JP5334887B2 - Electronic component mounting package and electronic device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting package capable of excellently transmitting even a high frequency signal of 25 GHz or higher by reducing impedance mismatching from a signal terminal to a circuit board. <P>SOLUTION: The invention relates to an electronic component mounting package including a substrate 1 comprised of a metal having a through-hole 1a, a signal terminal 3 fixed through a sealing 2 filling the through-hole 1a, and a circuit board 4 which is mounted on an upper surface of the substrate 1 and in which a signal line conductor 4b is formed from an upper surface of an insulated substrate 4a to the middle of its side face, wherein the signal line conductor 4b positioned on the side face of the insulated substrate 4a and a side face of a portion of the signal terminal 3 protruding from the upper surface of the substrate 1 are abutted and connected. An average impedance from the portion of the signal terminal 3 protruding from the substrate 1 to the signal line conductor 4b on the upper surface of the insulated substrate 4a is made closer to a predetermined value, thereby also reducing a transmission loss. Thus, a high frequency signal can be excellently transmitted. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an electronic component mounting package for transmitting a high-frequency signal of 10 GHz or more, and an electronic apparatus using the same, which are used in optical communication, microwave communication, millimeter wave communication, and the like.

  In recent years, the demand for high-speed communication at a transmission distance of 40 km or less has increased rapidly, and research and development on high-speed and large-capacity information transmission has been promoted. In particular, high-speed electronic devices that receive and transmit optical signals using optical communication devices are attracting attention, and high-output and high-speed optical signals by electronic devices have been researched and developed as issues to improve transmission capacity. ing.

A conventional electronic component mounting package for such an electronic device includes, as shown in a cross-sectional view in FIG. 12, a disc-shaped metal base 101 provided with an electronic component mounting portion at a substantially central position. A through hole 101a penetrating from the upper surface to the lower surface is provided, and the signal terminal 103 is fixed through the sealing material 102 made of insulating glass filled in the through hole 101a. Further, a ground terminal 106 is connected to the lower surface of the base 101 between the two through holes 101a and 101a. Furthermore, an electronic component 105 used in an optical communication device including an optical semiconductor element such as an LD (Laser Diode) or a PD (Photo Diode) is mounted on the mounting portion of the base 101, The electronic component 105 and the signal terminal 103 are electrically connected by the bonding wire 107, and a metal lid is welded or brazed so as to cover the electronic component 105 on the outer peripheral region of the upper surface of the base 101. The electronic device is obtained by joining and sealing hermetically (see, for example, Patent Document 1).

In such a conventional electronic component mounting package, the impedance of the portion of the signal terminal 103 protruding from the base 101 and the bonding wire 107 connecting the signal terminal 103 and the electronic component 105 is high, resulting in signal transmission loss. There was a problem of being big. On the other hand, as in the example shown in FIG. 13, instead of directly connecting the electronic component 105 and the signal terminal 103 with the bonding wire 107, the ground conductor layer 104d is formed on the side surface facing the signal terminal 103, It has been proposed to connect via a circuit board 104 formed with a signal line conductor 104b whose impedance is matched on the upper surface (see, for example, Patent Document 2). By using the circuit board 104 on which the signal line conductor 104b with matching impedance is formed, the ground conductor layer 104d is disposed near the signal terminal 103, and the length of the bonding wire 107 is shortened, so that the signal terminal 103 protrudes. It was intended to suppress an increase in impedance from the portion to the electronic component 105.

JP-A-8-130266 JP 2007-123804 A

However, in recent years, the required transmission speed has been increased and the frequency of transmission signals has been improved to about 25 to 40 GHz, and it is required to increase the output and speed of electronic devices. Therefore, even in the case of an electronic component mounting package using the conventional circuit board 104, the impedance of the bonding wire 107 portion from the portion protruding from the base 101 of the signal terminal 103 becomes higher for a higher frequency signal. The problem was not solved, and good high-frequency signal transmission characteristics could not be obtained due to the high impedance of this portion.

  The present invention has been completed in view of the above problems, and its object is to provide a high-frequency signal of 25 GHz or higher that suppresses an increase in impedance from the portion where the signal terminal protrudes from the base to the signal line conductor of the circuit board. It is an object of the present invention to provide a package for mounting an electronic component that can transmit the signal in a satisfactory manner.

  The electronic component mounting package of the present invention includes a base made of a metal having a through hole penetrating from the upper surface to the lower surface, a signal terminal fixed through the sealing material filled in the through hole, A circuit board on which a signal line conductor is formed from the top surface of the insulating substrate to the middle of the side surface, and the base of the signal line conductor and the signal terminal located on the side surface of the insulating substrate. The side surface of the part which protruded from the upper surface of this is contacted and connected.

  In the electronic component mounting package of the present invention, in the above structure, the signal line conductor located on the side surface of the insulating substrate is formed with a capacitor conductor extending in parallel in the width direction from the signal line conductor. It is what.

  The electronic device of the present invention is characterized in that an electronic component is mounted on the electronic component mounting package of the present invention having the above-described configuration.

