JP2013027218A - 電力変換装置 - Google Patents
電力変換装置 Download PDFInfo
- Publication number
- JP2013027218A JP2013027218A JP2011161533A JP2011161533A JP2013027218A JP 2013027218 A JP2013027218 A JP 2013027218A JP 2011161533 A JP2011161533 A JP 2011161533A JP 2011161533 A JP2011161533 A JP 2011161533A JP 2013027218 A JP2013027218 A JP 2013027218A
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- power semiconductor
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Classifications
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- H—ELECTRICITY
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- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- B60L15/00—Methods, circuits, or devices for controlling the traction-motor speed of electrically-propelled vehicles
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- B60L3/00—Electric devices on electrically-propelled vehicles for safety purposes; Monitoring operating variables, e.g. speed, deceleration or energy consumption
- B60L3/0023—Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train
- B60L3/003—Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train relating to inverters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- H05K7/20927—Liquid coolant without phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- B60L2210/40—DC to AC converters
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B60L2240/00—Control parameters of input or output; Target parameters
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- B60L2240/44—Drive Train control parameters related to combustion engines
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B60L2240/00—Control parameters of input or output; Target parameters
- B60L2240/40—Drive Train control parameters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H—ELECTRICITY
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- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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Abstract
【解決手段】略直方体形状である流路形成体12にパワー半導体モジュール300を複数個側面から挿入し、流路形成体12の下面に平滑コンデンサモジュール500、上面に第1交流バスバー801、回路基板20を固定したモジュールを製作する。この構造により構成部品の低背化を達成することができ、生産組立性が向上し低コスト化も達成できる。
【選択図】 図5
Description
電力変換装置100は、後述する電力変換モジュール200を核として、電力変換モジュール200を固定及び保護するハウジング10とカバー8とを有し、外部との接続は、直流電源の入力部及び交流電源の出力部であるコネクタモジュール120及び制御回路への信号を伝送する信号コネクタ21及び冷却媒体を流路形成体12へ導入・排出するための入口配管13及び出口配管14で構成される。流路形成体12とハウジング10は、図示の如く別部品である。電力変換装置100は、底面及び上面の形状を略長方形としたことで、車両への取り付けが容易となり、また生産し易い効果がある。なお、以下実施例では、ハウジング10の底面からカバー8への方向を上向き、その逆を下向きとし、上下方向を高さ方向とする。
