JP2008085742A - Crystal oscillator, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a crystal oscillator capable of surely preventing a short-circuit between electrode terminals when conductively connecting an electronic element inside a package of the crystal oscillator, and to provide its manufacturing method. <P>SOLUTION: The crystal oscillator (50, 150, 250) comprises: an insulating substrate (51); a first metal pad and a second metal pad (11, 13) formed on the substrate and equal to the height of the electronic element (41, 43); and a conductive adhesive (31) inserted between the terminal of the electronic element and the first metal pad and the second metal pad for conductively connecting the electronic element mounted between the first metal pad and the second metal pad. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a crystal oscillator including a crystal resonator element disposed in a package, an electronic element that supplies power to the crystal resonator element, an electronic element that inputs vibration of the crystal resonator element, and a method of manufacturing the crystal oscillator.

  Conventionally, in a crystal oscillator manufacturing process, a crystal vibrating piece having various vibration modes, an electronic element for supplying power to the crystal vibrating piece, and an electronic element for inputting the vibration mode are fixed in a package.

  For example, a quartz crystal resonator element and an electronic element are accommodated in a rectangular box-shaped package made of ceramic, and the package is sealed with a lid from above. A plurality of electrode terminals are arranged on the inner bottom surface of the package. A large number of packages on which electrode terminals are formed are arranged side by side on a jig, and a conductive adhesive is applied onto the electrode terminals while moving the nozzle of the dispenser. Next, the electrode terminal of the crystal vibrating piece or the electrode terminal of the electronic element is superposed on the electrode terminal to join them together.

  However, with the recent miniaturization of electronic devices, the above-mentioned conventional crystal oscillator must also be miniaturized, the size of the electrode terminals is reduced, and the distance between the electrode terminals is becoming narrower. In the application method using the dispenser, when a conductive adhesive is applied on the electrode terminal provided in the package, it is difficult to accurately apply a predetermined amount of the conductive adhesive on the electrode terminal. Even if it can be applied on the electrode terminal, the conductive adhesive may protrude when the electrode terminal of the electronic element is pressed against the adjacent electrode terminal, causing a short circuit. It was.

On the other hand, the application amount of the conductive adhesive can be suppressed by reducing the diameter of the nozzle of the dispenser. However, if the nozzle diameter is reduced, the conductive adhesive may be deteriorated or the tip of the nozzle may be reduced. Since the injection pressure from the part becomes weak, the application amount may become unstable, resulting in poor adhesion.
JP 2005-260727 A

  Accordingly, an object of the present invention is to reliably prevent short-circuiting between electrode terminals when an electronic element is conductively connected in a crystal oscillator package in response to recent high integration and high frequency crystal resonators. An object of the present invention is to provide a crystal oscillator and a method for manufacturing the same.

A crystal oscillator having a crystal resonator and an electronic element according to a first aspect includes an insulating substrate, a first metal pad and a second metal pad which are formed on the substrate and have the same height as the electronic element, and terminals of the electronic element And a conductive adhesive inserted between the first metal pad and the second metal pad and conductively connecting the electronic device mounted between the first metal pad and the second metal pad.
According to the above configuration, the electronic element may be mounted between the first metal pad and the second metal pad, and the conductive adhesive may be applied between the terminal of the electronic element and the metal pad. The applied conductive adhesive does not spread laterally but flows down to the substrate along the first metal pad and the second metal pad. For this reason, the conductive adhesive does not protrude. If a small amount of conductive adhesive is applied from above, the electronic element will not be peeled off or displaced by some vibration.

In the crystal oscillator according to the second aspect, the first metal pad and the second metal pad are formed by repeatedly applying a refractory metal paste.
According to the above configuration, since the first metal pad and the second metal pad are formed by recoating the high melting point metal paste, it can be freely adjusted to an appropriate position according to the height (thickness) of the plurality of electronic elements. Metal pads can be formed.

A crystal oscillator according to a third aspect includes a first cavity in which a crystal resonator is disposed and a second cavity in which an electronic element is disposed.
According to the above configuration, since the crystal resonator and the electronic element are arranged in different cavities, the crystal resonator is not affected by the heat of the electronic element.

