TW201540800A - Material for bonding electronic component, and method for bonding electronic component - Google Patents

Abstract

The purpose of the present invention is to provide a material for bonding an electronic component, such as an electroconductive paste or electroconductive film provided with each of reworkability, storage stability, heat resistance, etc., and to provide a highly reliable electronic device in which the material for bonding an electronic component is used. A material for bonding is used which contains 20-100 parts by mass of core-shell-type organic particles and 0.1-100 parts by mass of electroconductive particles with respect to 100 parts by mass of epoxy resin, the material for bonding containing at least 45 parts by mass of a phenoxy-type epoxy resin having a glass transition temperature of 100 DEG C or higher in 100 parts by mass of the epoxy resin.

Description

Electronic component followed by material and electronic component Field of invention

The present invention relates to an electronic component bonding material such as an adhesive composition for attaching an electronic component to a circuit substrate. More specifically, there is an electronic component bonding material which is used as an adhesive composition and a film, etc., which is easier to carry out heavy work and has improved storage stability, and the heavy work is performed by following the electronic component. Also stripped according to demand.

Background of the invention

Conventionally, as an adhesive for an electronic component and a circuit board, an epoxy-based thermosetting resin is used. The epoxy-based thermosetting resin is cured by reacting an epoxy resin with a crosslinking agent to form a crosslinked structure, and therefore has excellent initial properties after curing, excellent resistance to wet heat test, and excellent properties after heat resistance test. High reliability.

On the other hand, after the electronic component is attached to the circuit board, the position of the electronic component is slightly corrected, and a work called rework or repair may be performed, that is, the circuit substrate is heated to soften the adhesive to separate the electronic component. The circuit board is peeled off and attached again, so it will be required to improve the heavy work industry. The linearity (hereinafter, referred to as "reworkability"), but the epoxy-based thermosetting resin has a problem of poor workability and poor storage stability.

A method for improving the reworkability is known as a method of controlling the crosslinking density of a crosslinked structure of an epoxy-based thermosetting resin.

For example, Patent Document 1 describes that the reworkability of the adhesive composition is improved by blending a non-crosslinkable thermoplastic material into a crosslinkable resin.

However, even if the crosslink density is controlled, as long as it has a crosslinked structure, problems such as vertical or heating fluidity are low and some adhesive remains, and the reworkability is still insufficient. Furthermore, the reworkability, the adhesion, and the heat resistance are inherently opposite, and the problem of lowering the reworkability and reducing the heat resistance is not solved.

In this regard, for example, Patent Document 2 discloses a conductive adhesive which is intended to improve both workability and adhesion, and is composed of a bisphenol A type epoxy resin, a phenoxy resin, and a liquid epoxy compound. And conductive filler composition. However, its reworkability and adhesion are insufficient.

As described above, in actuality, an electronic component adhesive material which can satisfy a high standard in any of heavy workability, storage stability, heat resistance, and moist heat resistance has not been obtained so far.

Advanced technical literature

Patent literature

Patent Document 1: Japanese Patent Publication No. 05-506691

Patent Document 2: Japanese Laid-Open Patent Publication No. Hei 11-209716

Summary of invention

The present invention has been made in view of the foregoing, and aims to provide an electronic component adhesive material which combines heavy workability, storage stability, heat resistance and moisture resistance. It is also an object to provide an electronic part adhesive composition and an adhesive film which are highly reliable in environmental tests which are particularly resistant to the severe conditions of 85 ° C / 85% RH. Furthermore, it is an object to provide an efficient follow-up method which can be carried out using the above-described adhesive material of the present invention.

The electronic component adhesive material of the present invention comprises 20 to 100 parts by mass of the core-shell type organic particles and 0.1 to 100 parts by mass of the conductive particles, and 100 parts by mass of the epoxy resin, based on 100 parts by mass of the epoxy resin. 45 parts by mass or more of the phenoxy type epoxy resin having a glass transition temperature of 100 ° C or higher.

The electronic component adhesive material of the present invention preferably does not contain a hardener for epoxy resin.

