JP2013048198A - Package for housing electronic component and electronic equipment using the same - Google Patents

Package for housing electronic component and electronic equipment using the same Download PDF

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JP2013048198A
JP2013048198A JP2011209296A JP2011209296A JP2013048198A JP 2013048198 A JP2013048198 A JP 2013048198A JP 2011209296 A JP2011209296 A JP 2011209296A JP 2011209296 A JP2011209296 A JP 2011209296A JP 2013048198 A JP2013048198 A JP 2013048198A
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Prior art keywords
base
mounting base
electronic component
hole
signal terminal
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JP5766081B2 (en
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Michinobu Iino
道信 飯野
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a package for housing an electronic component capable of suppressing mismatching of impedance for transmitting high frequency signal in a good manner.SOLUTION: The package includes a base body 1 containing a first through hole, a placement base stage 6 placed on the upper surface of the base body 1, a circuit board 5 which is placed and jointed on the upper surface of the placement base stage 6, with a signal line conductor 5b formed on its upper surface, and a signal terminal 4 which penetrates a sealing material 3 filled in the first through hole 1a for fixing. The placement base stage 6 contains a second through hole 6a being continued from the first through hole, and one end of the signal terminal 4 protrudes from the upper surface of the placement base stage 6 through the second through hole 6a, and is electrically connected to the signal line conductor 5b. Since the signal terminal 4 penetrates the second through hole 6a, portion of the second through hole 6a forms a so-called air coaxial structure, which allows transmission of high frequency signal in a good manner.

Description

本発明は、光通信分野やマイクロ波通信およびミリ波通信等の分野で用いられる、高い周波数帯域で作動する各種電子部品を収納する電子部品収納用パッケージおよびそれを用いた電子装置に関するものである。   The present invention relates to an electronic component storage package for storing various electronic components that operate in a high frequency band, and an electronic apparatus using the same, which are used in the fields of optical communication, microwave communication, millimeter wave communication, and the like. .

近年、40ｋｍ以下の伝送距離における高速通信に対する需要が急激に増加しており、高速大容量の情報伝送に関する研究開発が進められている。とりわけ、光通信装置を用いて光信号を受発信する電子装置の高速化が注目されており、電子装置による光信号の高出力化と高速化が伝送容量を向上させるための課題として研究開発されている。   In recent years, the demand for high-speed communication at a transmission distance of 40 km or less has increased rapidly, and research and development on high-speed and large-capacity information transmission has been promoted. In particular, high-speed electronic devices that receive and transmit optical signals using optical communication devices are attracting attention, and high-output and high-speed optical signals by electronic devices have been researched and developed as issues to improve transmission capacity. ing.

このような電子装置用の従来の電子部品搭載用パッケージは、図19に断面図で示すように、略中央に電子部品の搭載部を設けた円板状の金属製の基体101に、基体101の上面から下面にかけて貫通する貫通孔101ａを設け、この貫通孔101ａに充填された絶縁性ガラスから成る封止材103を貫通して信号端子104が固定されているものである。また、基体101の
上面に載置用基台106を介して回路基板105を載置接合し、この回路基板105上に電子部品108を搭載して、信号端子104の上端部と電子部品108とを回路基板105を介して電気的に接
続していた。そして、基体101の上面の外周領域に電子部品108を覆うように金属製の蓋体109を溶接またはろう接により基体101の上面周縁部に接合して気密封止することによって、電子装置としていた（例えば、特許文献１を参照）。 A conventional electronic component mounting package for such an electronic device has, as shown in a cross-sectional view in FIG. 19, a substrate 101 made of a disk-shaped metal base 101 provided with a mounting portion for an electronic component in the approximate center. A through hole 101a penetrating from the upper surface to the lower surface is provided, and the signal terminal 104 is fixed through the sealing material 103 made of insulating glass filled in the through hole 101a. Further, a circuit board 105 is placed and bonded to the upper surface of the base 101 via a mounting base 106, and an electronic component 108 is mounted on the circuit board 105, and the upper end portion of the signal terminal 104 and the electronic component 108 are Are electrically connected via the circuit board 105. Then, a metallic lid 109 was welded or brazed to the outer peripheral area of the upper surface of the base 101 and joined to the peripheral edge of the upper surface of the base 101 to provide an airtight seal. (For example, see Patent Document 1).

また、載置用基台106は、上面に載置する回路基板105に大きな応力が加わらないようにするための緩衝材としての中継基台として機能させている。すなわち、基体101の熱膨張
係数と回路基板105の熱膨張係数との違いによる応力を緩和するために、基体101の上面に載置用基台106を載置接合し、この載置用基台106の上面に回路基板105を載置接合してい
た。 Further, the mounting base 106 functions as a relay base as a buffer material for preventing a large stress from being applied to the circuit board 105 mounted on the upper surface. That is, in order to relieve the stress due to the difference between the thermal expansion coefficient of the base 101 and the thermal expansion coefficient of the circuit board 105, the mounting base 106 is mounted on the upper surface of the base 101, and the mounting base The circuit board 105 was placed and bonded to the upper surface of 106.

特開平８−130266号公報JP-A-8-130266

しかしながら、従来の電子装置では、載置用基台106を用いていることで、信号端子104の基体101から突出した部分が、載置用基台106の厚みの分だけ長くなる。そうすると、近年、要求される伝送速度が高まるにつれ、伝送信号の周波数が25〜40ＧＨｚ程度まで向上してきており、電子装置をより高出力化させ、高速化させることが要求されてくると、載置用基台106の厚みの分だけ長くなった信号端子104の基体101から突出した部分から、回
路基板105の信号線路導体105ｂまでの部分における、インピーダンスの不整合が無視できないものとなって、この部分でのインピーダンスの不整合によって高周波信号の伝送性が劣化し易くなるという問題があった。 However, in the conventional electronic device, since the mounting base 106 is used, the portion of the signal terminal 104 that protrudes from the base 101 becomes longer by the thickness of the mounting base 106. Then, in recent years, as the required transmission speed increases, the frequency of the transmission signal has been improved to about 25 to 40 GHz, and if it is required to increase the output and speed of the electronic device, Impedance mismatch between the portion of the signal terminal 104 protruding from the base 101 of the signal base 104 and the portion of the circuit board 105 extending from the base 101 to the signal line conductor 105b cannot be ignored. There is a problem that the transmission performance of the high-frequency signal is likely to be deteriorated due to the impedance mismatch at the portion.

本発明は上記問題点に鑑み完成されたものであり、その目的は、信号端子の基体から突出した部分から回路基板の信号線路導体までのインピーダンスの不整合を小さいものとし、25ＧＨｚ以上の高周波信号を良好に伝送させることができる電子部品収納用パッケージを提供することにある。   The present invention has been completed in view of the above problems, and its purpose is to reduce impedance mismatching from the portion of the signal terminal protruding from the base to the signal line conductor of the circuit board, and a high-frequency signal of 25 GHz or more. It is an object of the present invention to provide an electronic component storage package that can transmit the signal in a satisfactory manner.

本発明の電子部品収納用パッケージは、上面から下面にかけて貫通する第１貫通孔を有しているとともに上面に電子部品が搭載される基体と、前記基体の上面の載置部に載置された載置用基台と、絶縁基板の上面に信号線路導体が形成されているとともに前記載置用基台の上面に載置接合された回路基板と、前記第１貫通孔に充填された封止材を貫通して固定された信号端子とを具備しており、前記載置用基台は、前記第１貫通孔に連通している第２貫通孔を有しており、前記信号端子の一端が前記第２貫通孔を通って前記載置用基台の上面から突出して、前記信号線路導体に電気的に接続されていることを特徴とするものである。   The electronic component storage package of the present invention has a first through hole penetrating from the upper surface to the lower surface and is mounted on a base on which the electronic component is mounted on the upper surface and a mounting portion on the upper surface of the base A mounting base, a circuit board having a signal line conductor formed on the upper surface of the insulating substrate and mounted and bonded to the upper surface of the mounting base, and a seal filled in the first through hole And the signal base fixed through the material, the mounting base has a second through hole communicating with the first through hole, and one end of the signal terminal. Protrudes from the upper surface of the mounting base through the second through hole and is electrically connected to the signal line conductor.

また、本発明の電子装置は、上記構成の本発明の電子部品収納用パッケージと、該電子部品収納用パッケージの前記基体に搭載されているとともに前記回路基板の前記信号線路導体に電気的に接続された電子部品と、該電子部品を覆うように設けられた蓋体とを具備していることを特徴とするものである。   The electronic device of the present invention is mounted on the base of the electronic component storage package of the present invention having the above-described configuration, and is electrically connected to the signal line conductor of the circuit board. The electronic component and a lid provided so as to cover the electronic component are provided.

本発明の電子部品収納用パッケージは、基体に設けられた第１貫通孔に連通する第２貫通孔を載置用基台に設けて、第２貫通孔の中に信号端子を通すことで、第２貫通孔の部分がいわゆるエア同軸構造となり、信号端子が基体の上面から突出した部分において、インピーダンスの不整合が発生しにくくなり、高周波信号を良好に伝送させることが可能となる。   In the electronic component storage package of the present invention, the second through hole communicating with the first through hole provided in the base is provided in the mounting base, and the signal terminal is passed through the second through hole, The portion of the second through-hole has a so-called air coaxial structure, and impedance mismatching hardly occurs at a portion where the signal terminal protrudes from the upper surface of the base body, so that a high-frequency signal can be transmitted satisfactorily.

また、本発明の電子装置によれば、上記構成の本発明の電子部品収納用パッケージと、電子部品収納用パッケージの基体に搭載されているとともに回路基板の信号線路導体に電気的に接続された電子部品と、該電子部品を覆うように設けられた蓋体とを具備していることから、回路基板の割れを防止し、高周波信号の伝送特性が良好で、高速で動作可能な電子装置を提供することが可能となる。   According to the electronic device of the present invention, the electronic component storage package of the present invention having the above-described configuration and the electronic component storage package are mounted on the base of the electronic component storage package and electrically connected to the signal line conductor of the circuit board. An electronic device comprising an electronic component and a lid provided so as to cover the electronic component, prevents cracking of the circuit board, has good high-frequency signal transmission characteristics, and can operate at high speed It becomes possible to provide.

本発明の電子装置の実施の形態の一例を示す斜視図である。It is a perspective view which shows an example of embodiment of the electronic device of this invention. 図１のＸ−Ｘ線における断面図である。It is sectional drawing in the XX line of FIG. （ａ）は、本発明の電子装置の実施の形態の他の例を示す斜視図であり、（ｂ）は、（ａ）のＸ−Ｘ線で切断した断面の一例を示す断面図である。(A) is a perspective view which shows the other example of embodiment of the electronic device of this invention, (b) is sectional drawing which shows an example of the cross section cut | disconnected by the XX line of (a). . 本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the other example of embodiment of the electronic component storage package of this invention. （ａ）は、本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大斜視図である。（ｂ）は、（ａ）のＸ−Ｘ線で切断した断面の一例を示す要部拡大断面図である。(A) is a principal part expansion perspective view which shows the other example of embodiment of the electronic component storage package of this invention. (B) is a principal part expanded sectional view which shows an example of the cross section cut | disconnected by the XX line of (a). （ａ）,（ｂ）は、本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大斜視図である。(A), (b) is a principal part expansion perspective view which shows the other example of embodiment of the electronic component storage package of this invention. 図６（ａ）,（ｂ）のＸ−Ｘ線で切断した断面の一例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows an example of the cross section cut | disconnected by the XX line of Fig.6 (a), (b). 本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the other example of embodiment of the electronic component storage package of this invention. 本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the other example of embodiment of the electronic component storage package of this invention. 本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the other example of embodiment of the electronic component storage package of this invention. 本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the other example of embodiment of the electronic component storage package of this invention. （ａ）は、本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大斜視図である。（ｂ）は、（ａ）のＸ−Ｘ線で切断した断面の一例を示す要部拡大断面図である。(A) is a principal part expansion perspective view which shows the other example of embodiment of the electronic component storage package of this invention. (B) is a principal part expanded sectional view which shows an example of the cross section cut | disconnected by the XX line of (a). （ａ）は、本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大斜視図である。（ｂ）は、（ａ）のＸ−Ｘ線で切断した断面の一例を示す要部拡大断面図である。(A) is a principal part expansion perspective view which shows the other example of embodiment of the electronic component storage package of this invention. (B) is a principal part expanded sectional view which shows an example of the cross section cut | disconnected by the XX line of (a). （ａ）,（ｂ）は、本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大斜視図である。(A), (b) is a principal part expansion perspective view which shows the other example of embodiment of the electronic component storage package of this invention. 図14（ａ）,（ｂ）のＸ−Ｘ線で切断した断面の一例を示す要部拡大断面図である。FIG. 15 is an essential part enlarged cross-sectional view showing an example of a cross section taken along line XX in FIGS. 14 (a) and 14 (b). （ａ）は、本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大斜視図である。（ｂ）は、（ａ）のＸ−Ｘ線で切断した断面の一例を示す要部拡大断面図である。(A) is a principal part expansion perspective view which shows the other example of embodiment of the electronic component storage package of this invention. (B) is a principal part expanded sectional view which shows an example of the cross section cut | disconnected by the XX line of (a). （ａ），（ｂ），（ｃ）は、本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大断面図である。(A), (b), (c) is a principal part expanded sectional view which shows the other example of embodiment of the electronic component storage package of this invention. 本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the other example of embodiment of the electronic component storage package of this invention. 従来の電子装置の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the conventional electronic device.

