JP2013038190A - Method for manufacturing substrate with reflector - Google Patents

Method for manufacturing substrate with reflector Download PDF

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JP2013038190A
JP2013038190A JP2011172333A JP2011172333A JP2013038190A JP 2013038190 A JP2013038190 A JP 2013038190A JP 2011172333 A JP2011172333 A JP 2011172333A JP 2011172333 A JP2011172333 A JP 2011172333A JP 2013038190 A JP2013038190 A JP 2013038190A
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reflector
resin
hole
lead frame
sheet
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JP5780044B2 (en
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Fumihiko Uehata
文彦 上畑
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate with a reflector having a reflector having tapered surfaces without causing a warp of a lead frame.SOLUTION: One or a plurality of through-holes for forming cavities are formed by punching a sheet-like resin which is a precursor of reflectors, heating members having tapered surfaces are inserted into these through-holes while being heated, inner wall surfaces of the through- holes are expanded while being fused, to form the tapered surfaces expanding toward the light output side of luminescent elements in the inner wall surfaces of the through-holes, and the sheet-like resin having the through-holes with the tapered surfaces formed in the inner wall surfaces is adhered onto lead frames, thereby manufacturing a substrate with the reflector.

Description

本発明は、リフレクタ付基板の製造方法に関する。   The present invention relates to a method for manufacturing a substrate with a reflector.

従来より、表面実装型ＬＥＤとしては、セラミックスをパッケージ材料としたものが一般的に知られている。図８に、従来のセラミックスパッケージにＬＥＤチップを実装した状態の構造を示す模式断面図を示す。２０１は基板、２０２は基板に巻きかけられた外部接続用配線である。ＬＥＤチップ２０３は、外部接続用配線２０２ｂの上に固着されるとともに、外部接続用配線２０２ａと金線等のワイヤ２０４で接続されている。ＬＥＤを搭載すべきキャビティーは、セラミックスケース２０５ａ、２０５ｂの側面部で包囲されている。このセラミックスケースによって、ＬＥＤからの発光を前方へ効率的に出光させている。   2. Description of the Related Art Conventionally, as surface-mount LEDs, those using ceramics as a package material are generally known. FIG. 8 is a schematic cross-sectional view showing a structure in which an LED chip is mounted on a conventional ceramic package. Reference numeral 201 denotes a substrate, and 202 denotes external connection wiring wound around the substrate. The LED chip 203 is fixed on the external connection wiring 202b and is connected to the external connection wiring 202a by a wire 204 such as a gold wire. The cavity in which the LED is to be mounted is surrounded by the side surfaces of the ceramic cases 205a and 205b. This ceramic case efficiently emits light emitted from the LED forward.

近時、放熱性、材料コスト、小型化に対する要求から、セラミックスをパッケージ材料としたＬＥＤにかわり、例えば、例えば銅などの金属からなるリードフレーム基板上に、熱可塑性樹脂、或いは熱硬化性樹脂からなるリフレクタが設けられたＬＥＤが知られている。特許文献１には、射出成型されたキャビティー枠を有する樹脂製のリフレクタ部を備えた反射体が開示されている。   Recently, due to demands for heat dissipation, material cost, and miniaturization, instead of LEDs using ceramics as a packaging material, for example, from a lead frame substrate made of a metal such as copper, from a thermoplastic resin or a thermosetting resin There is known an LED provided with a reflector. Patent Document 1 discloses a reflector including a resin reflector having an injection-molded cavity frame.

特開２０１０−２８０７４７号公報JP 2010-280747 A

しかしながら、上記特許文献１に開示がされているように、樹脂製のリフレクタは、射出成型やトランスファー成型により一体的に成型されるのが一般的であり、このような、方法で成型されたリフレクタは、リードフレームと、リフレクタの樹脂との線膨脹係数の違いによってリードフレームに反りが生じてしまう。また、リフレクタの形状や寸法を変更するたびに金型を製作し直す必要があり、金型の製造コストがかかることとなる。   However, as disclosed in Patent Document 1, a resin reflector is generally integrally formed by injection molding or transfer molding, and the reflector molded by such a method is used. The lead frame is warped due to the difference in coefficient of linear expansion between the lead frame and the resin of the reflector. In addition, it is necessary to remanufacture the mold every time the shape and dimensions of the reflector are changed, which increases the manufacturing cost of the mold.