The conductive paste of the present invention contains 100 to 900 parts by mass of the solvent with respect to the electronic component adhesive material of the present invention.

Further, the conductive adhesive film is formed by forming a film on the release substrate, and the film contains the electronic component adhesive material.

The electronic device of the present invention transmits the electronic component to the circuit board through the conductor layer composed of the above-described electronic component bonding material of the present invention.

The aforementioned electronic device is preferably when the electronic machine is heated to 200 ° C. The peel strength of the electronic parts is 10 N/cm or less.

The electronic component adhesive material of the present invention is composed of an epoxy resin, a predetermined amount of core-shell type organic particles, and conductive particles, and the epoxy resin contains a predetermined amount or more of phenoxylate having a glass transition temperature of 100 ° C or more. Base type epoxy resin, therefore, the workability and storage stability are improved. On the other hand, it is also excellent in adhesion, and it is possible to carry out high heat and humidity resistance which can withstand severe test conditions such as the 85 ° C / 85% RH test. Therefore, the reliability of the article using the adhesive material can be greatly improved.

1‧‧‧Flexible printed circuit board

2‧‧‧Glass epoxy substrate

3‧‧‧Resistance meter

A~g‧‧‧electrode

A’~g’‧‧‧electrode

Fig. 1 is a schematic view showing a sample for measurement for explaining a method of measuring a connection resistance.

Fig. 2 is an enlarged view showing an important portion (the succeeding portion of the electrode group) of Fig. 1.

Used to implement the type of invention

The electronic component adhesive material of the present invention contains at least an epoxy resin, core-shell type organic particles, and conductive particles, and the epoxy resin contains a predetermined amount or more of glass transition temperature (hereinafter sometimes abbreviated as "Tg") of 100. A phenoxy epoxy resin above °C.

The phenoxy type epoxy resin used in the present invention is a prepolymer obtained by a condensation reaction of bisphenol and epichlorohydrin, and a polymer obtained by polymerizing at least one of the prepolymers. In the present specification, when only "phenoxy resin" is mentioned, it also includes the aforementioned prepolymer, or its polymer, or prepolymer and poly Any of a mixture of compounds.

In the present specification, the term "bisphenol" means a compound having two hydroxyphenyl groups, and the Tg is not particularly limited as long as it is obtained from the phenoxy resin in the above range, and a preferred example thereof is exemplified by 1,1-bis(4-hydroxyphenyl)-1-phenylethane (formula (1)) and bis(4-hydroxyphenyl)diphenylethane (formula (2)) represented by the following formula; 2,2-bis(3-methyl-4-hydroxyphenyl)propane (formula (3)), 1,3-bis(2-(4-hydroxyphenyl)-2-propyl)benzene (formula 4)), 1,4-bis(2-(4-hydroxyphenyl)-2-propyl)benzene (formula (5)), 5,5-(1-methylethylidene)-di[1] , 1-(diphenyl)-2-ol]propane (formula (6)), 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane (formula (7)) 1,1-bis(4-hydroxyphenyl)cyclohexane (formula (8)) and the like.

The above-mentioned polymerization does not use a crosslinking agent. Therefore, the phenoxy resin used in the present invention is a thermoplastic resin which does not substantially form a crosslinked structure after curing.

The aforementioned phenoxy resin is preferably at room temperature and is solid. It is a solid at room temperature and is a solid state which is in a solvent-free state at 25 ° C and does not exhibit fluidity. When the phenoxy resin is a normal temperature and is a solid, it can be used as a conductive paste and a conductive adhesive film.

The phenoxy type epoxy resin having a glass transition temperature of 100 ° C or higher is preferably contained in 100 parts by mass of the epoxy resin from the viewpoints of heat resistance, particularly, resistance to heat resistance and reworkability. 45 parts by mass or more, more preferably 50 parts by mass or more.

The electronic component adhesive material of the present invention may also be an epoxy resin other than the above phenoxy epoxy resin. a phenoxy ring as described above Examples of the epoxy resin other than the oxygen resin include a sulfonyl epoxy resin, a biphenyl epoxy resin, a novolac epoxy resin, a glycidylamine epoxy resin, and a glycidyl ester epoxy resin. Etc.

