JP2013070312A - Vibration device and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration device capable of avoiding a contact between an electrode of an electronic element and a joint member of an exterior member, and suppressing the degradation of fixing strength of the electronic element.SOLUTION: A crystal vibrator 1 includes: a crystal vibration piece 10; a thermistor 20 having electrodes 21 and 22 at both ends; and a package base 31 mounted with the crystal vibration piece 10 on a first main surface 33 side, and housing the thermistor 20 in a second recessed portion 36 provided on a second main surface 35. At four corners on the second main surface 35 side of the package base 31, electrode terminals 37a-37d connected with the crystal vibration piece 10 or the thermistor 20 are respectively provided. The thermistor 20 is disposed so as to make a longitudinal direction thereof intersect a longitudinal direction of the package base 31. A distance L1 between the electrode terminal 37a (37c) and the electrode terminal 37b (37d) adjacent to each other which are provided in a lateral direction of the package base 31 is longer than a length L2 in a direction connecting the electrodes 21 and 22 of the thermistor 20.

Description

  The present invention relates to a vibration device and an electronic apparatus including the vibration device.

Conventionally, as a vibration device, a concave portion is provided on the outer bottom surface of a package containing a piezoelectric vibrator (hereinafter referred to as a piezoelectric vibrating piece), a chip-type electronic component is mounted in the concave portion, a chip-type electronic component, and a piezoelectric A piezoelectric device configured by electrically connecting a resonator element and an electrode terminal of a package with a conductive pattern is known (see, for example, Patent Document 1 and Patent Document 2).
Also known is a piezoelectric oscillator having a structure in which a resin is filled in a second concave portion corresponding to the concave portion in which an integrated circuit element corresponding to the chip-type electronic component is mounted (see, for example, Patent Document 3). ).

Japanese Patent Laid-Open No. 10-322129 Japanese Patent Laid-Open No. 11-145768 JP 2008-263564 A

For example, the piezoelectric devices of Patent Documents 1 and 2 are provided with electrode terminals at each of the four corners of the outer bottom surface of the package for mounting on an external member such as a wiring board.
In recent years, vibration devices represented by the above-described piezoelectric devices, piezoelectric oscillators, and the like have been reduced in size and thickness, and each component is laid out with a sufficient space.

For this reason, the piezoelectric devices disclosed in Patent Documents 1 and 2 join the electrode terminal and the external member due to positional displacement when mounted on the external member. For example, the bonding member such as solder is a chip-type electronic device. There is a risk of contact with an electrode of a component (hereinafter referred to as an electronic element).
As a result, in the piezoelectric devices of Patent Documents 1 and 2, there is a possibility that the electronic element and the electrode terminal that is originally not connected to the electronic element among the electrode terminals are short-circuited via the bonding member.

As a measure for avoiding this, for example, as in the piezoelectric oscillator of the above-mentioned Patent Document 3, a resin is filled in a second concave portion (concave portion) in which an integrated circuit element (hereinafter referred to as an electronic element) is mounted. A configuration that covers the electronic element and prevents contact between the electronic element and the bonding member is conceivable.
However, with this measure, the performance of the electronic device deteriorates due to the problem that it becomes difficult to replace the electronic device, and the generation of thermal stress due to a change in ambient temperature caused by the difference in thermal expansion coefficient between the electronic device and the resin. For example, when the electronic element is a temperature-sensitive element, there is a problem that the sensitivity to changes in the surrounding temperature decreases due to a delay in heat conduction caused by the thermal conductivity of the resin.

  Further, in the piezoelectric devices disclosed in Patent Documents 1 and 2, since the longitudinal direction of the electronic element is along the longitudinal direction of the package in the embodiment, the fixing strength (bonding strength) of the electronic element is reduced due to the warping of the package. There is a fear.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A vibration device according to this application example includes a vibration piece, an electronic element having a pair of electrodes at both ends, the vibration piece mounted on the first main surface side, and the opposite side of the first main surface. The electronic element is housed in a concave housing portion provided on the second main surface, and a container body having a rectangular outer shape on the second main surface is provided on the second main surface side of the container body. Each corner is provided with an electrode terminal connected to the vibrating piece or the electronic element, and the electronic element is arranged so that the longitudinal direction intersects the longitudinal direction of the container body, and the short side of the container body is provided. A distance between the adjacent electrode terminals provided along the hand direction is longer than a length in a direction connecting the pair of electrodes of the electronic element.

