JP2013038360A - Metal support flexible board, metal support carrier tape for tape automated bonding using metal support flexible board, metal support flexible circuit board for mounting led, and metal support flexible circuit board with laminated copper foil for circuit formation - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a metal support flexible wiring board which enables processing from a reel to a reel, which also enables easy packaging design, easy heat radiation design, and the inspection automation which is conducted by CCD recognition.SOLUTION: A metal support flexible board is composed of an adhesive layer (1), a support body (2), and a support body covering layer (3). In the metal support flexible board, the support body (2) is formed by metal foil, and the support body covering layer (3) is formed on the adhesive layer (1) side of the support body (2) and/or the opposite side of the adhesive layer (1) side. Further, the adhesive layer (1) and/or the support body covering layer (3) has/have been subject to color processing.

Description

  The present invention relates to a metal-supported flexible printed board. More specifically, semiconductor device connection substrates such as tape automated bonding (TAB) and ball grid array (BGA) package interposers used for mounting semiconductor integrated circuits (ICs), LEDs, and power The present invention relates to a metal-supporting flexible substrate for electronic components suitable for producing a substrate for mounting a system device.

  Furthermore, the present invention relates to a metal support carrier tape for tape automated bonding, a metal support flexible circuit board for LED mounting, and a metal support flexible circuit board laminated with a copper foil for circuit formation.

  A flexible board is a circuit-forming board that is composed of a support, an adhesive, a circuit-forming conductor layer, etc., and has excellent flexibility. After mounting the desired functional parts on the formed conductor circuit layer, the solder Circuit boards are protected by resists and coverlay films, and are widely used as interposers for wiring various electronic devices and mounting ICs.

  Today, as various electronic components are being developed with the spread of electronic devices, the power consumption per unit volume of circuit boards continues to rise as the size and density increase. It is required to satisfy a number of high requirements and safety improvements according to the requirements. In particular, a flexible circuit board for mounting a driver IC for driving a plasma display that requires a high amount of heat generation due to a high drive voltage and a high insulation performance, and an LED element that generates a large amount of local heat generated by light emission are mounted. For flexible circuit boards, it is necessary to improve heat resistance and heat dissipation design while maintaining insulation performance and low curl properties as a technology to cope with higher functionality, higher speed, and higher output It has become.

  For this reason, while using a metal substrate having high heat dissipation as a substrate of a circuit device, and disposing a silica sol inorganic varnish as an insulating layer on the metal substrate, a substrate capable of preventing dielectric breakdown due to wire bonding is provided. Proposed. (For example, refer to Patent Document 1).

  However, since silica sol-based inorganic varnish is not flexible, in the flexible circuit board, cracks occur in the insulating layer, and the curl of the flexible circuit board is large, making it impossible to process from reel to reel. In addition, there are problems such as difficulty in securing a semi-cured state control of the resin layer and punching properties in order to use it in an automated bonding method.

  Also, as a method using a metal support layer, a TAB tape carrier for a liquid crystal display element is proposed in which an adhesive is applied on a base metal as a base base and a copper pattern is formed thereon. ing. (For example, refer to Patent Document 2).

  However, in the configuration in which there is a conductive layer directly under the insulating layer, and the formed circuit is arranged immediately above, while maintaining the insulation between the circuit wiring and the insulation of each circuit wiring-supporting metal layer, Insulation performance was insufficient for application as a plasma display driver IC having a high driving voltage or an LED mounting substrate having a large amount of heat generation. Also, when the copper foil for circuit formation is sequentially laminated in the customer process as in the tape automated bonding method, the adhesive layer is sandwiched between the copper foil for circuit formation and the support copper foil to absorb moisture from the adhesive layer. Since there was no escape space for moisture, the adhesive layer had problems such as foaming.

  In addition, since circuit boards using these metal support layers have a metal substrate / metal circuit configuration, pattern recognition inspection using a CCD camera is difficult during the inspection process, and there is a problem that automation is difficult.

  As a method for enabling pattern recognition inspection with a CCD camera, a method for improving circuit visibility by blending an inorganic filler colored with a treatment liquid containing a coupling agent into a thermosetting resin has been proposed. Yes. (For example, refer to Patent Document 3). However, the coloring component not only lowers the insulation reliability of the thermosetting resin layer but also lowers the adhesion strength with the metal substrate / metal circuit, so that it can be applied to substrates such as TAB, BGA, and LED which have been miniaturized. Was unsuitable.

  In addition, a method has been proposed for improving circuit visibility by changing the color tone by forming an oxide film on the surface of a metal substrate by oxidation or reduction treatment or the like. (For example, refer to Patent Document 4). However, the formed film has a high dissolution rate in etching liquids such as copper chloride and iron chloride and strong acid process liquids such as tin plating, so that the surface erosion is severe, and the oxidation / reduction layer and the base material In order to penetrate between the layers, there are problems such as dropping of a resin layer or a circuit formed on the surface.