According to a fourth aspect of the present invention, there is provided a crystal oscillator manufacturing method comprising: a crystal oscillator manufacturing method for mounting a crystal resonator and an electronic element; an arrangement step of disposing an insulating substrate; and a metal paste on a flat substrate by a screen printing method. A step of forming the first metal pad and the second metal pad by printing at least twice, a mounting step of mounting the electronic element between the first metal pad and the second metal pad, and a terminal of the electronic element; And an applying step of applying a conductive adhesive that conductively connects the first metal pad and the second metal pad.
According to the above configuration, the electronic element may be mounted between the first metal pad and the second metal pad, and the insertion conductive adhesive may be applied between the terminal of the electronic element and the metal pad. The applied conductive adhesive does not spread laterally but flows down to the substrate along the first metal pad and the second metal pad. For this reason, a conductive adhesive does not short-circuit with other wiring.

In the manufacturing method of the crystal oscillator according to the fifth aspect, in the forming step, after applying the metal paste by the screen printing method, the metal paste is temporarily dried, and then the metal paste is further applied by the screen printing method.
According to the above configuration, the metal paste can be overcoated by screen printing in accordance with the height of the electronic element. For this reason, a metal pad can be freely formed according to the height (thickness) of a plurality of electronic elements.

According to the crystal oscillator manufacturing method of the sixth aspect, the metal paste is mixed with a thermoplastic resin or a temporarily dryable resin agent.
According to the said structure, when applying metal paste repeatedly, the time which dries the apply | coated metal paste can be shortened and productivity can be improved.

According to a seventh aspect of the crystal oscillator manufacturing method, the substrate is a rectangular ceramic insulating layer, and after forming the first metal pad and the second metal pad, the frame-shaped ceramic insulating layer, the rectangular ceramic insulating layer, And laminating and pressure-bonding and firing.
According to the above configuration, the screen printing method can apply the metal paste to the planar ceramic insulating layer. If a ceramic layer formed into a predetermined shape, for example, a rectangular shape, and a ceramic layer formed into a frame shape are laminated and pressed and sintered, a package having a cavity in which an electronic element can be mounted can be obtained.

In addition, the crystal oscillator manufacturing method according to the eighth aspect includes a second mounting step for mounting the crystal resonator and a sealing step for sealing the crystal resonator.
According to the above configuration, the crystal unit can be blocked from outside air.

According to the present invention, an electronic element can be mounted in a crystal oscillator package while reliably preventing a short circuit.
Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Configuration of first crystal oscillator>
FIG. 1 is a view showing one surface-mount type first crystal oscillator 50 according to the embodiment. 1A is an external perspective view of the first crystal oscillator 50, FIG. 1B is a side view of the first crystal oscillator 50, and FIG. 1C is a bottom view in which the resin of the first crystal oscillator 50 is removed. It is.

  In FIG. 1, the first crystal oscillator 50 includes a substantially rectangular parallelepiped package 51 in which a concave cavity portion 58 on the front surface side is formed and a concave cavity portion 59 is also formed on the bottom surface side. The concave cavity 58 on the front side has a rectangular or tuning fork crystal resonator 20, and the crystal resonator 20 is bonded and fixed with a conductive adhesive 31. The concave cavity portion 59 on the bottom side includes an IC chip 41 and two chip-shaped electronic component elements 43 that constitute a control circuit. The IC chip 41 and the two electronic component elements 43 are made of a conductive adhesive 31. Bonded and fixed. The concave cavity portion 58 on the front surface side is sealed and fixed with a metal lid 61, and the concave cavity portion 59 on the bottom surface side is filled with a filling resin 66 (see FIG. 2B).