According to this, in the vibration device, the distance between the electrode terminals adjacent to each other provided along the short direction (the direction orthogonal to the longitudinal direction) of the container body (corresponding to the main body of the package) is Since it is longer than the length in the direction connecting the pair of electrodes of the electronic element, the electrode of the electronic element due to the displacement of the vibration device at the time of mounting without filling the resin like the piezoelectric oscillator of Patent Document 3 described above Contact with a joining member such as solder on the electrode terminal joining surface (land) of the external member can be avoided.
As a result, the vibrating device can avoid a short circuit through the joining member between the electronic element and the electrode terminal that is originally not connected to the electronic element among the electrode terminals.
In addition, since the vibration device is arranged so that the longitudinal direction of the electronic element intersects the longitudinal direction of the container body, the electronic device is fixed to the warp of the container body (which tends to have a large warp in the longitudinal direction). A decrease in strength (bonding strength) can be suppressed.

  [Application Example 2] In the vibration device according to the application example, three of the four electrode terminals provided at the four corners are cut at the corners on the storage unit side in a chamfered shape. It is preferable.

According to this, since the corner part by the side of the storage part of three electrode terminals of the four electrode terminals is cut in a chamfered shape, the vibration device further increases the distance from the electrode of the electronic element to the electrode terminal. can do.
In addition, in the vibrating device, the corner of one of the four electrode terminals is not cut, so that it becomes possible to identify the reference electrode terminal at the time of mounting or the like.

  Application Example 3 In the vibration device according to the application example described above, the first main surface side is hermetically sealed with a metal lid that covers the vibration piece, and the two electrodes connected to the electronic element One of the terminals is preferably electrically connected to the lid.

  According to this, the vibration device is hermetically sealed on the first main surface side by the metal lid that covers the resonator element, and one of the two electrode terminals connected to the electronic element is electrically connected to the lid. Therefore, the shielding property can be improved.

  Application Example 4 In the vibrating device according to the application example described above, it is preferable that the electrode terminal electrically connected to the lid body is a ground terminal.

  According to this, since the electrode terminal electrically connected to the lid body is the ground terminal (synonymous with the GND terminal), the vibrating device can further improve the shielding performance.

  Application Example 5 In the vibration device according to the application example, it is preferable that the electronic element is a thermistor.

  According to this, since the electronic device is a thermistor, the vibration device can accurately detect the temperature of the vibration piece by the thermistor housed in the container body on which the vibration piece is mounted.

  Application Example 6 An electronic apparatus according to this application example includes the vibration device according to any one of the application examples.

  According to this, since the electronic apparatus of this configuration includes the vibration device according to any one of the application examples, it is possible to provide an electronic apparatus that exhibits the effect according to any of the application examples.

  Application Example 7 In the electronic device according to the application example described above, it is preferable that the electronic device includes an oscillation circuit that drives the vibration piece and a temperature compensation circuit that corrects a frequency variation caused by a temperature change of the vibration piece.

  According to this, since the electronic device of this configuration includes the oscillation circuit that drives the resonator element and the temperature compensation circuit that corrects the frequency variation caused by the temperature change of the resonator element, the resonance frequency at which the oscillation circuit oscillates is reduced. Temperature compensation can be performed, and an electronic device having excellent temperature characteristics can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows schematic structure of the crystal oscillator of 1st Embodiment, (a) is the top view seen from the lid (lid body) side, (b) is the AA line of (a). It is sectional drawing, (c) is the top view seen from the bottom face side. It is a schematic diagram which shows schematic structure of the crystal oscillator of the modification 1, (a) is a top view seen from the lid side, (b) is sectional drawing in the AA of (a), (C) is the top view seen from the bottom face side. It is a schematic diagram which shows schematic structure of the crystal oscillator of the modification 2, (a) is a top view seen from the lid side, (b) is sectional drawing in the AA of (a), (C) is the top view seen from the bottom face side. The model perspective view which shows the mobile telephone of 2nd Embodiment.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings.