  The electronic component mounting package of the present invention includes a base made of a metal having a through-hole penetrating from the upper surface to the lower surface, a signal terminal that is fixed through the sealing material filled in the through-hole, and an upper surface of the base. A circuit board on which a signal line conductor is formed from the upper surface of the insulating substrate to the middle of the side surface, and a portion protruding from the upper surface of the base of the signal line conductor and the signal terminal located on the side surface of the insulating substrate Since there is no contact between the portion where the signal terminal protrudes from the base and the signal line conductor of the circuit board, there is no bonding wire that increases the impedance, and the signal terminal protrudes from the base of the signal terminal. Even if the part protrudes from the upper surface of the base and is connected to the signal line conductor and has high impedance, it is connected to the signal line conductor on the side surface of the insulating substrate by a brazing material or the like. In this part, since the thickness of the signal line conductor on the side surface increases and the capacitance between the signal line conductor and the ground conductor (or the base that functions as the ground conductor) on the lower surface of the insulating substrate increases, the impedance decreases. The average impedance from the portion where the signal terminal protrudes from the base to the signal line conductor on the upper surface of the insulating substrate is close to a predetermined value, so that transmission loss is reduced and high-frequency signals can be transmitted satisfactorily. Become.

  According to the electronic component mounting package of the present invention, in the above configuration, when the signal line conductor located on the side surface of the insulating substrate is formed with the capacitor conductor extending in the width direction from the signal line conductor, the capacitor conductor Since the capacitance between the signal line conductor on the side and the ground conductor can be finely adjusted by the position and size of the side, the average of the signal terminal from the portion protruding from the base to the signal wiring conductor on the upper surface of the insulating substrate Impedance can be matched to a predetermined value, transmission loss is smaller, and high-frequency signals can be transmitted better.

  In addition, according to the electronic device of the present invention, since the electronic component is mounted on the electronic component mounting package of the present invention having the above-described configuration, the electronic device has good high-frequency signal transmission characteristics and can operate at high speed. It becomes.

It is a perspective view which shows an example of embodiment of the electronic device of this invention. It is sectional drawing in the AA of FIG. (A) is sectional drawing which expands and shows the A section of FIG. 2, (b) is sectional drawing in the AA of (a). (A) is sectional drawing which expands and shows the principal part of the other example of embodiment of the electronic component mounting package of this invention, (b) is sectional drawing in the AA of (a). . (A) is sectional drawing which expands and shows the principal part of the other example of embodiment of the electronic component mounting package of this invention, (b) is sectional drawing in the AA of (a). . (A) is sectional drawing which expands and shows the principal part of the other example of embodiment of the electronic component mounting package of this invention, (b) is sectional drawing in the AA of (a). . (A) is sectional drawing which expands and shows the principal part of the other example of embodiment of the electronic component mounting package of this invention, (b) is sectional drawing in the AA of (a). . (A) is sectional drawing which expands and shows the principal part of the other example of embodiment of the electronic component mounting package of this invention, (b) is sectional drawing in the AA of (a). . (A) is sectional drawing which expands and shows the principal part of the other example of embodiment of the electronic component mounting package of this invention, (b) is sectional drawing in the AA of (a). . (A) is a perspective view which shows the other example of embodiment of the electronic device of this invention, (b) is sectional drawing in the AA of (a). (A) is sectional drawing which expands and shows the A section of FIG.10 (b), (b) is sectional drawing in the AA of (a). It is a perspective view which shows an example of embodiment of the conventional electronic device. It is a perspective view which shows an example of embodiment of the conventional electronic device.

  The electronic component mounting package and electronic device of the present invention will be described in detail below. 1 to 9, reference numeral 1 denotes a substrate of an electronic component mounting package, 1 a denotes a through hole penetrating the substrate 1, 2 denotes a sealing material 2 filled in the through hole 1 a, and 3 denotes a base 1 by the sealing material 2. 4 is a circuit board mounted on the upper surface of the substrate 1, 4a is an insulating substrate of the circuit board 4, and 4b is formed from the upper surface of the insulating substrate 4a of the circuit board 4 to the middle of the side surface. A signal line conductor, 4c is a capacitive conductor formed on the side surface of the insulating substrate 4a of the circuit board 4, 4d is a ground conductor formed on the lower surface of the insulating substrate 4a of the circuit board 4, 5 is an electronic component, and 6 is on the base 1. The connected ground terminal, 7 is a bonding wire for electrically connecting the electronic component 5 and the signal line conductor 4b, and 8 is a lid.

  In the example shown in FIGS. 1 to 9, the circuit board 4 has a signal line conductor 4b formed from the upper surface to the middle of the side surface of the insulating substrate 4a, and a ground conductor 4c formed on the lower surface to form a microstrip line. Yes. The circuit board 4 is made of metal by connecting and fixing the grounding conductor 4d on the lower surface of the circuit board 4 to the upper surface of the substrate 1 that also functions as a ground by using a conductive bonding material such as solder or conductive adhesive. It is mounted on the substrate 1. Then, the end portion of the signal terminal 3 protruding from the base 1 is connected to the signal line conductor 4b formed on the side surface of the circuit board 4 using a bonding material such as solder to constitute the electronic component mounting package of the present invention. Yes. In addition to the signal line conductor 4b and the ground conductor 4d, circuit wiring may be formed on the circuit board 4 or an electronic component may be mounted depending on the intended use of the circuit board. Further, FIG. 1 shows a state in which the lid 8 is removed so that the internal structure of the electronic device can be easily understood.