The electronic component adhesive material of the present invention may be a resin other than the epoxy resin such as the phenoxy epoxy resin, as long as it does not deviate from the object of the present invention. Examples of such a resin include an acrylic resin, a polyester resin, a polyimide resin, a polyamide resin, a polyolefin resin, a urethane resin, and the like.

Next, the core-shell type organic particles (hereinafter sometimes referred to as "core-shell type particles") used in the present invention are multilayer structure fine particles having at least a core and a shell of different compositions. In the present invention, the core is made of acrylic acid. The rubber is composed of an acrylic polymer and an epoxy polymer on the surface of the inner core to form an outer shell. By using such core-shell type particles in an appropriate amount, the peel strength and the effect of the shake resistance (hereinafter sometimes referred to as the thixotropic index) can be improved, and the effect of preventing the sedimentation of the conductive particles can be obtained by the improvement of the shakeability.

The size of the core-shell type particles used in the present invention, the average particle diameter is preferably in the range of 0.01 to 10 μm, more preferably 0.1 to 5 μm.

The suitable blending amount of the core-shell type organic particles in the present invention is related to the particle diameter, but it is preferably 100 parts by mass relative to the resin component from the viewpoints of improvement in peel strength and shake resistance and good printability. It is preferably in the range of 20 to 100 parts by mass, and more preferably in the range of 20 to 50 parts by mass.

Moreover, the electronic component of the present invention can be added to the material as needed. Add inorganic particles. Examples of such inorganic particles include well-known inorganic particles such as talc, cerium oxide microparticles, alumina, barium sulfate, mica powder, aluminum hydroxide, magnesium hydroxide, and calcium carbonate. In terms of improvement in strength and shakeability, talc and cerium oxide particles are preferred.

The blending amount when the inorganic fine particles are blended is preferably in the range of 1 to 200 parts by mass, and more preferably 2 to 100 parts by mass, per 100 parts by mass of the resin component, from the viewpoint of improving the peel strength and the shake.

The conductive particles used in the present invention are not particularly limited, and those which are generally used in various conductive pastes and conductive adhesive films can be appropriately selected and used. Preferred examples of the composition include gold, silver, copper and nickel. In addition to the metal powder composed of a single metal or the like, a metal powder composed of two or more kinds of alloys and a metal powder coated with another metal may be used. Further, those in which the resin particles are coated with a metal and the resin particles coated with the metal are provided with an insulating layer may be used.

The shape of the metal powder can be suitably selected from among the users by a spherical shape, a scale shape, a dendritic shape, etc., and a spherical shape is preferable. Further, the particle diameter is not limited, but generally the average particle diameter is about 1 to 50 μm.

The blending amount of the conductive particles is preferably in the range of 0.1 to 100 parts by mass, and more preferably 1 to 50 parts by mass, per 100 parts by mass of the resin component, from the viewpoint of conductivity and insulating properties. When the blending amount of the conductive particles is within the above range, it can also be used as an anisotropic conductive material.

When the electronic component adhesive of the present invention is used as a conductive paste, it is adjusted to a desired viscosity by adding a solvent. The solvent used in the present invention has a boiling point of preferably 100 in terms of workability when the paste is applied. More preferably, it is 150 to 250 ° C to 300 ° C. Preferred examples of the solvent include N-methylpyrrolidone, hexane, heptane, decane, toluene, xylene, cyclohexanone, mineral spirits, butyl carbitol, and butyl carbitol. Acetate, isophorone, etc.

Further, the solvent is used in an amount of 100 to 900 parts by mass based on 100 parts by mass of the total amount of the phenoxy type epoxy resin, the core-shell type organic particles and the conductive particles (only a solid content) of the adhesive composition. The range is better. When the solvent is 100 parts by mass or more, when the conductive paste is applied by screen printing, it is easy to prevent mesh clogging and uneven coating. In addition, when the solvent is 900 parts by mass or less, it is easy to ensure the coating thickness.