本発明の電子部品収納用パッケージおよび電子装置について以下に詳細に説明する。   The electronic component storage package and electronic device of the present invention will be described in detail below.

図１は、本発明の電子装置の実施の形態の一例を示す斜視図であり、蓋体を外した例である。図２は、図１のＸ−Ｘ線で切断した断面の一例を示す断面図である。図１および図２において、１は電子部品収納用パッケージの基体、１ａは基体１を貫通する第１貫通孔、１ｂは基体１の上面の載置部、３は第１貫通孔１ａに充填された封止材、４は封止材３によって基体１から突出して固定された信号端子、５は載置用基台６の上面に搭載された回路基板、５ａは回路基板５の絶縁基板、５ｂは回路基板５の絶縁基板５ａの上面に形成された信号線路導体、６は基体１の上面の載置部１ｂに載置され、回路基板５が搭載接合される載置用基台である。６ａは載置用基台６を貫通する第２貫通孔である。８は電子部品、９は基体１に接続された接地端子、10は電子部品８と信号配線導体５ｂとを電気的に接続するボンディングワイヤ、11は基体１の上面外周部に接合され、回路基板５および電子部品８を気密封止する蓋体（枠体ともいう）である。   FIG. 1 is a perspective view showing an example of an embodiment of an electronic apparatus according to the present invention, in which a lid is removed. FIG. 2 is a cross-sectional view showing an example of a cross section taken along line XX of FIG. 1 and 2, reference numeral 1 denotes a base of an electronic component storage package, 1a denotes a first through-hole penetrating the base 1, 1b denotes a mounting portion on the upper surface of the base 1, and 3 denotes a filling of the first through-hole 1a. 4 is a signal terminal which protrudes from the base 1 and is fixed by the sealing material 3, 5 is a circuit board mounted on the upper surface of the mounting base 6, 5a is an insulating substrate of the circuit board 5, 5b Is a signal line conductor formed on the upper surface of the insulating substrate 5a of the circuit board 5, and 6 is a mounting base that is mounted on the mounting portion 1b on the upper surface of the base 1 and on which the circuit board 5 is mounted and joined. Reference numeral 6 a denotes a second through-hole penetrating the mounting base 6. 8 is an electronic component, 9 is a ground terminal connected to the substrate 1, 10 is a bonding wire for electrically connecting the electronic component 8 and the signal wiring conductor 5b, and 11 is bonded to the outer periphery of the upper surface of the substrate 1, 5 and a lid (also referred to as a frame) for hermetically sealing the electronic component 8.

図２に示す例では、回路基板５は、絶縁基板５ａの上面に信号線路導体５ｂが形成され、下面には接地導体５ｃが形成されてマイクロストリップ線路が形成されている。回路基板５の下面の接地導体５ｃが、グラウンドとしても機能する載置用基台６の上面にはんだや導電性接着剤等の導電性の接合材を用いて接続されるとともに固定されることによって回路基板５が載置用基台６の上面に搭載接合されている。そして、信号端子４は第１貫通孔１ａ内に封止材３によって固定されている。そして、この信号端子４と回路基板５の一方主面上の信号線路導体５ｂとがろう材によって電気的に接続されて本発明の電子部品収納用パッケージが構成されている。   In the example shown in FIG. 2, the circuit board 5 has a signal line conductor 5b formed on the upper surface of the insulating substrate 5a and a ground conductor 5c formed on the lower surface to form a microstrip line. The ground conductor 5c on the lower surface of the circuit board 5 is connected and fixed to the upper surface of the mounting base 6 that also functions as a ground using a conductive bonding material such as solder or conductive adhesive. The circuit board 5 is mounted and bonded to the upper surface of the mounting base 6. And the signal terminal 4 is being fixed by the sealing material 3 in the 1st through-hole 1a. The signal terminal 4 and the signal line conductor 5b on one main surface of the circuit board 5 are electrically connected by a brazing material to constitute the electronic component storage package of the present invention.

接地端子９は、２本で信号端子４を挟むようにして基体１に接続されており、外部回路基板12の信号配線導体12ｂの両側に配置された接地配線導体12ｃにろう材等で接合されている。   The two ground terminals 9 are connected to the base 1 so as to sandwich the signal terminal 4 between them, and are joined to the ground wiring conductors 12c disposed on both sides of the signal wiring conductor 12b of the external circuit board 12 by a brazing material or the like. .

本発明の電子部品収納用パッケージは、図１および図２に示す例のように、上面から下面にかけて貫通する第１貫通孔１ａを有しているとともに上面に電子部品８が搭載される基体１と、基体１の上面の載置部１ｂに載置された載置用基台６と、絶縁基板５ａの上面
に信号線路導体５ｂが形成されているとともに載置用基台６の上面に載置接合された回路基板５と、第１貫通孔１ａに充填された封止材３を貫通して固定された信号端子４とを具備しており、載置用基台６は、第１貫通孔１ａに連通している第２貫通孔６ａを有しており、信号端子４の一端が第２貫通孔６ａを通って載置用基台６の上面から突出して、信号線路導体５ｂに電気的に接続されている。このような構成により、基体１に設けられた第１貫通孔１ａに連通する第２貫通孔６ａを載置用基台６に設けて、第２貫通孔６ａの中に信号端子４を通すことで、第２貫通孔６ａの部分がいわゆるエア同軸構造となり、信号端子４が基体１の上面から突出した部分において、インピーダンスの不整合が発生しにくくなり、高周波信号を良好に伝送させることが可能となる。 The electronic component storage package of the present invention has a first through hole 1a penetrating from the upper surface to the lower surface and has an electronic component 8 mounted on the upper surface as in the example shown in FIGS. And a mounting base 6 mounted on the mounting portion 1b on the upper surface of the base 1, and a signal line conductor 5b formed on the upper surface of the insulating substrate 5a and mounted on the upper surface of the mounting base 6. The circuit board 5 is placed and bonded, and the signal terminal 4 is fixed through the sealing material 3 filled in the first through hole 1a. The second through hole 6a communicated with the hole 1a is provided, and one end of the signal terminal 4 protrudes from the upper surface of the mounting base 6 through the second through hole 6a and is electrically connected to the signal line conductor 5b. Connected. With such a configuration, the second through hole 6a communicating with the first through hole 1a provided in the base 1 is provided in the mounting base 6, and the signal terminal 4 is passed through the second through hole 6a. Thus, the portion of the second through-hole 6a has a so-called air coaxial structure, and impedance mismatching hardly occurs at the portion where the signal terminal 4 protrudes from the upper surface of the base 1, so that a high-frequency signal can be transmitted satisfactorily. It becomes.

本発明の電子部品収納用パッケージは、図３（ａ），（ｂ）に示す例のように、基体１の上面に載置部１ｂを囲繞するように枠体２が取着された箱型でもよい。また、図３（ａ），（ｂ）に示す例は、電子装置を外部回路基板12に実装した例である。この場合、図４に示す例のように、載置用基台６の側面の全面を枠体２の内面に当接させて共振が発生しないようにすることが好ましいが、例えば、枠体２の内面と基体１の上面とで形成される角部がなだらかな曲線状（以下、Ｒ部という）となった場合、載置用基台６の側面の全面を枠体２の内面に当接させることが難しくなり、載置用基台６の側面と枠体２の内面との間に空間７を有することとなる。そうすると、空間７で共振が発生するおそれがあり、共振によるノイズ（以下、共振ノイズという）が信号線路導体５ｂ中の高周波信号に加わってしまい、高周波信号を良好に伝送することが難しくなるおそれがある。そのため、図５に示す例のように、枠体２と信号端子４との間には載置用基台６の上面に信号端子４の一端よりも高さが高い壁部６ｃを形成して、枠体２と載置用基台６との間に共振が起こった場合でも、共振ノイズを壁部６ｃで遮断して、共振ノイズが信号線路導体５ｂ中の高周波信号に加わることを抑制し、高周波信号をより良好に伝送させることが可能となる。   As shown in FIGS. 3A and 3B, the electronic component storage package according to the present invention has a box shape in which a frame 2 is attached to an upper surface of a base 1 so as to surround a mounting portion 1b. But you can. 3A and 3B is an example in which an electronic device is mounted on the external circuit board 12. In this case, as in the example shown in FIG. 4, it is preferable that the entire side surface of the mounting base 6 is brought into contact with the inner surface of the frame body 2 so that resonance does not occur. When the corner formed by the inner surface of the substrate 1 and the upper surface of the base body 1 has a gently curved shape (hereinafter referred to as R portion), the entire side surface of the mounting base 6 abuts the inner surface of the frame 2. Therefore, the space 7 is provided between the side surface of the mounting base 6 and the inner surface of the frame body 2. Then, resonance may occur in the space 7, and noise due to resonance (hereinafter referred to as resonance noise) is added to the high-frequency signal in the signal line conductor 5b, which may make it difficult to transmit the high-frequency signal satisfactorily. is there. Therefore, as in the example shown in FIG. 5, a wall 6 c having a height higher than one end of the signal terminal 4 is formed on the upper surface of the mounting base 6 between the frame 2 and the signal terminal 4. Even when resonance occurs between the frame 2 and the mounting base 6, the resonance noise is blocked by the wall portion 6 c to suppress the resonance noise from being added to the high-frequency signal in the signal line conductor 5 b. Therefore, it is possible to transmit a high-frequency signal better.

図３（ａ），（ｂ）において、１は電子部品収納用パッケージの基体、１ａは基体１を貫通する第１貫通孔、１ｂは基体１の上面の載置部、２は電子部品収納用パッケージ本体の側壁用の枠体、３は第１貫通孔１ａに充填された封止材、４は封止材３によって基体１から突出して固定された信号端子、５は載置用基台６の上面に搭載された回路基板、５ａは回路基板５の絶縁基板、５ｂは回路基板５の絶縁基板５ａの上面に形成された信号線路導体、５ｃは回路基板５の絶縁基板５ａの下面に形成された接地導体、６は基体１の上面の載置部１ｂに載置され、回路基板５が搭載接合される載置用基台である。６ａは載置用基台６を貫通する第２貫通孔、７は枠体２の内面と載置用基台６の枠体２の内面に対向する側の側面との間の空間である。８は基体１に搭載実装されたＬＮ変調素子等の電子部品、９は基体１に接続された接地端子、10は電子部品８と信号配線導体５ｂとを電気的に接続するボンディングワイヤ、11は枠体２の上面に接合され、回路基板５および電子部品８を気密封止する蓋体である。そして、図５（ａ）,（ｂ）に示す例のように、載置用基台
６の上面には、信号端子４の一端よりも高さの高い壁部６ｃが形成されている。 3 (a) and 3 (b), 1 is a base of an electronic component storage package, 1a is a first through hole penetrating the base 1, 1b is a mounting portion on the upper surface of the base 1, and 2 is an electronic component storage. Frame body for the side wall of the package body, 3 is a sealing material filled in the first through hole 1a, 4 is a signal terminal protruding from the base body 1 by the sealing material 3, and 5 is a mounting base 6 5a is an insulating substrate of the circuit board 5, 5b is a signal line conductor formed on the upper surface of the insulating substrate 5a of the circuit board 5, and 5c is formed on the lower surface of the insulating substrate 5a of the circuit board 5. The grounded conductor 6 is placed on the placement portion 1b on the upper surface of the base 1 and is a mounting base on which the circuit board 5 is mounted and joined. Reference numeral 6 a denotes a second through-hole penetrating the mounting base 6, and 7 denotes a space between the inner surface of the frame body 2 and the side surface of the mounting base 6 facing the inner surface of the frame body 2. 8 is an electronic component such as an LN modulation element mounted on the substrate 1, 9 is a ground terminal connected to the substrate 1, 10 is a bonding wire for electrically connecting the electronic component 8 and the signal wiring conductor 5b, and 11 is The lid is bonded to the upper surface of the frame 2 and hermetically seals the circuit board 5 and the electronic component 8. And the wall part 6c whose height is higher than the end of the signal terminal 4 is formed in the upper surface of the mounting base 6 like the example shown to Fig.5 (a), (b).

また、図３（ａ）,（ｂ）に示す例において、回路基板５は、絶縁基板５ａの上面に信
号線路導体５ｂが形成され、下面には接地導体５ｃが形成されてマイクロストリップ線路が形成されている。回路基板５の下面の接地導体５ｃが、グラウンドとしても機能する載置用基台６の上面にＡｕ−Ｓｎ合金等の低融点ろう材等の導電性接合材を用いて接続されるとともに固定されることによって回路基板５が載置用基台６の上面に搭載接合されている。そして、信号端子４は第１貫通孔１ａ内に封止材３によって固定されている。そして、この信号端子４と回路基板５の一方主面上の信号線路導体５ｂとがろう材によって電気的に接続されて本発明の電子部品収納用パッケージが構成されている。 In the example shown in FIGS. 3A and 3B, the circuit board 5 has a signal line conductor 5b formed on the upper surface of the insulating substrate 5a and a ground conductor 5c formed on the lower surface to form a microstrip line. Has been. The grounding conductor 5c on the lower surface of the circuit board 5 is connected and fixed to the upper surface of the mounting base 6 that also functions as a ground by using a conductive bonding material such as a low melting point brazing material such as an Au-Sn alloy. Thus, the circuit board 5 is mounted and bonded to the upper surface of the mounting base 6. And the signal terminal 4 is being fixed by the sealing material 3 in the 1st through-hole 1a. The signal terminal 4 and the signal line conductor 5b on one main surface of the circuit board 5 are electrically connected by a brazing material to constitute the electronic component storage package of the present invention.