本発明はこのような状況に鑑みてなされたものであり、リードフレームに反りが生ずることがなく、且つリフレクタの形状や寸法を変更した場合であっても、金型を製作する必要がなく製造コストに優れたリフレクタ付基板の製造方法を提供することを主たる課題とする。   The present invention has been made in view of such a situation, and the lead frame is not warped. Even when the shape and dimensions of the reflector are changed, it is not necessary to manufacture a mold. The main object is to provide a method for manufacturing a substrate with a reflector excellent in cost.

上記課題を解決するための本発明の方法は、リードフレームと、該リードフレーム上に設けられたリフレクタとから構成され、リードフレームとリフレクタとによって発光素子を収容するキャビティーが形成されたリフレクタ付基板の製造方法であって、リフレクタの前駆体であるシート状樹脂を打ち抜いて、前記キャビティーを形成するための１又は複数の貫通孔を形成する打ち抜き工程と、前記打ち抜き工程で打ち抜かれた貫通孔に、テーパー面をもつ加熱部材を挿入し、該貫通孔の内壁面を溶融させながら押し広げることで、該貫通孔の内壁面に発光素子の出光側に向かって広がるテーパー面を形成するテーパー形成工程と、前記テーパー形成工程後、リードフレーム上に、内壁面にテーパー面が形成された貫通孔を有するシート状樹脂を接着する接着工程と、を有することを特徴とする。   A method of the present invention for solving the above-described problems is provided with a reflector including a lead frame and a reflector provided on the lead frame, and a cavity for accommodating a light emitting element is formed by the lead frame and the reflector. A method for manufacturing a substrate, comprising: punching a sheet-like resin that is a precursor of a reflector to form one or a plurality of through holes for forming the cavity; and a through hole punched in the punching step A taper that forms a tapered surface that extends toward the light output side of the light-emitting element on the inner wall surface of the light-emitting element by inserting a heating member having a tapered surface into the hole and expanding the inner wall surface of the through-hole while being melted. And a sheet-like tree having a through hole with a tapered surface formed on the inner wall surface on the lead frame after the taper forming step. It characterized by having a a bonding step of bonding.

また、前記加熱部材が、超音波振動によって貫通孔の内壁面を溶融させる加熱部材であってもよい。   The heating member may be a heating member that melts the inner wall surface of the through hole by ultrasonic vibration.

本発明によれば、リードフレームに反りが生じないリフレクタ付基板を製造することができる。さらに、リフレクタの成型に金型を必要とせず、設計変更に低コストで容易に対応することが可能となる。   According to the present invention, it is possible to manufacture a substrate with a reflector that does not warp the lead frame. Furthermore, it is possible to easily cope with a design change at a low cost without requiring a mold for molding the reflector.

本発明の製造方法に用いられる製造装置の一例である。It is an example of the manufacturing apparatus used for the manufacturing method of this invention. 打ち抜き工程を説明するための図であり、（ａ）は、貫通孔が形成されたシート状樹脂の概略断面図であり、（ｂ）は、貫通孔が形成されたシート状樹脂の概略上面図である。It is a figure for demonstrating a punching process, (a) is a schematic sectional drawing of the sheet-like resin in which the through-hole was formed, (b) is a schematic top view of the sheet-like resin in which the through-hole was formed. It is. テーパー形成工程を説明するための概略断面図である。It is a schematic sectional drawing for demonstrating a taper formation process. 加熱部材の形状の一例を示す図である。It is a figure which shows an example of the shape of a heating member. 接着工程を説明するための概略断面図である。It is a schematic sectional drawing for demonstrating an adhesion process. 表面実装型ＬＥＤの一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of surface mount type LED. 表面実装型ＬＥＤの製造方法の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the manufacturing method of surface mount type LED. 従来の表面実装型ＬＥＤの一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the conventional surface mount type LED.

