CN105814161A - Material for bonding electronic component, and method for bonding electronic component - Google Patents
Material for bonding electronic component, and method for bonding electronic component Download PDFInfo
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- CN105814161A CN105814161A CN201480069841.6A CN201480069841A CN105814161A CN 105814161 A CN105814161 A CN 105814161A CN 201480069841 A CN201480069841 A CN 201480069841A CN 105814161 A CN105814161 A CN 105814161A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Abstract
The purpose of the present invention is to provide a material for bonding an electronic component, such as an electroconductive paste or electroconductive film provided with each of reworkability, storage stability, heat resistance, etc., and to provide a highly reliable electronic device in which the material for bonding an electronic component is used. A material for bonding is used which contains 20-100 parts by mass of core-shell-type organic particles and 0.1-100 parts by mass of electroconductive particles with respect to 100 parts by mass of epoxy resin, the material for bonding containing at least 45 parts by mass of a phenoxy-type epoxy resin having a glass transition temperature of 100 DEG C or higher in 100 parts by mass of the epoxy resin.
Description
Technical field
The present invention relates to the electronic component grafting materials such as a kind of cement constituent being joined to by electronic component on circuit base plate.Specifically, the present invention relates to a kind of electronic component grafting material as cement constituent or junction film etc., thus, after electronic component is joined to circuit base plate temporarily, (rework) operation of doing over again when peeling off as required will be more prone to, and storage stability is improved simultaneously.
Background technology
All the time, electronic component all employ epoxy (epoxy) class thermosetting resin (thermosettingresin) with the cement of circuit base plate.About epoxy (epoxy) class thermosetting resin (thermosettingresin), reacted by epoxy (epoxy) resin and cross-linking agent, form cross-linked structure and harden, so the initial characteristic after hardening, the characteristic after hot resistance test and after heat resistant test are all very superior, have the advantages that reliability is high.
On the other hand, after electronic component is attached circuit base plate, in order to the position of electronic component is finely tuned, it is heated sometimes for circuit base plate, softening cement, again attach up again after peeling off electronic component from circuit base plate, this operation is called does over again (rework) or repairs (repair), it is desirable to this (rework) operation of doing over again and be more prone to (hereinafter referred to as " (rework) property of can doing over again "), but the problem that epoxy (epoxy) class thermosetting resin (thermosettingresin) exists above-mentioned do over again (rework) property and storage stability difference.
About the method improving (rework) property of can doing over again, it is known to the method controlling the crosslink density of the cross-linked structure of epoxy (epoxy) class thermosetting resin (thermosettingresin).
Such as describe according in patent documentation 1, in crosslinkable resin, add non-crosslinked plastic material hot in nature, improve (rework) property of doing over again of cement constituent with this.
But, even if controlling crosslink density, as long as there being cross-linked structure, the mobility after heating is very low, and there is cement and have the problem of some residuals etc., and (rework) property of can doing over again is also not enough.(rework) property and the originally contrary character of zygosity thermostability it addition, can do over again, after (rework) property of can doing over again improves, the problem that will decline of zygosity thermostability not yet solves.
With regard to this, such as Patent Document 2 discloses a kind of electric conductivity cement being made up of bisphenol-A (bisphenolA) type epoxy (epoxy) resin, phenoxy group (Phenoxy) resin, liquid epoxy (epoxy) compound and electroconductive stuffing, it is intended to improve can do over again (rework) property and zygosity simultaneously.But, its can do over again (rework) property and zygosity etc. are still insufficient.
As it has been described above, in reality, the electronic component grafting material that can do over again (rework) property, storage stability, thermostability and humidity resistance can highly be met not yet develops.
Look-ahead technique document
Patent documentation
Patent documentation 1: JP-A 05-506691 publication
Patent documentation 2: Unexamined Patent 11-209716 publication.
Summary of the invention
The problem that invention to solve
The present invention just in view of the foregoing, its object is to the electronic component grafting material providing one to have can do over again (rework) property, storage stability, thermostability and humidity resistance concurrently.About its purpose, electronic component cement constituent that be especially to provide for a kind of environmental test withstood under this critical conditions of 85 DEG C/85%RH, that trustworthiness is high and junction film.Additionally, the present invention also aims to the joint method providing the grafting material of a kind of the invention described above can carry out effectively joint.
Solve the means of problem
Electronic component grafting material about the present invention, containing 20 ~ 100 mass unit nucleocapsid (coreshell) type organic fillers and 0.1 ~ 100 mass unit electroconductive particle for 100 mass unit epoxy (epoxy) resins, containing the glass transition temperatures (glasstransitiontemperature) more than 45 mass units phenoxy group (phenoxy) type epoxy (epoxy) resin more than 100 DEG C in 100 mass unit above-mentioned epoxy (epoxy) resin.