また、図３（ａ）,（ｂ）に示す例は、信号端子４の基体１の下面から突出した部分は
折り曲げられ、この折り曲げられて外部回路基板12の上面と平行になった部分が信号配線
導体12ｂにろう材等で接合されている。また、信号端子４の基体1の下面から突出した部
分を直接、外部回路基板12に接続するのではなく、信号端子４と外部回路基板12との間に、インピーダンス整合を行ったフレキシブル基板（図示せず）を介して信号端子４および接地端子９を信号配線導体12ｂおよび接地配線導体12ｃにろう材等で接合しても良い。この場合は、外部回路基板12と基体１との熱膨張係数の違いによって信号端子４に応力が加わることをフレキシブル基板で緩和することができるので、より接続信頼性を高めることができるので好ましい。 In the example shown in FIGS. 3A and 3B, the portion of the signal terminal 4 protruding from the lower surface of the base 1 is bent, and the portion that is bent and parallel to the upper surface of the external circuit board 12 is a signal. The wiring conductor 12b is joined with a brazing material or the like. In addition, a portion of the signal terminal 4 protruding from the lower surface of the base 1 is not directly connected to the external circuit board 12, but a flexible board (FIG. 5) in which impedance matching is performed between the signal terminal 4 and the external circuit board 12. The signal terminal 4 and the ground terminal 9 may be joined to the signal wiring conductor 12b and the ground wiring conductor 12c with a brazing material or the like via a not shown. In this case, stress applied to the signal terminal 4 due to the difference in thermal expansion coefficient between the external circuit board 12 and the substrate 1 can be mitigated by the flexible board, which is preferable because the connection reliability can be further improved.

接地端子９は、２本で信号端子４を挟むようにして基体１に接続されており、外部回路基板12の信号配線導体12ｂの両側に配置された接地配線導体12ｃにろう材等で接合されている。   The two ground terminals 9 are connected to the base 1 so as to sandwich the signal terminal 4 between them, and are joined to the ground wiring conductors 12c disposed on both sides of the signal wiring conductor 12b of the external circuit board 12 by a brazing material or the like. .

図３（ａ）,（ｂ）に示す例のように、信号端子４は上端部で回路基板５の上面の信号
線路導体５ｂとろう材で接続されており、第２貫通孔６ａの中心をエア同軸でインピーダンスが例えば50Ωとなるように貫通しており、また基体１の第１貫通孔１ａの中心にインピーダンスが50Ωとなるように封止材３で固定されている。信号端子４は封止材３の下部から電子装置の外部に伸びており、封止材３から出たところで基体１の下面と平行となるように曲がっている。そして、電子装置の信号端子４を外部回路基板12の信号配線導体12ｂにろう材で接続し、電子装置の基体１の下面を外部回路基板12の接地配線導体12ｃにろう材で接続した場合には、信号端子４は封止材３から外に延びている部分においてもインピーダンスが50Ωとなるように形成されている。 As shown in the example shown in FIGS. 3A and 3B, the signal terminal 4 is connected to the signal line conductor 5b on the upper surface of the circuit board 5 by a brazing material at the upper end, and the center of the second through hole 6a is connected. The air coaxial is penetrated so that the impedance becomes 50Ω, for example, and is fixed by the sealing material 3 at the center of the first through hole 1a of the base 1 so that the impedance becomes 50Ω. The signal terminal 4 extends from the lower part of the sealing material 3 to the outside of the electronic device, and is bent so as to be parallel to the lower surface of the substrate 1 when coming out of the sealing material 3. When the signal terminal 4 of the electronic device is connected to the signal wiring conductor 12b of the external circuit board 12 with a brazing material, and the lower surface of the base 1 of the electronic device is connected to the ground wiring conductor 12c of the external circuit board 12 with a brazing material. The signal terminal 4 is formed to have an impedance of 50Ω even in a portion extending outward from the sealing material 3.

また、基体１の上面に載置部１ｂを囲繞するように枠体２が取着されている場合は、図４に示す例のように、載置用基台６の側面の全面を枠体２の内面に当接させることが好ましい。この場合は、載置用基台６の側面と枠体２の内面との間に空間７が形成されず、そもそも共振が発生しないので、共振ノイズが信号線路導体５ｂを伝送する高周波信号に加わることがなく、高周波信号を良好に伝送することが可能となる。   When the frame body 2 is attached to the upper surface of the base 1 so as to surround the mounting portion 1b, the entire side surface of the mounting base 6 is framed as shown in the example of FIG. 2 is preferably brought into contact with the inner surface. In this case, since the space 7 is not formed between the side surface of the mounting base 6 and the inner surface of the frame 2 and resonance does not occur in the first place, resonance noise is added to the high-frequency signal transmitted through the signal line conductor 5b. Therefore, it is possible to transmit a high frequency signal satisfactorily.

また、本発明の電子部品収納用パッケージは、図５（ａ）の要部拡大斜視図および図５（ｂ）の要部拡大断面図（図５（ａ）のＸ−Ｘ線で切断した要部拡大断面図）に示す例のように、上記構成において、枠体２と信号端子４との間に、載置用基台６の上面には、信号端子４の一端よりも高さの高い壁部６ｃが形成されている。壁部６ｃは、例えば枠体２の内面と基体１との上面とで形成される角部にＲ部が形成されて、枠体２の内面と載置用基台６の側面とを当接させることができない場合に、枠体２の内面と載置用基台６の側面との間に発生する共振を遮断する機能を有する。壁部６ｃの幅は、信号端子４の直径の少なくとも２倍以上で載置用基台６の幅以下であることが好ましい。これにより、枠体２と載置用基台６との間に共振が起こった場合でも、共振ノイズを壁部６ｃで遮断することができるので、高周波信号をより良好に伝送させることが可能となる。   In addition, the electronic component storage package of the present invention is an essential part enlarged perspective view of FIG. 5A and an essential part enlarged sectional view of FIG. 5B (required by cutting along line XX of FIG. 5A). As in the example shown in the enlarged sectional view), in the above configuration, the upper surface of the mounting base 6 is higher than the one end of the signal terminal 4 between the frame 2 and the signal terminal 4. A wall 6c is formed. The wall portion 6c is formed with an R portion at a corner portion formed by, for example, the inner surface of the frame body 2 and the upper surface of the base 1, and abuts the inner surface of the frame body 2 and the side surface of the mounting base 6. When it cannot be made, it has a function which interrupts | blocks the resonance which generate | occur | produces between the inner surface of the frame 2 and the side surface of the mounting base 6. FIG. The width of the wall 6c is preferably at least twice the diameter of the signal terminal 4 and not more than the width of the mounting base 6. Thereby, even when resonance occurs between the frame 2 and the mounting base 6, the resonance noise can be blocked by the wall portion 6 c, so that a high-frequency signal can be transmitted better. Become.

また、図５（ａ），（ｂ）に示す例のように、載置用基台６の側面と枠体２の内面との間に空間７を有する場合は、空間７の幅が50μｍ以上0.1ｍｍ以下であることが好ましい
。具体的には、空間７の幅と共振の強さとの関係は、空間７の幅の２乗に反比例して共振の強さは減少するので、空間７の幅、すなわち枠体２の内面と載置用基台６の側面との間の距離が小さく、50μｍ未満であると強い共振が起こり共振ノイズも大きくなり、信号線路導体５ｂを伝わる高周波信号に悪影響を及ぼしてしまう。従って、空間７の幅は50μｍ以上が好ましく、また空間７の幅は大きいほど共振が弱くなるので、電気特性的には空間７の幅は大きいほど好ましいが、電子装置を小型化するために、空間７の幅は0.1ｍｍ以
下とするのが好ましい。 5A and 5B, when the space 7 is provided between the side surface of the mounting base 6 and the inner surface of the frame body 2, the width of the space 7 is 50 μm or more. It is preferably 0.1 mm or less. Specifically, the relationship between the width of the space 7 and the strength of the resonance is such that the strength of the resonance decreases in inverse proportion to the square of the width of the space 7, so that the width of the space 7, that is, the inner surface of the frame 2 If the distance to the side surface of the mounting base 6 is small and less than 50 μm, strong resonance occurs and resonance noise increases, which adversely affects the high-frequency signal transmitted through the signal line conductor 5b. Accordingly, the width of the space 7 is preferably 50 μm or more, and the resonance is weaker as the width of the space 7 is larger. Therefore, the width of the space 7 is preferably larger in terms of electrical characteristics, but in order to reduce the size of the electronic device, The width of the space 7 is preferably 0.1 mm or less.

空間７の幅を50μｍ以上0.1ｍｍ以下とするための一例としては、図18に示す例のよう
に、枠体２の内面に段差部２ｃを設けて、段差部２ｃの側面と載置用基台６の側面とを当接させることで、枠体２の内面に対する載置用基台６の位置決めを確実かつ容易にできるので、空間７の幅を所定の寸法に確実に設定することができる。さらに、載置用基台６の位置決めが確実できることから、第２貫通孔６ａの中に信号端子４を中心位置がずれることなく確実に通すことができ、第２貫通孔６ａのエア同軸構造で、信号端子４が基体１の上面から突出した部分において、インピーダンスの不整合が発生しにくくなり、高周波信号を良好に伝送させることが可能となる。 As an example for setting the width of the space 7 to 50 μm or more and 0.1 mm or less, as shown in the example of FIG. 18, a stepped portion 2 c is provided on the inner surface of the frame body 2, and the side surface of the stepped portion 2 c and the mounting base Since the mounting base 6 can be positioned with respect to the inner surface of the frame 2 reliably and easily by contacting the side surface of the base 6, the width of the space 7 can be reliably set to a predetermined dimension. . Furthermore, since the positioning of the mounting base 6 can be ensured, the signal terminal 4 can be surely passed through the second through-hole 6a without shifting the center position, and the air coaxial structure of the second through-hole 6a. In the portion where the signal terminal 4 protrudes from the upper surface of the substrate 1, impedance mismatching is less likely to occur, and high-frequency signals can be transmitted satisfactorily.

本発明の電子部品収納用パッケージは、図６（ａ）,（ｂ）の要部拡大斜視図および図
７の要部拡大断面図（図６（ａ）,（ｂ）のＸ−Ｘ線で切断した要部拡大断面図）に示す
例のように、上記構成において、壁部６ｃは、信号端子４の載置用基台６から上側に突出した部分を取り囲むように形成されている。このような場合は、基体１の上面から回路基板５の信号線路導体５ｂまでの部分においてエア同軸構造となるので、信号端子４が基体１から突出した部分のほぼ全体においてインピーダンスの不整合が発生しにくくなり、高周波信号をより良好に伝送させることが可能となる。また、載置用基台６の側面と枠体２の内面との間に形成された空間７において共振が起こり共振ノイズが発生したとしても、載置用基台６の壁部６ｃによって、共振ノイズが信号線路導体５ｂを伝送する高周波信号に加わることを防止し、高周波信号を良好に伝送させることが可能となる。図６（ａ）,
（ｂ）および図７においては、壁部６ｃのエア同軸部分は上方に開放した形状としているが、インピーダンスを整合させながら、信号端子４の上面を覆うように形成すると、より共振ノイズが伝送する高周波信号に加わり難くなるので好ましい。 The electronic component storage package according to the present invention is an enlarged perspective view of a main part of FIGS. 6A and 6B and an enlarged cross-sectional view of a main part of FIG. 7 (in FIG. 6A and FIG. In the above configuration, the wall 6c is formed so as to surround a portion of the signal terminal 4 that protrudes upward from the mounting base 6 as in the example shown in FIG. In such a case, since the air coaxial structure is formed in the portion from the upper surface of the substrate 1 to the signal line conductor 5b of the circuit board 5, impedance mismatch occurs in almost the entire portion where the signal terminal 4 protrudes from the substrate 1. This makes it possible to transmit a high-frequency signal better. Further, even if resonance occurs in the space 7 formed between the side surface of the mounting base 6 and the inner surface of the frame body 2, resonance occurs due to the wall 6 c of the mounting base 6. It is possible to prevent noise from being added to the high frequency signal transmitted through the signal line conductor 5b and to transmit the high frequency signal satisfactorily. FIG.
In FIG. 7B and FIG. 7, the air coaxial portion of the wall portion 6 c is open upward, but if it is formed so as to cover the upper surface of the signal terminal 4 while matching the impedance, more resonance noise is transmitted. This is preferable because it is difficult to add to a high-frequency signal.