本発明は、リードフレームと、該リードフレーム上に設けられたリフレクタとから構成され、リードフレームとリフレクタとによって発光素子を収容するキャビティーが形成されたリフレクタ付基板の製造方法であって、リフレクタの前駆体であるシート状樹脂を打ち抜いて、キャビティーを形成するための１又は複数の貫通孔を形成する打ち抜き工程と、打ち抜き工程で打ち抜かれた貫通孔に、挿入方向と反対方向に広がるテーパー面を有する加熱部材を挿入し、該貫通孔の内壁面を溶融させながら押し広げることで、該貫通孔の内壁面に発光素子の出光側に向かって広がるテーパー面を形成するテーパー形成工程と、テーパー形成工程後、リードフレーム上に、内壁面にテーパー面が形成された貫通孔を有するシート状樹脂を接着する接着工程と、を有することを特徴とする。以下、本発明の製造方法の各工程について添付の図面を参照して具体的に説明する。   The present invention relates to a method of manufacturing a reflector-equipped substrate comprising a lead frame and a reflector provided on the lead frame, wherein a cavity for receiving a light emitting element is formed by the lead frame and the reflector. A punching process for punching out a sheet-shaped resin that is a precursor of the resin to form one or a plurality of through holes for forming a cavity, and a taper that extends in a direction opposite to the insertion direction in the through holes punched in the punching process A taper forming step of forming a tapered surface extending toward the light output side of the light emitting element on the inner wall surface of the light emitting element by inserting a heating member having a surface and expanding the inner wall surface of the through hole while melting the inner wall surface; After the taper forming process, a contact is made on the lead frame by adhering a sheet-like resin having a through hole with a tapered surface formed on the inner wall surface. And having a step. Hereafter, each process of the manufacturing method of this invention is demonstrated concretely with reference to attached drawing.

（打ち抜き工程）
打ち抜き工程は、図２（ａ）、（ｂ）に示すようにリフレクタの前駆体であるシート状樹脂５０を打ち抜いて、キャビティーを形成するための１又は複数の貫通孔５１を形成する工程である。なお、図２（ａ）は、貫通孔５１が形成されたシート状樹脂の概略断面図であり、図中の符号（Ａ）は打ち抜かれた部分である。図２（ｂ）は、貫通孔５１が形成されたシート状樹脂の上面図である。 (Punching process)
As shown in FIGS. 2A and 2B, the punching step is a step of punching out the sheet-like resin 50 that is a precursor of the reflector and forming one or a plurality of through holes 51 for forming a cavity. is there. FIG. 2A is a schematic cross-sectional view of the sheet-like resin in which the through-hole 51 is formed, and reference numeral (A) in the drawing is a punched portion. FIG. 2B is a top view of the sheet-like resin in which the through hole 51 is formed.

当該工程でシート状樹脂５０に形成される貫通孔５１の内壁面は、発光素子からの光を反射するリフレクタとしての機能を奏する。したがって、本願明細書では、貫通孔５１が形成されたシート状樹脂５０をリフレクタと定義する。つまり、当該工程においてシート状樹脂５０に貫通孔５１を形成することで、テーパー面形成前のリフレクタ８０が得られる。   The inner wall surface of the through-hole 51 formed in the sheet-like resin 50 in this process functions as a reflector that reflects light from the light emitting element. Therefore, in this specification, the sheet-like resin 50 in which the through hole 51 is formed is defined as a reflector. That is, by forming the through hole 51 in the sheet-like resin 50 in the process, the reflector 80 before forming the tapered surface is obtained.

貫通孔５１の形成方法について特に限定はなく、プレス装置や、パンチング金型等を用いて形成することができる。また、当該工程で形成される貫通孔５１は１つであってもよく、複数であってもよい。   The method for forming the through hole 51 is not particularly limited, and the through hole 51 can be formed using a press device, a punching die, or the like. Moreover, the through-hole 51 formed at the said process may be one, and plural may be sufficient as it.

貫通孔５１の形状についても特に限定はなく、図示するような略四角柱の形状であってもよく、略円柱状の形状であってもよく、或いはこれ以外の形状であってもよい。なお、この貫通孔５１の内壁面には、後述するテーパー形成工程によって、テーパー面が形成される。また、貫通孔５１の大きさについてもいかなる限定もされず、リードフレームとリフレクタによって形成されるキャビティーの大きさに応じて適宜設定することができる。   The shape of the through-hole 51 is not particularly limited, and may be a substantially quadrangular prism shape as illustrated, a substantially cylindrical shape, or another shape. A taper surface is formed on the inner wall surface of the through hole 51 by a taper forming process described later. Further, the size of the through hole 51 is not limited in any way, and can be appropriately set according to the size of the cavity formed by the lead frame and the reflector.