  The package 51 is configured by integrally laminating a substantially rectangular ceramic insulating layer 51b and frame-shaped ceramic insulating layers 51a and 51c having openings. The rectangular ceramic insulating layer 51b and the frame-shaped ceramic insulating layers 51a and 51c are manufactured by molding a tape-shaped ceramic material called a green sheet. The ceramic insulating layer 51b serves as a partition part that partitions the region in which the crystal resonator 20 is accommodated from the region in which the IC chip 41 and the chip-shaped electronic component element 43 are accommodated. Further, the ceramic insulating layers 51a and 51c are frame-shaped leg portions, whereby the surface-side recessed cavity portion 58 and the bottom-side recessed cavity portion surrounded by the partition portion and the frame-shaped leg portion. 59.

  The outer terminal electrodes 62 are formed at the corners of the ceramic insulating layer 51c of the frame-shaped leg portion. Although not shown in the drawing, terminal electrodes for controlling the operation of the IC chip 41 are formed on the side surfaces of the package 51 as necessary. The external terminal electrode 62 is formed by punching out fine holes called through holes from a green sheet and filling a metal paste.

  Further, two crystal electrode pads (not shown) for crystal resonators are formed in the concave cavity portion 58 on the surface side of the package 51, and the electrode terminals of the crystal resonator 20 are for crystal. The electrode pad is bonded and fixed with a conductive adhesive 31. Four IC chip electrode pads 11 for the IC chip 41 and four electronic component electrode pads 13 for the pair of electronic component elements 43 are formed inside the concave cavity portion 59 on the bottom surface side of the package 51. ing. Further, wiring patterns are formed for connection to the crystal electrode pads, the IC chip electrode pads 11, the electronic component electrode pads 13, the external terminal electrodes 62, and the like.

  Further, a wiring pattern for connecting the electrode pads 11 and 13 and the external terminal electrode 62 is formed between the ceramic layers 51a to 51c constituting the package 51 or in the thickness direction of the ceramic layers 51a to 51c.

  The IC chip 41 controls an oscillator, for example, and includes an amplifying unit, a temperature compensating unit, and a sensitive unit. Examples of the amplifying means include an amplifying inverter, and the temperature compensating means includes a computing means, a temperature compensation data storage means, a varicap diode, a load capacitor, a resistance means, and the like.

  An example of the electronic component element 43 is a capacitor. The capacitor that is the electronic component element 43 is connected, for example, between the IC chip 41 and the external terminal electrode 62 so that one is at the ground potential. This removes a DC component that becomes noise in the output signal. Further, a capacitor, which is another electronic component element 43, is connected between the IC chip 41 and the external terminal electrode 62, and removes high-frequency noise superimposed on the power supply voltage supplied to the external terminal electrode 62.

  The IC chip electrode pad 11 and the electronic component electrode pad 13 are formed at positions where the IC chip 41 and the electronic component element 43 just enter between the pads. These IC chip electrode pads 11 and electronic component electrode pads 13 are formed of a refractory metal paste 15 such as molybdenum or tungsten, and are equivalent to the height (thickness) of the IC chip 41 and electronic component element 43. It is served.

  The IC chip 41 is mounted between the four IC chip electrode pads 11 on the bottom surface of the concave cavity 59 of the package 51 with a chip mounter or the like. The two electronic component elements 43 are also mounted on the bottom surface of the concave cavity portion 59 of the package 51 with a chip mounter or the like between the two electronic component electrode pads 13. Then, the conductive adhesive 31 is bonded between the electrode on the surface of the IC chip 41 and the electrode pad 11 for the IC chip. In addition, the electrode on the surface of the electronic component element 43 is bonded to the electronic component electrode pad 13 via the conductive adhesive 31 containing Ag powder.

  The conductive adhesive 31 is cured and joined by applying and applying a conductive resin paste made of, for example, Ag powder, epoxy resin, phenol resin, or the like using a dispenser or the like, and thermosetting at about 150 ° C.

<Manufacturing process of crystal oscillator>
Next, a manufacturing method of the crystal oscillator 50 having the above-described configuration will be described with reference to FIGS. 2A and 2B. 2A and 2B show a method of applying the IC chip electrode pad 11 and the electronic component electrode pad 13 to the package 51 by screen printing.

