999-11-29 | 2001-06-08 | Sanyo Electric Co Ltd | 部品実装装置 |
JP2001210994A (ja) * | 2000-01-27 | 2001-08-03 | Sanyo Electric Co Ltd | 電子部品装着装置 |
JP2002329752A (ja) * | 2002-04-30 | 2002-11-15 | Matsushita Electric Ind Co Ltd | 電子部品のボンディング装置 |
WO2004051731A1 (ja) * | 2002-12-02 | 2004-06-17 | Matsushita Electric Industrial Co., Ltd. | 部品供給ヘッド装置、部品供給装置、部品実装装置、及び実装ヘッド部の移動方法 |
JP2005347321A (ja) * | 2004-05-31 | 2005-12-15 | Yamaha Motor Co Ltd | 部品供給装置およびそれを備えた実装機 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021158204A (ja) * | 2020-03-26 | 2021-10-07 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
JP7451259B2 (ja) | 2020-03-26 | 2024-03-18 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
Also Published As
Publication number | Publication date |
---|---|
CN103283317A (zh) | 2013-09-04 |
WO2013069182A1 (ja) | 2013-05-16 |
US20140068928A1 (en) | 2014-03-13 |
US9357685B2 (en) | 2016-05-31 |
CN103283317B (zh) | 2016-09-07 |
KR20140086923A (ko) | 2014-07-08 |
JP5845409B2 (ja) | 2016-01-20 |
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