JP-A-8-288605 Japanese Patent Laid-Open No. 8-0558080 JP-A-2-216893 JP-A-63-98181

  The present invention is a metal with easy packaging design and heat dissipation design that can handle reel-to-reel processing and CCD automatic recognition inspection while maintaining excellent insulation and other circuit board reliability. An object is to provide a supporting flexible substrate.

  In order to solve the above-mentioned problems, a metal-supported flexible substrate of the present invention comprises (1) an adhesive layer, (2) a support, and (3) a metal-support flexible substrate comprising a support-coating layer. The body is made of metal foil, (2) the support is (1) the adhesive layer side and / or the opposite side, (3) the support coating layer is configured, and (1) the bond The agent layer and / or (3) the support covering layer is colored.

  According to the present invention, it is possible to perform an easy packaging design and a heat radiation design because it has excellent wire bonding properties and low curl properties while maintaining excellent insulating properties and punching characteristics. The electronic component using the metal-supported flexible substrate of the present invention has chemical resistance necessary for circuit processing and insulation that enables high-voltage driving in the metal-supported substrate circuit, and reel-to-reel processing and punching processing. The flying leads can be easily formed, and can be used for automatic inspection by CCD recognition, so that heat radiation can be designed and manufactured at a simpler and lower cost than conventional electronic components.

  Hereinafter, the present invention will be described in detail.

  The metal-supporting flexible substrate of the present invention has (2) a support composed of metal foil, (2) (3) a support coating layer on the (1) adhesive layer side and / or the opposite side of the support. have. By using a metal foil for the support, the thermal conductivity of the circuit board is improved, and the size of the heat sink can be minimized. Furthermore, since the metal-supported flexible substrate of the present invention can easily form a device hole by punching or the like, a component to be mounted such as an IC or an LED element can be mounted from the back surface of the circuit formation surface using the device hole. (2) The support itself can be used as a heat sink or the thermal conductivity to the heat sink can be improved.

  Copper foil, stainless steel foil, and aluminum foil are preferably used as the metal foil, but other copper alloy foils such as phosphor bronze, nickel foil, magnesium foil, titanium foil, or alloy foils containing these may be used depending on the application / required function. A metal foil having a thermal expansion coefficient of 10 to 30 ppm / ° C. can be suitably selected according to the balance of the entire packaging. (2) The thickness of the support can be appropriately selected in accordance with the required flexibility and tear strength, but 12 μm to 150 μm is preferably used, and 12 μm to 75 μm is more preferably used.

  In addition, (2) the metal foil as a support is organic (1) for the purpose of imparting easy adhesion and insulation of the adhesive layer, changing the appearance gloss, and avoiding chemical exposure during circuit formation.・ Inorganic coupling treatment, surface treatment such as plating, resin coating, ceramic layer formation, etc., (2) (1) Adhesive layer side and / or opposite side of support (3) Support coating layer Is configured. Further, a coating layer for the purpose of insulation protection or the like may be additionally provided on the hole cross section when a device hole, a sprocket hole or the like is formed by punching or the like.

  (3) The thickness of the support coating layer is preferably 2 μm or more as a lower limit from the viewpoint of the balance between the coating strength and the reel handling property and (2) the insulation reliability of the support and the circuit conductor layer is enhanced. Things are more preferable. The upper limit is preferably 100 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. (3) The layer structure of the support covering layer may be a single layer or a plurality of layers.

  (3) When a resin is used for the support coating layer, it is not particularly limited, but a polyimide resin or a polyamideimide resin excellent in heat resistance and chemical resistance is preferably used, and in particular, the polyamideimide resin is chemical resistant. It is preferably used from the viewpoint of imparting and easy adhesion. (3) The polyamideimide resin used in the support coating layer has a Tg (glass transition temperature) of 300 ° C. or higher and a weight average molecular weight after curing of 10,000 or higher from the viewpoint of heat resistance and chemical resistance. (1) From the viewpoint of imparting easy adhesion of the adhesive layer, it is preferable that the epoxy resin is mixed and cured by 5% by weight or more.