The electronic component grafting material of the present invention is preferably without epoxy (epoxy) resin sclerosing agent.
Relative to the electronic component grafting material of the invention described above, the electric conductivity mastic (paste) of the present invention solvent containing 100 ~ 900 mass units.
Additionally, electric conductivity junction film is formed by the overlay film formed containing above-mentioned electronic component grafting material in peeling base.
The electronic equipment of the present invention is that electronic component is bonded on circuit base plate by the conductor layer that the electronic component grafting material of the invention described above is constituted to obtain.
About above-mentioned electronic equipment, it is desirable to electronic equipment is heated to when 200 DEG C the peel strength of electronic component at below 10N/cm.
Invention effect
The electronic component grafting material of the present invention is described above, it is made up of epoxy (epoxy) resin containing a certain amount of above glass transition temperature (glasstransitiontemperature) phenoxy group (Phenoxy) type epoxy (epoxy) resin more than 100 DEG C and a certain amount of nucleocapsid (coreshell) type organic filler and electroconductive particle, thus, (rework) property of can doing over again and storage stability increase than in the past.On the other hand, the zygosity of the present invention is also very excellent, has high humidity resistance with it when engaging, it is possible to withstands 85 DEG C/85%RH and tests this harsh experimental condition.Therefore, it can be substantially improved the reliability of the product using this grafting material.
Accompanying drawing explanation
Fig. 1 is the sketch map illustrating to connect the test sample of the assay method of resistance.
Fig. 2 is the enlarged drawing of Fig. 1 intermediate portions (bonding part between electrode).
Detailed description of the invention
The electronic component grafting material of the present invention at least contains: containing a certain amount of above glass transition temperature (being hereinafter, sometimes referred to simply as " Tg ") epoxy (epoxy) resin of phenoxy group (phenoxy) type epoxy (epoxy) resin more than 100 DEG C, nucleocapsid (coreshell) type organic filler and electroconductive particle.
Phenoxy group (Phenoxy) type epoxy (epoxy) resin that the present invention uses is at least one polymer being polymerized (polymerization) in the prepolymer (prepolymer) that obtains of condensation (condensation) reaction of bis-phenol (bisphenol) and chloropropylene oxide (epichlorohydrin) and prepolymer (prepolymer) thereof.When being used alone " phenoxy group (phenoxy) resin " word in this manual, in the mixture of above-mentioned prepolymer or its polymer or prepolymer and polymer is included in.
nullSo-called in this manual " bis-phenol (bisphenol) " refers to the compound having two hydroxyphenyl (hydroxyphenyl)，As long as Tg phenoxy group (phenoxy) resin in above-mentioned scope can be obtained，It is not particularly limited，Comparatively ideal example is if any represented by below formula 1,Double; two (4-the hydroxyphenyl)-1-diphenylphosphino ethane (1 of 1-,1-Bis (4-hydroxyphenyl)-1-phenylethane) (formula (1))、Double; two (4-hydroxyphenyl) diphenyl methane (Bis (4-hydroxyphenyl) diphenylmethane) (formula (2))、2,Double; two (3-methyl-4-hydroxyphenyl) propane (2 of 2-，2-Bis(3-methyl-4-hydroxyphenyl) propane) (formula (3))、1,Double; two (2-(4-the hydroxyphenyl)-2-propyl group of 3-) benzene (1,3-Bis (2-(4-hydroxyphenyl)-2-propyl) benzene) (formula (4))、1,Double; two (2-(4-the hydroxyphenyl)-2-propyl group of 4-) benzene (1,4-Bis(2-(4-hydroxyphenyl)-2-propyl) benzene) (formula (5))、5,5-(1-methyl ethylidene)-bis-[1,The double; two phenyl of 1-()-2-alcohol] propane (5，5-(1-Methylethylidene)-bis [1，1-(Bisphenyl)-2-ol ］ propane) (formula (6))、1,Double; two (the 4-hydroxy phenyl)-3 of 1-,3,5-trimethyl-cyclohexane (1，1-bis(4-Hydroxyphenyl)-3，3，5-trimethylcyclohexane) (formula (7))、1,Double; two (4-hydroxyphenyl) hexamethylene (1 of 1-,1-Bis (4-hydroxyphenyl) cyclohexane) (formula (8)) etc..
(changing 1)
(changing 2)
Not using cross-linking agent in above-mentioned polymerization (polymerization), therefore, phenoxy group (phenoxy) resin used in the present invention is the thermoplastic resin being substantially also formed without cross-linked structure after a kind of hardening.
It is solid under the best room temperature of above-mentioned phenoxy group (phenoxy) resin.Under so-called room temperature for solid refer to 25 DEG C without solvent state under do not show the solid state of mobility.It is solid under above-mentioned phenoxy group (phenoxy) resin room temperature, so just can serve as electric conductivity mastic (paste) or electric conductivity junction film.