  As shown in FIG. 2A (a), a substantially rectangular ceramic insulating layer 51b having a flat surface is first disposed. Next, a thin metal or plastic fiber screen mask 92 provided with an opening 95 is placed on the arranged rectangular ceramic insulating layer 51b. The openings 95 are formed in accordance with the positions and shapes of the individual IC chip electrode pads 11 and the electronic component electrode pads 13. A slight gap is formed between the back surface of the screen mask 92 and the contact surface of the rectangular ceramic insulating layer 51b to prevent rubbing of the refractory metal paste 15 such as molybdenum or tungsten after the screen printing is completed, and to conduct printing. The amount of the adhesive 32 can be finely adjusted.

  Next, as shown in FIG. 2A (b), an appropriate amount of the refractory metal paste 15 is placed on the end of the screen mask 92, and the squeegee 96 is used to uniformly extend the refractory metal paste 15 to form a rectangular ceramic insulating layer 51b. The high melting point metal paste 15 is formed at the positions of the IC chip electrode pads 11 and the electronic component electrode pads 13. The refractory metal paste 15 constitutes an IC chip electrode pad 11 and an electronic component electrode pad 13. However, a single screen printing method does not reach the height (thickness) of the IC chip 41 and the electronic component element 43. Therefore, in the present embodiment, after the application to the surface of the rectangular ceramic insulating layer 51b, the applied refractory metal paste 15 is temporarily dried.

  Then, as shown in FIG. 2A (c), the refractory metal paste 15 is applied again with the squeegee 96. This process is repeated about 2 to 7 times until the height of the IC chip 41 and the electronic component element 43 is reached. In order to perform these steps quickly, it is possible to shorten the drying time by using the refractory metal paste 15 mixed with a thermoplastic resin or a resin agent that can be temporarily dried. After the series of screen printing steps is completed, the screen mask 92 is taken out from the rectangular ceramic insulating layer 51b.

  Next, as shown in FIG. 2A (d), ceramic insulating layers 51a and 51c are stacked on a rectangular ceramic insulating layer 51b that has undergone a screen printing process. The ceramic insulating layers 51a and 51c are formed according to the wiring pattern. The through hole is formed and filled with a high melting point metal paste such as molybdenum or tungsten, and at the same time, various electrode pads, terminal electrodes, and a conductor film to be a wiring pattern are formed on the surface by printing the high melting point metal paste. Then, these ceramic insulating layers 51a, 51b, 51c are laminated and pressure-bonded, followed by firing treatment, after which each external terminal electrode 62 exposed on the surface of the package 51, the IC chip electrode pad 11, and the electronic component electrode. The package 51 is completed by applying Ni plating, flash gold plating, etc. to the pad 13 and various wiring patterns. That. That is, the external terminal electrodes 62, IC chip electrode pads 11 and the electronic component electrode pad 13 exposed on the surface of the package 51, will have been Au plated film.

  As shown in FIG. 2B (e), the IC chip electrode pad 11 and the electronic component electrode pad 13 are formed by the refractory metal paste 15 through the steps so far. The IC chip 41 is mounted between the IC chip electrode pads 11 and the bottom surface of the concave cavity 59 by a chip mounter or the like. Similarly, the electronic component element 43 is mounted between the two electronic component electrode pads 13 so as to reach the bottom surface of the recessed cavity portion 59.

  In FIG. 2B (f), the conductive adhesive 31 is applied between the IC chip 41 and the IC chip electrode pad 11 mounted in the concave cavity 59 from above using a dispenser. Further, a conductive adhesive 31 is applied between the electronic component element 43 and the electronic component electrode pad 13 from above. The applied conductive adhesive 31 flows down to the bottom surface of the recessed cavity portion 59 without spreading in the lateral direction. That is, the conductive adhesive 31 does not spread laterally and does not short-circuit with other electrodes. Moreover, since the application amount of the conductive adhesive 31 from the nozzle of the dispenser may be the same as before, it is not necessary to reduce the diameter of the nozzle of the dispenser. Even if only a small amount of the conductive adhesive 31 is applied and the adhesive strength is weak, the IC chip 41 is held between the IC chip electrode pads 11 and the electronic component element 43 is held between the electronic component electrode pads 13. Therefore, contact failure due to vibration or the like can be reliably prevented. The applied conductive adhesive 31 is thermally cured at about 150 degrees C. The conductive adhesive 31 may use an ultraviolet curable resin instead of a thermosetting resin.