貫通孔５１を形成するためのシート状樹脂５０は、後述する加熱部材によって加熱をした際に溶融する樹脂からなるものであればよくその材料について特に限定はない。例えば、エポキシ樹脂、変性エポキシ樹脂、シリコーン樹脂、変性シリコーン樹脂、アクリル樹脂、ウレタン樹脂等が使用可能である。これらの樹脂は、１種を単独で用いてもよく、２種以上を混合して用いることもできる。   The sheet-like resin 50 for forming the through hole 51 is not particularly limited as long as it is made of a resin that melts when heated by a heating member described later. For example, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylic resin, a urethane resin, or the like can be used. These resins may be used alone or in combination of two or more.

また、シート状樹脂には、樹脂のほか、鉄、ニッケル、チタン等の金属、或いはこれらの金属酸化物等も併せて使用可能である。特に、酸化チタンは、シート状樹脂を白色化、すなわちリフレクタを白色化させることができ反射率を向上させることができる点で、上記樹脂とともに、好ましく使用することができる。   In addition to the resin, a metal such as iron, nickel, titanium, or a metal oxide thereof can be used as the sheet-like resin. In particular, titanium oxide can be preferably used together with the above resin in that the sheet-like resin can be whitened, that is, the reflector can be whitened and the reflectance can be improved.

シート状樹脂５０の厚みについても特に限定はなく、リフレクタ付基板におけるキャビティーの深さに応じて適宜設定することができ、通常５００μｍ〜１５００μｍ程度である。   The thickness of the sheet-like resin 50 is not particularly limited, and can be appropriately set according to the depth of the cavity in the reflector-equipped substrate, and is usually about 500 μm to 1500 μm.

（テーパー形成工程）
テーパー形成工程は、図３（ａ）〜（ｃ）に示すように上述した打ち抜き工程で打ち抜かれた貫通孔５１に、テーパー面５２ａを有する加熱部材５２を加熱させながら挿入し、該貫通孔５１の内壁面を溶融させながら押し広げることで、図３（ｄ）に示すように該貫通孔５１の内壁面に発光素子の出光側に向かって広がるテーパー面５３を形成する工程である。換言すれば、テーパー面を有するリフレクタ８５を形成する工程である。 (Taper forming process)
In the taper forming process, as shown in FIGS. 3A to 3C, the heating member 52 having the tapered surface 52a is inserted into the through hole 51 punched in the punching process described above while being heated, and the through hole 51 is formed. This is a step of forming a tapered surface 53 that spreads toward the light output side of the light emitting element on the inner wall surface of the through hole 51 as shown in FIG. In other words, this is a step of forming the reflector 85 having a tapered surface.

加熱部材５２は、挿入方向と反対方向に広がるテーパー面５２ａを有するものであればよく、例えば、図４（ａ）に示す略四角錐形状、図４（ｂ）に示す略円錐台形状、図４（ｃ）に示す略円錐形状、図４（ｄ）に示す略円錐台形状等の対称形状のものを好適に使用可能である。なお、図４の矢印方向は挿入方向である。   The heating member 52 only needs to have a tapered surface 52a extending in the direction opposite to the insertion direction. For example, the heating member 52 has a substantially quadrangular pyramid shape shown in FIG. 4A, a substantially truncated cone shape shown in FIG. Symmetrical shapes such as the substantially conical shape shown in FIG. 4C and the substantially truncated cone shape shown in FIG. 4D can be suitably used. In addition, the arrow direction of FIG. 4 is an insertion direction.

また、加熱部材５２のテーパー角度は１０°〜４５°の範囲内であることが好ましい。加熱部材５２のテーパー角度をこの範囲に設定することで、貫通孔５１のテーパー角度もこの範囲内となり、テーパー面５３を有する貫通孔５１（キャビティー）内に収容される発光素子が発光する光を効果的に外部に放出することが可能となる。なお、貫通孔５１のテーパー角度とは、リードフレームの底面に対する法線と、貫通孔の内壁面とでなされる角である。   The taper angle of the heating member 52 is preferably in the range of 10 ° to 45 °. By setting the taper angle of the heating member 52 within this range, the taper angle of the through hole 51 also falls within this range, and light emitted from the light emitting element accommodated in the through hole 51 (cavity) having the tapered surface 53 is emitted. Can be effectively released to the outside. The taper angle of the through hole 51 is an angle formed by the normal to the bottom surface of the lead frame and the inner wall surface of the through hole.