  In addition, (3) the support coating layer can be arranged on the adhesive layer side and the opposite side as needed according to the purpose, and either one or both of them is provided with peelability. Also good. Peelability means that (3) a support covering layer is arranged (2) a part of the support is peeled off from the support (2) or conversely (2) the surface of the support is (3) the support covering This means that (3) the support covering layer can be peeled without leaving a part of the layer or causing peeling at other interfaces. When peelability is given to the (3) support coating layer on the adhesive layer side, it becomes possible to eliminate the base material of the processed product, and it is peeled to the (3) support coating layer on the opposite side of the adhesive layer side. When the property is imparted, it is possible to obtain a high heat dissipation substrate utilizing the metal support while maintaining the chemical resistance against the existing circuit processing line. In this case, (3) the support covering layer has a layer structure of two or more layers, and (2) the first layer in contact with the support is an adhesive material and / or a thermoplastic resin, other than the first layer It is preferable that at least one layer is at least one selected from polyester, polyolefin, polyphenylene sulfide, polyvinyl butyral, polyvinyl acetate, polyvinyl alcohol, polycarbonate, polyamide, polyimide, polyamideimide, and polymethyl methacrylate. Thereby, the first layer has releasability, and at least one layer other than the first layer secures the tensile strength at the time of peeling and ensures easy peeling while securing the chemical resistance at the time of circuit processing. Can do.

  Further, (1) the adhesive layer and / or (3) the support coating layer is colored, and may be colored with a dark pigment or dye as compared with the metal layer formed with a circuit. Preferably, a pigment is more preferably used from the viewpoint of ensuring insulation reliability. The coloring is preferably a dark color system in order to absorb and scatter light from the light source and easily obtain a contrast with the circuit metal, and an organic pigment is more preferable than an inorganic pigment from the viewpoint of ensuring insulation. The dark color system here refers to a color system having a lightness (L * value) lower than that of a copper surface on which a circuit is formed, and the L * value is preferably 50 or less, more preferably 30 or less. . For coloring, dioxazine-based violet, quinacdrine-based red, magenta, violet, anthraquinone-based red, alizarin-based red, naphthol-based red, monoazo red, polyazo red, perylene red, anthraquinonyl red, diketopyrrolopyrrole red, phthalocyanine Pigments such as blue, phthalocyanine green, and sap green can be mentioned, and these can be mixed to obtain a color tone with good contrast. The coloring process not only makes the contrast detection stable and easy during the automatic circuit inspection process by the CCD camera, but also increases the heat absorption and contributes to the improvement of the function as a heat dissipation substrate. The coloring treatment may be performed on either (1) the adhesive layer or (3) the support coating layer, but in consideration of insulation reliability, adhesion durability under humidification / heating environment, etc. It is preferable to carry out with (3) support covering layer which is not in direct contact. In addition to coloring with pigments or dyes, the surface roughness of (1) the adhesive layer and / or (3) the support coating layer is increased by carrying out the composition of the inorganic filler and surface roughening treatment. By increasing the amount of light scattering, it becomes possible to make the surface pattern of the (2) metal support difficult to be recognized by the CCD camera through (1) the adhesive layer and / or (3) the support coating layer. (1) Improving the defect detection ability of the adhesive layer, increasing the inspection accuracy, and increasing the degree of freedom of color selection and expanding the applicable coloring range. It becomes. Examples of inorganic fillers include metal fine particles, metal hydroxides, metal oxides, silicon carbide, titanium carbide silica, titanium oxide, aluminum nitride, titanium nitride, silicon nitride, or inorganic salts such as calcium carbonate, carbon black, silica, Glass etc. are mentioned. Of these, silica, alumina, titanium oxide, aluminum nitride, magnesium hydroxide, aluminum hydroxide and the like are preferably used. Here, the silica may be either amorphous or crystalline, and it is not limited that the silica can be properly used according to the characteristics of each. These inorganic fillers may be subjected to a surface treatment using a silane coupling agent or the like for the purpose of improving adhesiveness or filling properties. Although the particle diameter of the inorganic filler is not particularly limited, it is blended with an average primary particle diameter of 0.005 to 30 μm in terms of dispersibility and coatability, surface roughening ability, etc. (1) Adhesive layer and / or (3) 120% or less of the total thickness of the support coating layer is preferable.

  In the metal-supported flexible substrate of the present invention, (1) the adhesive layer may contain (A) a polyamide resin containing a dimer acid residue.

  (A) The dimer acid in the polyamide resin containing a dimer acid residue is industrially a dibasic acid in the highest molecular weight region, and has a bulky hydrocarbon group and thus has a high hydrophobicity. Therefore, the dimer acid polyamide resin derived from dimer acid is an organic solvent necessary for realizing the metal-supported flexible substrate of the present invention while maintaining toughness, flexibility and low water absorption because of low crystallinity. It has the solubility of. Furthermore, it has hydrolysis resistance and flame retardancy derived from the strong binding force of the amide bond. Therefore, by using a polyamide resin having a dimer acid residue, while maintaining the chemical resistance, flame retardancy and low curl properties required for a flexible substrate, the punching property in the tape automated bonding method and the similar method can be achieved. Keep good. Moreover, it is possible to satisfactorily suppress foaming due to moisture absorbed by the resin when the adhesive is completely cured after the circuit metal layer is disposed after punching. A polyamide resin having a dicarboxylic acid residue having 36 carbon atoms is preferable in terms of toughness, film-forming property and processability. If it is a polyamide resin which has a dimer acid residue, a well-known various thing can be used and you may use 2 or more types.