The electronic component mounting package of the present invention includes a base body 1 made of a metal having a through hole 1a penetrating from the upper surface to the lower surface, and a sealing material filled in the through hole 1a, as in the examples shown in FIGS. 2 and a circuit board 4 mounted on the upper surface of the base body 1 and having a signal line conductor 4b formed from the upper surface of the insulating substrate 4a to the middle of the side surface. The signal line conductor 4b positioned on the side surface of the insulating substrate 4a and the side surface of the portion of the signal terminal 3 protruding from the upper surface of the base 1 are in contact with each other and connected. Because of this configuration, there is no bonding wire that increases the impedance between the portion where the signal terminal 3 protrudes from the base body 1 and the signal line conductor 4b of the circuit board 4, and the signal terminal 3 protrudes from the base body 1 Even if the impedance of the portion that protrudes from the upper surface of the base 1 and is connected to the signal line conductor 4b is high, the side portion of the insulating substrate 4a that is connected to the signal line conductor 4b by the brazing material or the like Since the signal line conductor 4b increases in thickness and the capacitance between the signal line conductor 4b and the ground conductor 4d (or the base 1 functioning as the ground conductor) on the lower surface of the insulating substrate 4a increases, the impedance decreases. The average impedance from the portion where the terminal 3 protrudes from the base 1 to the signal line conductor 4b on the upper surface of the insulating substrate 4a is close to a predetermined value. It becomes small transmission loss becomes as, it is possible to satisfactorily transmit a high-frequency signal.

  In addition, the electronic component mounting package of the present invention has a signal line connected to the signal line conductor 4b located on the side surface of the insulating substrate 4a in the above-described configuration, as in the example in which the main part is enlarged and shown in FIGS. It is preferable that a capacitive conductor 4c extending in parallel with the width direction from the conductor 4b is formed. In such a configuration, the capacitance between the signal line conductor 4b on the side surface and the ground conductor 4d can be finely adjusted depending on the position and size of the capacitive conductor 4c, so that the signal terminal 3 protrudes from the base body 1. The average impedance from the portion thus formed to the signal line conductor 4b on the upper surface of the insulating substrate 4a can be matched to a predetermined value, resulting in an electronic component mounting package with a smaller transmission loss.

  The base 1 has a mounting portion on which an electronic component 5 such as an LD or PD and a circuit board 4 are mounted on the upper surface. In the example shown in FIG. 1, the upper surface of the disk-shaped base 1 is the mounting portion. In the example shown in FIG. 1, one electronic component 5 is mounted on the base body 1 having two through holes 1 a via one circuit board 4, but the electronic component 5 is directly mounted on the base body 1. Or a plurality of electronic components 5 may be mounted. Further, more than two through holes 1 a for fixing the signal terminals 3 may be formed according to the number of electronic components 5 and the number of terminals of the electronic components 5.

The substrate 1 is usually a flat plate having a thickness of 0.5 to 2 mm, and the shape is not particularly limited.
For example, a disc shape with a diameter of 3 to 10 mm, a semi-disc shape with a radius cut from 1.5 to 8 mm, a square plate shape with a side of 3 to 15 mm, etc., formed from the upper surface to the lower surface. 0.6 diameter
It has a through hole 1a of ˜2.65 mm. The thickness of the substrate 1 is preferably 0.5 mm or more and 2 mm or less.
When the thickness of the substrate 1 is less than 0.5 mm, when the metal lid 8 for protecting the electronic component 5 is bonded to the upper surface of the metal substrate 1, the substrate 1 is bonded according to bonding conditions such as a bonding temperature. It becomes easy to bend and deform. On the other hand, if the thickness of the substrate 1 exceeds 2 mm, the thickness of the electronic component mounting package or the electronic device becomes unnecessarily thick, and it is difficult to reduce the size.

The base 1 is made of a metal sintered material such as a metal such as Fe—Ni—Co alloy, Cu—Zn alloy, stainless steel, or a Cu—W sintered material. For example, the metal ingot is rolled, punched, and cut. Conventionally known metal processing or MIM (Metal Injection Molding)
For example, a disk-shaped substrate 1 as shown in FIG. 1 is formed by injection molding. The through-hole 1a is formed by punching with a metal mold or by cutting such as drilling at the same time that the metal plate is processed into a disk shape or after being processed into a disk shape. The substrate 1 is preferably made of a material having a thermal expansion coefficient close to that of the electronic component 5 to be used. As a thing which is made of a metal having good thermal conductivity and has a thermal expansion coefficient close to that of the electronic component 5 or ceramic circuit board 4 to be mounted or a low cost, for example, Fe99.6 mass% -Mn0.4
Examples thereof include a mass% SPC (Steel Plate Cold) material, an Fe—Ni—Co alloy, and an Fe—Mn alloy.

Further, a Ni layer having a thickness of 0.5 to 9 μm is excellent on the surface of the base body 1 with excellent corrosion resistance and wettability with a brazing material for joining and fixing the electronic component 5, the circuit board 4 or the lid 8. And thickness is 0.5
It is preferable to sequentially deposit a ~ 5 μm Au layer by a plating method. Thereby, it is possible to effectively prevent the base body 1 from being oxidatively corroded, and to braze the electronic component 5, the circuit board 4, or the lid body 8 to the base body 1 satisfactorily.

  A through hole 1 a formed in the base 1 is filled with a sealing material 2, and the signal terminal 3 is fixed through the sealing material 2. One end (upper end) of the signal terminal 3 is fixed so as to protrude from the upper surface of the base body 1 to the same level as the upper surface of the circuit board 4. On the other hand, it is preferable that the other end (lower end) of the signal terminal 3 protrudes from the lower surface of the base 1 by about 1 to 20 mm in order to connect to an external electric circuit (not shown). As in the example shown in FIG. 1, the upper end portion of the signal terminal 3 and the electronic component 5 are electrically connected, and the lower end portion of the signal terminal 3 is electrically connected to an external electric circuit (not shown). Thus, the signal terminal 3 functions to transmit high-frequency input / output signals between the electronic component 5 and the external electric circuit.