(First embodiment)
First, a crystal resonator as an example of a vibrating device will be described.
FIG. 1 is a schematic diagram illustrating a schematic configuration of the crystal resonator according to the first embodiment. 1A is a plan view seen from the lid (lid) side, and FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A, and FIG. These are the top views seen from the bottom face side. In FIG. 1A, the lid is omitted. In addition, for easy understanding, the dimensional ratio of each component is different from the actual one.

  As shown in FIG. 1, a crystal resonator 1 includes a crystal vibrating piece 10 as a vibrating piece, a thermistor 20 functioning as a temperature sensor (temperature sensing element) as an electronic element, a crystal vibrating piece 10 and a thermistor 20. And a package 30 as a container in which is mounted (stored).

The quartz crystal resonator element 10 is, for example, an AT cut type cut out from a rough crystal or the like at a predetermined angle, and has a planar shape formed in a substantially rectangular shape. It has the connected base 12 integrally.
The quartz crystal resonator element 10 has a base 12 formed with lead electrodes 15 a and 16 a drawn from substantially rectangular excitation electrodes 15 and 16 formed on one main surface 13 and the other main surface 14 of the vibration portion 11. Yes.
The lead electrode 15 a is drawn from the excitation electrode 15 on one main surface 13 to the base portion 12 along the longitudinal direction (left and right direction on the paper surface) of the crystal vibrating piece 10, and to the other main surface 14 along the side surface of the base portion 12. It wraps around and extends to the vicinity of the excitation electrode 16 on the other main surface 14.
The lead electrode 16 a is drawn from the excitation electrode 16 on the other main surface 14 to the base portion 12 along the longitudinal direction of the quartz crystal vibrating piece 10, wraps around one main surface 13 along the side surface of the base portion 12, and The surface 13 extends to the vicinity of the excitation electrode 15.
The excitation electrodes 15 and 16 and the extraction electrodes 15a and 16a are, for example, metal films having a structure in which Cr is a base layer and Au is laminated thereon.

The thermistor 20 is, for example, a chip-type (rectangular shape) temperature sensing element (temperature sensing resistance element), and has a pair of electrodes 21 and 22 at both ends in the longitudinal direction, and has an electric resistance against temperature changes. It is a resistor with great change.
As the thermistor 20, for example, a thermistor called an NTC (Negative Temperature Coefficient) thermistor whose resistance decreases with increasing temperature is used. NTC thermistors are frequently used as temperature sensors because the change in resistance value is proportional to the change in temperature.
The thermistor 20 is housed in a package 30 and detects the temperature in the vicinity of the quartz crystal vibrating piece 10, thereby serving as a temperature sensor that contributes to correction of frequency fluctuations associated with the temperature change of the quartz crystal vibrating piece 10.

The package 30 includes a package base 31 as a substantially flat container body having a substantially rectangular planar shape and a lid 32 as a flat lid body that covers one side of the package base 31, and has a substantially rectangular parallelepiped shape. It is configured.
The package base 31 is made of an aluminum oxide sintered body, crystal, glass, silicon (high resistance silicon), etc., which are formed by stacking and firing ceramic green sheets.
The lid 32 is made of the same material as the package base 31 or a metal such as Kovar, 42 alloy, stainless steel.

The first main surface 33, which is the main surface on one side of the package base 31, is provided with a first recess 34 in which the crystal vibrating piece 10 is mounted, and the other main surface on the opposite side of the first main surface 33. A certain second main surface 35 is provided with a second concave portion 36 as a concave storage portion in which the thermistor 20 is stored.
The first recess 34 and the second recess 36 have a substantially rectangular planar shape, and are provided at substantially central portions of the first main surface 33 and the second main surface 35, respectively. In the crystal unit 1, the package 30 is reduced in size by providing the first recess 34 and the second recess 36 of the package base 31 so as to overlap in a plan view.