壁部６ｃは、図６（ａ）に示す例のように、載置用基台６の回路基板５と重なっていない部分を全て突出させて壁部６ｃとしてもよく、図６（ｂ）に示す例のように、第２貫通孔６ａの周囲のみ突出させて壁部６ｃとしてもよい。   As in the example shown in FIG. 6A, the wall 6c may be formed as a wall 6c by projecting all portions of the mounting base 6 that do not overlap the circuit board 5 as shown in FIG. 6B. As shown in the example, only the periphery of the second through hole 6a may be projected to form the wall portion 6c.

また、図４に示した例において、上記したように、載置用基台６は、その側面を枠体２の内面に当接させることが好ましいが、枠体２と載置用基台６との間の角にＲ部を有することで、載置用基台６の側面の全面を枠体２の内面に当接させることが難しい場合がある。このような場合は、図８に示す例のように、載置用基台６の下部に、載置用基台６の下部の角を切り欠いた切り欠き６ｄを形成することで、載置用基台６の側面を枠体２の内面に容易に当接させることができる。その結果、載置用基台６の側面と枠体２の内面との間の共振の発生を抑制し、高周波信号を良好に伝送することが可能となる。   In the example shown in FIG. 4, as described above, the mounting base 6 preferably has its side surface abutted against the inner surface of the frame 2, but the frame 2 and the mounting base 6. It may be difficult to bring the entire side surface of the mounting base 6 into contact with the inner surface of the frame body 2 by having the R portion at the corner between and the mounting base 6. In such a case, as shown in the example shown in FIG. 8, the mounting base 6 is formed by forming a notch 6 d in which the lower corner of the mounting base 6 is cut out at the lower part of the mounting base 6. The side surface of the base 6 can be easily brought into contact with the inner surface of the frame 2. As a result, it is possible to suppress the occurrence of resonance between the side surface of the mounting base 6 and the inner surface of the frame 2 and to transmit a high-frequency signal satisfactorily.

また、図９に示す例は、載置用基台６の側面に突起部６ｂを形成した例である。この場合は、突起部６ｂによって形成された空間７に接合用のろう材13を溜めることができるので、枠体２の内面と載置用基台６の側面とを強固に接合することができ、載置用基台６の側面と枠体２の内面との間に空間７が形成されず、その結果、載置用基台６の側面と枠体２の内面との間の共振の発生を抑制し、高周波信号をより良好に伝送することが可能となる。   Further, the example shown in FIG. 9 is an example in which the protrusion 6 b is formed on the side surface of the mounting base 6. In this case, since the joining brazing material 13 can be stored in the space 7 formed by the protrusion 6b, the inner surface of the frame 2 and the side surface of the mounting base 6 can be firmly joined. The space 7 is not formed between the side surface of the mounting base 6 and the inner surface of the frame 2, and as a result, resonance occurs between the side surface of the mounting base 6 and the inner surface of the frame 2. And high-frequency signals can be transmitted better.

また、図10に示す例は、枠体２の内面の下部に、枠体２の下部の角を切り欠いた切り欠き２ｂを形成した例である。この場合は、載置用基台６の側面を枠体２の内面に容易に当接させることができる。その結果、載置用基台６の側面と枠体２の内面との間の共振の発生を抑制し、高周波信号を良好に伝送することが可能となる。   Further, the example shown in FIG. 10 is an example in which a notch 2 b is formed in the lower part of the inner surface of the frame 2 by notching the lower corner of the frame 2. In this case, the side surface of the mounting base 6 can be easily brought into contact with the inner surface of the frame body 2. As a result, it is possible to suppress the occurrence of resonance between the side surface of the mounting base 6 and the inner surface of the frame 2 and to transmit a high-frequency signal satisfactorily.

また、図11に示す例は、枠体２の内面に突部２ａを形成した例である。この場合は、突部２ａによって形成された空間７に接合用のろう材13を溜めることができるので、枠体２の内面と載置用基台６の側面とを強固に接合することができ、載置用基台６の側面と枠体２の内面との間に空間７が形成されず、その結果、載置用基台６の側面と枠体２の内面と
の間の共振の発生を抑制し、高周波信号をより良好に伝送することが可能となる。 Further, the example shown in FIG. 11 is an example in which a protrusion 2 a is formed on the inner surface of the frame 2. In this case, since the brazing filler metal 13 can be stored in the space 7 formed by the protrusion 2a, the inner surface of the frame 2 and the side surface of the mounting base 6 can be firmly bonded. The space 7 is not formed between the side surface of the mounting base 6 and the inner surface of the frame 2, and as a result, resonance occurs between the side surface of the mounting base 6 and the inner surface of the frame 2. And high-frequency signals can be transmitted better.

なお、空間７における共振の発生は、空間７の高さに起因し、空間７の高さがλ／４（λは波長）のｎ倍で共振が発生する。例えば40ＧＨｚの高周波信号の場合、λ／４が1.875ｍｍ、載置用基台６の厚み（載置用基台６の下面から回路基板５が載置接合される上面
までの高さ）が1.7ｍｍ、回路基板５の絶縁基板５ａの厚みが0.25ｍｍで共振が発生する
。このことより、載置用基台６の側面に突起部６ｂを形成するか、枠体２の内面に突部２ａを形成することで、空間７が完全にろう材13で埋まらなかったとしても、突起部６ｂによって空間７の高さが小さくなり、信号を伝送する周波数帯では共振ノイズが悪影響を及ぼさなくなるので好ましい。具体的には、空間７の高さが半分になると共振周波数がほぼ２倍となって高周波側にシフトするので、信号を伝送する周波数帯では共振ノイズが悪影響を及ぼさなくなる。 The occurrence of resonance in the space 7 is caused by the height of the space 7, and resonance occurs when the height of the space 7 is n times λ / 4 (λ is a wavelength). For example, in the case of a high frequency signal of 40 GHz, λ / 4 is 1.875 mm, and the thickness of the mounting base 6 (height from the lower surface of the mounting base 6 to the upper surface on which the circuit board 5 is mounted and bonded) is 1.7. Resonance occurs when the thickness of the insulating substrate 5a of the circuit board 5 is 0.25 mm. Therefore, even if the projection 6b is formed on the side surface of the mounting base 6 or the projection 2a is formed on the inner surface of the frame 2, the space 7 is not completely filled with the brazing material 13. The height of the space 7 is reduced by the protrusion 6b, and resonance noise does not have an adverse effect in the frequency band for transmitting signals, which is preferable. Specifically, when the height of the space 7 is halved, the resonance frequency is almost doubled and shifted to the high frequency side, so that the resonance noise does not have an adverse effect in the frequency band for transmitting signals.

また、本発明の電子部品収納用パッケージは、図12（ａ）の要部拡大斜視図および図12（ｂ）の要部拡大断面図（図12（ａ）のＸ−Ｘ線で切断した要部拡大断面図）に示す例のように、上記構成において、壁部６ｃが、電波吸収体14を含むものである。図12（ａ）,
（ｂ）に示す例は、壁部６ｃの全体が電波吸収体14であり、図13（ａ）,（ｂ）に示す例
は、壁部６ｃの枠体２側の側面に電波吸収体14が設けられているものである。このような場合は、空間７で共振ノイズが発生したとしても、発生した共振ノイズが壁部６ｃによって遮蔽されるのと同時に、電波吸収体14に吸収されることによって、金属による遮蔽の壁部６ｃの場合より確実に共振ノイズを減少させることができる。その結果、共振ノイズが信号線路導体５ｂを伝送する高周波信号に加わることを抑制し、高周波信号をより良好に伝送することが可能となる。 Further, the electronic component storage package of the present invention is an essential part enlarged perspective view of FIG. 12 (a) and an essential part enlarged sectional view of FIG. 12 (b) (required by cutting along line XX of FIG. 12 (a)). In the above configuration, the wall 6c includes the radio wave absorber 14 as in the example shown in FIG. FIG.
In the example shown in (b), the entire wall portion 6c is the radio wave absorber 14, and in the example shown in FIGS. 13 (a) and 13 (b), the radio wave absorber 14 is provided on the side surface of the wall portion 6c on the frame 2 side. Is provided. In such a case, even if resonance noise occurs in the space 7, the generated resonance noise is shielded by the wall portion 6c, and at the same time, absorbed by the radio wave absorber 14, thereby shielding the metal shielding wall portion. Resonance noise can be reduced more reliably than in the case of 6c. As a result, it is possible to suppress the resonance noise from being added to the high-frequency signal transmitted through the signal line conductor 5b, and to transmit the high-frequency signal better.

図13（ａ）,（ｂ）に示す例のように、壁部６ｃの枠体２側の側面に電波吸収体14が設
けられている場合は、壁部６ｃの枠体２側の側面の全面に電波吸収体14が設けられていることが好ましい。この場合、空間７で共振が起こった場合でも、共振ノイズを壁部６ｃの枠体２側の側面の全面に形成された電波吸収体14で効率よく吸収し減少させることができる。 As shown in FIGS. 13A and 13B, when the radio wave absorber 14 is provided on the side surface of the wall portion 6c on the frame body 2 side, the side surface of the wall portion 6c on the side of the frame body 2 is It is preferable that the radio wave absorber 14 is provided on the entire surface. In this case, even when resonance occurs in the space 7, the resonance noise can be efficiently absorbed and reduced by the radio wave absorber 14 formed on the entire side surface of the wall portion 6c on the frame body 2 side.

電波吸収体14とは、電波の持っているエネルギーを吸収し、そのエネルギーを熱に変換して最終的には空中に放射するものである。具体的には、電波吸収体14は、載置用基台６の側面と枠体２の内面との間の空間７で共振ノイズが発生した場合に、その共振ノイズの電波を吸収できるものであれば特に制限は無く、磁性損失を利用する磁性電波吸収体、誘電損失を利用する誘電性電波吸収体、抵抗損失を利用する導電性電波吸収体を利用することができる。また、これらを組み合わせたものであってもかまわない。   The radio wave absorber 14 absorbs energy possessed by radio waves, converts the energy into heat, and finally radiates it into the air. Specifically, the radio wave absorber 14 can absorb radio waves of the resonance noise when resonance noise is generated in the space 7 between the side surface of the mounting base 6 and the inner surface of the frame 2. If there is no particular limitation, a magnetic wave absorber using magnetic loss, a dielectric wave absorber using dielectric loss, and a conductive wave absorber using resistance loss can be used. A combination of these may also be used.

磁性電波吸収体は、周波数が高くなると電流によって磁性体に発生する磁界が遅れることにより、電流を打ち消す働きをする磁気損失によって電波吸収作用が現れるものである。磁性電波吸収体としては、例えば、焼結フェライト、軟磁性金属、鉄カルボニル等があり、電磁波を熱エネルギーに変換し吸収する。   In the magnetic wave absorber, when the frequency is increased, the magnetic field generated in the magnetic body is delayed by the current, and the electromagnetic wave absorbing action appears due to the magnetic loss that works to cancel the current. Examples of magnetic wave absorbers include sintered ferrite, soft magnetic metal, and iron carbonyl, which convert electromagnetic waves into thermal energy and absorb them.

誘電性電波吸収体は、直流電流はほとんど通さないが、高周波領域では静電容量に電流が流れるため、その高周波電流が流れようとするのに対し、誘電体損失により電波吸収作用が現れるものである。誘電性電波吸収体としては、シリコーンゴム等の樹脂を基材として、カーボンなどの導電性材料を含有させたものがある。   Dielectric wave absorbers pass almost no direct current, but current flows through the capacitance in the high-frequency region, so that the high-frequency current tends to flow. is there. Examples of the dielectric wave absorber include a resin such as silicone rubber as a base material and a conductive material such as carbon.

導電性電波吸収体は、誘電損失タイプに含有させた導電性材料が絶縁体中に独立して分散しているのに対し、抵抗を持つ程度に接続して分散されているものであり、電波が流れようとするのに対し、抵抗により電波吸収作用を行なうものである。   Conductive electromagnetic wave absorbers are those in which the conductive material contained in the dielectric loss type is dispersed and connected to the extent that it has resistance, whereas the conductive material is dispersed independently in the insulator. The electric wave is absorbed by the resistance.

電波吸収体14が焼結フェライトから成る場合であれば、例えば、以下のようにして作製される。まず、50ｍｏｌ％以上のＦｅ２Ｏ３とＮｉＯとを含む原料粉末に適当な有機バインダや可塑剤，分散剤，溶剤等を添加混合して泥漿状となす。これを従来周知のドクターブレード法等でシート状となすことによってフェライトグリーンシートを得る。このときに焼結性確保のため、平均粒径１μｍ以下のＦｅ２Ｏ３原料粉末やＮｉＯ原料粉末を用いることが好ましい。そして、フェライトグリーンシートに適当な打ち抜き加工を施すことによって所定の形状に成形するとともに、必要に応じて複数枚積層して生成形体を作製し、これを1200〜1400℃で焼成することで作製することができる。 If the radio wave absorber 14 is made of sintered ferrite, for example, it is manufactured as follows. First, an appropriate organic binder, a plasticizer, a dispersant, a solvent, and the like are added to and mixed with a raw material powder containing 50 mol% or more of Fe 2 O 3 and NiO to form a slurry. A ferrite green sheet is obtained by making this into a sheet by a conventionally known doctor blade method or the like. At this time, in order to ensure sinterability, it is preferable to use an Fe 2 O 3 raw material powder or an NiO raw material powder having an average particle size of 1 μm or less. Then, the ferrite green sheet is formed into a predetermined shape by performing an appropriate punching process, and if necessary, a plurality of sheets are laminated to produce a generated shape, which is fired at 1200 to 1400 ° C. be able to.