  As in the example shown in FIG. 6, the through hole 1 a has a shape with a small diameter on the upper surface side of the base body 1, and the sealing material 2 is filled only in a large diameter portion, so A part may be provided. Thus, the air coaxial portion is provided, and the impedance of the air coaxial portion is determined from the impedance of a predetermined value (for example, 50Ω) in the sealing material 2 and the predetermined value of the portion where the signal terminal 3 protrudes from the upper surface of the base 1. By setting the impedance to a value intermediate between the high impedance and gradual change of the impedance, the transmission of the high frequency signal becomes better. At this time, as shown in the example shown in FIG. 6, the sealing material 2 is provided with a gap between the portion around the small diameter portion of the through hole 1 a of the substrate 1 and the portion overlapping the large diameter portion. When filled, the stray capacitance between the signal terminal 3 in the sealing material 2 and the portion overlapping the large diameter portion of the through hole 1a of the substrate 1 can be reduced. It is sufficient that the impedance of the signal terminal 3 is not shifted.

The sealing material 2 is made of an insulating inorganic material such as glass or ceramics, and has a function of securing the insulation between the signal terminal 3 and the base 1 and fixing the signal terminal 3 in the through hole 1 a of the base 1. Have. Examples of such a sealing material 2 include glass such as borosilicate glass and soda glass, and a glass filler added with a ceramic filler for adjusting the thermal expansion coefficient and relative dielectric constant of the sealing material 2. The relative dielectric constant is appropriately selected for impedance matching. Examples of the filler that lowers the dielectric constant include lithium oxide. For example, to set the characteristic impedance to 50Ω, the inner diameter of the through hole 1a is 1.75 mm and the outer diameter of the signal terminal 3 is 0.2 mm, or the inner diameter of the through hole 1a is 2.2 mm and the outer diameter of the signal terminal 3 is 0.25. In the case of mm, the sealing material 2 having a relative dielectric constant of 6.8 may be used. Further, when the inner diameter of the through hole 1a is 1.65 mm and the outer diameter of the signal terminal 3 is 0.25 mm, the sealing material 2 having a relative dielectric constant of 5 may be used.

  To fix the signal terminal 3 through the sealing material 2 filled in the through hole 1a, for example, when the sealing material 2 is made of glass, a known powder pressing method or extrusion molding method is used. A glass powder is molded to produce a cylindrical molded body having an inner diameter matched to the outer diameter of the signal terminal 3 and an outer diameter matched to the inner diameter of the through hole 1a. Then, the signal terminal 3 is inserted into the hole of the sealing material 2 and then heated to a predetermined temperature to melt the sealing material 2 and then cooled and solidified. it can. As a result, the through hole 1a is hermetically sealed by the sealing material 2, and the signal terminal 3 is insulated and fixed from the base body 1 by the sealing material 2, thereby forming a coaxial line.

In addition, the sealing material 2 is filled in the through-hole 1a that penetrates the base 1, and the signal terminal 3 is fixed by filling the sealing material 2 inside the annular outer peripheral conductor formed of the same material as the base 1. Thus, a coaxial connector may be manufactured, and the coaxial connector may be joined into the through hole 1a of the base body 1 by a joining material such as Au—Sn solder. In this case, when glass with a low dielectric constant is used as the sealing material 2, the glass with a low dielectric constant generally has a high melting point. Therefore, when the low dielectric constant glass is filled in the through-hole 2 a, the substrate 1 is used. It must be heated to a high temperature (about 1000 ° C). At this time, the mounting surface of the electronic component 5 or the circuit board 4 may be deformed, whereas the bonding with Au-Sn solder is about 350 ° C. This is preferable because deformation of the mounting surface can be suppressed.

  The signal terminal 3 is made of a metal such as an Fe—Ni—Co alloy or an Fe—Ni alloy. For example, when the signal terminal 3 is made of an Fe—Ni—Co alloy, rolling or punching is performed on an ingot of the alloy. By applying a metal processing method such as processing, a wire having a length of 1.5 to 22 mm and a diameter of 0.1 to 0.5 mm is manufactured.

When the diameter of the signal terminal 3 is smaller than 0.1 mm, the signal terminal 3 is easily bent, and the signal terminal 3 is easily bent even with a little carelessness in handling. If the signal terminal 3 is bent, when the air coaxial portion as described above is provided, the impedance at this portion is likely to go wrong, and the workability of connection with an external circuit may be lowered. If the diameter of the signal terminal 3 exceeds 0.5 mm, the through hole 2a necessary for impedance matching is used.
The diameter of the signal terminal 3 is preferably 0.1 to 0.5 mm.

  A ground terminal 6 is joined to the lower surface of the base 1. The ground terminal 6 is manufactured in the same manner as the signal terminal 3 and bonded to the lower surface of the base 1 using a brazing material or the like. In order to facilitate positioning and improve the bonding strength, a hole may be formed in advance on the lower surface of the substrate 1, and the ground terminal 6 may be inserted into the hole for bonding. For the same reason, the grounding terminal 6 may be provided with a ridge so as to contact the lower surface of the base 1 to increase the bonding area. By joining the ground terminal 6 to the base 1 in this manner, the base 1 functions as a ground conductor when the ground terminal 6 is connected to an external electric circuit.