  A polyamide resin having a dimer acid residue can be obtained by polycondensation of dimer acid and diamine by a conventional method. At this time, dicarboxylic acid other than dimer acid, azelaic acid and sebacic acid are used as copolymerization components. You may contain. As diamine, well-known things, such as ethylenediamine, hexamethylenediamine, and piperazine, can be used, and two or more kinds may be used.

  In the metal-supported flexible substrate of the present invention, (1) the adhesive layer may contain (B) a phenol resin. The phenol resin is not particularly limited as long as it contains two or more phenolic hydroxyl groups in one molecule, and any known phenol resin such as novolac type phenol resin and resol type phenol resin can be used. Two or more of the above may be used, and it is preferable to use a resol type phenol resin from the viewpoint of insulation reliability.

  In the present invention, the adhesive layer may contain (C) an epoxy resin. The epoxy resin preferably has two or more epoxy groups, and in addition to the epoxy group, a total of three chemical reaction sites selected from the group consisting of an allyl group, a methallyl group, an amino group, a hydroxyl group and a carboxyl group. What has the above is also preferable. When two or more different chemical reaction sites are included, it is sufficient that the total number of all types of chemical reaction sites in the unit molecule is three or more. The position of the chemical reaction site is not particularly limited, but preferably has a chemical reaction site at least in the side chain. Two or more of the above epoxy resins may be used.

  In the present invention, (1) the adhesive layer may contain (D) a curing accelerator. For example, known ones such as aromatic polyamines, imidazole derivatives such as 2-alkyl-4-methylimidazole and 2-phenyl-4-alkylimidazole, dicyandiamide, triphenylphosphine and diazabicycloundecene can be exemplified. Two or more of these may be used.

  In the present invention, (1) the adhesive layer may contain (E) a filler. The filler is not particularly limited as long as it does not impair the properties of the adhesive, but silica, alumina, aluminum nitride, titanium oxide, magnesium hydroxide, aluminum hydroxide and the like are preferably used. Here, the silica may be either amorphous or crystalline, and it is not limited that the silica can be properly used according to the characteristics of each. These inorganic fillers may be subjected to a surface treatment using a silane coupling agent or the like for the purpose of improving adhesiveness or filling properties.

  In addition to the above components, it is not limited at all to contain an antioxidant, an ion scavenger and the like within a range that does not impair the properties of the adhesive. The antioxidant is not particularly limited as long as it imparts an antioxidant function. Known antioxidants such as a phenol-based antioxidant, a thioether-based antioxidant, a phosphorus-based antioxidant, and an amine-based antioxidant are used. An inhibitor can be used. Two or more of these may be used.

  The metal-supported flexible substrate of the present invention is a metal-supported carrier tape by (1) maintaining the adhesive layer in a semi-cured state and (4) arranging a protective film before arranging the metal layer for circuit formation. Also good. The protective film is not particularly limited as long as it can be peeled without impairing the form and function of the adhesive layer. For example, polyester, polyolefin, polyphenylene sulfide, polyvinyl chloride, polytetrafluoroethylene, polyvinylidene fluoride, polyvinyl fluoride, polyvinyl butyral , Plastic films such as polyvinyl acetate, polyvinyl alcohol, polycarbonate, polyamide, polyimide, polymethyl methacrylate, films coated with a release agent such as silicone or fluorine compound, and papers laminated with these films, release films Examples thereof include paper impregnated or coated with a moldable resin.

  Metal support carrier tape is formed by punching, etc., after forming the necessary device holes, peeling off the protective film, and arranging the metal layer for circuit formation by the laminating method or pressing method. Lead) can be formed. If mounting using flying leads, ICs and LED elements can be mounted from either the front or back of the metal support carrier tape, which not only improves the layout and heat dissipation design of the mounted components. Further, the dielectric breakdown of the support metal layer-circuit forming layer due to the compressive breakdown of the insulating layer, which is a problem in the wire bonding method, can be further avoided.

  Next, the method for producing the metal-supported flexible substrate of the present invention will be described with examples.