The adhesive material of the present invention preferably has a 90° peel strength (tensile speed: 50 m/min, maximum value at break) in an environment of 200 ° C, which is preferably 10 N/cm or less, in terms of particularly excellent workability. More preferably 5 N/cm or less.

Further, the conductive paste preferably has a thixotropic index (TI) at 25 ° C of 1.5 or more. When TI is 1.5 or more, sedimentation of electroconductive particle can be suppressed. Further, TI should be 3.0 or less. When the TI is 3.0 or less, when the conductive paste is applied by screen printing, it is possible to prevent the mesh from being clogged and unevenly coated.

The electronic component adhesive material of the present invention may be blended with an antioxidant, a pigment, a dye, a tackifying resin, a plasticizer, or an ultraviolet absorbing agent as long as it does not violate the object of the present invention, not only the resin component other than the phenoxy resin. Additives such as a agent, an antifoaming agent, a flatness adjuster, a filler, a flame retardant, and the like.

The electronic component following material of the present invention preferably does not contain a hardener. Here, the hardener is an aliphatic polyamine and a polyamide resin, an aliphatic diamine, and a aryl A conventional hardener for an epoxy resin which promotes hardening of an epoxy resin, such as an aromatic diamine, an imidazole compound, or an acid anhydride. By not containing a hardener, workability and storage stability can be improved.

The electronic component adhesive material of the present invention may be, for example, an anisotropic conductive adhesive film. In this case, for example, the conductive paste is applied to the surface and subjected to a release treatment. The polyester film and the polyimide film are peeled off from the substrate and dried.

When the anisotropic conductivity obtained by the above operation is followed by the paste or the film, the operation of the electronic component can be carried out by a conventional method.

The method of manufacturing an electronic device by using an electrically conductive paste in which an electronic component is attached to a circuit board is not limited, and can be manufactured, for example, by the following method. First, the conductive paste is applied to the surface of the circuit board by screen printing to form a predetermined pattern. Next, the circuit substrate is heated to volatilize the solvent to form a conductor layer composed of a predetermined pattern. Further, an electronic component is placed on the conductor layer and heat-pressed, and the electronic component is attached to the circuit board through the conductive adhesive layer to obtain an electronic device. The temperature and pressure at the time of hot pressing can be suitably set, and it is preferably 2 to 4 MPa and 100 to 220 °C.

The method of manufacturing an electronic device by using a conductive type bonding film to bond an electronic component to a circuit board is not limited, and can be manufactured, for example, by the following method. First, a conductive paste is applied to the surface of the release substrate, and the solvent is volatilized to obtain a conductive adhesive film having a conductive adhesive layer formed on the release substrate. Secondly, the conductive connection on the conductive film The coating layer is bonded to the surface of the circuit board and temporarily pressed to transfer the conductive adhesive layer to the surface of the circuit board. Further, the temperature and pressure at the time of the temporary pressing can be appropriately set, and it is preferably 1 to 5 MPa and 80 to 100 °C. Next, the peeling base material is peeled off to expose the conductive adhesive layer to form a conductor layer, and the electronic component is placed thereon and heat-pressed, and the conductive adhesive layer is passed through to bond the electronic component to the circuit board, thereby obtaining an electronic device. . The temperature and pressure at the time of hot pressing can be suitably set, and when using the electronic component joining material of the present invention, it is preferably 2 to 4 MPa and 100 to 220 °C.

When the electronic device thus obtained is heated to 200 ° C, the peeling strength of the electronic component is preferably 10 N/cm or less, more preferably 5 N/cm or less. When the peel strength is 10 N/cm or less, an electronic device excellent in reworkability can be obtained.

The repair work of the electronic parts can be carried out according to the conventional operation method, and the circuit board and the electronic parts which have been subsequently heated are heated to about 150 to 230 ° C, the electronic parts are removed and the adhesive is removed, and the electronic parts are replaced again.

Example

The following examples of the invention are shown, but the invention is not limited by the following examples. Further, the following blending ratios and the like are based on mass basis (parts by mass, % by mass, etc.) unless otherwise specified.