The circuit board 4 is made of ceramics such as aluminum oxide (alumina: Al ₂ O ₃ ) sintered body, aluminum nitride (AlN) sintered body, glass ceramic sintered body, epoxy, polyimide, tetrafluoroethylene, liquid crystal polymer, etc. The signal line conductor 4b is formed from the upper surface of the insulating substrate 4a made of the above resin to the middle of the side surface. As described above, in the example shown in FIGS. 2 to 9, the ground conductor 4d is formed on the lower surface of the insulating substrate 4a, but the ground conductor 4d is not necessarily required. This is because when the circuit board 4 is bonded to the substrate 1 with a conductive bonding material such as a conductive adhesive, it becomes a microstrip line using the substrate 1 as a ground conductor. However, as in the examples shown in FIGS. 2 to 9, by forming the ground conductor 4d on the lower surface of the insulating substrate 4a, it is easy to join the circuit board 4 to the base body 1 with solder or brazing material (not shown). This is preferable. In the example shown in FIGS. 4 to 9, the capacitor conductor 4c extending in parallel in the width direction from the signal line conductor 4b is formed on the signal line conductor 4b located on the side surface of the insulating substrate 4a.

If the insulating substrate 4a is made of, for example, an aluminum oxide sintered body, it is suitable for a raw material powder such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO). An organic solvent, a solvent and an organic binder are added and mixed to form a slurry, which is formed into a sheet by a known doctor blade method, calendar roll method or the like to obtain a ceramic green sheet (hereinafter also referred to as a green sheet). Thereafter, the green sheet is punched into a predetermined shape, and a plurality of laminated sheets are produced as necessary to produce a laminate, which is then fired at a temperature of about 1600 ° C. Alternatively, a raw material powder such as Al ₂ O ₃ , SiO ₂ , CaO, MgO or the like, which is added with an organic binder as necessary, is filled into a mold and press-molded to form a predetermined shape, and this molded body Is fired at a temperature of about 1600 degrees.

At this time, the signal line conductor 4b, the ground conductor 4d, and the capacitive conductor 4c are made of tungsten (W
), Molybdenum (Mo), manganese (Mn), and other high melting point metal powders, an appropriate organic binder or solvent is added and mixed to form a paste into a ceramic green sheet or its It is formed by printing and applying in a predetermined shape to a laminate or a ceramic molded body, and simultaneously firing them. After producing the insulating substrate 4a, the metallized layer may be baked by printing and applying the same metal paste onto the insulating substrate 4a and baking it. In this case, a Ni layer having a thickness of 0.5 to 9 μm and an Au layer having a thickness of 0.5 to 5 μm are sequentially deposited by plating on the exposed surfaces of the signal line conductor 4b, the ground conductor 4d and the capacitor conductor 4c. It is good to leave it. As a result, it is possible to effectively prevent these wires from being oxidatively corroded, wire bonding with the electronic component 5, brazing to the substrate 1 of the circuit board 4, and brazing between the signal line conductor 4b and the signal terminal 3. The property can be improved.

  When the thickness of the insulating substrate 4a is thin, it is difficult to form the signal line conductor 4b from the upper surface of the insulating substrate 4a to the middle of the side surface by applying a metal paste. In such a case, in the above manufacturing method, prior to the application of the metal paste, a through hole is formed in the ceramic green sheet with a mold or the like, and the through hole is filled with the metal paste, and overlaps with the through hole. In this way, a metal paste is printed and applied to the pattern shape of the signal line conductor 4b, a ceramic green sheet without a through hole is laminated thereunder, and the laminate is cut so as to divide the through hole in the vertical direction. The signal line conductor 4b on the side surface may be formed by firing. A through conductor is formed from the upper surface to the lower surface of the insulating substrate 4a, and a portion of the through conductor that is cut in the vertical direction and exposed to the side surface becomes the signal line conductor 4b. The length of the signal line conductor 4b on the side surface can be changed by changing the number of ceramic green sheets forming the through holes or changing the thickness. Instead of cutting at the stage of the green sheet laminate, the insulating substrate 1a may be cut so that the through conductors are cut in the vertical direction after firing.

  In this method, since the thickness of the side signal line conductor 4b can be increased by the cross-sectional shape of the through hole, the capacitance between the side signal line conductor 4b and the ground conductor 4d can be increased.

  Alternatively, the through conductor may be formed by applying the metal paste to the inner surface of the through hole without filling the through hole with the metal paste. In this case, the surface of the signal line conductor 4b on the side surface is concave (a concave portion is formed on the surface). Therefore, when the signal terminal 3 and the signal line conductor 4b on the side surface are connected with the brazing material, the concave portion is formed. The brazing material tends to accumulate, so that the workability of brazing is improved and the connection reliability is improved.

  In this method of forming the signal line conductor 4b on the side surface, in order to form the capacitive conductor 4c as in the example shown in FIG. 4B, the width of the portion of the through conductor exposed on the side surface of the insulating substrate 4a is set to the signal line conductor. It may be larger than the width of 4b. In order to form a capacitor conductor 4c having a wider upper surface side than the lower surface side as in the example shown in FIG. 5B, a laminate is produced by laminating three or more green sheets. By forming a through hole in the layer, the width of the upper through hole is made larger than the width of the lower through hole, and a through conductor having a larger width on the upper side than the lower side is formed as in the example shown in FIG. do it. Furthermore, in order to form the capacitor conductor 4c having a shape in which the width gradually decreases from the upper surface to the lower surface side as in the example shown in FIG. 6B, a female die for forming a through hole in the green sheet is used. If the one that is larger than usual compared to the male mold is used, the main surface on the female mold side of the green sheet can form a through hole with a larger diameter. A laminated body may be formed with the top. In this way, a through conductor having a larger diameter on the upper side than the lower side and an inverted trapezoidal shape can be formed as in the example shown in FIG.

Further, as a method of forming the signal line conductor 4b, the ground conductor 4d, and the capacitive conductor 4c, there is a method of forming the insulating substrate 4a after forming the insulating substrate 4a by a vapor deposition method or a photolithography method.
In order to reduce the size of the electronic device and form a large number of wirings in a small area, a method of forming by an evaporation method or a photolithography method is preferable. In this case, before the formation of the signal line conductor 4b, the ground conductor 4d, and the capacitive conductor 4c, the main surface of the insulating substrate 4a may be polished as necessary.