Consider that the humidity resistance after thermostability, particularly joint and (rework) property of can doing over again will be comparatively good, so above-mentioned phenoxy group (phenoxy) type epoxy (epoxy) resin that glass transition temperature is more than 100 DEG C preferably contains more than 45 mass units in epoxy (epoxy) resin of 100 mass units, containing more than 50 mass units even more ideal.
The electronic component grafting material of the present invention can also use other epoxies (epoxy) resin beyond above-mentioned phenoxy group (phenoxy) type epoxy (epoxy) resin.Other epoxies (epoxy) resin beyond this above-mentioned phenoxy group (phenoxy) type epoxy (epoxy) resin is if any sulfonyl (sulfonyl) type epoxy (epoxy) resin, biphenyl (biphenyl) type epoxy (epoxy) resin, novolaks (novolak) type epoxy (epoxy) resin, glycidyl amine (glycidylamine) type epoxy (epoxy) resin, well-known epoxy (epoxy) resins such as ethylene oxidic ester (glycidylester) type epoxy (epoxy) resin.
As long as the electronic component grafting material of the present invention is in the scope not violating the object of the invention, it is also possible to use the resin beyond epoxy (epoxy) resins such as above-mentioned phenoxy group (phenoxy) type epoxy (epoxy) resin.This resin is if any acrylic acid (acrylic) resin, polyester (polyester) resin, polyimides (polyimide) resin, polyamide (polyamide) resin, polyolefin (polyolefin) resin, urethanes (urethane) resin etc..
Nucleocapsid (coreshell) the type organic filler (below sometimes referred to as " nucleocapsid (coreshell) type particle ") that the present invention uses is the multiple structure micropartical of a kind of kernel at least containing different composition and shell, in the present invention, kernel is made up of acrylic acid (acrylic) class rubber, allow acrylic acid (acrylic) base polymer or epoxy (epoxy) base polymer and core surface glycerol polymerization (graftpolymerization), form shell.The appropriate effect using this nucleocapsid (coreshell) type particle can obtain raising peel strength and thixotropy (below sometimes referred to as thixotroping (thixotropy) index), along with thixotropic improve, it is possible to be effectively prevented electroconductive particle sedimentation.
About the size of nucleocapsid (coreshell) the type particle used in the present invention, being advisable in 0.01 ~ 10 μ m with mean diameter, 0.1 ~ 5 μm better.
The mixed volume that above-mentioned nucleocapsid (coreshell) type organic filler in the present invention is suitable for is different according to its particle diameter difference, but from improving peel strength and this effect of thixotropy and obtaining good printability (printability, or printquality) angle set out, relative to 100 mass unit resinous principles, they are preferably within the scope of 20 ~ 100 mass units, then better in the scope of 20 ~ 50 mass units.
About the electronic component grafting material of the present invention, inorganic particulate can also be added as required.This inorganic particulate is if any well-known inorganic particulates such as Talcum (talc), silicon dioxide (silica) micropartical, aluminium oxide (alumina), barium sulfate (bariumsulfate), Muscovitum (mica) powder, aluminium hydroxide (aluminumhydroxide), magnesium hydroxide (magnesiumhydroxide), calcium carbonate (calciumcarbonate), wherein, from improving peel strength and this point of thixotropy simultaneously, especially it is preferred with Talcum (talc) and silicon dioxide (silica) particle.
About the mixed volume being mixed into the inorganic particles period of the day from 11 p.m. to 1 a.m, from improving peel strength and thixotropic viewpoint, relative to 100 mass unit resinous principles preferably within the scope of 1 ~ 200 mass unit, 2 ~ 100 mass units are then better.
The electroconductive particle used in the present invention is not particularly limited, and the material commonly used in various electric conductivity mastic (paste) and electric conductivity junction film all can suitably be selected.Specifically, it may be preferable to the material that gold, silver, copper and mickel (nickel) are constituted.Except with outside the metal powder that the single metal in above-mentioned substance is constituted, it is also possible to use the metal powder of more than two kinds alloys compositions or be coated, with other kinds of metal, the material that above-mentioned metal powder is obtained.It is coated the obtained material of metal to resin particle further, it is also possible to use or the material that insulating barrier is obtained is set on the resin particle be coated metal.
The shape of metal powder suitably can be selected from the shape that spherical, flakey, dendriform etc. always use, but is preferred with spherical.Particle diameter is also unrestricted, but average particle diameter is about 1 ~ 50 μm.
About the mixed volume of electroconductive particle, from electric conductivity and insulating properties, to be advisable in the scope of 0.1 ~ 100 mass unit relative to 100 mass unit resinous principles, 1 ~ 50 mass unit is better.The mixed volume of electroconductive particle is in above-mentioned scope, it is possible to use as anisotropy (anisotropy) conductive material.