また、加熱部材５２は、（ｉ）それ自体が発熱する発熱体として機能し貫通孔の内壁面の樹脂を溶融させることができるものや、（ｉｉ）それ自体が発熱体として機能しなくとも結果として貫通孔の内壁面の樹脂を溶融させることができるものを挙げることができる。（ｉ）の加熱部材５２としては、従来公知の発熱体を挙げることができ、（ｉｉ）の加熱部材５２としては、超音波振動が可能なホーン等を挙げることができる。また、発熱体の温度や、超音波振動の振動条件については、シート状樹脂の材料等に応じて適宜設定することができる。   In addition, the heating member 52 (i) functions as a heating element that itself generates heat and can melt the resin on the inner wall surface of the through hole, or (ii) results even if the heating member 52 does not function as a heating element. Examples of the resin that can melt the resin on the inner wall surface of the through hole. Examples of the heating member 52 of (i) include conventionally known heating elements, and examples of the heating member 52 of (ii) include a horn capable of ultrasonic vibration. Further, the temperature of the heating element and the vibration conditions of the ultrasonic vibration can be appropriately set according to the material of the sheet-like resin.

貫通孔５１への加熱部材５２の挿入速度についても特に限定はなく、加熱部材５２の形状に応じた、テーパー面５３を貫通孔５１の内壁面に形成することができる範囲内で適宜設定可能である。   The insertion speed of the heating member 52 into the through hole 51 is not particularly limited, and can be set as appropriate within a range in which the tapered surface 53 can be formed on the inner wall surface of the through hole 51 according to the shape of the heating member 52. is there.

（接着工程）
接着工程は、図５に示すように、テーパー形成工程後、リードフレーム６０上に、内壁面にテーパー面５３が形成された貫通孔５１を有するシート状樹脂を接着する工程である。換言すれば、リードフレーム６０上に、テーパー面を有するリフレクタ８５を接着する工程である。 (Adhesion process)
As shown in FIG. 5, the bonding step is a step of bonding a sheet-like resin having a through hole 51 having an inner wall surface formed with a tapered surface 53 on the lead frame 60 after the taper forming step. In other words, it is a step of bonding the reflector 85 having a tapered surface on the lead frame 60.

リードフレーム６０としては、従来公知のリードフレーム、例えば、金属の平板をプレス金型でプレス抜きし、これを立体的に所定形状に成型してなる金属リードフレーム等を使用することができる。また、図示する形態では、リードフレーム６０は、バックテープ７０上に所定の間隔をあけて配されている。   As the lead frame 60, a conventionally known lead frame, for example, a metal lead frame formed by pressing a metal flat plate with a press die and molding it into a predetermined shape three-dimensionally can be used. In the illustrated form, the lead frames 60 are arranged on the back tape 70 with a predetermined interval.

接着方法としては、例えば、貫通孔５１を形成する前、或いは貫通孔５１を形成した後のシート状樹脂５０の、リードフレームとの接着面に粘着シートを張り合わせ、リードフレーム６０と、内壁面にテーパー面５３が形成された貫通孔５１を有するシート状樹脂とを重ね合わせた後に加熱する方法を挙げることができる。また、粘着シートにかえて、従来公知の粘着剤を塗布することとしてもよい。   As an adhesion method, for example, an adhesive sheet is bonded to the adhesive surface of the sheet-like resin 50 before forming the through hole 51 or after forming the through hole 51 with the lead frame, and the lead frame 60 and the inner wall surface are bonded. An example is a method in which heating is performed after superposing the sheet-like resin having the through-hole 51 in which the tapered surface 53 is formed. Moreover, it is good also as applying a conventionally well-known adhesive instead of an adhesive sheet.

以上説明した、リフレクタ付基板の製造方法によれば、リフレクタを形成した後にリードフレームと接着することから、リフレクタ付基板の製造時にリードフレームにかかる負荷を低減させることができ、リードフレームと、リフレクタの材料とで線膨脹係数が大きく異なる場合であっても、リードフレームの反りを防止することができる。また、本発明の製造方法によれば、簡便な方法でリフレクタの内壁面にテーパー面を形成することができ、反射効率を向上させることができる。   According to the method for manufacturing a substrate with a reflector described above, since the reflector is bonded to the lead frame after forming the reflector, it is possible to reduce the load applied to the lead frame when manufacturing the substrate with the reflector. Even when the linear expansion coefficient differs greatly from that of the material, it is possible to prevent the lead frame from warping. Moreover, according to the manufacturing method of this invention, a taper surface can be formed in the inner wall surface of a reflector by a simple method, and reflection efficiency can be improved.