  Hereinafter, the case where the wiring conductors to be the signal line conductor 4b, the ground conductor 4d, and the capacitive conductor 4c are formed by vapor deposition or photolithography will be described in detail. The wiring conductor is composed of a conductor layer having a three-layer structure in which, for example, an adhesion metal layer, a diffusion prevention layer, and a main conductor layer are sequentially laminated.

From the viewpoint of improving the adhesion with the insulating substrate 4a made of ceramics or the like, the adhesion metal layer is made of titanium (Ti), chromium (Cr), tantalum (Ta), niobium (Nb), nickel-chromium (Ni -Cr) alloy, tantalum nitride (Ta ₂ N), or the like, preferably made of at least one kind of metal having a thermal expansion coefficient close to that of ceramics, and its thickness is 0.01 to 0.2 μm.
The degree is preferred. If the thickness of the adhesion metal layer is less than 0.01 μm, it tends to be difficult to firmly adhere the adhesion metal layer to the insulating substrate 4a. On the other hand, if the thickness of the adhesion metal layer exceeds 0.2 μm, the adhesion metal layer tends to be peeled off from the insulating substrate 4a due to internal stress during film formation.

  From the viewpoint of preventing mutual diffusion between the adhesion metal layer and the main conductor layer, the diffusion prevention layer is platinum (Pt), palladium (Pd), rhodium (Rh), nickel (Ni), Ni—Cr alloy, Ti— It is preferably made of at least one metal having good thermal conductivity such as W alloy, and the thickness is preferably about 0.05 to 1 μm. If the thickness of the diffusion prevention layer is less than 0.05 μm, defects such as pinholes tend to be generated, making it difficult to perform the function as the diffusion prevention layer. If the thickness exceeds 1 μm, the diffusion prevention layer is caused by internal stress during film formation. There is a tendency to easily peel from the adhesion metal layer. When a Ni—Cr alloy is used for the diffusion prevention layer, the Ni—Cr alloy has good adhesion to the insulating substrate 4a, so that the adhesion metal layer can be omitted.

  The main conductor layer is preferably made of at least one of gold (Au), Cu, Ni, and silver (Ag) having a low electric resistance, and the thickness is preferably about 0.1 to 5 μm. If the thickness of the main conductor layer is less than 0.1 μm, the electric resistance becomes large, and there is a tendency that the electric resistance required for the wiring conductor to be the signal line conductor 4b and the ground conductor 4d of the circuit board cannot be satisfied. If it exceeds, the main conductor layer tends to be easily peeled off from the diffusion preventing layer due to internal stress during film formation. Further, since Cu is easily oxidized, a protective layer made of Ni and Au may be coated thereon.

In order to set the characteristic impedance of the signal line conductor 4b of the circuit board 4 to 50Ω, in the case of the circuit board 4 having a microstrip structure, the circuit board 4 is made of a 96% aluminum oxide sintered body having a dielectric constant of 9.5 and has a thickness of 0.3. The grounding conductor 4d is formed on the lower surface of the insulating substrate 4a which is mm, and the signal line conductor 4b on the upper surface may be 0.3 mm wide and 4 μm thick. The insulating substrate 4a is made of the same material and has a thickness of In the case of 0.5 mm, the signal line conductor 4b may have a thickness of 4 μm and a width of 0.5 mm.

  If the upper surface side of the insulating substrate 4a is wider as in the examples shown in FIGS. 5 to 8, the impedance of the capacitive conductor 4c becomes gentle and the transmission of high-frequency signals becomes better. . Furthermore, as in the examples shown in FIGS. 6 and 8, when the change in the width of the capacitive conductor 4c is gradual, the change in impedance becomes more gradual and the transmission of high-frequency signals becomes even better.

Further, as in the example shown in FIG. 9A, the signal line conductor 4 on the side surface is also provided when at least the portion where the signal line conductor 4 b on the side surface of the insulating substrate 4 a is formed as an inclined surface whose upper surface side is inclined inward. As the thickness of the brazing material increases toward the upper surface side of the insulating substrate 4a, the capacity increases, so that the impedance change becomes gradual and the transmission of the high-frequency signal becomes good.

The ground conductor 4d is formed on substantially the entire lower surface of the insulating substrate 2a, but is formed slightly inside the side surface on which the signal line conductor 4b is formed in order to prevent a short circuit with the signal terminal 3. In order to ensure insulation between the signal terminal 3 and the distance from the side surface (d1 shown in FIG. 3) is 0.1.
It is good to set it as about mm or more. Furthermore, in the examples shown in FIGS. 4, 5, and 7 to 9, the ground conductor 4 d is not formed in a portion overlapping the through hole 1 a when viewed from above. In this way, the impedance of the signal terminal 3 in the through hole 1a is not shifted due to the stray capacitance between the signal terminal 3a in the through hole 1a and the ground conductor 4d in a position overlapping the through hole 1a. So good.

  The circuit board 1 is fixed to the upper surface of the substrate 1 with a bonding material such as a conductive adhesive, solder, or brazing material. As described above, it is preferable to form the ground conductor 4d on the lower surface of the insulating substrate 4a because it is easy to join the circuit board 4 to the base body 1 with solder or brazing material.