When the electronic component cement of the present invention is used as electric conductivity mastic (paste), it is possible to be adjusted by adding solvent, obtain desired viscosity.About the solvent used in the present invention, the good viewpoint of workability during from coating mastic (paste), being advisable with boiling point for 100 ~ 300 DEG C, 150 ~ 250 DEG C better.Preferred solvent specifically can be listed below: N-Methyl pyrrolidone (N-methylPyrrolidone), hexane (hexane), heptane (heptane), decane (decane), toluene (toluene), dimethylbenzene (xylene), Ketohexamethylene (cyclohexanone), solvent naphtha (solventnaphtha), butyl carbitol (Butylcarbitol), butyl carbitol acetate (butylcarbitolacetate), isophorone (Isophorone) etc..
Consumption is made about solvent, refer to relative to phenoxy group (phenoxy) type epoxy (epoxy) tree of the cement constituent of 100 mass units, the total amount (solid state component) of nucleocapsid (coreshell) type organic filler and electroconductive particle, it is preferably in the scope of 100 ~ 900 mass units.Solvent is more than 100 mass units, then when by silk screen printing (screenprinting) applying conductive mastic (paste), it is easy to prevents blocking silk screen (screen) hole, and prevents coating irregular.When they are below 900 mass units, it is easier to guarantee coating thickness.
About the grafting material of the present invention, from the angle obtaining (rework) property of doing over again excellent especially, 90 under 200 DEG C of environmentoPeel strength (stretches (tensile) speed: 50m/ divides, maximum during fracture) and is preferably below 10N/cm, below 5N/cm better.
Electric conductivity mastic (paste) is preferably more than 1.5 at thixotroping (thixotropy) index (TI) of 25 DEG C.When TI is more than 1.5, it is possible to prevent electroconductive particle from settling.Additionally, TI is preferably below 3.0.TI is below 3.0, when by silk screen printing (screenprinting) applying conductive mastic (paste), it is possible to prevent silk screen (screen) hole plug and coating irregular.
In the scope not violating the object of the invention, in the electronic component grafting material of the present invention outside resinous principle except above-mentioned phenoxy group (phenoxy) type epoxy (epoxy) resin, it is also possible to be mixed into the adding ingredients such as antioxidant, pigment, dyestuff, tackifying resin, plasticizer (plasticizer), UV absorbent, defoamer, leveling agent (levelingagent), filler and fire retardant.
The electronic component grafting material of the present invention is preferably without sclerosing agent.Sclerosing agent said here refers to that aliphatic polyamines (polyamine) and polyamide (polyamide) resin, aliphatic diamine (diamine), aromatic series (aromatic) diamidogen (diamine), imidazoles (imidazole) compounds, anhydride (acidanhydride) etc. are used for promoting well-known epoxy (epoxy) the resin sclerosing agent of epoxy (epoxy) hardening of resin.Without sclerosing agent, can do over again (rework) property and storage stability can be improved with this.
The electronic component grafting material of the present invention such as can also adopt the form of anisotropic conductive junction film, now, such as in the peeling base such as polyester (polyester) film or polyimides (polyimide) film surface has been carried out lift-off processing, it is coated with above-mentioned electric conductivity mastic (paste) so that it is dry and obtain.
The work engaging electronic component by anisotropic conductive joint mastic (paste) obtained by as above method or film can be carried out according to method always.
Engage mastic (paste) by electric conductivity electronic component is joined to circuit base plate to make the method for electronic equipment and do not limit, for instance can make in order to lower section method.First, by silk screen printing (screenprinting) mode, electric conductivity is engaged mastic (paste) and coat circuit base plate surface, form certain pattern (pattern).Then heating line substrate, makes solvent volatilize, and forms the conductor layer being made up of certain pattern (pattern).On this conductor layer, place electronic component, hot press again, make electronic component be joined on circuit base plate by electric conductivity cement layers, obtain electronic equipment with this.Temperature and pressure during hot press can suitably set, it is desirable to be 2 ~ 4MPa, 100 ~ 220 DEG C.
The method being joined on circuit base plate with electric conductivity junction film by electronic component to make electronic equipment does not limit, as made in order to lower section method.First, electric conductivity is engaged mastic (paste) and coats peeling base surface, make solvent volatilize, obtain the electric conductivity junction film defining electric conductivity cement layers in peeling base with this.Then, the electric conductivity cement layers on electric conductivity junction film is fitted in circuit base plate surface, carries out interim punching press (press), electric conductivity cement layers is transferred (Transfer) to circuit base plate surface.Temperature and pressure during interim punching press can suitably set, it is desirable to be 1 ~ 5MPa, 80 ~ 100 DEG C.Then, peel off peeling base, expose electric conductivity cement layers, form conductor layer, placing electronic component thereon, carry out hot press, making electronic component be joined on circuit base plate by electric conductivity cement layers, thus obtaining electronic equipment.Temperature and pressure during hot press can suitably set, but use the present invention electronic component grafting material time, it is desirable to be 2 ~ 4MPa, 100 ~ 220 DEG C.