<Modulation of Conductive Resin Composition>

[Example 1]

In a glass container equipped with a stirrer, a dropping funnel and a thermometer, 700 g of epichlorohydrin and 1100 g of 1,1-bis(4-hydroxyphenyl)-1-phenylethane were added and uniformly dissolved. After the solution, it was heated to 80 °C. Next, 400 g of a 20% aqueous sodium hydroxide solution was dropped in a glass vessel for 5 hours, and after reacting for 2 hours, the aqueous phase was removed, and excess epichlorohydrin was distilled off to obtain a reaction product. To the obtained reaction product, 500 g of toluene was added to dissolve it uniformly, and 160 g of water was added thereto, followed by washing with water, followed by separation of oil and water, and water was removed from the oil layer, and then toluene was distilled to obtain epoxy resin A (phenoxy group). Type epoxy resin). The glass transition temperature of the obtained epoxy resin A was 130 °C.

Further, the glass transition temperature was measured by a differential scanning calorimetry method in the following manner. First, 10 mg to 20 mg of the sample was placed on an aluminum pan, and the sample was heated from -10 ° C to 200 ° C (temperature rise of the first time) under a nitrogen gas flow at a temperature increase rate of 10 ° C / min, and cooled. Next, the temperature rise of the second time is performed under the same conditions as the temperature rise of the first time. The baseline shift of the DSC curve obtained at this time was used as a reference, and the glass transition temperature was measured (hereinafter, the epoxy resins B and C were also measured in the same manner).

Next, the obtained epoxy resin A, core-shell type particles, conductive particles, and solvent were uniformly mixed according to the amounts shown in Table 1, to obtain an electronic component subsequent material.

[Embodiment 2]

An electronic component subsequent material was obtained in the same manner as in Example 1 except that the blending amount of the core-shell type particles, the conductive particles, and the solvent was the amount shown in Table 1.

[Example 3]

The electronic parts were obtained in the same manner as in Example 1 except that the blending amount of the core-shell type particles, the conductive particles, and the solvent was the amount shown in Table 1. material.

[Example 4]

Except that the blending amount of epoxy resin A, epoxy resin B (glass transition temperature: 98 ° C), core-shell type organic particles, conductive particles and solvent is the blending amount shown in Table 1, the others are implemented. Example 1 obtained the electronic component follow-up material in the same manner.

[Example 5]

The electronic parts were obtained in the same manner as in Example 1 except that the blending amounts of the epoxy resin A, the epoxy resin B, the core-shell type organic particles, the conductive particles, and the solvent were the amounts shown in Table 1. Then the material.

[Comparative Example 1]

Except that epoxy resin B was used instead of epoxy resin A, the blending amount of epoxy resin B, core-shell type particles, conductive particles and solvent was the amount shown in Table 1, and the rest and examples were given. 1 Obtain the electronic part following material in the same manner.

[Comparative Example 2]

An electronic component subsequent material was obtained in the same manner as in Example 1 except that the blending amount of the core-shell type particles, the conductive particles, and the solvent was the amount shown in Table 1.

[Comparative Example 3]

An electronic component subsequent material was obtained in the same manner as in Example 1 except that the blending amount of the core-shell type particles, the conductive particles, and the solvent was the amount shown in Table 1.

[Comparative Example 4]

Except that the blending amount of core-shell particles, conductive particles and solvent is as shown in Table 1. The electronic component follow-up material was obtained in the same manner as in Example 1 except that the blending amount is shown.

[Comparative Example 5]

In addition to the epoxy resin A, epoxy resin B, epoxy resin C, and imidazole hardener (Asahi Kasei Homes Corporation, trade name HX3921HP) were used, and epoxy resin B and epoxy resin C were used. The electronic component subsequent material was obtained in the same manner as in Example 1 except that the blending amount of the core-shell type particles, the conductive particles, and the solvent was the amount shown in Table 1.

[Comparative Example 6]

The electronic parts were obtained in the same manner as in Example 1 except that the blending amounts of the epoxy resin A, the epoxy resin B, the core-shell type organic particles, the conductive particles, and the solvent were the amounts shown in Table 1. Then the material.