  (A) (1) The metal composition of the present invention is prepared by dissolving the resin composition constituting the adhesive layer in a solvent to form an adhesive coating, and (2) coating and drying on the support to form the adhesive layer. A flexible substrate is obtained. The film thickness of the adhesive layer is not particularly limited as long as it satisfies each required function such as adhesiveness, insulation, and thermal conductivity, but it is preferably applied so as to be 2 to 200 μm in order to maintain flexibility. It is more preferable to apply so that it may become 2-50 micrometers. The application method is not particularly limited, but general application equipment such as a comma method, a lip method, a roll method, a Mayer bar method, and a gravure method may be appropriately used in accordance with the paint properties. Drying conditions are usually 100 to 200 ° C. and 1 to 5 minutes. Solvents are not particularly limited, but aromatics such as toluene, xylene and chlorobenzene, ketones such as methyl ethyl ketone and methyl isobutyl ketone, aprotics such as dimethylformamide, dimethylacetamide and N methylpyrrolidone, ethanol, methanol and isopropyl alcohol Alcohol solvents such as N butanol and benzyl alcohol are suitable, and two or more of these may be used. In addition, when (D) a curing accelerator or (E) filler that is insoluble in a solvent is used, a method of dispersing in a solvent in advance using a homomixer, a bead mill, a sand mill, a cavitation type dispersion device, or the like. Alternatively, (1) a method of kneading and dispersing in any one or more of each resin constituting the adhesive layer using an extruder, a Banbury mixer, or the like can be suitably used.

  (B) The adhesive layer formed by the method described in (a) may be laminated with a protective film (4) having releasability if necessary to obtain the metal-supported flexible substrate of the present invention. When the thickness of the adhesive is further increased, the coating material may be applied again, or the formed adhesive layer may be laminated a plurality of times. Alternatively, (4) an adhesive layer may be formed on the protective film in advance, and (2) the support may be laminated to obtain the metal-supported flexible substrate of the present invention. (2) When the (3) support coating layer is arranged on the support, (3) a coating material in which the resin that becomes the support coating layer is dissolved or dispersed in an organic solvent is prepared in advance; It is preferable to apply (3) a support covering layer by coating and drying at a predetermined thickness. In addition, when a support covering layer (3) having releasability is provided, a releasable resin layer is provided. It is preferable that a multilayer structure obtained by applying and drying a film for maintaining the tensile strength necessary for peeling is previously bonded to (2) a support by a laminating method or the like.

(2) Laminating conditions of (1) adhesive layer on the support are usually a temperature of 50 to 160 ° C. and a pressure of 0.1 to 0.5 MPa. The laminating temperature is preferably 140 ° C. or lower. It can be judged that it is good if it is 120 ° C. or lower, and very good if it is 100 ° C. or lower. In addition, (2) when (3) support coating layer is formed on the (1) adhesive layer side of the support, (2) (3) the support coating layer is arranged on the support ( 1) The adhesive layer is laminated, and in that case, it is preferable to laminate under the same conditions as in the case of (2) directly laminating the adhesive layer on the support.

  After obtaining the metal-supporting flexible substrate of the present invention, the degree of cure of the adhesive layer may be adjusted by, for example, heat treatment at 40 to 100 ° C. for about 20 to 300 hours. By adjusting the degree of curing, it is possible to prevent excessive flow of the adhesive when the circuit-forming metal layer is disposed on the metal-supporting flexible substrate and to prevent foaming due to moisture during heat curing.

  The electronic component using the metal-supported flexible substrate of the present invention has chemical resistance necessary for circuit processing and insulation necessary for the metal support substrate, and easy to reel-to-reel processing, punching processing, and formation of flying leads. Thus, a simpler and lower cost heat radiation design can be achieved compared to conventional electronic components.

  Although an example of embodiment of this invention is shown below, this invention is not limited to these Examples. First, the evaluation method in an Example and a comparative example is demonstrated.

(1) Evaluation of CCD recognizability of metal-supported flexible board For metal-supported flexible circuit boards obtained in each of the examples and comparative examples, a high-precision automatic length measuring machine (QV-HYPER606PRO, QVPAKver.7, B & W CCD camera, Inc. CCD recognizability was evaluated according to the following criteria. If it is greater than or equal to ○, it can be determined that the process can be passed, and if it is greater than ◎, it can be determined that the process can be fully automated.
A: Automatic detection, shape measurement, and pass / fail judgment of circuit patterns is possible by using circuit pattern edge / shape detection using design values input to QVPAK and contrast with circuit metal, and (1) Support The surface pattern of the body was not reflected and reflected, and (1) detailed defect inspection and automatic recognition of the exposed part of the adhesive layer without a circuit could be performed, and complete automation was possible.
○: By using the design value input to QVPAK and the circuit pattern edge / shape detection using the contrast with the circuit metal, automatic recognition / shape measurement / pass / fail judgment of the circuit pattern is possible, and (1) support Although there was a slight reflection of the surface pattern of the body, (1) rough defect inspection and automatic recognition of the exposed part of the adhesive layer without a circuit could be performed.
Δ: Detection using pattern recognition using a reference image input to QVPAK was possible, and it was possible to extract major defects such as circuit defects, but details including dimensions and other defects It was unsuitable for conducting detailed inspections.
×: Contrast was insufficient in the input image, and pattern detection, edge detection, etc. were impossible.