About the electronic equipment so obtained, the peel strength of electronic component when being heated to 200 DEG C is advisable with below 10N/cm, it is desirable at below 5N/cm.Peel strength is obtained with doing over again the excellent electronic equipment of (rework) property at below 10N/cm.
Repairing (repair) work of electronic component can carry out according to operational method always, the circuit base plate after joint and electronic component is heated to about 150 ~ 230 DEG C, takes off electronic component, wipe cement, re-start the joint of electronic component.
Embodiment
It is below embodiments of the invention, but the present invention is not limited by following example.It addition, be mixed into ratio etc. about the following stated, as long as no dated especially, all adopt quality standard (mass unit, quality % etc.).
<preparation of electroconductive resin constituent>
[embodiment 1]
The chloropropylene oxide (epichlorohydrin) of 700g and the 1 of 1100g is added in the glass container being equipped with blender, lower water clock bucket and thermometer, double; two (4-the hydroxyphenyl)-1-vinylbenzene (1 of 1-, 1-bis(4-Hydroxyphenyl)-1-phenylethane), after being uniformly dissolved, it is heated to 80 DEG C.Then, with 5 hours to sodium hydroxide (sodiumhydroxide) the aqueous solution 400g of instillation 20% in glass container, after reacting 2 hours, aqueous phase is removed, the chloropropylene oxide (epichlorohydrin) that Distillation recovery is superfluous, it is thus achieved that reaction product.The reaction product obtained adds 500g toluene (toluene) be uniformly dissolved, add after 160g water washes, carry out oil-water separation, after removing water from oil reservoir, redistillation removes toluene (Toluene), it is thus achieved that epoxy (epoxy) Resin A (phenoxy group (phenoxy) type epoxy (epoxy) resin).Gamma transition (glasstransition, the hereafter same) temperature of epoxy (epoxy) Resin A obtained is 130 DEG C.
Glass transition temperature uses differential scanning calorimetry following methods to record.First, in aluminum dish (AluminiumPan), put into 10mg ~ 20mg sample, with the programming rate of 10 DEG C/minute, sample is heated to 200 DEG C (first time heats up) from-10 DEG C under nitrogen flowing, and cools down.Then carried out second time with the same condition that heats up with first time to heat up.Baseline shift (baselineshift) according to the DSC curve now obtained, determines glass transition temperature (below epoxy (epoxy) resin B and C also having been measured) with same method.
Then, epoxy (epoxy) Resin A obtained is mixed homogeneously with nucleocapsid (coreshell) type particle, electroconductive particle and solvent mixed volume shown in table 1, it is thus achieved that electronic component grafting material.
[embodiment 2]
Except mixed volume mixed volume shown in table 1 of nucleocapsid (coreshell) type particle, electroconductive particle and solvent, other are all in the same manner as in Example 1, it is thus achieved that electronic component grafting material.
[embodiment 3]
Except mixed volume mixed volume shown in table 1 of nucleocapsid (coreshell) type particle, electroconductive particle and solvent, other are all similarly to Example 1, it is thus achieved that electronic component grafting material.
[embodiment 4]
Beyond mixed volume mixed volume shown in table 1 of division ring oxygen (epoxy) Resin A, epoxy (epoxy) resin B (glass transition temperature 98 DEG C), nucleocapsid (coreshell) type organic filler, electroconductive particle and solvent, other are all similarly to Example 1, it is thus achieved that electronic component grafting material.
[embodiment 5]
Beyond mixed volume mixed volume shown in table 1 of division ring oxygen (epoxy) Resin A, epoxy (epoxy) resin B, nucleocapsid (coreshell) type organic filler, electroconductive particle and solvent, other are all similarly to Example 1, it is thus achieved that electronic component grafting material.
[comparative example 1]
By epoxy (epoxy) resin B substituted epoxy (epoxy) Resin A, the mixed volume of epoxy (epoxy) resin B, nucleocapsid (coreshell) type particle, electroconductive particle and solvent adopts mixed volume shown in table 1, in addition, other are all similarly to Example 1, it is thus achieved that electronic component grafting material.
[comparative example 2]
Except mixed volume mixed volume shown in table 1 of nucleocapsid (coreshell) type particle, electroconductive particle and solvent, other are all similarly to Example 1, it is thus achieved that electronic component grafting material.