Internal terminals 34 b and 34 c are provided on the bottom surface 34 a of the first recess 34 of the package base 31 at positions facing the extraction electrodes 15 a and 16 a of the crystal vibrating piece 10.
In the quartz crystal resonator element 10, the lead electrodes 15 a and 16 a are joined to the internal terminals 34 b and 34 c via a conductive adhesive 40 such as epoxy, silicone, or polyimide that is mixed with a conductive material such as a metal filler. Has been. As a result, the quartz crystal vibrating piece 10 is mounted in the first recess 34 on the first main surface 33 side.

In the crystal resonator 1, the first concave portion 34 of the package base 31 is covered with the lid 32 in a state where the crystal resonator element 10 is bonded to the internal terminals 34 b and 34 c of the package base 31, and the package base 31 and the lid 32 are separated from each other. The first recess 34 of the package base 31 is hermetically sealed by bonding with a bonding member 38 such as a seam ring, low-melting glass, or adhesive.
Note that the hermetically sealed first recess 34 of the package base 31 is in a vacuum state (high vacuum state) or in a state filled with an inert gas such as nitrogen, helium, or argon. Yes.

Electrode pads 36 b and 36 c are provided at positions facing the electrodes 21 and 22 of the thermistor 20 on the bottom surface 36 a of the second recess 36 of the package base 31.
In the thermistor 20, the electrodes 21 and 22 are joined to electrode pads 36b and 36c via a joining member 41 such as solder. As a result, the thermistor 20 is housed in the second recess 36.
Here, the thermistor 20 has a longitudinal direction (here, a direction connecting the electrode 21 and the electrode 22) intersecting with a longitudinal direction (left and right direction on the paper surface) of the package base 31 (here, orthogonal). Has been placed.

Rectangular electrode terminals 37a, 37b, 37c, and 37d are provided at the four corners of the second main surface 35 having a rectangular outer shape of the package base 31, respectively.
Among the four electrode terminals 37a to 37d, for example, the two electrode terminals 37b and 37d located at one diagonal are connected to the internal terminals 34b and 34c connected to the lead electrodes 15a and 16a of the quartz crystal vibrating piece 10, and the other The remaining two electrode terminals 37 a and 37 c located on the opposite side of the are connected to electrode pads 36 b and 36 c connected to the electrodes 21 and 22 of the thermistor 20.

Here, between the adjacent electrode terminals 37a and 37b provided along the short direction (direction orthogonal to the longitudinal direction) of the package base 31 (between the electrode terminal 37c and the electrode terminal 37d). Distance L1 is configured to be longer than the length L2 in the direction connecting the pair of electrodes 21 and 22 of the thermistor 20.
Note that the distance L1 is the outer end of the electrode pad 36b to which the thermistor 20 is joined (the end far from the electrode pad 36c) and the outer end of the electrode pad 36c (the side far from the electrode pad 36b). It is more preferable that it is configured to be longer than a distance L3 connecting the end part of the first part.

  The internal terminals 34b and 34c, the electrode pads 36b and 36c, and the electrode terminals 37a to 37d are made of, for example, a metal film obtained by laminating various films such as Ni and Au on a metallized layer such as W and Mo by plating.

In the crystal resonator 1, the crystal resonator element 10 is subjected to thickness-shear vibration by a drive signal applied from the outside via the electrode terminals 37 b and 37 d, the internal terminals 34 b and 34 c, the extraction electrodes 15 a and 16 a, and the excitation electrodes 15 and 16. Is resonated (oscillated) at a predetermined frequency.
In the crystal resonator 1, the thermistor 20 detects the temperature in the second recess 36 near the crystal resonator element 10 in the package base 31 as a temperature sensor, and outputs a detection signal via the electrode terminals 37 a and 37 c.