また、上記では、内壁面にテーパー面５３を有する複数の貫通孔５１（複数のキャビティー）が設けられたリフレクタ付基板を中心に説明を行ったが、複数の貫通孔５１を有するリフレクタ付基板をダイシングすることで、１つの貫通孔５１（１つのキャビティー）を有するリフレクタ付基板とすることができる。また、ダイシングは発光素子等の搭載後に行ってもよく、発光素子等の搭載前に行ってもよい。   In the above description, the description has been made mainly on the substrate with a reflector provided with a plurality of through holes 51 (a plurality of cavities) having the tapered surface 53 on the inner wall surface, but the substrate with a reflector having the plurality of through holes 51 is provided. By dicing, a substrate with a reflector having one through hole 51 (one cavity) can be obtained. Further, dicing may be performed after mounting the light emitting element or the like, or may be performed before mounting the light emitting element or the like.

次に、図１を参照しながら、本発明のリフレクタ付基板の製造方法の一実施形態を説明する。なお、本発明は、この実施形態によって限定されるものではない。   Next, an embodiment of a method for manufacturing a substrate with a reflector according to the present invention will be described with reference to FIG. The present invention is not limited to this embodiment.

図１は、本発明のリフレクタ付基板の製造方法に用いられる装置図であり、樹脂貯留部１０１、熱ロール１０２、オーブン１０３、粘着シート１０４、切断機１０５、プレス装置１０６、超音波ホーン１０７、アーム１０８を備える。   FIG. 1 is an apparatus diagram used in the method of manufacturing a substrate with a reflector according to the present invention, and includes a resin reservoir 101, a heat roll 102, an oven 103, an adhesive sheet 104, a cutting machine 105, a press device 106, an ultrasonic horn 107, Arm 108 is provided.

図示する装置では、樹脂貯留部１０１に貯留された樹脂を、熱ロール１０２で引き延ばしロール状の樹脂板に成形する。次いで、ロール状の樹脂板をロール送りしオーブン１０３内で加熱することで、ロール状の樹脂板を硬化する。   In the illustrated apparatus, the resin stored in the resin storage unit 101 is stretched by a hot roll 102 and formed into a roll-shaped resin plate. Next, the roll-shaped resin plate is cured by feeding the roll-shaped resin plate and heating it in the oven 103.

次いで、硬化したロール状の樹脂板と、粘着シート１０４とを張り合わせる。粘着剤が張り合わされたロール状の樹脂板を、切断機１０５によってシート状に切断する。これにより、リフレクタの前駆体であるシート状樹脂が準備される。なお、シート状樹脂は、図示しないグリッパーでシート固定されている。   Next, the cured roll-shaped resin plate and the adhesive sheet 104 are bonded together. The roll-shaped resin plate to which the adhesive is bonded is cut into a sheet by a cutting machine 105. Thereby, the sheet-like resin which is a precursor of a reflector is prepared. Note that the sheet-like resin is fixed by a gripper (not shown).

シート状樹脂を図示しないグリッパーによって間欠送りし、プレス装置１０６に搬送する。プレス装置１０６は、図２に示すような所定形状でシート状樹脂に貫通孔を打ち抜く。   The sheet-like resin is intermittently fed by a gripper (not shown) and conveyed to the press device 106. The pressing device 106 punches through holes in the sheet-like resin in a predetermined shape as shown in FIG.

打ち抜かれた貫通孔に、テーパー面を有する超音波ホーン１０７を超音波振動させながら挿入し、貫通孔の内壁面にテーパー面を形成する。   An ultrasonic horn 107 having a tapered surface is inserted into the punched through hole while ultrasonically vibrating to form a tapered surface on the inner wall surface of the through hole.

テーパー面が形成された貫通孔を有するシート状樹脂をアーム１０８でピックアップし、該シート状樹脂をバックテープ７０上に所定の間隔をあけて配されたリードフレーム６０上に搭載する。リードフレーム６０上にテーパー面が形成された貫通孔を有するシート状樹脂を搭載後、加熱処理を行い、リードフレーム６０とテーパー面が形成された貫通孔を有するシート状樹脂を接着する。これによりリフレクタ付基板が製造される。   A sheet-like resin having a through hole with a tapered surface is picked up by an arm 108 and the sheet-like resin is mounted on a lead frame 60 arranged on the back tape 70 at a predetermined interval. After mounting a sheet-like resin having a through hole with a tapered surface on the lead frame 60, heat treatment is performed to bond the lead frame 60 and the sheet-like resin having a through hole with a tapered surface. Thereby, a board | substrate with a reflector is manufactured.