  In FIG. 2B (g), the recessed cavity portion 59 is filled with a filling resin 66 in order to firmly bond the above-described IC chip 41 and electronic component element 43 and to improve moisture resistance reliability. ing. The filling resin 66 is made of, for example, at least two kinds of filling resins. For example, a resin layer that is mainly filled and cured on the bottom surface side of the recessed cavity portion 59 and a resin layer that is filled and cured on the resin layer. It is. Specifically, it is made of a resin material having a relatively high shrinkage rate that is filled and cured on the bottom surface side of the concave cavity portion 59. It is a material with many resin components, such as an epoxy resin generally called underfill resin. This resin layer is filled and cured to such an extent that at least the upper surface of the IC chip 41 is completely covered.

  That is, the bonding strength of the both is improved by the stress generated by the shrinkage of the resin layer filled between the IC chip 41, the electronic component element 43 and the bottom surface of the concave cavity portion 59. In addition, stress generated by contraction of the resin layer formed so as to completely cover the IC chip 41 is generated toward the IC chip 41. Thereby, the stress works so as to press from the upper surface side of the IC chip 41 to the bottom surface side of the recessed cavity portion 59, and the IC chip 41 bonded to the bottom surface of the recessed cavity portion 59 and the IC chip electrode pad 11. Bonding strength is improved.

  Further, the resin layer filled on the surface is filled and cured in view of fear that sufficient moisture resistance cannot be obtained only by the resin layer covering the IC chip 41 and the electronic component element 43. As a result, the bonding strength and moisture resistance reliability of the IC chip 41 and the electronic component element 43 mounted in the concave cavity portion 59 are improved. It is important to prevent the filling resin 66 from protruding from the opening surface of the recessed cavity portion 59. This is because the surface mount type first crystal oscillator 50 is stably disposed on the printed wiring board.

In FIG. 2B (h), the package 51 is turned over. Then, the conductive adhesive 31 is applied from above to the electrode portion for the crystal resonator formed in the concave cavity portion 58 on the front surface side using a dispenser. Then, the crystal unit 20 is pressed and joined by the mounter.
The crystal resonator 20 mounted on the surface side of the package 51 is hermetically sealed by a metal lid 61. The metal lid 61 is made of a metal material such as Kovar or 42 alloy, has a thickness of 0.1 mm, for example, and is welded to a frame-like seam ring brazed to the sealing conductor pattern on the surface of the package 51. Be joined.

  Note that the bonding of the crystal resonator 20 with the conductive adhesive 31 may be performed in the step of FIG. 2B (f) instead of the step of FIG. 2B (h). By doing so, it is possible to simultaneously perform heat curing or ultraviolet curing of the conductive adhesive 31 after application.

<Configuration of second crystal oscillator>
FIG. 3 is a view showing one surface-mount type second crystal oscillator 150 of the embodiment, and shows a state before the crystal resonator 20 is attached. 3A is an external perspective view of the second crystal oscillator 150, FIG. 3B is a side view of the second crystal oscillator 150 before the crystal resonator 20 is attached, and FIG. 3C is the second crystal oscillator 150. FIG. 6 is a side view after the crystal unit 20 is attached.

  In FIG. 3, the second crystal oscillator 150 has a substantially rectangular parallelepiped package 151 in which a concave cavity portion 158 on the surface side is formed. The second crystal oscillator 150 does not have a concave cavity on the bottom side. In addition, the same code | symbol is attached | subjected regarding the same components or the same member demonstrated in FIG.

  The package 151 is formed by integrally laminating a substantially rectangular ceramic insulating layer 151b, a frame-shaped ceramic insulating layer 151a having an opening, and a pedestal ceramic insulating layer 151c. The crystal resonator 20, the IC chip 41, and the chip-shaped electronic component element 43 are accommodated in the recessed cavity portion 158 formed by the frame-shaped ceramic insulating layer 151 a and the ceramic insulating layer 151 b. The ceramic insulating layer 151b has external terminal electrodes 62 formed at the corners. Although not shown in the drawing, terminal electrodes for controlling the operation of the IC chip 41 are formed on the side surfaces of the package 51 as necessary.