As described above, the crystal resonator 1 according to the present embodiment is provided between the electrode terminals 37a and 37b adjacent to each other provided along the short direction of the package base 31 (the electrode terminal 37c and the electrode terminal 37d). The distance L1 between the pair of electrodes 21 and 22 of the thermistor 20 is longer than the length L2 in the direction connecting the pair of thermistors 20, so that the resin such as the piezoelectric oscillator of Patent Document 3 described above is not filled. The contact between the electrodes 21 and 22 of the thermistor 20 and the bonding member such as solder on the electrode terminal bonding surface (land) of the external member due to the displacement of the crystal unit 1 during mounting can be avoided.
As a result, the crystal resonator 1 avoids a short circuit through the bonding member between the thermistor 20 and the electrode terminals 37b and 37d that are originally not connected to the thermistor 20 among the electrode terminals 37a to 37d. Can do.

  In addition, since the crystal unit 1 is arranged so that the longitudinal direction of the thermistor 20 is orthogonal to the longitudinal direction of the package base 31, the longitudinal direction of the thermistor 20 is along the longitudinal direction of the package base 31. It is possible to suppress a decrease in the fixing strength (bonding strength) of the thermistor 20 with respect to the warp of the package base 31 (prone to a large warp in the longitudinal direction).

  In addition, since the electronic element of the crystal resonator 1 is the thermistor 20, the thermistor 20 is disposed outside the package base 31 by the thermistor 20 housed in the package base 31 on which the crystal resonator element 10 is mounted. The temperature of the quartz crystal vibrating piece 10 can be detected more accurately than in the case where it is used.

The electrode terminal 37c has a conductive via (through hole filled with a metal or a conductive material) penetrating the package base 31, as indicated by a broken line in FIG. 1B or FIG. 3B described later. The electrical connection to the lid 32 by either a conductive electrode) or a conductive film formed in a castellation (recessed portion) (not shown) provided at the outer corner of the package base 31 provides a shielding property. It is preferable from the viewpoint of improvement.
Further, the crystal resonator 1 can further improve the shielding property by grounding the electrode terminal 37c as a ground terminal (GND terminal).

Next, a modification of the first embodiment will be described.
(Modification 1)
FIG. 2 is a schematic diagram showing a schematic configuration of the crystal resonator of the first modification. 2A is a plan view viewed from the lid side, FIG. 2B is a cross-sectional view taken along the line AA in FIG. 2A, and FIG. It is the top view seen from.
In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As illustrated in FIG. 2, the crystal resonator 2 according to the first modification differs from the first embodiment in the shapes of the electrode terminals 37 a to 37 d.
The crystal resonator 2 includes the four electrode terminals 37a to 37d provided at the four corners of the second main surface 35 of the package base 31, and the corners of the three electrode terminals 37a, 37b, and 37d on the second recess 36 side. Is cut into a chamfer. In addition, about the electrode terminal 37c connected to the electrode 22 of the thermistor 20, the corner | angular part by the side of the 2nd recessed part 36 is not given here.

According to this, since the crystal resonator 2 has the four electrode terminals 37a to 37d, the corners on the second recess 36 side of the three electrode terminals 37a, 37b, and 37d are cut into a chamfered shape. The distance from the electrodes 21 and 22 of the thermistor 20 to the electrode terminals 37a, 37b, and 37d can be made longer than in the first embodiment.
As a result, the crystal resonator 2 has a distance L1 substantially longer than that of the first embodiment on the side close to the thermistor 20 in the electrode terminals 37a to 37d. Contact between the electrodes 21 and 22 of the thermistor 20 and the bonding members on the electrode terminals (37a to 37d) of the external member can be reliably avoided.

In addition, the crystal resonator 2 has a reference electrode terminal (for mounting) or the like because the corner on the second recess 36 side of one electrode terminal 37c of the four electrode terminals 37a to 37d is not cut. Here, identification of 37c) is possible.
Note that the cut amounts of the corner portions of the electrode terminals 37a, 37b, and 37d are appropriately set according to the required fixing strength (bonding strength) of the crystal resonator 2. Further, the cutting of the corners of the electrode terminals 37a, 37b, and 37d can be applied to Modification 2 described later.