[comparative example 3]
Except mixed volume mixed volume shown in table 1 of nucleocapsid (coreshell) type particle, electroconductive particle and solvent, other are all similarly to Example 1, it is thus achieved that electronic component grafting material.
[comparative example 4]
Except mixed volume mixed volume shown in table 1 of nucleocapsid (coreshell) type particle, electroconductive particle and solvent, other are all similarly to Example 1, it is thus achieved that electronic component grafting material.
[comparative example 5]
With epoxy (epoxy) resin B, epoxy (epoxy) resin C and imidazoles (imidazole) class sclerosing agent, (Asahi Chemical Industry's (strain) makes, trade name HX3921HP) substituted epoxy (epoxy) Resin A, the mixed volume of epoxy (epoxy) resin B, epoxy (epoxy) resin C, nucleocapsid (coreshell) type particle, electroconductive particle and solvent adopts mixed volume shown in table 1, in addition, other are all similarly to Example 1, it is thus achieved that electronic component grafting material.
[comparative example 6]
Beyond mixed volume mixed volume shown in table 1 of division ring oxygen (epoxy) Resin A, epoxy (epoxy) resin B, nucleocapsid (coreshell) type organic filler, electroconductive particle and solvent, other are all similarly to Example 1, it is thus achieved that electronic component grafting material.
[comparative example 7]
Beyond mixed volume mixed volume shown in table 1 of division ring oxygen (epoxy) Resin A, epoxy (epoxy) resin B, nucleocapsid (coreshell) type organic filler, electroconductive particle and solvent, other are all similarly to Example 1, it is thus achieved that electronic component grafting material.
<manufacture of anisotropic conductive joint mastic (paste) and evaluation>
Phenoxy group (phenoxy) type epoxy (epoxy) resin, nucleocapsid (coreshell) type organic filler, electroconductive particle and solvent are mixed in ratio shown in table 1 and mix, it is thus achieved that electric conductivity engages mastic (paste).This electric conductivity is engaged mastic (paste) and coats on soft printing substrate, soft printing substrate and FR-4(glass epoxide (epoxy) copper clad laminate is made by this mastic (paste)) laminating, with temperature 180 DEG C, pressure 4MPa punching press 7 seconds, make it fit, make sample for evaluation, measure or evaluate its peel strength with following methods, connect resistance value, thixotropy (thixotropy), (rework) characteristic of can doing over again.The situation that is mixed into of each composition, in Table 1, measures and evaluation result is in Table 2.
<being mixed into composition>
Epoxy (epoxy) resin B: bis-phenol (bisphenol) A type epoxy (epoxy) resin (Mitsubishi chemical Co., Ltd's system, trade name JER1256)
Epoxy (epoxy) resin C: sulfonyl (sulfonyl) type epoxy (epoxy) resin (Mitsubishi chemical Co., Ltd's system, trade name YX8100)
Latency sclerosing agent: modified imidazole (imidazole) type sclerosing agent (Asahi Kasei Corporation's system, trade name HX3921HP)
Nucleocapsid (coreshell) type organic filler: like gram (AICA) Industrial Co., Ltd system, trade name AC3816N(stratum nucleare: acrylic acid (acrylic) class rubber, shell: acrylic acid (acrylic) class glass (glass) shaped polymer (polymer), average primary particle diameter: 0.5 μm)
Electroconductive particle: the gold plated resin particle of mean diameter 10 μm
Solvent: butyl carbitol acetate (butylcarbitolacetate) (boiling point 247 DEG C)
<evaluation sample>
Soft printing substrate (Northwest electronics industry Co., Ltd. system)
Structure: polyimides (polyimide) 25 μm, cement 20 μm, Copper Foil 18 μm
Coating: 3 μm of nickel, gold 0.05 μm
Glass (glass) epoxy (epoxy) substrate (Northwest electronics industry Co., Ltd. system)
Structure: Copper Foil 35 μm
Coating: 3 μm of nickel, gold 0.05 μm
(measuring and evaluation methodology)
Can do over again (rework) characteristic: using as the soft printing substrate of sample for evaluation, under 200 DEG C of environment, with cupping machine, (Shimadzu Seisakusho Ltd.'s (strain) makes, trade name AGS-X50S) divide with draw speed 50m/, peel angle 90 ° is peeled off, measure fracture time maximum.As long as at below 10N/cm, (rework) property of can doing over again is well.