このようにして作製した焼結フェライトから成る電波吸収体14を載置用基台６の上面や、壁部６ｃの枠体２側の側面に、半田やＡｕ−Ｓｎ合金等の低融点ろう材等で接合する。   The radio wave absorber 14 made of sintered ferrite thus produced is placed on the upper surface of the mounting base 6 or the side surface of the wall portion 6c on the side of the frame 2 on the low melting point brazing material such as solder or Au—Sn alloy. Join with etc.

また、例えば、シリコーンゴム原料100重量部に対して、カルボニル鉄の粉末300〜1500重量部、有機溶媒および必要に応じて、膨張性黒鉛，各種加硫剤，加硫助剤，加硫促進助剤，軟化剤，老化防止剤，可塑剤，離型剤，硬化剤，発泡剤，着色剤等の添加剤を添加混練し、乾燥させることにより電波吸収体14を作製することもできる。シート状に成形して所定の寸法にしたものを載置用基台６の上面に接合してもよいし、乾燥前の混練物を載置用基台６の上面に印刷塗布した後に乾燥させてもよい。   Also, for example, with respect to 100 parts by weight of the silicone rubber raw material, 300 to 1500 parts by weight of carbonyl iron powder, an organic solvent, and if necessary, expansive graphite, various vulcanizing agents, vulcanizing aids, vulcanization acceleration aids The radio wave absorber 14 can also be produced by adding and kneading additives such as an agent, a softening agent, an anti-aging agent, a plasticizer, a release agent, a curing agent, a foaming agent, and a colorant, and drying. A sheet formed into a predetermined size may be bonded to the upper surface of the mounting base 6, or the kneaded material before drying is printed on the upper surface of the mounting base 6 and then dried. May be.

また、図14（ａ），（ｂ）に示す例は、図14（ａ）が、信号端子４の載置用基台６から上側に突出した部分を取り囲むように形成されている壁部６ｃが電波吸収体14である例であり、図14（ｂ）が、第２貫通孔６ａの周囲のみ突出させた壁部６ｃが電波吸収体14である例である。図15に示す例は、図14（ａ），（ｂ）のＸ−Ｘ線で切断した要部拡大断面図である。図14（ａ），（ｂ）および図15に示す例のような場合は、基体１の上面から回路基板５の信号線路導体５ｂまでの部分においてエア同軸構造となるので、信号端子４が基体１から突出した部分のほぼ全体においてインピーダンスの不整合が発生しにくくなることに加えて、電波吸収体14である壁部６ｃによって、空間７で共振ノイズが発生したとしても、発生した共振ノイズが壁部６ｃによって遮蔽されるのと同時に、電波吸収体14に吸収されることによって、金属による遮蔽の壁部６ｃの場合より確実に共振ノイズを減少させることができる。その結果、共振ノイズが信号線路導体５ｂを伝送する高周波信号に加わることを抑制し、高周波信号をより良好に伝送することが可能となる。   Further, in the example shown in FIGS. 14A and 14B, the wall portion 6c formed so as to surround the portion of FIG. 14A projecting upward from the mounting base 6 of the signal terminal 4 is shown. 14 is an example in which the electromagnetic wave absorber 14 is shown, and FIG. 14B is an example in which the wall absorber 6 c protruding only around the second through hole 6 a is the electromagnetic wave absorber 14. The example shown in FIG. 15 is an enlarged cross-sectional view of a main part taken along line XX of FIGS. 14 (a) and 14 (b). In the case of the example shown in FIGS. 14A, 14B and 15, since the air coaxial structure is formed in the portion from the upper surface of the base 1 to the signal line conductor 5b of the circuit board 5, the signal terminal 4 is the base. In addition to the fact that impedance mismatching hardly occurs in almost the entire portion protruding from 1, even if resonance noise is generated in the space 7 by the wall portion 6c that is the radio wave absorber 14, the generated resonance noise is not generated. By being absorbed by the radio wave absorber 14 at the same time as being shielded by the wall 6c, the resonance noise can be reduced more reliably than in the case of the wall 6c shielded by metal. As a result, it is possible to suppress the resonance noise from being added to the high-frequency signal transmitted through the signal line conductor 5b, and to transmit the high-frequency signal better.

また、本発明の電子部品収納用パッケージは、上記構成において、基体１の上面には載置部１ｂを囲繞するように枠体２が取着されており、枠体２の内面と、載置用基台６の側面のうち信号端子４が貫通している側の側面との間に、抵抗体15が設けられている。図16（ａ）の要部拡大斜視図および図16（ｂ）の要部拡大断面図（図16（ａ）のＸ−Ｘ線で切断した要部拡大断面図）に示す例は、載置用基台６の側面に、抵抗体15が形成された例であり、図17（ａ）の要部拡大断面図に示す例は、枠体２の内面の載置用基台６に対向する部位に、抵抗体15が形成された例であり、図17（ｂ）の要部拡大断面図に示す例は、載置用基台６の側面および枠体２の内面の載置用基台６に対向する部位の両方に、抵抗体15が形成された例である。さらに、図17（ｃ）の要部拡大断面図に示す例は、枠体２の内面と載置用基台６の側面との間の空間７内に、枠体２の内面および載置用基台６の側面に平行に抵抗体15が壁状に設けられた例である。このような場合は、抵抗体15により、枠体２の内面と載置用基台６の側面との間の共振ノイズを抑えることができ、その結果、共振ノイズが信号線路導体５ｂを伝送する高周波信号に加わることを抑制し、高周波信号をより良好に伝送することが可能となる。   In the electronic component storage package of the present invention, the frame 2 is attached to the upper surface of the base 1 so as to surround the mounting portion 1b. A resistor 15 is provided between the side surface of the base 6 and the side surface through which the signal terminal 4 passes. An example shown in an enlarged perspective view of an essential part in FIG. 16A and an enlarged sectional view of an essential part in FIG. 16B (enlarged sectional view taken along line XX in FIG. 16A) is mounted. This is an example in which the resistor 15 is formed on the side surface of the base 6, and the example shown in the enlarged sectional view of the main part in FIG. 17A is opposed to the mounting base 6 on the inner surface of the frame 2. FIG. 17B is an example in which the resistor 15 is formed at the site, and the example shown in the enlarged cross-sectional view of the main part is a mounting base on the side surface of the mounting base 6 and the inner surface of the frame body 2. This is an example in which the resistor 15 is formed in both of the parts facing 6. Further, in the example shown in the enlarged sectional view of the main part of FIG. 17C, the inner surface of the frame body 2 and the mounting surface are placed in the space 7 between the inner surface of the frame body 2 and the side surface of the mounting base 6. This is an example in which a resistor 15 is provided in a wall shape parallel to the side surface of the base 6. In such a case, the resistor 15 can suppress the resonance noise between the inner surface of the frame 2 and the side surface of the mounting base 6, and as a result, the resonance noise is transmitted through the signal line conductor 5b. It is possible to suppress the addition to the high frequency signal and to transmit the high frequency signal better.

抵抗体15は、図16（ａ）に示す例のように、載置用基台６の側面の全面に形成されていることが好ましく、また図17（ａ）に示す例のように、抵抗体15が枠体２の内面に形成さ
れている場合も、枠体２の内面の載置用基台６に対向する部位の全面に抵抗体15が形成されていることが好ましい。さらに、図17（ｃ）に示す例のように、空間７内に壁状の抵抗体15を形成する場合もまた、載置用基台６の側面と同じ幅であることが好ましい。このような場合は、枠体２の内面の全面や載置用基台６の側面の全面に形成された抵抗体15で、枠体２の内面と載置用基台６の側面との間の共振ノイズを効率よく抑えることができる。 The resistor 15 is preferably formed on the entire side surface of the mounting base 6 as in the example shown in FIG. 16A, and the resistor 15 is resistant as in the example shown in FIG. Even when the body 15 is formed on the inner surface of the frame body 2, the resistor body 15 is preferably formed on the entire surface of the inner surface of the frame body 2 facing the mounting base 6. Furthermore, as in the example shown in FIG. 17C, when the wall-shaped resistor 15 is formed in the space 7, it is preferable that the width is the same as the side surface of the mounting base 6. In such a case, the resistor 15 formed on the entire inner surface of the frame 2 and the entire side surface of the mounting base 6, between the inner surface of the frame 2 and the side surface of the mounting base 6. The resonance noise can be efficiently suppressed.

図16（ａ），（ｂ）に示す例のように、抵抗体15を載置用基台６の側面に形成する場合は、例えば、載置用基台６の側面を露出させた状態で窒化タンタルやニッケル−クロム、ニッケル−クロム−シリコン、タングステン−シリコン、モリブデン−シリコン、タングステン、モリブデン、チタン、クロム等から成る層をイオンプレーティング法やスパッタリング法、蒸着法等の薄膜形成技術を採用することによって被着させるとともにその厚みを0.01μｍ乃至10μｍの範囲とすることが好ましく、好適には0.05μｍ乃至１μｍの範囲とするのがよい。その厚みは0.01μｍ未満であると抵抗体15が薄すぎて共振ノイズの吸収が不十分となりやすく、また10μｍを超えると抵抗体15を薄膜形成技術により形成する際に大きな応力が発生するとともにこれが内部に内在し、内在応力によって載置用基台６と接着層２ａとの接合強度が低下してしまう傾向にある。   When the resistor 15 is formed on the side surface of the mounting base 6 as in the example shown in FIGS. 16A and 16B, for example, the side surface of the mounting base 6 is exposed. Thin film formation technology such as ion plating, sputtering, and evaporation is used for layers made of tantalum nitride, nickel-chromium, nickel-chromium-silicon, tungsten-silicon, molybdenum-silicon, tungsten, molybdenum, titanium, chromium, etc. The thickness is preferably in the range of 0.01 μm to 10 μm, and more preferably in the range of 0.05 μm to 1 μm. If the thickness is less than 0.01 μm, the resistor 15 is too thin to absorb resonance noise easily, and if it exceeds 10 μm, a large stress is generated when the resistor 15 is formed by a thin film forming technique. It exists inside, and there exists a tendency for the joint strength of the mounting base 6 and the contact bonding layer 2a to fall by internal stress.

また、図17（ａ）に示す例のように、抵抗体15を枠体２の内面の載置用基台６に対向する部位に形成する場合は、枠体２の内面を露出させた状態にしておき、上述したような載置用基台６の側面に抵抗体15を形成する場合と同様の薄膜形成技術を用い、抵抗体15の厚みも同様の厚みとすればよい。   Further, as in the example shown in FIG. 17A, when the resistor 15 is formed in a portion of the inner surface of the frame 2 facing the mounting base 6, the inner surface of the frame 2 is exposed. In addition, the thin film forming technique similar to that for forming the resistor 15 on the side surface of the mounting base 6 as described above may be used, and the thickness of the resistor 15 may be set to the same thickness.

このように、空間７が上述したような50μｍ以上0.1ｍｍ以下の小さい隙間で、載置用
基台６の側面および枠体２の内面との間に電波吸収体14を形成することが困難な場合でも、載置用基台６の側面および枠体２の内面に、厚みの薄い抵抗体を薄膜形成技術を用いて形成することができ、抵抗体15により、枠体２の内面と載置用基台６の側面との間の共振ノイズを抑えることができ、その結果、共振ノイズが信号線路導体５ｂを伝送する高周波信号に加わることを抑制し、高周波信号をより良好に伝送することが可能となる。 As described above, it is difficult to form the radio wave absorber 14 between the side surface of the mounting base 6 and the inner surface of the frame body 2 with a small gap of 50 μm or more and 0.1 mm or less as described above. Even in this case, a thin resistor can be formed on the side surface of the mounting base 6 and the inner surface of the frame body 2 by using a thin film forming technique, and the inner surface of the frame body 2 is mounted by the resistor 15. Resonance noise with the side surface of the base 6 can be suppressed, and as a result, the resonance noise can be suppressed from being added to the high-frequency signal transmitted through the signal line conductor 5b, and the high-frequency signal can be transmitted better. It becomes possible.

本発明の電子装置は、基体１の載置部１ｂに載置用基台６および電子部品８が接合され、そして、電子部品８の電極と電気的に接続する信号線路導体５ｂを有する回路基板５を載置用基台６の上面に載置して接合し、信号線路導体５ｂと信号端子４とを半田を介して電気的に接合するとともに電子部品８と信号線路導体５ｂとをボンディングワイヤ10で電気的に接続する。しかる後、図２に示す例では基体１の上面外周部に、または図３（ａ）,（ｂ）に示す例では枠体２の上面に、蓋体11を半田付け法やシーム溶接法により接合す
ることにより構成される。 The electronic device of the present invention is a circuit board having a signal line conductor 5b in which a mounting base 6 and an electronic component 8 are joined to a mounting portion 1b of a base 1 and electrically connected to an electrode of the electronic component 8. 5 is placed on the upper surface of the mounting base 6 and joined, the signal line conductor 5b and the signal terminal 4 are electrically joined via solder, and the electronic component 8 and the signal line conductor 5b are bonded to each other by a bonding wire. Connect 10 electrically. Thereafter, the lid 11 is soldered or seam-welded on the outer periphery of the upper surface of the substrate 1 in the example shown in FIG. 2 or on the upper surface of the frame 2 in the examples shown in FIGS. 3 (a) and 3 (b). Constructed by joining.