(Modification 2)
FIG. 3 is a schematic diagram showing a schematic configuration of the crystal resonator of the second modification. 3A is a plan view seen from the lid side, FIG. 3B is a cross-sectional view taken along line AA in FIG. 3A, and FIG. It is the top view seen from.
In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 3, the crystal resonator 3 of Modification 2 is different from the first embodiment in the configuration on the first main surface 133 side of the package 130.
In the crystal resonator 3, the first main surface 133 of the package base 131 is a flat surface without a recess, and internal terminals 34 b and 34 c for mounting the crystal vibrating piece 10 are provided on the first main surface 133. .

In the crystal resonator 3, the first main surface 133 side of the package base 131 is hermetically sealed by a lid 132 as a metal lid that covers the crystal resonator element 10. The lid 132 is made of a metal such as Kovar, 42 alloy, stainless steel or the like, and is formed in a cap shape having a collar portion 132a provided on the entire circumference.
In the crystal resonator 3, an internal space in which the crystal resonator element 10 can vibrate is secured by the swelling of the cap portion of the lid 132.
The lid 132 is joined to the first main surface 133 of the package base 131 through a conductive joining member 138 such as a seam ring, a brazing material, and a conductive adhesive.
In the crystal resonator 3, the internal space is in a vacuum state (high vacuum state) or a state filled with an inert gas such as nitrogen, helium, or argon, as in the first embodiment. .

The crystal resonator 3 has an internal structure in which one electrode terminal 37c of two electrode terminals 37a and 37c connected to the thermistor 20 among the four electrode terminals 37a to 37d extends from the electrode pad 36c of the package base 131. It is electrically connected to the lid 132 through the wiring 36e, conductive vias (through holes filled with a conductive member) 131a and 131b, and a conductive bonding member 138.
The electrode terminal 37c is connected to the electrode 22 on the ground side (GND side) of the thermistor 20 and serves as a ground terminal (GND terminal).

As described above, the crystal resonator 3 is hermetically sealed with the metal lid 132 that covers the crystal vibrating piece 10 on the first main surface 133 side, and the two electrode terminals 37 a and 37 c connected to the thermistor 20. Since one electrode terminal 37c is electrically connected to the lid 132, the shielding property can be improved.
Further, in the crystal resonator 3, the electrode terminal 37c electrically connected to the lid 132 is a ground terminal (GND terminal), so that the shielding property can be further improved.
The configuration on the first main surface 133 side of the crystal unit 3 can also be applied to the first modification.

(Second Embodiment)
Next, a mobile phone will be described as an example of an electronic device including the above-described crystal resonator.
FIG. 4 is a schematic perspective view showing the mobile phone of the second embodiment.
A cellular phone 700 is a cellular phone provided with the crystal resonators of the first embodiment and each modification.
A cellular phone 700 illustrated in FIG. 4 uses the above-described crystal resonator (any one of 1 to 3) as a timing device such as a reference clock oscillation source, and further includes a liquid crystal display device 701, a plurality of operation buttons 702, and a reception. A mouth 703 and a mouthpiece 704 are provided. The form of the mobile phone is not limited to the illustrated type, and may be a so-called smartphone type.

  The vibration device such as the above-described crystal resonator (crystal oscillator) is not limited to the above mobile phone, but an electronic book, a personal computer, a television, a digital still camera, a video camera, a video recorder, a navigation device, a pager, an electronic notebook, a calculator, Provided is an electronic device that can be suitably used as a timing device such as a word processor, a workstation, a videophone, a POS terminal, or a device equipped with a touch panel, and in any case provides the effects described in the above embodiment and each modification. can do.