(2) Evaluation of L * value of metal-supporting flexible board Using the metal-supporting flexible board with copper foil for circuit formation obtained in each Example and Comparative Example, the circuit copper foil was removed after all the circuit copper foil was removed by etching. The formed surface was measured for color saturation using a color meter (NR-1 manufactured by Nippon Denshoku Industries Co., Ltd.), and its L * value was measured.

  The L * value may be 50 or less, and more preferably 30 or less.

(3) Evaluation of peel strength of metal-supported flexible board About the metal-supported flexible circuit board obtained in each Example and Comparative Example, the formed 50 μm conductor was used with Tensilon (UTM-4-100 manufactured by Orientec Co., Ltd.) Peel strength was measured by peeling at 90 ° direction at 50 mm / min. Further, after normal measurement, wet heat treatment at 121 ° C./100% RH / 168 hr was performed in a HAST chamber (EMS-221M, manufactured by Espec Corp.), peel strength after PCT was measured, and the peel strength retention rate was calculated. .

  The peel strength retention needs to be 40% or more, preferably 50% or more, good 60% or more, and extremely good 70% or more.

(4) Evaluation of chemical resistance of metal-supported flexible substrate The metal-supported flexible circuit board obtained in each Example and Comparative Example was obtained by using 1, a ferric chloride solution (40 ° C., 37%), 2, a sodium hydroxide solution ( The chemical resistance was evaluated by observing the appearance after immersion in 30 ° C, 1N), 3, electroless tin plating solution (70 ° C, "Timposit" LT-34, manufactured by Rohm and Haas). Judgment criteria are as follows. If it is Δ or more, it can be judged that the process can be passed and it can be judged to be acceptable.
A: When immersed in the chemical solution 1 for 5 minutes, then in the chemical solution 2 for 5 minutes, and further in the chemical solution 3 for 5 minutes, the surface appearance of (2) the support and (3) the support coating layer depends on the chemical solution. There is no significant damage.
○: The requirement of the above ◎ is not satisfied, but (2) the support and (3) the support when immersed in the chemical 1 for 3 minutes, then in the chemical 2 for 3 minutes, and further in the chemical 3 for 3 minutes. The surface appearance of the body covering layer is not significantly damaged by the chemical solution.
Δ: The above requirements of ◎ and ○ are not satisfied, but when immersed in 1 chemical solution for 1 minute, then in 2 chemical solution for 1 minute, and further in 3 chemical solution for 1 minute, (2) the support and (3 ) No significant damage by the chemical solution is observed on the surface appearance of the support coating layer.
×: When immersed in the chemical solution 1 for 1 minute, then in the chemical solution 2 for 1 minute, and further in the chemical solution 3 for 1 minute in sequence, the surface appearance of (2) the support or (3) the support coating layer depends on the chemical solution There is significant damage.

Example 1
(A) Preparation of Adhesive Layer Sheet In preparation of the adhesive layer sheet, (A) dimer acid polyetheramide resin ("Tomide" (registered trademark) PA-200, Fuji Kasei Kogyo Co., Ltd.) as components (A) to (D). Manufactured by the company, amine value 3, melt viscosity 40.0 Pa · s) 100 parts by weight, (B) resol phenol resin (CKM1634 Showa High Polymer Co., Ltd.) 50 parts by weight, (C) epoxy resin (“Epicoat” (registered trademark)) YL980, manufactured by Japan Epoxy Resin Co., Ltd., 80 parts by weight, (D) a curing accelerator (2ethyl-4methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.), 2 parts by weight, ethanol / toluene mixed solvent (mixed weight ratio, ethanol 1) : Toluene 4) was added, and the mixture was stirred and mixed at 30 ° C. to prepare an adhesive composition having a solid content concentration of 25% by weight. This adhesive composition was applied to a protective film (4) protective film (polyethylene terephthalate film having a thickness of 25 μm with a silicone release agent (“Film Vina” (registered trademark) GT manufactured by Fujimori Kogyo Co., Ltd.)) of about 12 μm using a bar coater. After applying to a dry thickness and drying at 150 ° C. for 4 minutes, another (4) protective film is bonded to the surface of the formed adhesive layer so that both sides are sandwiched by (4) protective film A layer sheet was prepared.

(B) Production of metal-supporting flexible substrate and metal-supporting flexible circuit substrate (4) One side of the protective film of the adhesive layer sheet obtained by the method described in (a) above was peeled off, and (2) the support (aluminum (3) Support coating layer (polyamideimide resin (Tg 300 ° C., weight average molecular weight 11000)) and color pigment (3003, 50 μm thick (manufactured by Sumi Light Aluminum Co., Ltd.) linear expansion coefficient 24.0 ppm / ° C.) A 1: 1 mixture of phthalocyanine blue and dioxazine violet)) is formed on both sides with a thickness of 100 μm and laminated at 100 ° C. and 0.3 MPa to form a metal-supported flexible substrate. Obtained.