The connection between the signal terminal 3 and the signal line conductor 4b on the side surface of the circuit board 4 may be made using a conductive bonding material such as solder or a conductive adhesive. The signal line conductor 4b located on the side surface of the insulating substrate 4a and the side surface of the portion of the signal terminal 3 protruding from the upper surface of the base 1 are in contact with each other, but are interposed between the signal terminal 3 and the signal line conductor 4b. A bonding material having a thickness of about 100 μm or less is considered to be in contact.

Here, the characteristic impedance at the connecting portion between the protruding portion of the signal terminal 3 from the base 1 and the signal line conductor 4b on the side surface of the circuit board 4 is as follows. For example, when the diameter of the signal terminal 3 is 0.25 mm and the dielectric constant of the sealing material 2 is 5, the diameter of the through hole 1a is 1.65 mm so that the signal terminal 3 is positioned in the through hole 1a. The characteristic impedance of the part is 50Ω. Further, the thickness of the insulating substrate 4a is 0.25 mm, the signal line conductor 4b having a width of 0.25 mm and a thickness of 4 μm is formed on the upper surface thereof, and the length of the signal line conductor 4b positioned on the side surface with the same width as the upper surface (see FIG. If L) shown in FIG. 4 is 0.125 mm, the characteristic impedance of the signal line conductor 4b in the portion overlapping the ground conductor 4d when viewed from above is 50Ω.

  Further, as in the example shown in FIG. 4, a capacitor conductor 4c having the same length as that of the signal line conductor 4b on the side surface is formed on both sides of the signal line conductor 4b, and its width is W (the width on one side is shown in FIG. W / 2), the distance between the insulating substrate 4a and the substrate 1 when the circuit board 4 is brazed to the substrate 1 (the thickness of the ground conductor 4d plus the thickness of the brazing material) is d2, and the signal terminal 3 and the side surface of the insulating base 4a (thickness of the signal line conductor 4b on the side surface plus the thickness of the brazing material interposed between the signal terminal 3 and the signal line conductor 4b) is d3. The characteristic impedance (Z1) of the portion between the signal terminal 3 protruding from the base 1 and the lower surface of the insulating substrate 4a, and the portion between the lower surface of the insulating substrate 4a of the signal terminal 3 and the connection to the signal line conductor 4b on the side surface Characteristic impedance (Z2) of the signal terminal 3 side signal An outline of the characteristic impedance (Z3) of the part where the line conductor 4b is connected and the characteristic impedance (Z4) of the part of the signal line conductor 4b where the ground conductor 4d is not formed when viewed from above is calculated as follows. Become.

  When d1 = 0.15 mm, W = 0 (when there is no capacitive conductor 4c), d2 = 0.05 mm, d3 = 0.05 mm, Z1 = 85Ω, Z2 = 43Ω, Z3 = 40Ω, Z4 = 50Ω, The average impedance from the portion of the terminal 3 protruding from the base 1 to the portion not overlapping with the ground conductor 4d in the top view of the signal line conductor 4b is approximately 50Ω.

When d1 = 0.20mm, W = 1.4mm, d2 = 0.05mm, d3 = 0.05mm, Z1 = 95Ω, Z2 = 46Ω, Z3 = 14Ω, Z4 = 51Ω, and the average impedance is similarly Nearly 50Ω.

  The electronic device of the present invention is characterized in that the electronic component 5 is mounted on the electronic component mounting package of the present invention having the above-described configuration. Since the electronic component mounting package has a small transmission loss, a high-frequency signal transmission characteristic is good and the electronic device can operate at high speed.

  In the example shown in FIG. 1, an electronic component 5 is mounted on a circuit board 4 mounted on the upper surface of the base 1, and the electronic component 5 and the signal terminal 3 are electrically connected via the circuit board 4. . Specifically, the electrode of the electronic component 5 on the circuit board 4 and the signal line conductor 4 b formed on the upper surface of the circuit board 4 are electrically connected by the bonding wire 7, and the signal positioned on the side surface of the circuit board 4. The line conductor 4b and the signal terminal 3 are electrically connected by a conductive bonding material such as a brazing material. The electronic component 5 may be directly mounted on the upper surface of the base 1, and the electrode of the electronic component 5 and the signal line conductor 4 b of the circuit board 4 may be electrically connected by the bonding wire 7.

The electronic component 5 is an IC (Integrated Circuit), an LSI (Large Scale Integrated circuit), an LD (Laser Diode), a PD (Photo Diode), an LN (Lithium Nitride) modulator, and the like. Mounting is performed by firmly bonding and fixing to the upper surface of the substrate 1 with a brazing material such as Ag brazing or Ag-Cu brazing, solder such as Au-Sn solder or Pb-Sn solder, or an adhesive such as epoxy resin.

  Then, after the electronic component 5 is mounted on the electronic component mounting package, the lid body 8 is joined to the base body 1 in order to cover the mounted electronic component 5 and hermetically seal it. The lid 8 is joined to the outer peripheral portion of the upper surface of the base 1 by a welding method such as a brazing method or a seam weld method.

  The lid 8 is a plate-shaped member made of a metal such as an Fe—Ni—Co alloy or Cu—W sintered material, or a ceramic such as an aluminum oxide sintered body or an aluminum nitride sintered body. Further, when the lid body 8 is made of ceramics, bonding with a brazing material is possible by forming a metal bonding layer on the peripheral edge of the lower surface by a thick film method or a thin film method.

  The present invention is not limited to the above-described embodiments and examples, and various modifications can be made without departing from the scope of the present invention.