Note that an electronic device typified by the mobile phone 700 corrects the oscillation circuit that drives the crystal resonator element 10 of the crystal resonator (any one of 1 to 3) and the frequency variation caused by the temperature change of the crystal resonator element 10. And a temperature compensation circuit.
According to this, an electronic device typified by the mobile phone 700 includes an oscillation circuit that drives the crystal vibrating piece 10 and a temperature compensation circuit that corrects a frequency variation caused by a temperature change of the crystal vibrating piece 10. Therefore, it is possible to provide temperature compensation for the resonance frequency at which the oscillation circuit oscillates, and to provide an electronic device having excellent temperature characteristics.

The shape of the resonator element is not limited to the flat plate type shown in the figure, but the central part is thick and the peripheral part is thin (convex type, bevel type, mesa type). Conversely, the central part is thin and the peripheral part is thin. A thick type (reverse mesa type) may be used.
The material of the resonator element is not limited to quartz, but lithium tantalate (LiTaO ₃ ), lithium tetraborate (Li ₂ B ₄ O ₇ ), lithium niobate (LiNbO ₃ ), zirconate titanate A piezoelectric material such as lead acid (PZT), zinc oxide (ZnO), and aluminum nitride (AlN), or a semiconductor such as silicon (Si) may be used.
Further, the driving method of the thickness shear vibration may be electrostatic driving by Coulomb force in addition to the piezoelectric effect of the piezoelectric body.

  DESCRIPTION OF SYMBOLS 1, 2, 3 ... Crystal resonator as a vibrating device, 10 ... Quartz vibrating piece as a vibrating piece, 11 ... Vibrating part, 12 ... Base part, 13 ... One main surface, 14 ... Other main surface, 15, 16 ... Excitation electrodes, 15a, 16a ... Extraction electrodes, 20 ... Thermistors as electronic elements, 21,22 ... Electrodes, 30 ... Packages, 31 ... Package bases as containers, 32 ... Lids as lids, 33 ... No. DESCRIPTION OF SYMBOLS 1 Main surface, 34 ... 1st recessed part, 34a ... Bottom surface, 34b, 34c ... Internal terminal, 35 ... 2nd main surface, 36 ... 2nd recessed part, 36a ... Bottom surface, 36b, 36c ... Electrode pad, 36e ... Internal wiring, 37a, 37b, 37c, 37d ... electrode terminals, 38 ... bonding member, 40 ... conductive adhesive, 41 ... bonding member, 130 ... package, 131 ... package base, 131a, 131b ... conductive via, 132 Lid, 132a ... flange portion, 133 ... first main surface, 138 ... conductive bonding member, 700 ... mobile phone, 701 ... liquid crystal display device, 702 ... operation button, 703 ... earpiece, 704 ... mouthpiece.

Claims (7)

A vibrating piece,
An electronic device having a pair of electrodes at both ends;
The vibrating element is mounted on the first main surface side, the electronic element is stored in a concave storage portion provided on the second main surface opposite to the first main surface, and the outer shape of the second main surface is A rectangular container body,
In each of the four corners on the second main surface side of the container body, an electrode terminal connected to the vibrating piece or the electronic element is provided,
The electronic element is arranged such that the longitudinal direction intersects the longitudinal direction of the container body,
A vibration device characterized in that a distance between the adjacent electrode terminals provided along the short direction of the container body is longer than a length in a direction connecting the pair of electrodes of the electronic element. .   2. The vibrating device according to claim 1, wherein three of the four electrode terminals provided at the four corners have corner portions on the storage portion side cut into a chamfered shape. 3. Vibrating device. The vibrating device according to claim 1 or 2, wherein the first main surface side is hermetically sealed by a metal lid that covers the vibrating piece,
One of the two electrode terminals connected to the electronic element is electrically connected to the lid body.   The vibration device according to claim 3, wherein the electrode terminal electrically connected to the lid is a ground terminal.   5. The vibration device according to claim 1, wherein the electronic element is a thermistor. 6.   An electronic apparatus comprising the vibration device according to any one of claims 1 to 5. The electronic device according to claim 6, wherein an oscillation circuit that drives the resonator element;
A temperature compensation circuit that corrects a frequency variation associated with a temperature change of the resonator element;
An electronic device characterized by comprising:

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