  The protective film (4) of the metal-supported flexible substrate was peeled off, and an 18 μm electrolytic copper foil (FQ-VLP, manufactured by Mitsui Kinzoku Mining Co., Ltd.) was laminated under the conditions of 140 ° C. and 0.3 MPa pressure. Subsequently, heat treatment was sequentially performed in an air oven at 80 ° C. for 3 hours, at 100 ° C. for 5 hours, and at 150 ° C. for 5 hours to produce a metal-supporting flexible substrate with a copper foil for circuit formation. Photoresist film formation, etching, and resist stripping are performed on the surface of the obtained copper foil for circuit formation of the metal-supported flexible substrate with copper foil for circuit formation by a conventional method to form a counter electrode circuit with a wiring pitch of 100 μm (conductor width: 50 μm). After that, it was immersed in an electroless tin plating solution of a borofluoric acid type (a tin plating solution (trade name) “TINPOSIT” (registered trademark) LT-34 manufactured by Rohm and Haas) at a temperature of 70 ° C. for 5 minutes to obtain a 0.5 μm thick plating. As a result, a metal-supported flexible circuit board was produced.

  The evaluations (1) to (3) were performed using the metal support flexible substrate for evaluation, the metal support flexible substrate with copper foil for circuit formation, and the metal support flexible circuit substrate obtained by the above method.

(Example 2)
In producing the metal-supporting flexible substrate, (3) it was produced by the same method as in Example 1 except that the thickness of the support coating layer was 50 μm, and the evaluations described in (1) to (3) were performed.

(Example 3)
In preparing the metal-supporting flexible substrate, (3) it was prepared in the same manner as in Example 1 except that the thickness of the support coating layer was 10 μm, and the evaluations described in (1) to (3) were performed.

Example 4
In preparing the metal-supporting flexible substrate, (3) it was prepared in the same manner as in Example 1 except that the thickness of the support coating layer was 5 μm, and the evaluations described in (1) to (3) were performed.

(Example 5)
In preparing the metal-supporting flexible substrate, (3) it was prepared in the same manner as in Example 1 except that the thickness of the support coating layer was 3 μm, and the evaluations described in (1) to (3) were performed.

(Example 6)
In the production of the metal support flexible substrate, (3) the support covering layer is made into a two-layer structure of 1.5 μm (total thickness 3.0 μm), and (2) the polyamideimide resin on the side in contact with the support (first layer) (Tg 300 ° C., weight average molecular weight 11000) and weight ratio 98: 2 mixed resin of color pigment (1: 1 mixture of phthalocyanine blue and dioxazine violet), (1) Side in contact with adhesive layer (second layer ) Was prepared in the same manner as in Example 1 except that only a polyamideimide resin (Tg 300 ° C., weight average molecular weight 11000) containing no coloring pigment was used, and the evaluations described in (1) to (3) were performed. It was.

(Example 7)
In making the metal-supported flexible substrate, (3) the support coating layer is made into a two-layer structure (total thickness: 3.0 μm) of 1.5 μm, and (2) a coloring pigment is applied to the side in contact with the support (first layer). Only the polyamidoimide resin (Tg 300 ° C., weight average molecular weight 11000) not included is used, and (1) the polyamideimide resin (Tg 300 ° C., weight average molecular weight 11000) on the side in contact with the adhesive layer (second layer) and the color pigment (A 1: 1 mixture of phthalocyanine blue and dioxazine violet) A weight ratio of 98: 2 was used except that a mixed resin was used, and the evaluations described in (1) to (3) were performed. It was.

(Example 8)
In producing the metal-supporting flexible substrate, (3) it was produced by the same method as in Example 1 except that the thickness of the support coating layer was 1.5 μm, and the evaluations described in (1) to (3) were performed. .

Example 9
In the production of a metal-supported flexible substrate, (3) a polyamideimide resin (Tg 300 ° C., weight average molecular weight 11000), a color pigment (a 1: 1 mixture of phthalocyanine blue and dioxazine violet), and mat treatment are applied to the support coating layer. It was prepared in the same manner as in Example 1 except that a weight ratio of 88: 2: 10 mixed resin (silica, FB-20D, average particle size 20 μm, manufactured by Denki Kagaku Kogyo Co., Ltd.) was used. The evaluation described in (3) was performed.

(Example 10)
In producing the metal-supporting flexible substrate, it was produced by the same method as in Example 9 except that the thickness of the support coating layer was 50 μm, and the evaluations described in (1) to (3) were performed.

