JP2013028104A5 - - Google Patents
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- Publication number
- JP2013028104A5 JP2013028104A5 JP2011166494A JP2011166494A JP2013028104A5 JP 2013028104 A5 JP2013028104 A5 JP 2013028104A5 JP 2011166494 A JP2011166494 A JP 2011166494A JP 2011166494 A JP2011166494 A JP 2011166494A JP 2013028104 A5 JP2013028104 A5 JP 2013028104A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- silicon substrate
- discharge head
- liquid discharge
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011166494A JP5762200B2 (ja) | 2011-07-29 | 2011-07-29 | 液体吐出ヘッド用基板の製造方法 |
| US13/545,370 US8449783B2 (en) | 2011-07-29 | 2012-07-10 | Method of manufacturing liquid ejection head substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011166494A JP5762200B2 (ja) | 2011-07-29 | 2011-07-29 | 液体吐出ヘッド用基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013028104A JP2013028104A (ja) | 2013-02-07 |
| JP2013028104A5 true JP2013028104A5 (https=) | 2014-09-11 |
| JP5762200B2 JP5762200B2 (ja) | 2015-08-12 |
Family
ID=47596374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011166494A Expired - Fee Related JP5762200B2 (ja) | 2011-07-29 | 2011-07-29 | 液体吐出ヘッド用基板の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8449783B2 (https=) |
| JP (1) | JP5762200B2 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR112015020862B1 (pt) | 2013-02-28 | 2021-05-25 | Hewlett-Packard Development Company, L.P. | barra de impressão moldada |
| US10821729B2 (en) | 2013-02-28 | 2020-11-03 | Hewlett-Packard Development Company, L.P. | Transfer molded fluid flow structure |
| EP2961612B1 (en) | 2013-02-28 | 2019-08-07 | Hewlett-Packard Development Company, L.P. | Molding a fluid flow structure |
| USD729808S1 (en) * | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
| USD758372S1 (en) | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
| USD759022S1 (en) * | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
| US9724920B2 (en) | 2013-03-20 | 2017-08-08 | Hewlett-Packard Development Company, L.P. | Molded die slivers with exposed front and back surfaces |
| US9308728B2 (en) * | 2013-05-31 | 2016-04-12 | Stmicroelectronics, Inc. | Method of making inkjet print heads having inkjet chambers and orifices formed in a wafer and related devices |
| USD780763S1 (en) * | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
| USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5658471A (en) | 1995-09-22 | 1997-08-19 | Lexmark International, Inc. | Fabrication of thermal ink-jet feed slots in a silicon substrate |
| US6171510B1 (en) * | 1997-10-30 | 2001-01-09 | Applied Materials Inc. | Method for making ink-jet printer nozzles |
| US6036874A (en) * | 1997-10-30 | 2000-03-14 | Applied Materials, Inc. | Method for fabrication of nozzles for ink-jet printers |
| JP5031493B2 (ja) | 2007-09-06 | 2012-09-19 | キヤノン株式会社 | インクジェットヘッド用基板の製造方法 |
-
2011
- 2011-07-29 JP JP2011166494A patent/JP5762200B2/ja not_active Expired - Fee Related
-
2012
- 2012-07-10 US US13/545,370 patent/US8449783B2/en not_active Expired - Fee Related
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