（表面実装型ＬＥＤ）
次に本発明の製造方法で製造されたリフレクタ付基板を用いて製造される表面実装型ＬＥＤ、及び表面実装型ＬＥＤの製造方法について図６、図７を用いて説明する。なお、図６は、本発明の製造方法で製造されたリフレクタ付基板を用いて製造される表面実装型ＬＥＤの概略断面図であり、図７は、表面実装型ＬＥＤの製造方法の一例を示す概略断面図である。 (Surface mount LED)
Next, a surface-mounted LED manufactured by using the substrate with a reflector manufactured by the manufacturing method of the present invention and a method for manufacturing the surface-mounted LED will be described with reference to FIGS. 6 is a schematic cross-sectional view of a surface-mounted LED manufactured using a substrate with a reflector manufactured by the manufacturing method of the present invention, and FIG. 7 shows an example of a method for manufacturing the surface-mounted LED. It is a schematic sectional drawing.

図６に示すように、一実施形態の表面実装型ＬＥＤ１００は、バックテープ７０上に所定の間隔をあけて配されたリードフレーム６０ａ、６０ｂと、該リードフレーム上にそれぞれ設けられたリフレクタ８５ａ、８５ｂと、リードフレーム６０ｂ上に、該リードフレーム６０ｂと電気的に接続するように搭載されたＬＥＤ５５（発光素子５５）とからなる。また、ＬＥＤ５５は、リードフレーム６０ａと配線用ワイヤ６５等によって接続されており、リードフレーム６０ａ、６０ｂと、リフレクタ８５ａ、８５ｂとで形成されるキャビティー９０は、透明樹脂７５によって埋められている。   As shown in FIG. 6, the surface-mounted LED 100 according to an embodiment includes lead frames 60 a and 60 b disposed on the back tape 70 at a predetermined interval, and reflectors 85 a provided on the lead frame, 85b and an LED 55 (light emitting element 55) mounted on the lead frame 60b so as to be electrically connected to the lead frame 60b. Further, the LED 55 is connected to the lead frame 60 a by the wiring wire 65 or the like, and the cavity 90 formed by the lead frames 60 a and 60 b and the reflectors 85 a and 85 b is filled with a transparent resin 75.

上記実施形態の表面実装型ＬＥＤ１００の製造方法の一例について説明する。まずはじめにリフレクタ付基板を準備する。リフレクタ付基板は、上記本発明のリフレクタ付基板の製造方法に従って製造することができ、ここでの説明は省略する。   An example of a method for manufacturing the surface-mounted LED 100 of the above embodiment will be described. First, a reflector-equipped substrate is prepared. The board | substrate with a reflector can be manufactured according to the manufacturing method of the board | substrate with a reflector of the said invention, The description here is abbreviate | omitted.

次いで、図７（ａ）に示すように、リードフレーム６０上にダイアタッチ等により、あらかじめ準備されたＬＥＤ５５を電気的に接続するように搭載し、ワイヤボンディング等によって、このＬＥＤ５５を隣接するリードフレーム６０と配線用ワイヤ６５等により接続する。   Next, as shown in FIG. 7A, an LED 55 prepared in advance is mounted on the lead frame 60 by die attach or the like so as to be electrically connected, and the LED 55 is connected to the adjacent lead frame by wire bonding or the like. 60 and the wiring wire 65 or the like.

次いで、図７（ｂ）に示すように、バックテープ７０上に所定の間隔をあけて配されたリードフレーム６０とリフレクタ８５によって形成されるキャビティー９０を透明樹脂７５で充填させる。透明樹脂７５としては、エポキシ樹脂や、シリコーン樹脂等を使用することができる。次いで、図７（ｂ）の破線部をダイシングすることで、図６に示す表面実装型ＬＥＤが製造される。   Next, as shown in FIG. 7B, the cavity 90 formed by the lead frame 60 and the reflector 85 arranged on the back tape 70 at a predetermined interval is filled with a transparent resin 75. As the transparent resin 75, an epoxy resin, a silicone resin, or the like can be used. Next, the surface mount type LED shown in FIG. 6 is manufactured by dicing the broken line portion of FIG.