  In addition, two crystal electrode pads 163 for the crystal resonator are formed on the ceramic insulating layer 151c for the pedestal, and the electrode terminals of the crystal resonator 20 are bonded and fixed to the crystal electrode pad 163 with the conductive adhesive 31. Is done. In the recessed cavity portion 58 on the bottom surface of the ceramic insulating layer 151b, four IC chip electrode pads 11 for the IC chip 41 and two electronic component electrode pads 13 for the electronic component element 43 are formed. Yes. Further, wiring patterns are formed for connection to the crystal electrode pads 163, the IC chip electrode pads 11, the electronic component electrode pads 13, the external terminal electrodes 62, and the like.

  The crystal resonator 20, the IC chip 41, and the electronic component element 43 mounted on the surface side of the package 151 are hermetically sealed by a metal lid 61. The metal lid 61 is welded and joined to a frame-like seam ring brazed to the sealing conductor pattern on the surface of the package 151.

  The IC chip electrode pad 11 and the electronic component electrode pad 13 are formed by the steps described in FIGS. 2A (a) to 2A (d). That is, the IC chip electrode pad 11 and the electronic component electrode pad 13 are formed of a refractory metal paste 15 such as molybdenum or tungsten, and are equivalent to the height (thickness) of the IC chip 41 and the electronic component element 43. It is arranged to the extent by screen printing.

  In the first crystal oscillator 50 of FIG. 1, the crystal resonator 20, the IC chip 41, and the electronic component element 43 are arranged in separate cavities. Although the child 30 is not affected, the second crystal oscillator 150 shown in FIG. However, since the second crystal oscillator 150 does not need to have separate cavities, it can be a smaller crystal oscillator.

<Configuration of third crystal oscillator>
FIG. 4 is a view showing one surface-mount type third crystal oscillator 250 according to the embodiment. FIG. 4A is a top view of the third crystal oscillator 250 to which the tuning-fork type crystal resonator 20 is attached, with the metal lid 61 being removed. FIG. 4B is a sectional view taken along line BB in FIG.

  In FIG. 4, the third crystal oscillator 250 includes an upper package 251 having a substantially rectangular parallelepiped shape in which a recessed cavity portion 258 is formed. The third crystal oscillator 250 includes a lower package 252 having a substantially rectangular parallelepiped shape in which a concave cavity portion 259 is formed. In addition, the same code | symbol is attached | subjected regarding the same components or the same member demonstrated in FIG.

  The upper package 251 and the lower package 252 are each configured by being integrally laminated with a substantially rectangular ceramic insulating layer and a frame-shaped ceramic insulating layer having an opening. The upper package 251 accommodates the crystal resonator 20. The lower package 252 accommodates the IC chip 41 and the chip-shaped electronic component element 43. The upper package 251 has external terminal electrodes 262 at the corners. The lower package 252 has external terminal electrodes 264 formed at the corners. The external terminal electrode 264 extends so as to be connected to the external terminal electrode 262 of the upper package 251.

  In addition, in the recessed cavity portion 258 of the upper package 251, wiring patterns that are connected to the two crystal electrode pads 263 for the crystal resonator, the external terminal electrode 262, and the like are formed. Then, the electrode terminal of the crystal unit 20 is bonded and fixed to the crystal electrode pad 263 with the conductive adhesive 31. In the concave cavity portion 259 of the lower package 252, four IC chip electrode pads 11 for the IC chip 41 and two electronic component electrode pads 13 for the electronic component element 43 are formed. Wiring patterns for connecting the electrode pads 11, the electronic component electrode pads 13, and the external terminal electrodes 264 are formed.