Connect resistance value (initially): measured by the sample for evaluation with shape shown in Fig. 1.In FIG, label 1 represents soft printing substrate (FPC), label 2 to be glass (glass) epoxy (epoxy) substrate, label 3 is that ohm gauge, label a ~ g represent that the electrode arranged on soft printing substrate, label a ' ~ g ' represent the electrode arranged on glass (glass) epoxy (epoxy) substrate.The width of electrode a ~ g, a ' ~ g ' is 75 μm.Electrode a and electrode a ' makes to overlap between end in the office, overlapping portion of soft printing substrate 1 and glass (glass) epoxy (epoxy) substrate 2 as illustrated in fig. 2, engages mastic (paste) by above-mentioned anisotropic conductive and engages.The length (l) of intersection is 5mm.By ohm gauge (Zhi Electric Co., Ltd system between above-mentioned electrode a and the end terminal of electrode a ', low ohmmeter, direct current mode 3227 " m Ω HiTESTER " (Japanese title: ミ リ オ system Ha イ テ ス タ)) measure connection resistance, also measure respectively between other electrodes (b-b ' between ~ g-g ' between) connection resistance, obtain meansigma methods.As long as it addition, all can use at 1 below Ω, it does not have problem.
Connect resistance value (85 DEG C/85% reliability): above-mentioned sample for evaluation after (85 DEG C of 85%RH) places 250 hours under hot and humid environment, measures connection resistance value in the same manner as said method.As long as it addition, connect resistance value 1 below Ω and its rate of change below 30% with regard to no problem, it is possible to use.The ratio (%) represented by following formula is referred at this so-called rate of change.
[several 1]
Rate of change (%)={ resistance value before (resistance value before resistance value-environmental test after environmental test)/environmental test } × 1
Peel strength (initially): to the soft printing substrate as sample for evaluation, at normal temperatures with cupping machine (Shimadzu Seisakusho Ltd.'s (strain) make, trade name AGS-X50S) divide with draw speed 50m/, peel angle 90 ° strippings, measure maximum when rupturing.If it is just no problem at more than 10N/cm, it is possible to use.
Peel strength (85 DEG C/85% reliability): sample for evaluation after (85 DEG C of 85%RH) places 250 hours under hot and humid environment, measures peel strength in the same manner as said method.If it is just no problem at more than 10N/cm, it is possible to use.
Thixotropic index: electronic component grafting material is adjusted to 25 DEG C, measures the viscosity under rotating speed 0.25rpm and 2rpm with E type viscometer (viscometer), with the ratio (viscosity under viscosity ÷ 0.25rpm under 2rpm) of above-mentioned viscosity for thixotropic index.As long as thixotropic index is more than 1.5 it is prevented that the sedimentation of conductive particle.
Workability during printing: use the silk screen (Screen) (テ ト ロ Application (registered trade mark)) of 80 orders (mesh) to carry out the presswork of cement constituent, make build (baking temperature 150 DEG C, 15 minutes) be maintained at 20 ± 5 μm.With or without problems such as wire drawing, misplacing of stencil, foaming, ink bleeds between visualization silk screen (Screen) and printed article, it is evaluated by following standard.
A: without problems such as wire drawing, misplacing of stencil, foaming, ink bleeds, workability during printing is good；
B: some problem, but in allowed band, workability during printing is all right；
C: problem is obvious, and workability during printing is bad.
Particle precipitation: be sufficiently stirred for mixing cement constituent, visualization ambient temperatare puts the cement constituent after 1 week, good by not finding that the situation that electroconductive particle settles is decided to be A(particle precipitation), it has been found that it is bad that situation during electroconductive particle sedimentation is decided to be C(particle precipitation).
[table 1]
[table 2]
Learning in result as shown in Table 2, (rework) property of doing over again of the grafting material of embodiment is superior, has resistance to 85 DEG C/85%RH and tests the high humidity resistance of the test under this stringent condition, and storage stability and presswork are also good.
In contrast to this, from the results of view, the thermostability of the comparative example 1 employing glass transition temperature low epoxy (epoxy) resin is low, always has a certain item relatively low in the amount workability when the printing of the comparative example 2 ~ 4 that present invention provide that outside scope of nucleocapsid (coreshell) type particle or storage stability.
It addition, employ in the comparative example 5 of sclerosing agent, due to the crosslinking of epoxy (epoxy) resin, (rework) property of can doing over again is low.Additionally, the less comparative example of content 6,7 thermostability of phenoxy group (phenoxy) type epoxy (epoxy) resin that glass transition temperature is more than 100 DEG C is poor.
Practicality
The grafting material of the present invention is suitable for the joint of various electronic component as the superior anisotropic conductive mastic (paste) of (rework) property of can doing over again or anisotropic conductive film.
Numbering explanation
1 soft printing substrate
2 glass (glass) epoxy (epoxy) substrate
3 ohm gauges
Claims (6)
1. an electronic component grafting material, it is characterised in that:
The electroconductive particle of hud typed organic filler containing 20 ~ 100 mass units and 0.1 ~ 100 mass unit for 100 mass unit epoxy resin,
Containing the glass transition temperatures more than 45 mass units phenoxy group type epoxy resin more than 100 DEG C in the described epoxy resin of 100 mass units.