(Example 11)
(3) Instead of silica (FB-20D, average particle size 20 μm, manufactured by Denki Kagaku Kogyo), silica (FB-5D, average particle size 5 μm, Electrochemical Industry) This was prepared in the same manner as in Example 9 except that the thickness of the support coating layer was 10 μm, and the evaluations described in (1) to (3) were performed.

(Example 12)
(3) Instead of silica (FB-20D, average particle size 20 μm, manufactured by Denki Kagaku Kogyo Co., Ltd.), silica (SO-E6, average particle size 2 μm, Admatex) Manufactured in the same manner as in Example 9 except that the thickness of the support coating layer was set to 5 μm, and the evaluations described in (1) to (3) were performed.

(Example 13)
(3) Instead of silica (FB-20D, average particle size 20 μm, manufactured by Denki Kagaku Kogyo Co., Ltd.), silica (SO-E6, average particle size 2 μm, Admatex) Manufactured in the same manner as in Example 9 except that the thickness of the support coating layer was 3 μm, and the evaluations described in (1) to (3) were performed.

(Example 14)
In the production of the metal support flexible substrate, (3) the support covering layer is made into a two-layer structure of 1.5 μm (total thickness 3.0 μm), and (2) the polyamideimide resin on the side in contact with the support (first layer) (Tg 300 ° C., weight average molecular weight 11000) and weight ratio 98: 2 mixed resin of color pigment (1: 1 mixture of phthalocyanine blue and dioxazine violet), (1) Side in contact with adhesive layer (second layer Example 1 except that a 90:10 weight ratio resin mixture of polyamideimide resin (Tg 300 ° C., weight average molecular weight 11000) and silica (SO-E3, average particle size 1 μm, manufactured by Admatechs) was used. And the evaluation described in the above (1) to (3) was performed.

(Example 15)
In the production of the metal support flexible substrate, (3) the support covering layer is made into a two-layer structure of 1.5 μm (total thickness 3.0 μm), and (2) the polyamideimide resin on the side in contact with the support (first layer) (Tg 300 ° C., weight average molecular weight 11000) only, (1) On the side in contact with the adhesive layer (second layer), a polyamideimide resin (Tg 300 ° C., weight average molecular weight 11000) and a color pigment (phthalocyanine blue) A 1: 1 mixture of dioxazine violet) and silica (FB-20D, average particle size 20 μm, manufactured by Denki Kagaku Kogyo Co., Ltd.) in a weight ratio of 88: 2: 10. And evaluated as described in (1) to (3) above.

(Example 16)
In producing the metal-supported flexible substrate, (3) The substrate was prepared by the same method as in Example 9 except that the thickness of the support coating layer was 1.5 μm, and the evaluations described in (1) to (3) were performed. .

(Comparative Example 1)
In preparation, it was prepared in the same manner as in Example 1 except that (3) the support coating layer was not formed on the support (2), and the evaluations described in (1) to (3) were performed.

(Comparative Example 2)
In making (2) support (aluminum foil, 3003, 50 μm thick (manufactured by Sumi Light Aluminum Co., Ltd.) linear expansion coefficient 24.0 ppm / ° C.) in advance, (3) support covering layer (polyamideimide resin (Tg 300 ° C., A weight average molecular weight of 11000) was prepared in the same manner as in Example 1 except that one having a thickness of 1 μm on both sides was used, and the evaluations described in (1) to (3) were performed.

  (3) The structure of the support coating layer is shown in Table 1, and the evaluation results of Examples and Comparative Examples are shown in Tables 1 and 2.

Claims (7)

(1) An adhesive layer, (2) a support, and (3) a metal support flexible substrate composed of a support coating layer, (2) the support is made of a metal foil, and (2) the support (1) the adhesive layer side and / or the opposite side thereof is (3) a support coating layer, and (1) the adhesive layer and / or (3) the support coating layer is colored. A metal-supporting flexible board characterized by 2. The metal-supporting flexible according to claim 1, wherein the coloring treatment on the adhesive layer and / or (3) the support covering layer is darker than the circuit wiring formed on the substrate. substrate. (3) The metal-supporting flexible substrate according to claim 1 or 2, wherein the thickness of the support covering layer is 2 µm or more and 100 µm or less. (2) The metal support flexible substrate according to any one of claims 1 to 3, wherein the support is one or more selected from copper foil, stainless steel foil, aluminum foil and nickel foil. A metal support carrier tape for tape automated bonding using the metal support flexible substrate according to claim 1. The metal support flexible circuit board for LED mounting using the metal support flexible board in any one of Claims 1-4. 5. A metal support flexible circuit board laminated with a copper foil for circuit formation using the metal support flexible board according to claim 1, wherein the circuit formed by the metal layer for circuit formation has a flying lead structure. A metal-supported flexible circuit board with laminated copper foil for circuit formation, characterized in that