基体１は、電子部品８を支持するための支持部材として機能するとともに第１貫通孔１ａが形成されており、この第１貫通孔１ａには、基体１から突出した信号端子４が封止材３によって固定されている。基体１の上面には、回路基板５が載置用基台６を介して載置される載置部１ｂを有しており、この載置部１ｂに、載置用基台６がＡｕ−Ｓｎ半田等の低融点ろう材を介して接着固定されている。   The base body 1 functions as a support member for supporting the electronic component 8 and has a first through hole 1a. The signal terminal 4 protruding from the base body 1 is sealed in the first through hole 1a. 3 is fixed. On the upper surface of the base body 1, a circuit board 5 is provided with a mounting portion 1 b on which a mounting base 6 is mounted, and the mounting base 6 is Au − on the mounting portion 1 b. It is bonded and fixed via a low melting point brazing material such as Sn solder.

基体１は、Ｆｅ−Ｎｉ−Ｃｒ合金(ＪＩＳ規格のＳＵＳ304、ＳＵＳ310等)やＦｅ-Ｎｉ-Ｃｒ-Ｍｏ合金(ＪＩＳ規格のＳＵＳ303、ＳＵＳ316等)等のステンレス鋼や、Ｆｅ−Ｎｉ
−Ｃｏ合金や、Ｃｕ−Ｚｎ合金等の金属材料から成る。 The substrate 1 is made of stainless steel such as Fe-Ni-Cr alloy (JIS standard SUS304, SUS310, etc.) or Fe-Ni-Cr-Mo alloy (JIS standard SUS303, SUS316, etc.), Fe-Ni, etc.
-It consists of metal materials, such as Co alloy and Cu-Zn alloy.

例えば、基体１の上面に載置実装される電子部品８が、強誘電体素子であるＬＮ(ニオ
ブ酸リチウム)による変調素子（以下、ＬＮ素子という）の場合、ＬＮ素子の熱膨張係数15.4×10-６／℃と近似しているＳＵＳ303(熱膨張係数14.6×10-6／℃)、ＳＵＳ304(熱膨
張係数17.3×10-6／℃)、ＳＵＳ310(熱膨張係数15.8×10-6／℃)、ＳＵＳ316(熱膨張係数16.0×10-6／℃)等のＦｅ−Ｎｉ−Ｃｒ合金やＦｅ−Ｎｉ−Ｃｒ−Ｍｏ合金の金属材料を
用いて、基体１を作製することが好ましい。この場合、基体１の上面にＬＮ素子を載置実装して電子装置とした場合、基体１と電子部品８との熱膨張係数が近似しているため、電子部品８が作動した際に発生する熱や、電子部品８を基体１へろう材を介して実装するための加熱により、熱膨張係数の差に起因する応力で、電子部品８が基体１から剥がれたりすることがなくなるので好ましい。 For example, when the electronic component 8 placed and mounted on the upper surface of the substrate 1 is a ferroelectric element LN (lithium niobate) modulation element (hereinafter referred to as LN element), the thermal expansion coefficient of the LN element is 15.4 × 10 -6 / ° C. and in which SUS303 (thermal expansion coefficient of 14.6 × 10 -6 / ℃) which approximates, SUS304 (thermal expansion coefficient of 17.3 × 10 -6 / ℃), SUS310 ( thermal expansion coefficient of 15.8 × 10 -6 / ℃ ), SUS316 (thermal expansion coefficient 16.0 × 10 −6 / ° C.) or the like, it is preferable to produce the substrate 1 using a metal material such as Fe—Ni—Cr alloy or Fe—Ni—Cr—Mo alloy. In this case, when an LN element is placed and mounted on the upper surface of the base body 1 to form an electronic device, the thermal expansion coefficients of the base body 1 and the electronic component 8 are approximated, and therefore, generated when the electronic component 8 is activated. It is preferable that the electronic component 8 is not peeled off from the base body 1 due to heat or heat for mounting the electronic component 8 on the base body 1 via the brazing material due to the stress caused by the difference in thermal expansion coefficient.

また、基体１は、基体１を形成する金属材料のインゴットに圧延加工や打ち抜き加工等の従来周知の金属加工法を施すことによって所定の形状に製作される。また、その表面に耐蝕性に優れ、かつ、ろう材との濡れ性に優れる金属を被着させておくことが好ましい。具体的には厚さ0.5〜９μｍのＮｉ層と厚さ0.5〜９μｍのＡｕ層を順次めっき法により被着させておくのがよく、基体１が酸化腐食するのを有効に防止するとともに、基体１の上面に回路基板４を載置するための載置用基台５を強固に接着固定させることができる。   The base body 1 is manufactured in a predetermined shape by applying a conventionally known metal processing method such as rolling or punching to an ingot of a metal material forming the base body 1. Further, it is preferable to deposit a metal having excellent corrosion resistance and excellent wettability with the brazing material on the surface. Specifically, a Ni layer having a thickness of 0.5 to 9 μm and an Au layer having a thickness of 0.5 to 9 μm are preferably sequentially deposited by a plating method, effectively preventing the substrate 1 from being oxidatively corroded and The mounting base 5 for mounting the circuit board 4 on the upper surface of 1 can be firmly bonded and fixed.

枠体２は、電子部品収納用パッケージ外部との電磁的遮蔽を行なう機能を有する。枠体２は、基体１との接合における熱歪みを小さくし接合を強固なものとするために、基体１の熱膨張係数に近似する金属材料が用いられる。この枠体２は、基体１と同様に、その材料のインゴットに圧延加工や打ち抜き加工等の従来周知の金属加工法を施すことにより所定の形状に製作される。そして、基体１と同様に、その表面に耐蝕性に優れ、かつ、ろう材との濡れ性に優れる金属を被着させておくことが好ましい。具体的には厚さ0.5〜９μ
ｍのＮｉ層と厚さ0.5〜９μｍのＡｕ層を順次めっき法により被着させておくのがよく、
枠体２が酸化腐食するのを有効に防止することができる。 The frame 2 has a function of electromagnetically shielding the outside of the electronic component storage package. For the frame body 2, a metal material that approximates the thermal expansion coefficient of the base body 1 is used in order to reduce thermal distortion in joining to the base body 1 and to strengthen the joining. Similar to the base body 1, the frame body 2 is manufactured in a predetermined shape by subjecting an ingot of the material to a conventionally known metal processing method such as rolling or punching. And like the base | substrate 1, it is preferable to make the surface adhere | attach the metal which is excellent in corrosion resistance and is excellent in wettability with a brazing material. Specifically, the thickness is 0.5-9μ
m Ni layer and 0.5-9 μm thick Au layer should be deposited sequentially by plating,
It is possible to effectively prevent the frame body 2 from being oxidatively corroded.

枠体２は、基体１と同じ金属材料を用いて、基体１と枠体２とを一体成形することが好ましい。この一体成形の方法としては、上述したＦｅ−Ｎｉ−Ｃｒ合金やＦｅ−Ｎｉ−Ｃｒ−Ｍｏ合金等の金属材料のインゴットに切削加工や放電加工等の従来周知の金属加工法を施すことにより所定の形状に製作することができる。基体１と枠体２とを一体成形した場合は、組み立て時の接合ずれを生じるという不具合が発生することがなくなるので好ましい。   The frame body 2 is preferably formed by integrally forming the base body 1 and the frame body 2 using the same metal material as the base body 1. As this integral molding method, the metal material ingot such as Fe-Ni-Cr alloy or Fe-Ni-Cr-Mo alloy described above is subjected to a conventionally known metal working method such as cutting or electric discharge machining. It can be manufactured in the shape of When the base body 1 and the frame body 2 are integrally molded, it is preferable that the problem of joining displacement during assembly does not occur.

枠体２は、図11に示す例のように、枠体２の内面から載置用基台６側に突出した突部２ａを有し、突部２ａは、載置用基台６の側面に当接していることが好ましい。この場合、上述したように、突部２ａによって形成された空間７に接合用のろう材13を溜めることができるので、枠体２の内面と載置用基台６の側面とを強固に接合することができ、その結果、載置用基台６の側面と枠体２の内面との間の共振の発生を抑制し、高周波信号をより良好に伝送することが可能となる。   As shown in the example shown in FIG. 11, the frame body 2 has a protruding portion 2 a that protrudes from the inner surface of the frame body 2 toward the mounting base 6, and the protruding portion 2 a is a side surface of the mounting base 6. It is preferable that it contacts. In this case, as described above, since the brazing filler metal 13 can be stored in the space 7 formed by the protrusions 2a, the inner surface of the frame 2 and the side surface of the mounting base 6 are firmly bonded. As a result, it is possible to suppress the occurrence of resonance between the side surface of the mounting base 6 and the inner surface of the frame body 2 and to transmit a high-frequency signal better.

また、突部２ａは、枠体２を作成する途中で圧延加工や切削加工等の従来周知の金属加工法を施すことで形成しても良いし、枠体２を形成した後に突部２ａの形状をした部品をろう材等で接着して形成してもよい。   Further, the protrusion 2a may be formed by applying a conventionally known metal processing method such as rolling or cutting in the course of creating the frame 2, or after forming the frame 2, the protrusion 2a The shaped part may be formed by bonding with a brazing material or the like.

封止材３は、ガラスやセラミックスなどの絶縁性の無機材料から成り、信号端子４と基体１との絶縁性を確保するとともに、信号端子４を基体１の第１貫通孔１ａ内に固定する機能を有する。このような封止材３の例としては、ホウケイ酸ガラス，ソーダガラス等のガラスおよびこれらのガラスに封止材３の熱膨張係数や比誘電率を調整するためのセラミックフィラーを加えたものが挙げられ、インピーダンスマッチングのためにその比誘電率を適宜選択する。比誘電率を低下させるフィラーとしては、酸化リチウム等が挙げられる。例えば、特性インピーダンスを50Ωとするには、第１貫通孔１ａの内径が1.75ｍｍで信号端子３の外径が0.2ｍｍの場合であれば、封止材３の比誘電率が6.8であるものを用いれ
ばよい。また、第１貫通孔１ａの内径が1.65ｍｍで信号端子４の外径が0.25ｍｍの場合であれば、封止材３の比誘電率が５であるものを用いればよい。 The sealing material 3 is made of an insulating inorganic material such as glass or ceramics, ensures insulation between the signal terminal 4 and the base 1, and fixes the signal terminal 4 in the first through hole 1 a of the base 1. It has a function. Examples of such a sealing material 3 include glass such as borosilicate glass and soda glass, and a glass filler added with a ceramic filler for adjusting the thermal expansion coefficient and relative dielectric constant of the sealing material 3. The relative dielectric constant is appropriately selected for impedance matching. Examples of the filler that lowers the dielectric constant include lithium oxide. For example, if the characteristic impedance is 50Ω, the relative permittivity of the sealing material 3 is 6.8 when the inner diameter of the first through hole 1a is 1.75 mm and the outer diameter of the signal terminal 3 is 0.2 mm. May be used. Further, when the inner diameter of the first through hole 1a is 1.65 mm and the outer diameter of the signal terminal 4 is 0.25 mm, the sealing material 3 having a relative dielectric constant of 5 may be used.

信号端子４を第１貫通孔１ａに充填された封止材３を貫通して固定するには、例えば、封止材３がガラスから成る場合は、周知の粉体プレス法や押し出し成形法を用いてガラス粉末を成形して、内径を信号端子４の外径に合わせ、外径を第１貫通孔１ａの内径に合わせた筒状の成形体を作製し、この封止材３の成形体を第１貫通孔１ａに挿入し、さらに信号端子４をこの封止材３の孔に挿通し、しかる後、所定の温度に加熱して封止材３を溶融させた後、冷却して固化させることにより行なうことができる。これにより、封止材３により第１貫通孔１ａが気密に封止されるとともに、封止材３によって信号端子４が基体１と絶縁されて固定され、同軸線路が形成される。   In order to fix the signal terminal 4 through the sealing material 3 filled in the first through-hole 1a, for example, when the sealing material 3 is made of glass, a known powder pressing method or extrusion molding method is used. Using this, the glass powder is molded, the inner diameter is matched with the outer diameter of the signal terminal 4, the cylindrical shaped body is made with the outer diameter matched with the inner diameter of the first through hole 1 a, and the molded body of the sealing material 3 Is inserted into the first through hole 1a, and the signal terminal 4 is further inserted into the hole of the sealing material 3, and then heated to a predetermined temperature to melt the sealing material 3, and then cooled and solidified. This can be done. Accordingly, the first through hole 1a is hermetically sealed by the sealing material 3, and the signal terminal 4 is insulated and fixed from the base body 1 by the sealing material 3 to form a coaxial line.