[Comparative Example 7]

The electronic parts were obtained in the same manner as in Example 1 except that the blending amounts of the epoxy resin A, the epoxy resin B, the core-shell type organic particles, the conductive particles, and the solvent were the amounts shown in Table 1. Then the material.

<Anisotropic Conductivity and subsequent manufacture and evaluation of paste>

The phenoxy type epoxy resin, the core-shell type organic particles, the conductive particles, and the solvent were mixed at a ratio shown in Table 1 to obtain a conductive paste. The conductive paste was applied to a flexible printed circuit board, and the flexible printed circuit board and the FR-4 (glass epoxy-coated copper plate) were bonded together by the paste, and pressed at a temperature of 180 ° C and a pressure of 4 MPa. The sample for evaluation was applied for 7 seconds, and the peeling strength, the connection resistance value, the shake resistance, and the rework characteristic were measured or evaluated by the following methods. The blending of the components is shown in Table 1, measurement and evaluation. The price results are shown in Table 2.

<doped synthesis>

Epoxy resin B: bisphenol A type epoxy resin (Mitsubishi Chemical Co., Ltd., trade name JER1256)

Epoxy resin C: sulfonium urea type epoxy resin (Mitsubishi Chemical Co., Ltd., trade name YX8100)

Latent curing agent: modified imidazole type hardener (Asahi Kasei Homes Corporation, trade name HX3921HP)

Core-shell type organic particles: manufactured by Aika Kogyo Co., Ltd., trade name AC3816N (nuclear layer: acrylic rubber, outer shell: acrylic glassy polymer, average primary particle diameter: 0.5 μm )

Conductive particles: gold-plated resin particles having an average particle diameter of 10 μm

Solvent: butyl carbitol acetate (boiling point 247 ° C)

<Evaluation sample>

Flexible printed circuit board (Kansai Denshi Kogyo Co., Ltd.)

Composition: Polyimine 25 μm, adhesive 20 μm, copper foil 18 μm

Plating: nickel 3μm, gold 0.05μm

Glass epoxy substrate (Kansai Denshi Kogyo Co., Ltd.)

Composition: copper foil 35μm

Plating: nickel 3μm, gold 0.05μm

<Measurement, evaluation method>

Rework characteristics: a flexible printed circuit board for evaluation samples, at 200 In the environment of °C, the tensile tester (Shimadzu Corporation, trade name: AGS-X50S) was used, and the peeling was performed at a tensile speed of 50 m/min and a peeling angle of 90°, and the maximum value at the time of the fracture was measured. . If it is 10 N/cm or less, the workability is good.

Connection resistance value (initial): Measurement was performed using the evaluation sample having the shape shown in Fig. 1. In Fig. 1, reference numeral 1 denotes a flexible printed circuit board (FPC), reference numeral 2 denotes a glass epoxy substrate, reference numeral 3 denotes a resistance meter, and reference numerals a to g denote electrodes formed on a flexible printed circuit board, and reference numerals a' to g' is an electrode formed on a glass epoxy substrate. The widths of the electrodes a to g, a' to g' were both 75 μm. The electrode a and the electrode a' are overlapped on the flexible printed circuit board 1 and the glass epoxy substrate 2, and the end groups are overlapped as shown in Fig. 2, and then the anisotropic conductivity is followed by the paste. The length (I) of the overlapping portion is 5 mm. Between the terminal terminals of the equal electrode a and the electrode a', the connection resistance was measured using a resistance meter (HIDKI EECORPORATION, low resistance meter, DC mode 3227 milliohm high speed tester), and respectively The connection resistance between the other electrodes (between b-b' and g-g') was measured, and the average value was obtained. Moreover, as long as it is 1 Ω or less, it can be used without any problem.

Connection resistance (85 ° C / 85% reliability): After the sample for evaluation described above was placed in a high-temperature and high-humidity environment (85 ° C, 85% RH) for 250 hours, the connection resistance was measured in the same manner as described above. Further, the connection resistance value is 1 Ω or less, and the rate of change is 30% or less, so that it can be used without problems. Here, the rate of change is a ratio (%) expressed by the following formula.