  The external terminal electrode 262 of the upper package 251 and the external terminal electrode 264 of the lower package 252 are bonded and fixed with a conductive adhesive 231. Although not shown in the figure, an insulating adhesive is applied to several places so that the plus and minus electrodes do not short-circuit. The recessed cavity 259 of the lower package 252 is sealed with the conductive adhesive 231 and the insulating adhesive, and the bottom surface of the upper package 251. The concave cavity portion 258 of the upper package 251 is sealed with a metal lid 61.

  The IC chip electrode pad 11 and the electronic component electrode pad 13 formed in the lower package 252 are formed by the steps described in FIGS. 2A (a) to 2A (d). That is, the IC chip electrode pad 11 and the electronic component electrode pad 13 are formed of a refractory metal paste 15 such as molybdenum or tungsten, and are equivalent to the height (thickness) of the IC chip 41 and the electronic component element 43. It is arranged to the extent by screen printing.

  The present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the claims. For example, in the above embodiment, the screen printing method is used to cover the screen mask 92 with respect to one ceramic insulating layer 51, 151, 252. However, if a large screen mask 92 is prepared by arranging a plurality of ceramic insulating layers. The IC chip electrode pads 11 and the electronic component electrode pads 13 can be formed on a plurality of ceramic insulating layers at a time.

FIG. 6 is a diagram showing a first crystal oscillator 50. It is the figure explaining the manufacturing method of the crystal oscillator element for every process. It is the figure explaining the manufacturing method of the crystal oscillator element for every process. 2 is a diagram showing a second crystal oscillator 150. FIG. FIG. 6 is a diagram showing a third crystal oscillator 250.

Explanation of symbols

11 ... Electrode pad for IC chip,
DESCRIPTION OF SYMBOLS 13 ... Electrode pad 20 for electronic components ... Crystal oscillator 31 ... Conductive adhesive 41 ... IC chip 43 ... For electronic component elements 50, 150, 250 ... Crystal oscillators 51, 151, 251, 252 ... Packages 58, 59, 158 , 258, 259 ... cavity 61 ... metallic lid parts 62, 162, 262 ... external terminal electrode 92 ... screen mask

Claims (8)

In a crystal oscillator having a crystal resonator and an electronic element that outputs a signal to the crystal resonator or inputs vibration from the crystal resonator,
An insulating substrate;
A first metal pad and a second metal pad formed on the substrate and having a height equivalent to the height of the electronic element;
Conductive adhesion inserted between the terminal of the electronic element and the first metal pad and the second metal pad, and conductively connecting the electronic element mounted between the first metal pad and the second metal pad Agent,
A crystal oscillator comprising:   2. The crystal oscillator according to claim 1, wherein the first metal pad and the second metal pad are formed by repeatedly applying a refractory metal paste. A first cavity in which the crystal unit is disposed;
The crystal oscillator according to claim 1, further comprising a second cavity in which the electronic element is disposed. In a method for manufacturing a crystal oscillator in which a crystal resonator and an electronic element are mounted,
A placement step of placing an insulating substrate;
Forming a first metal pad and a second metal pad by printing a metal paste on the flat substrate by screen printing at least twice; and
A mounting step of mounting an electronic element between the first metal pad and the second metal pad;
A method of manufacturing a crystal oscillator, comprising: applying a conductive adhesive that conductively connects the terminal of the electronic element to the first metal pad and the second metal pad.   5. The crystal oscillator according to claim 4, wherein in the forming step, after applying a metal paste by a screen printing method, the metal paste is temporarily dried, and then the metal paste is further applied by a screen printing method. Production method.   6. The method for manufacturing a crystal oscillator according to claim 4, wherein the metal paste is mixed with a thermoplastic resin or a resin agent capable of being temporarily dried. The substrate is a rectangular ceramic insulating layer;
5. The method according to claim 4, further comprising a step of firing after forming the first metal pad and the second metal pad, laminating and pressing the frame-shaped ceramic insulating layer and the rectangular ceramic insulating layer. The manufacturing method of the crystal oscillator as described in any one of Claim 6. A second mounting step for mounting the crystal resonator;
The method for manufacturing a crystal oscillator according to claim 4, further comprising a sealing step for sealing the crystal resonator.