JP2013055165A5 - - Google Patents
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- Publication number
- JP2013055165A5 JP2013055165A5 JP2011191121A JP2011191121A JP2013055165A5 JP 2013055165 A5 JP2013055165 A5 JP 2013055165A5 JP 2011191121 A JP2011191121 A JP 2011191121A JP 2011191121 A JP2011191121 A JP 2011191121A JP 2013055165 A5 JP2013055165 A5 JP 2013055165A5
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- JP
- Japan
- Prior art keywords
- substrate
- processing
- impedance
- unit
- potential distribution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 claims 31
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011191121A JP5793028B2 (ja) | 2011-09-01 | 2011-09-01 | 基板処理装置及び半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011191121A JP5793028B2 (ja) | 2011-09-01 | 2011-09-01 | 基板処理装置及び半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013055165A JP2013055165A (ja) | 2013-03-21 |
| JP2013055165A5 true JP2013055165A5 (cg-RX-API-DMAC7.html) | 2014-10-09 |
| JP5793028B2 JP5793028B2 (ja) | 2015-10-14 |
Family
ID=48131901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011191121A Expired - Fee Related JP5793028B2 (ja) | 2011-09-01 | 2011-09-01 | 基板処理装置及び半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5793028B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015141521A1 (ja) * | 2014-03-21 | 2015-09-24 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法及び記録媒体 |
| KR101557223B1 (ko) * | 2014-03-25 | 2015-10-05 | (주)아이씨디 | 유도결합용 플라즈마 처리 시스템 |
| JP6126155B2 (ja) | 2015-03-31 | 2017-05-10 | 株式会社日立国際電気 | 半導体装置の製造方法、プログラムおよび基板処理装置 |
| EP4120804A4 (en) * | 2020-03-11 | 2023-11-22 | Kokusai Electric Corp. | SUBSTRATE PROCESSING DEVICE, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, AND PROGRAM |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2546995B2 (ja) * | 1986-10-30 | 1996-10-23 | 日本真空技術株式会社 | 真空槽内における基板の表面処理方法及び装置 |
| EP0280074B1 (en) * | 1987-02-24 | 1995-12-20 | International Business Machines Corporation | Plasma reactor |
| JPH07263411A (ja) * | 1994-03-17 | 1995-10-13 | Sony Corp | プラズマエッチング装置 |
| JPH08316212A (ja) * | 1995-05-23 | 1996-11-29 | Hitachi Ltd | プラズマ処理方法及びプラズマ処理装置 |
| JP3436931B2 (ja) * | 2000-05-04 | 2003-08-18 | 東京エレクトロン株式会社 | プラズマを用いて基板を処理するための装置および方法 |
| KR100823302B1 (ko) * | 2006-12-08 | 2008-04-17 | 주식회사 테스 | 플라즈마 처리 장치 |
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2011
- 2011-09-01 JP JP2011191121A patent/JP5793028B2/ja not_active Expired - Fee Related