  For example, in the above example, the electronic component mounting package using the circular metal stem as in the example shown in FIG. 1 has been described as an example. However, the electronic component mounting package of the present invention is similar to the example shown in FIG. It may be a box-type electronic component mounting package. FIG. 10 (a) is a perspective view showing an example in which the electronic component mounting package of the present invention is mounted on an external circuit board, and FIG. 10 (b) is a cross-sectional view taken along line AA of FIG. 10 (a). FIG. FIG. 11A is an enlarged cross-sectional view showing a portion A of FIG. 10B, and FIG. 11B is a cross-sectional view taken along the line AA of FIG. 11A. 10 and 11, 9 is an external circuit board, 9a is an insulating board of the external circuit board 9, 9b is a signal wiring conductor of the external circuit board 9, 9c is a ground wiring conductor of the external circuit board 9, and 9d is an external circuit board. 9 show via conductors for connecting the upper and lower ground wiring conductors 9c through the insulating substrate 9, and the other reference numerals denote the same parts as in FIGS.

  In the example of the electronic component mounting package shown in FIGS. 10 and 11, a through hole 1a is provided on the upper surface (bottom surface) of the bottom plate of the box-shaped substrate 1. FIG. The circuit board 4 is mounted on the bottom surface of the base 1, and the signal terminal 3 is fixed in the through hole 1 a by the sealing material 2. The signal terminal 3 and the signal line conductor 4 a on one main surface of the wiring board 4 are electrically connected by a brazing material 5.

In this example, the portion of the signal terminal 3 protruding from the lower surface of the base 1 is bent,
A portion that is bent and parallel to the upper surface of the external circuit board 9 is joined to the signal wiring conductor 9b by a brazing material or the like. The signal terminal 3 may be inserted into a hole formed in the insulating substrate 9a of the external circuit board 9 without being bent. At this time, a conductor is formed on the inner surface of the hole and connected to the signal wiring conductor 9b.

  The two ground terminals 6 are connected to the base 1 so as to sandwich the signal terminal 2 therebetween, and are joined to the ground wiring conductors 9c arranged on both sides of the signal wiring conductor 9b of the external circuit board by a brazing material or the like.

  In the example shown in FIGS. 10 and 11, the base 1 is formed with a notch having a certain distance from the portion of the signal terminal 3 parallel to the upper surface of the external circuit board 9. Since the upper surface has an air coaxial structure and the signal wiring conductor 9b to which the signal terminal 3 is connected has a microstrip line structure, it can be easily surface-mounted with matching impedance, and an expensive connector is not used. Can transmit high power and high frequency. Further, the external circuit board 9 can be reduced in size by not using a small and difficult-to-bend connector.

  The base 1 in the example shown in FIG. 10 and FIG. 11 is a joining material such as silver brazing made of a frame made of a metal ingot similar to the above using a known metal processing method such as rolling, punching or cutting. It is formed by joining to a flat plate (bottom plate). Further, the base body 1 may be manufactured by forming the frame portion integrally with the flat plate by, for example, the MIM method.

  The wiring board 4 in the case of the example shown in FIGS. 10 and 11 is manufactured in the same manner as the wiring board 4 in the example shown in FIGS. 1 to 9, but the electronic component 5 is formed on one main surface of the wiring board 4. Therefore, only the signal line conductor 4a is formed, and the signal line conductor 4b and the ground conductor 4d on the other main surface side constitute a microstrip line.

  The electronic component 5 is mounted on the bottom surface of the base 1, the terminals of the electronic component 5 and the signal line conductor 4 b of the wiring substrate 4 are connected by the bonding wires 7, and the lid body 8 is bonded to the upper surface of the frame portion. The electronic device of the present invention is obtained. In this example, the electronic component 5 is directly mounted on the base 1, which is to radiate the heat generated in the electronic component 5 to the outside through the metallic base 1. If the electronic component 5 generates a large amount of heat, a Peltier element or the like may be mounted between the electronic component 5 and the base 1 to cool the electronic component 5.

  Further, for example, in the above example, the case where the signal line conductor 4b of the circuit board 4 has a microstrip structure has been described. However, a coplanar structure in which the ground conductor 4d is disposed on both sides of the signal line conductor 4b with a space therebetween. Alternatively, a grounded coplanar structure in which ground conductors 4d are arranged on both sides of the signal line conductor 4b and one main surface of the insulating substrate 4a and the upper and lower ground conductors 4d are connected by via conductors may be employed.

DESCRIPTION OF SYMBOLS 1 ...... Base 1a ..... Through-hole 2 ..... Sealing material 3 ....... Signal terminal 4 ..... Circuit board 4a・ ・ ・ ・ ・ ・ Insulating substrate 4b ・ ・ ・ ・ ・ ・ Signal wiring conductor 4c ・ ・ ・ ・ ・ ・ Capacitance conductor 4d ・ ・ ・ ・ ・ ・ Grounding conductor 5 ・ ・ ・ ・ ・ ・ ・ ・ Electronic components 6 ・ ・ ・······ grounding terminal 7 ········ bonding wire 8 ······························································ ... Signal line conductor 9c ... Ground wiring conductor 9d ... Via conductor

Claims (3)

A base made of a metal having a through hole penetrating from the upper surface to the lower surface, a signal terminal fixed through the sealing material filled in the through hole, and an upper surface of the insulating substrate mounted on the upper surface of the base And a circuit board on which signal line conductors are formed in the middle of the side surface, and the signal line conductor located on the side surface of the insulating substrate and the side surface of the portion of the signal terminal protruding from the top surface of the base body An electronic component mounting package characterized by being connected in contact with each other. 2. The electronic component mounting package according to claim 1, wherein a capacitor conductor extending in parallel with the width direction from the signal line conductor is formed on the signal line conductor located on a side surface of the insulating substrate. An electronic device in which an electronic component is mounted on the electronic component mounting package according to claim 1.

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