以上説明した一実施形態の表面実装型ＬＥＤの製造方法によれば、リフレクタ付基板が、本発明の製造方法にしたがって形成されていることから、リードフレームに反りが生じない表面実装型ＬＥＤを提供することができる。さらに、リフレクタの成型に金型を必要とせず、表面実装型ＬＥＤの設計変更に低コストで容易に対応することが可能となる。   According to the method for manufacturing the surface-mounted LED of the embodiment described above, the substrate with the reflector is formed according to the manufacturing method of the present invention, so that the surface-mounted LED that does not warp the lead frame is provided. can do. Further, a mold is not required for molding the reflector, and it is possible to easily cope with a design change of the surface mount type LED at a low cost.

５０ シート状樹脂
５１ 貫通孔
５２ 加熱部材
５２ａ 加熱部材のテーパー面
５３ 貫通孔の内壁面に形成されたテーパー面
５５ ＬＥＤ（発光素子）
６０、６０ａ、６０ｂ リードフレーム
６５ 配線用ワイヤ
７０ バックテープ
７５ 透明樹脂
８０ テーパー面形成前のリフレクタ
８５、８５ａ、８５ｂ テーパー面形成後のリフレクタ
９０ キャビティー
１００ 表面実装型ＬＥＤ
１０１ 樹脂貯留部
１０２ 熱ロール
１０３ オーブン
１０４ 粘着シート
１０５ 切断機
１０６ プレス装置
１０７ 超音波ホーン
１０８ アーム DESCRIPTION OF SYMBOLS 50 Sheet-like resin 51 Through-hole 52 Heating member 52a Tapered surface 53 of a heating member Tapered surface 55 formed in the inner wall face of a through-hole LED (light emitting element)
60, 60a, 60b Lead frame 65 Wire for wiring 70 Back tape 75 Transparent resin 80 Reflector 85, 85a, 85b before taper surface formation Reflector 90 after taper surface formation Cavity 100 Surface mount type LED
DESCRIPTION OF SYMBOLS 101 Resin storage part 102 Heat roll 103 Oven 104 Adhesive sheet 105 Cutting machine 106 Press apparatus 107 Ultrasonic horn 108 Arm

Claims (2)

リードフレームと、該リードフレーム上に設けられたリフレクタとから構成され、リードフレームとリフレクタとによって発光素子を収容するキャビティーが形成されたリフレクタ付基板の製造方法であって、
リフレクタの前駆体であるシート状樹脂を打ち抜いて、前記キャビティーを形成するための１又は複数の貫通孔を形成する打ち抜き工程と、
前記打ち抜き工程で打ち抜かれた貫通孔に、テーパー面をもつ加熱部材を挿入し、該貫通孔の内壁面を溶融させながら押し広げることで、該貫通孔の内壁面に発光素子の出光側に向かって広がるテーパー面を形成するテーパー形成工程と、
前記テーパー形成工程後、リードフレーム上に、内壁面にテーパー面が形成された貫通孔を有するシート状樹脂を接着する接着工程と、
を有するリフレクタ付基板の製造方法。 A method of manufacturing a reflector-equipped substrate comprising a lead frame and a reflector provided on the lead frame, wherein a cavity for receiving a light emitting element is formed by the lead frame and the reflector,
A punching step of punching out a sheet-shaped resin that is a precursor of the reflector to form one or a plurality of through holes for forming the cavity;
A heating member having a tapered surface is inserted into the through hole punched in the punching step, and the inner wall surface of the through hole is expanded while being melted, so that the inner wall surface of the through hole faces the light emitting side of the light emitting element. A taper forming process for forming a tapered surface that spreads out,
After the taper forming step, an adhesion step of adhering a sheet-like resin having a through hole with a tapered surface formed on the inner wall surface on the lead frame;
A method for manufacturing a substrate with a reflector. 前記加熱部材が、超音波振動によって貫通孔の内壁面を溶融させる加熱部材であることを特徴とする請求項１に記載のリフレクタ付基板の製造方法。   The method for manufacturing a substrate with a reflector according to claim 1, wherein the heating member is a heating member that melts an inner wall surface of the through hole by ultrasonic vibration.
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