信号端子４は、Ｆｅ−Ｎｉ−Ｃｏ合金やＦｅ−Ｎｉ合金等の金属から成り、例えば信号端子４がＦｅ−Ｎｉ−Ｃｏ合金から成る場合は、この合金のインゴット（塊）に圧延加工や打ち抜き加工等の金属加工方法を施すことによって、長さが1.5〜22ｍｍ、直径が0.1〜0.5ｍｍの線状に製作される。   The signal terminal 4 is made of a metal such as an Fe—Ni—Co alloy or an Fe—Ni alloy. For example, when the signal terminal 4 is made of an Fe—Ni—Co alloy, rolling or punching is performed on an ingot of the alloy. By applying a metal processing method such as processing, a wire having a length of 1.5 to 22 mm and a diameter of 0.1 to 0.5 mm is manufactured.

信号端子４の直径が0.1ｍｍより小さい場合は、信号端子４が曲がりやすいものになり
取り扱い上の少しの不注意でも信号端子４が曲がってしまいやすくなる。信号端子４が曲がってしまうと、エア同軸部を有する場合は、この部分でのインピーダンスが狂いやすくなり、また、外部回路との接続の作業性が低下する場合がある。また信号端子４の直径が0.5ｍｍを超えると、インピーダンス整合を行うために必要な第１貫通孔１ａおよび第２
貫通孔６ａの径が不要に大きくなるため、電子装置が小型化し難くなるので、信号端子４の直径は0.1〜0.5ｍｍであるのが好ましい。 When the diameter of the signal terminal 4 is smaller than 0.1 mm, the signal terminal 4 is easily bent, and the signal terminal 4 is easily bent even with a little carelessness in handling. If the signal terminal 4 is bent, when the air coaxial portion is provided, the impedance at this portion is likely to go wrong, and the workability of connection with an external circuit may be lowered. Further, when the diameter of the signal terminal 4 exceeds 0.5 mm, the first through hole 1a and the second hole necessary for impedance matching are used.
Since the diameter of the through-hole 6a becomes unnecessarily large, it is difficult to reduce the size of the electronic device. Therefore, the diameter of the signal terminal 4 is preferably 0.1 to 0.5 mm.

基体１の下面には接地端子９が接合される。接地端子９は、信号端子４と同様にして作製され、基体１の下面にロウ材等を用いて接合される。位置決めの容易性と接合強度の向上のために、予め基体１の下面に穴を形成しておき、その穴に接地端子９を挿入して接合してもよい。また、同様の理由で、基体１の下面に当接するように接地端子９に鍔をつけて、接合面積をより大きくしてもよい。このようにして基体１に接地端子９を接合することにより、接地端子９を外部電気回路に接続した際には、基体１が接地導体としても機能する。   A ground terminal 9 is joined to the lower surface of the substrate 1. The ground terminal 9 is manufactured in the same manner as the signal terminal 4 and bonded to the lower surface of the base 1 using a brazing material or the like. In order to facilitate positioning and improve the bonding strength, a hole may be formed in advance on the lower surface of the substrate 1, and the ground terminal 9 may be inserted into the hole for bonding. For the same reason, the grounding terminal 9 may be provided with a ridge so as to come into contact with the lower surface of the base 1 to increase the bonding area. By joining the ground terminal 9 to the base body 1 in this way, the base body 1 also functions as a ground conductor when the ground terminal 9 is connected to an external electric circuit.

回路基板５は、絶縁基板５ａがアルミナ（Ａｌ２Ｏ３）セラミックスまたは窒化アルミニウム（ＡｌＮ）セラミックス絶縁基板５ａ等のセラミックスから成り、インピーダンス整合用の基板として機能する。回路基板５は、絶縁基板５ａの上面に高周波信号の伝送線路としての信号線路導体５ｂが形成され、絶縁基板５ａの下面には、接地導体５ｃが形成されている。この接地導体５ｃは、Ａｕ−Ｓｎ合金等の低融点ろう材を介して載置用基台５の上面に接合している。このように、回路基板５は、絶縁基板５ａと信号線路導体５ｂと接地導体５ｃとで構成されている。 In the circuit board 5, the insulating substrate 5a is made of ceramics such as alumina (Al 2 O 3 ) ceramics or aluminum nitride (AlN) ceramics insulating substrate 5a, and functions as a substrate for impedance matching. In the circuit board 5, a signal line conductor 5b as a high-frequency signal transmission line is formed on the upper surface of the insulating substrate 5a, and a ground conductor 5c is formed on the lower surface of the insulating substrate 5a. The ground conductor 5c is joined to the upper surface of the mounting base 5 via a low melting point brazing material such as an Au—Sn alloy. As described above, the circuit board 5 includes the insulating substrate 5a, the signal line conductor 5b, and the ground conductor 5c.

信号線路導体５ｂは、信号端子４と同じ例えば50Ωのインピーダンスとなるように形成されたマイクロストリップ線路であり、その一端側は電子部品８とボンディングワイヤ10を介して接続され、他端側は信号端子４の先端部に接合されることにより、信号端子４と電子部品８とが電気的に接続される。また、接地電位（グランド）は、外部回路基板12の接地配線導体12ｃから基体１と載置用基台６を介して回路基板５の下面の接地導体５ｃとろう材等を介して電気的に接続している。回路基板５の信号線路導体５ｂの特性インピーダンスを50Ωとするには、マイクロストリップ構造の回路基板５の場合であれば、誘電率9.5である96％酸化アルミニウム質焼結体からなり、厚みが0.3ｍｍである絶縁基板５ａの下面に接地導体５ｃを形成し、上面の信号線路導体５ｂを、幅が0.3ｍｍで厚みが４μｍ
のものとすればよく、絶縁基板５ａが同じ材料からなり、厚みが0.5ｍｍである場合には
、信号線路導体５ｂを厚みが４μｍで幅が0.5ｍｍのものとすればよい。 The signal line conductor 5b is a microstrip line formed so as to have the same impedance as, for example, 50Ω as the signal terminal 4, and one end side thereof is connected to the electronic component 8 via the bonding wire 10 and the other end side is a signal. By joining to the tip of the terminal 4, the signal terminal 4 and the electronic component 8 are electrically connected. The ground potential (ground) is electrically connected from the ground wiring conductor 12c of the external circuit board 12 through the base 1 and the mounting base 6 through the ground conductor 5c on the lower surface of the circuit board 5 and the brazing material. Connected. In order to set the characteristic impedance of the signal line conductor 5b of the circuit board 5 to 50Ω, in the case of the circuit board 5 having a microstrip structure, the circuit board 5 is made of a 96% aluminum oxide sintered body having a dielectric constant of 9.5 and has a thickness of 0.3. The grounding conductor 5c is formed on the lower surface of the insulating substrate 5a, and the signal line conductor 5b on the upper surface has a width of 0.3 mm and a thickness of 4 μm.
When the insulating substrate 5a is made of the same material and has a thickness of 0.5 mm, the signal line conductor 5b may have a thickness of 4 μm and a width of 0.5 mm.

回路基板５の絶縁基板５ａは、例えばアルミナセラミックスからなる場合であれば、酸化アルミニウム，酸化マグネシウム，酸化カルシウム等の原料粉末に適当な有機バインダ，可塑剤，および溶剤を添加混合して得た泥漿物に、従来周知のドクターブレード法やカレンダーロール法を採用することによってセラミックグリーンシート（セラミック生シート）を形成し、次にこのセラミックグリーンシートに適当な打ち抜き加工を施して所定形状となすとともに、必要に応じて複数枚を積層して成形体となし、しかる後、この成形体を約1,600℃の温度で焼成することによって製作される。この焼成後の絶縁基板５ａは、
厚みが約0.2〜0.3ｍｍであり、インピーダンスを例えば50Ωに整合させるために薄く製作される。 If the insulating substrate 5a of the circuit board 5 is made of, for example, alumina ceramics, a slurry obtained by adding and mixing an appropriate organic binder, plasticizer, and solvent to a raw material powder such as aluminum oxide, magnesium oxide, and calcium oxide. A ceramic green sheet (ceramic raw sheet) is formed by adopting a conventionally known doctor blade method or calendar roll method, and then a suitable punching process is performed on the ceramic green sheet to obtain a predetermined shape. If necessary, a plurality of sheets are laminated to form a molded body, and then the molded body is manufactured by firing at a temperature of about 1,600 ° C. The insulating substrate 5a after firing is
The thickness is about 0.2-0.3 mm, and it is made thin to match the impedance to, for example, 50Ω.

信号線路導体５ｂ、接地導体５ｃは、タングステン，モリブデン，マンガン，銅，銀，パラジウム，白金，金等の金属材料からなる。   The signal line conductor 5b and the ground conductor 5c are made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, or gold.

信号線路導体５ｂ、接地導体５ｃは、例えばタングステンからなる場合であれば、タングステンの粉末に有機溶剤，バインダを添加混練して金属ペーストを作製し、絶縁基板５ａとなるセラミックグリーンシートに金属ペーストを所定の配線パターンとなるように、従来周知のスクリーン印刷法を用いて印刷することによって形成する。   If the signal line conductor 5b and the ground conductor 5c are made of tungsten, for example, an organic solvent and a binder are added to the tungsten powder and kneaded to prepare a metal paste, and the metal paste is applied to the ceramic green sheet to be the insulating substrate 5a. A predetermined wiring pattern is formed by printing using a conventionally known screen printing method.

信号線路導体５ｂ、接地導体５ｃは、薄膜加工で作製することもできる。信号線路導体５ｂ、接地導体５ｃを薄膜加工で作製することにより、信号線路導体５ｂ、接地導体５ｃを密着金属層、拡散防止層および主導体層が順次積層された３層構造の導体層とすることができ、高精度なパターンを形成できるので好ましい。   The signal line conductor 5b and the ground conductor 5c can also be produced by thin film processing. By producing the signal line conductor 5b and the ground conductor 5c by thin film processing, the signal line conductor 5b and the ground conductor 5c are formed into a three-layered conductor layer in which an adhesion metal layer, a diffusion prevention layer, and a main conductor layer are sequentially laminated. This is preferable because a highly accurate pattern can be formed.

信号線路導体５ｂ、接地導体５ｃを薄膜加工で作製する場合、例えば以下のようにして作製される。   When the signal line conductor 5b and the ground conductor 5c are manufactured by thin film processing, for example, they are manufactured as follows.

焼成後の絶縁基板５ａに、蒸着法，スパッタリング法，イオンプレーティング法等の薄膜形成法によって信号線路導体５ｂ、接地導体５ｃとなる各層（密着金属層、拡散防止層および主導体層が順次積層された３層構造の導体層）を形成する。その後レジスト膜を形成し、フォトリソ加工、エッチング等の薄膜加工によって信号線路導体５ｂ、接地導体５ｃを形成する。   Each layer (adhesive metal layer, diffusion prevention layer, and main conductor layer) is sequentially laminated on the insulating substrate 5a after firing by a thin film forming method such as vapor deposition, sputtering, or ion plating. A three-layer structure conductor layer) is formed. Thereafter, a resist film is formed, and the signal line conductor 5b and the ground conductor 5c are formed by thin film processing such as photolithography and etching.

載置用基台６は、第１貫通孔１ａに連通し直径が0.23〜1.15ｍｍの第２貫通孔６ａを有している。信号端子４が通る第２貫通孔６ａの直径は、中心に信号端子４が貫通することで特性インピーダンスが50Ωのエア同軸が形成されるような寸法とする。例えば、信号端子４の直径が0.2ｍｍの場合であれば、第２貫通孔６ａの直径は0.46ｍｍとすればよい。   The mounting base 6 has a second through hole 6a that communicates with the first through hole 1a and has a diameter of 0.23 to 1.15 mm. The diameter of the second through hole 6a through which the signal terminal 4 passes is set such that an air coaxial with a characteristic impedance of 50Ω is formed by the signal terminal 4 passing through the center. For example, if the diameter of the signal terminal 4 is 0.2 mm, the diameter of the second through hole 6a may be 0.46 mm.

載置用基台６は、基体１の上面の載置部１ｂにＡｕ−Ｓｎ合金等の低融点ろう材を介して接合しており、載置用基台６の上面には、回路基板５がＡｕ−Ｓｎ合金等の低融点ろう材を介して載置接合している。また、載置用基台６は、基体１の熱膨張係数と、回路基板５の熱膨張係数との中間の熱膨張係数を持つＦｅ−Ｎｉ合金等の金属から成り、温度変化によって、上面に載置する回路基板５に大きな応力が働いて割れたりすることがないようにするための緩衝材としての中継基台として機能する。すなわち、ＬＮ素子の熱膨張係数に合わせた基体１に、直接、回路基板５を載置すると、基体１の熱膨張係数と回路基板５の熱膨張係数との違いによる応力で、回路基板５が割れてしまうことがあるために、基体１の上面の載置部１ｂに載置用基台６を載置し、この載置用基台６の上面に回路基板５を載置するという本発明の構成としている。   The mounting base 6 is joined to the mounting portion 1 b on the upper surface of the base 1 via a low melting point brazing material such as an Au—Sn alloy, and the circuit board 5 is mounted on the upper surface of the mounting base 6. Are placed and bonded via a low melting point brazing material such as an Au-Sn alloy. The mounting base 6 is made of a metal such as an Fe—Ni alloy having a thermal expansion coefficient intermediate between the thermal expansion coefficient of the base 1 and the thermal expansion coefficient of the circuit board 5, and is formed on the upper surface by a temperature change. It functions as a relay base as a buffer material for preventing the circuit board 5 to be placed from cracking due to large stress. That is, when the circuit board 5 is placed directly on the base body 1 that matches the thermal expansion coefficient of the LN element, the circuit board 5 is caused by stress due to the difference between the thermal expansion coefficient of the base body 1 and the thermal expansion coefficient of the circuit board 5. Since the substrate may be broken, the mounting base 6 is mounted on the mounting portion 1 b on the upper surface of the base 1, and the circuit board 5 is mounted on the upper surface of the mounting base 6. The configuration is as follows.