2. electronic component grafting material according to claim 1, it is characterised in that:
Without hardener for epoxy resin.
3. an electric conductivity mastic, it is characterised in that:
Solvent containing 100 ~ 900 mass units for the electronic component grafting material of claim 1 or 2.
4. an electric conductivity junction film, it is characterised in that:
Form by forming the overlay film of the electronic component grafting material containing claim 1 or 2 in peeling base.
5. an electronic equipment, it is characterised in that:
The conductor layer that electronic component is consisted of the electronic component grafting material of claim 1 or 2 is bonded on circuit base plate.
6. electronic equipment according to claim 5, it is characterised in that:
Described electronic equipment is heated to when 200 DEG C the peel strength of electronic component at below 10N/cm.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-269792 | 2013-12-26 | ||
| JP2013269792 | 2013-12-26 | ||
| PCT/JP2014/006328 WO2015098059A1 (en) | 2013-12-26 | 2014-12-18 | Material for bonding electronic component, and method for bonding electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105814161A true CN105814161A (en) | 2016-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480069841.6A Pending CN105814161A (en) | 2013-12-26 | 2014-12-18 | Material for bonding electronic component, and method for bonding electronic component |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6301366B2 (en) |
| KR (1) | KR101862734B1 (en) |
| CN (1) | CN105814161A (en) |
| TW (1) | TWI609938B (en) |
| WO (1) | WO2015098059A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111500237A (en) * | 2020-06-08 | 2020-08-07 | 东莞市新懿电子材料技术有限公司 | Fast-flowing low-temperature-curable underfill adhesive and preparation method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2020139020A (en) * | 2019-02-27 | 2020-09-03 | ナミックス株式会社 | Conductive adhesive |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001323224A (en) * | 2000-05-17 | 2001-11-22 | Hitachi Chem Co Ltd | Adhesive composition, method for connecting circuit terminal using the same and connection structure of the circuit terminal |
| CN102576766A (en) * | 2009-10-15 | 2012-07-11 | 日立化成工业株式会社 | Conductive adhesive, solar cell, method for manufacturing solar cell, and solar cell module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991018957A1 (en) | 1990-06-08 | 1991-12-12 | Minnesota Mining And Manufacturing Company | Reworkable adhesive for electronic applications |
| JPH10279903A (en) * | 1997-04-04 | 1998-10-20 | Asahi Chem Ind Co Ltd | Electroconductive adhesive |
| JPH11209716A (en) | 1998-01-30 | 1999-08-03 | Asahi Chem Ind Co Ltd | Electroconductive adhesive |
| JP2005294086A (en) * | 2004-04-01 | 2005-10-20 | Sumitomo Electric Ind Ltd | Film glue |
| KR100776131B1 (en) * | 2006-12-22 | 2007-11-16 | 제일모직주식회사 | Double layered anisotropic conductive adhesive film using thermoplastic resin |
| JP2011184528A (en) * | 2010-03-05 | 2011-09-22 | Hitachi Chem Co Ltd | Circuit connecting material |
| JP5767792B2 (en) * | 2010-08-27 | 2015-08-19 | デクセリアルズ株式会社 | Method for manufacturing mounting body, connection method, and anisotropic conductive film |
-
2014
- 2014-12-18 KR KR1020167012034A patent/KR101862734B1/en active IP Right Grant
- 2014-12-18 JP JP2015554547A patent/JP6301366B2/en not_active Expired - Fee Related
- 2014-12-18 CN CN201480069841.6A patent/CN105814161A/en active Pending
- 2014-12-18 WO PCT/JP2014/006328 patent/WO2015098059A1/en active Application Filing
- 2014-12-23 TW TW103144950A patent/TWI609938B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001323224A (en) * | 2000-05-17 | 2001-11-22 | Hitachi Chem Co Ltd | Adhesive composition, method for connecting circuit terminal using the same and connection structure of the circuit terminal |
| CN102576766A (en) * | 2009-10-15 | 2012-07-11 | 日立化成工业株式会社 | Conductive adhesive, solar cell, method for manufacturing solar cell, and solar cell module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111500237A (en) * | 2020-06-08 | 2020-08-07 | 东莞市新懿电子材料技术有限公司 | Fast-flowing low-temperature-curable underfill adhesive and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI609938B (en) | 2018-01-01 |
| KR20160102390A (en) | 2016-08-30 |
| JPWO2015098059A1 (en) | 2017-03-23 |
| KR101862734B1 (en) | 2018-07-04 |
| JP6301366B2 (en) | 2018-03-28 |
| TW201540800A (en) | 2015-11-01 |
| WO2015098059A1 (en) | 2015-07-02 |
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Application publication date: 20160727 |