[Number 1] Rate of change (%) = {(resistance value after environmental test - resistance value before environmental test) / resistance value before environmental test} × 1

Peeling strength (initial): The flexible printed circuit board of the sample for evaluation was stretched at a normal temperature by a tensile tester (Shimadzu Corporation, trade name: AGS-X50S) at a tensile speed of 50 m/ The peeling angle was 90° and peeled off, and the maximum value at the time of the fracture was measured. If it is 10 N/cm or less, it can be used without problems.

Peeling strength (85° C./85% reliability): After the sample for evaluation was allowed to stand in a high-temperature and high-humidity environment (85° C., 85% RH) for 250 hours, the peel strength was measured in the same manner as described above. If it is 10 N/cm or less, it can be used without problems.

Thixotropy index: The electronic component was adjusted to 25 ° C, and the viscosity of the rotating number of 0.25 rpm and 2 rpm was measured with an E-type viscometer, and the ratio of its viscosity (viscosity at 2 rpm 黏 0.25 rpm) was used as the viscosity. Thixotropy index. Further, as long as the thixotropic index is 1.5 or more, sedimentation of the conductive fine particles can be prevented.

Printing workability: Printing of an adhesive composition was carried out using a mesh of 80 mesh (Tetoron (registered trademark)), and the dry film thickness (drying temperature: 150 ° C, 15 minutes) was maintained at 20 ± 5 μm. By visual observation of whether there were any unsatisfactory conditions such as wiring, board error, foaming, and bleed between the mesh and the printed matter, and evaluated according to the following criteria: A: no line, board error, foaming, bleeding, etc. In this case, the printing workability is good, and B: some are not ideal, but the allowable range is acceptable, the printing workability is acceptable, the C: unsatisfactory situation is remarkable, and the print workability is poor.

Particle sedimentation characteristics: The composition of the adhesive was sufficiently stirred and mixed, and the composition of the adhesive which was left to stand at room temperature for one week was visually observed, and when no precipitation of the conductive particles was observed, A (particle sedimentation property was good) was observed, and conductivity was observed. In the case of sedimentation of the particles, C (poor particle sedimentation characteristics).

From the results shown in Table 2, it was found that the adhesive material of the examples was excellent in reworkability, and had high heat and humidity resistance, storage stability, and printing operation capable of withstanding the test of the severe condition of 85 ° C / 85% RH test. Sex is also good.

In contrast, Comparative Example 1 using an epoxy resin having a low glass transition temperature is low in heat resistance, and the amount of core-shell particles is Comparative Example 2 to 4 outside the range prescribed by the present invention, which is printing workability or Any of the preservation stability is low.

Further, in Comparative Example 5 using a curing agent, the reworkability was inferior due to crosslinking of the epoxy resin. Further, in Comparative Examples 6 and 7 in which the content of the phenoxy type epoxy resin having a glass transition temperature of 100 ° C or more was small, the heat resistance was inferior.

Industrial availability

The adhesive material of the present invention is suitable for use as an anisotropic conductive paste or an anisotropic film excellent in reworkability for following various electronic parts.

Claims (6)

An electronic component splicing material comprising 20 to 100 parts by mass of core-shell type organic particles and 0.1 to 100 parts by mass of conductive particles with respect to 100 parts by mass of the epoxy resin, and the foregoing epoxy resin 100 mass The phenoxy type epoxy resin having a glass transition temperature of 100 ° C or higher is contained in an amount of 45 parts by mass or more. The electronic component according to claim 1 is followed by a material which does not contain a hardener for epoxy resin. A conductive paste comprising 100 to 900 parts by mass of a solvent with respect to the electronic component following material of claim 1 or 2. A conductive adhesive film obtained by forming a film on a release substrate, and the film contains the electronic component bonding material of claim 1 or 2. An electronic device characterized in that an electronic component is attached to a circuit substrate through a conductor layer composed of an electronic component according to claim 1 or 2. The electronic device of claim 5, wherein when the electronic device is heated to 200 ° C, the peel strength of the electronic component is 10 N/cm or less.