載置用基台６は、例えば基体１がＳＵＳ304（熱膨張係数17.3×10-6／℃）で、回路基
板５がアルミナセラミックス（熱膨張係数6.5×10-6／℃）の場合は、基体１および回路
基板５の中間の熱膨張係数を持つＦｅ−50Ｎｉ合金（熱膨張係数9.9×10-6／℃）の金属
材料からなることが好ましい。この場合、載置用基台６が、基体１および回路基板５の中間の熱膨張係数を持つことで、熱膨張係数の差によって発生する応力が回路基板５に加わることを低減し、回路基板５が割れてしまうことがなくなるので好ましい。 For example, when the base 1 is SUS304 (thermal expansion coefficient 17.3 × 10 −6 / ° C.) and the circuit board 5 is alumina ceramics (thermal expansion coefficient 6.5 × 10 −6 / ° C.) Preferably, it is made of a metal material of an Fe-50Ni alloy (thermal expansion coefficient 9.9 × 10 −6 / ° C.) having a thermal expansion coefficient intermediate between 1 and the circuit board 5. In this case, since the mounting base 6 has an intermediate thermal expansion coefficient between the base 1 and the circuit board 5, it is possible to reduce the stress generated by the difference in the thermal expansion coefficient from being applied to the circuit board 5. 5 is preferable because it does not break.

また、回路基板５が割れないようにするためには、載置用基台６は厚みが１〜２ｍｍであることが好ましい。厚みが１ｍｍ未満であると基体１と回路基板５の熱膨張係数の差によって発生する応力を十分に緩和することができずに回路基板５が割れやすくなる。厚みが２ｍｍを超えると、不要に電子装置の高さが高くなり、装置の薄型化を阻害してしまう。伝送する周波数が高くなるにつれ、伝送特性を高めるために回路基板５を薄くして信号線路導体５ｂを細く形成することが好ましいので、回路基板５を割れ難くするためには載置用基台６は厚みが1.7〜２ｍｍがより好ましい。   In order to prevent the circuit board 5 from being broken, the mounting base 6 preferably has a thickness of 1 to 2 mm. If the thickness is less than 1 mm, the stress generated due to the difference in thermal expansion coefficient between the base 1 and the circuit board 5 cannot be sufficiently relaxed, and the circuit board 5 is easily cracked. If the thickness exceeds 2 mm, the height of the electronic device becomes unnecessarily high and obstructs thinning of the device. As the transmission frequency becomes higher, it is preferable to make the circuit board 5 thinner and the signal line conductor 5b thinner in order to improve the transmission characteristics. Therefore, in order to make the circuit board 5 difficult to break, the mounting base 6 More preferably, the thickness is 1.7-2 mm.

載置用基台６は、その材料のインゴットに圧延加工や打ち抜き加工等の従来周知の金属加工法を施すことで形成できる。   The mounting base 6 can be formed by applying a conventionally known metal processing method such as rolling or punching to the ingot of the material.

載置用基台６は、図９に示す例のように、載置用基台６の側面から枠体２の内面側に突出した突起部６ｂを有し、突起部６ｂは、枠体２の内面に当接していることが好ましい。この場合、突起部６ｂによって形成された空間７に接合用のろ、その結果、載置用基台６の側面と枠体２の内面との間の共振のう材13を溜めることができるので、枠体２の内面と載置用基台６の側面とを強固に接合することができ発生を抑制し、高周波信号をより良好に伝送することが可能となる。   As shown in the example shown in FIG. 9, the mounting base 6 has a protrusion 6 b that protrudes from the side surface of the mounting base 6 toward the inner surface of the frame 2, and the protrusion 6 b is the frame 2. It is preferable to be in contact with the inner surface. In this case, the space for the joining formed in the space 7 formed by the protrusion 6b can be stored, and as a result, the resonance material 13 between the side surface of the mounting base 6 and the inner surface of the frame 2 can be stored. In addition, the inner surface of the frame 2 and the side surface of the mounting base 6 can be firmly joined, and the occurrence can be suppressed and the high-frequency signal can be transmitted better.

また、突起部６ｂは載置用基体６を作成する途中で圧延加工や切削加工等の従来周知の金属加工法を施すことで形成しても良いし、載置用基体６を形成した後に突起部６ｂの形状をした部品をろう材等で接着して形成してよい。   Further, the protrusion 6b may be formed by applying a conventionally known metal processing method such as rolling or cutting in the course of forming the mounting base 6, or after the mounting base 6 is formed. The part having the shape of the part 6b may be formed by bonding with a brazing material or the like.

蓋体11は、図２に示す例では基体１の上面外周部に、または図３（ａ）,（ｂ）に示す
例では枠体２の上面に、半田付け法やシーム溶接法により接合され、電子部品８を電子部品収納用パッケージの中に気密封止するものである。蓋体11の材料は、Ｆｅ−Ｎｉ−Ｃｏ合金等の金属材料やアルミナセラミックス等のセラミックスから成り、枠体２上面にＡｕ−Ｓｎ合金等の低融点ろう材を介して接合したり、シーム溶接等の溶接により接合することで、電子部品８を電子部品収納用パッケージ内に封止する。 The lid 11 is joined to the outer peripheral portion of the upper surface of the base 1 in the example shown in FIG. 2 or to the upper surface of the frame 2 in the examples shown in FIGS. 3A and 3B by soldering or seam welding. The electronic component 8 is hermetically sealed in an electronic component storage package. The material of the lid 11 is made of a metal material such as Fe-Ni-Co alloy or ceramics such as alumina ceramic, and is joined to the upper surface of the frame 2 via a low melting point brazing material such as Au-Sn alloy or seam welding. The electronic component 8 is sealed in the electronic component storage package by bonding by welding or the like.

１・・・・・・・基体
１ａ・・・・・・第１貫通孔
１ｂ・・・・・・載置部
２・・・・・・・枠体
２ａ・・・・・・突部
２ｂ・・・・・・枠体の切り欠き
２ｃ・・・・・・段差部
３・・・・・・・封止材
４・・・・・・・信号端子
５・・・・・・・回路基板
５ａ・・・・・・絶縁基板
５ｂ・・・・・・信号線路導体
５ｃ・・・・・・接地導体
６・・・・・・・載置用基台
６ａ・・・・・・第２貫通孔
６ｂ・・・・・・突起部
６ｃ・・・・・・壁部
６ｄ・・・・・・載置用基台の切り欠き
７・・・・・・・空間
８・・・・・・・電子部品
９・・・・・・・接地端子
１０・・・・・・ボンディングワイヤ
１１・・・・・・蓋体
１２・・・・・・外部回路基板
１２ａ・・・・・絶縁基体
１２ｂ・・・・・信号配線導体
１２ｃ・・・・・接地配線導体
１３・・・・・・ろう材
１４・・・・・・電波吸収体
１５・・・・・・抵抗体 DESCRIPTION OF SYMBOLS 1 .... Base | substrate 1a ..... 1st through-hole 1b ..... Placement part 2 ....... Frame body 2a ...... Projection part 2b Turn the ...... frame outs 2c ...... stepped portion 3 ......... sealing member 4 ......... signal terminal 5 ....... circuit Substrate 5a ... Insulating substrate 5b ... Signal line conductor 5c ... Grounding conductor ... 2 through-hole 6b ··· Projection 6c ··· Wall 6d ··· Notch in mounting base 7 ········ Space 8 ··· ... Electronic components 9 ... Grounding terminal 10 ... Bonding wire 11 ... Lid 12 ... External circuit board 12a ... Insulation Base 12b ... Signal wiring conductor 12c ... · Ground wiring conductor 13 ...... brazing material 14 ...... wave absorber 15 ...... resistor

Claims (6)

上面から下面にかけて貫通する第１貫通孔を有しているとともに上面に電子部品が搭載される基体と、前記基体の上面の載置部に載置された載置用基台と、絶縁基板の上面に信号線路導体が形成されているとともに前記載置用基台の上面に載置接合された回路基板と、前記第１貫通孔に充填された封止材を貫通して固定された信号端子とを具備しており、前記載置用基台は、前記第１貫通孔に連通している第２貫通孔を有しており、前記信号端子の一端が前記第２貫通孔を通って前記載置用基台の上面から突出して、前記信号線路導体に電気的に接続されていることを特徴とする電子部品収納用パッケージ。 A base having a first through-hole penetrating from the upper surface to the lower surface and mounting an electronic component on the upper surface; a mounting base mounted on a mounting portion on the upper surface of the base; and an insulating substrate A signal terminal having a signal line conductor formed on the upper surface and mounted and bonded to the upper surface of the mounting base, and a signal terminal fixed through the sealing material filled in the first through hole The mounting base has a second through hole that communicates with the first through hole, and one end of the signal terminal passes through the second through hole. A package for storing electronic parts, characterized in that it protrudes from the top surface of the mounting base and is electrically connected to the signal line conductor. 前記基体の上面には前記載置部を囲繞するように枠体が取着されており、該枠体と前記信号端子との間には前記載置用基台の上面に前記信号端子の一端よりも高さが高い壁部が形成されていることを特徴とする請求項１記載の電子部品収納用パッケージ。 A frame body is attached to the upper surface of the base so as to surround the mounting portion, and one end of the signal terminal is placed on the upper surface of the mounting base between the frame body and the signal terminal. The electronic component storage package according to claim 1, wherein a wall portion having a height higher than the height is formed. 前記壁部は、前記信号端子の前記載置用基台から上側に突出した部分を取り囲むように形成されていることを特徴とする請求項２記載の電子部品収納用パッケージ。 3. The electronic component storage package according to claim 2, wherein the wall portion is formed so as to surround a portion protruding upward from the mounting base of the signal terminal. 前記壁部が、電波吸収体を含むことを特徴とする請求項２または請求項３記載の電子部品収納用パッケージ。 4. The electronic component storage package according to claim 2, wherein the wall portion includes a radio wave absorber. 前記基体の上面には前記載置部を囲繞するように前記枠体が取着されており、該枠体の内面と、前記載置用基台の側面のうち前記信号端子が貫通している側の側面との間に、抵抗体が設けられていることを特徴とする請求項１乃至請求項４記載のいずれかに記載の電子部品収納用パッケージ。 The frame body is attached to the upper surface of the base body so as to surround the mounting portion, and the signal terminal passes through the inner surface of the frame body and the side surface of the mounting base. 5. The electronic component storage package according to claim 1, wherein a resistor is provided between the side surface and the side surface. 請求項１乃至請求項５のいずれかに記載の電子部品収納用パッケージと、該電子部品収納用パッケージの前記基体に搭載されているとともに前記回路基板の前記信号線路導体に電気的に接続された電子部品と、該電子部品を覆うように設けられた蓋体とを具備していることを特徴とする電子装置。 6. The electronic component storage package according to claim 1, wherein the electronic component storage package is mounted on the base body of the electronic component storage package and is electrically connected to the signal line conductor of the circuit board. An electronic apparatus comprising: an electronic component; and a lid provided so as to cover the electronic component.
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Publication number Priority date Publication date Assignee Title
JP2014179432A (en) * 2013-03-14 2014-09-25 Kyocera Corp Package for mounting electronic component and electronic device using the same
JP2019129209A (en) * 2018-01-24 2019-08-01 京セラ株式会社 Wiring board, package for electronic component, and electronic device

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JP2001217332A (en) * 2000-01-31 2001-08-10 Hitachi Ltd High frequency circuit package
JP2004031573A (en) * 2002-06-25 2004-01-29 Oki Electric Ind Co Ltd Optical transmission/reception module
JP2004253419A (en) * 2003-02-18 2004-09-09 Sumitomo Electric Ind Ltd Optical semiconductor package
JP2007123806A (en) * 2005-09-29 2007-05-17 Kyocera Corp Electronic component mounting substrate and electronic device

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JPH0682855U (en) * 1993-04-30 1994-11-25 京セラ株式会社 Package for semiconductor device
JP2001217332A (en) * 2000-01-31 2001-08-10 Hitachi Ltd High frequency circuit package
JP2004031573A (en) * 2002-06-25 2004-01-29 Oki Electric Ind Co Ltd Optical transmission/reception module
JP2004253419A (en) * 2003-02-18 2004-09-09 Sumitomo Electric Ind Ltd Optical semiconductor package
JP2007123806A (en) * 2005-09-29 2007-05-17 Kyocera Corp Electronic component mounting substrate and electronic device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014179432A (en) * 2013-03-14 2014-09-25 Kyocera Corp Package for mounting electronic component and electronic device using the same
JP2019129209A (en) * 2018-01-24 2019-08-01 京セラ株式会社 Wiring board, package for electronic component, and electronic device

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