10 ハウジング
12 流路形成体
13 入口配管
14 出口配管
19 冷却流路
20 回路基板
21 信号コネクタ
100 電力変換装置
120 コネクタモジュール
121 コネクタハウジング
136 バッテリ
138 直流コネクタ部
140 インバータ回路
150 上下アームの直列回路
150A 上アーム半導体モジュール
150B 下アーム半導体モジュール
174 ドライバ回路
180 電流センサ
188 交流コネクタ部
200 電力変換モジュール
300 パワー半導体モジュール
420 流路カバー
450 抵抗器
500 平滑コンデンサモジュール
504 負極側のコンデンサ端子
506 正極側のコンデンサ端子
508 負極側の電源端子
509 正極側の電源端子
514 コンデンサセル
800 バスバーアッセンブリ
801 第1交流バスバー
802 バスバー保持部材
803 伝熱部材
804 第2交流バスバー
814 直流バスバー
Claims (15)
- 直流電流を交流電流に変換するパワー半導体素子を有するパワー半導体モジュールと、
前記直流電流を平滑化する平滑コンデンサモジュールと、
前記パワー半導体素子の交流電流出力を伝達するための交流バスバーと、
前記パワー半導体素子を制御する制御回路部と、
冷媒を流す流路を形成する流路形成体とを備える電力変換装置であって、
前記パワー半導体モジュールは、第1放熱部と前記パワー半導体素子を介して当該第1放熱部と対向する第2放熱部と、を有し、
前記流路形成体は、前記パワー半導体モジュールを前記流路内に挿入するための開口部と、
前記パワー半導体モジュールの前記第1放熱部と前記流路を介して対向する第1上面壁と、
前記パワー半導体モジュールの前記第2放熱部と前記流路を介して対向する第2下面壁と、により構成され、
前記流路形成体の前記開口部は、前記第1上面壁と前記第2下面壁と繋ぐ側壁に形成され、
前記平滑コンデンサモジュールは、前記流路形成体の前記第1上面壁又は前記第2下面壁を形成する流路形成体外形部と向き合う位置に配置され、
前記パワー半導体素子の交流電流出力を接続するための交流バスバーは、前記流路形成体の前記第1上面壁又は前記第2下面壁を形成する流路形成体外形部と向き合う位置に配置され、
前記制御回路部は、前記流路形成体の前記第1上面壁又は前記第2下面壁を形成する流路形成体外形部と向き合う位置に配置されることを特徴とする電力変換装置。 - 請求項1に記載の電力変換装置において、
前記流路形成体は、ハウジングとは物理的に分離して形成されるとともに固定具により前記ハウジングに固定された構造を特徴とする電力変換装置。 - 請求項1に記載の電力変換装置において、
前記パワー半導体モジュールと前記平滑コンデンサモジュールと前記交流バスバーと前記制御回路部とが前記流路形成体に組付けられた状態で、前記ハウジングに組付けられることを特徴とする電力変換装置。 - 請求項1に記載の電力変換装置において、
前記流路形成体の流路部及び外部との接続部分は、前記ハウジングを介することなく外部に露出されていることを特徴とする電力変換装置。 - 請求項1に記載の電力変換装置において、
前記流路形成体の外部との接続部分を具備するフランジ部は、
筐体となるケースと接触する部分にシール部材を備えることを特徴とする電力変換装置。 - 請求項5に記載の電力変換装置において、
前記フランジ部は、
流路形成体の長辺方向に対し垂直な面で構成され、流路形成体をハウジングに収容した際にハウジングの底面に近い側のフランジの近傍に、流路形成体を支持するための支持部を備え、フランジ面を締結部材を用いてフランジ面に垂直な方向からハウジングに固定し、流路形成体の前記フランジに対面する部分に設けられた固定用の孔は、締結部材を用いてフランジ面に平行な方向からハウジングに固定することを特徴とする電力変換装置。 - 請求項1に記載の電力変換装置において、
前記流路形成体の前記第1上面壁又は前記第2下面壁の一方が開口部となり、
開口部を塞ぐために他方の前記第1上面壁又は前記第2下面壁を備えた流路カバーを構成とすることを特徴とする電力変換装置。 - 請求項7に記載の電力変換装置において、
流路カバーの流路の内部側は、流路形成体の内部の形状とパワー半導体モジュールの外形に沿った形の凸の形状を持つことを特徴とする電力変換装置。 - 請求項8に記載の電力変換装置において、
流路カバーの流路外部側は、前記凸形状に合わせて凹ませた形状を持ち、凹ませた部分に交流バスバーを固定するためのボスを備えたことを特徴とする電力変換装置。 - 請求項1に記載の電力変換装置において、
流路形成体に、電流センサを取り付けるためのボスを備えたことを特徴とする電力変換装置。 - 請求項1に記載の電力変換装置において、
流路形成体に、回路基板を取り付けるためのボスを備えたことを特徴とする電力変換装置。 - 請求項1に記載の電力変換装置において、
制御回路部は、ドライバ回路と制御回路を構成するそれぞれの部品が、一枚の基板上に配置されたことを特徴とする電力変換装置。 - 請求項1に記載の電力変換装置において、
前記流路形成体の前記開口部を備える面の最小高さは、パワー半導体モジュールのケースに具備されたフランジの寸法と略同一であることを特徴とする電力変換装置。 - 請求項1記載の電力変換装置において、
前記流路形成体は所定の物質を型に鋳込む製法で製作され、
前記側壁は傾斜を持ったテーパー面で、
前記第1上面壁と第2下面壁はテーパーを必要としない面で構成されたことを特徴とする電力変換装置。 - モータと接続された電力変換装置において、
前記電力変換装置は、
直流電流を交流電流に変換するパワー半導体素子を有するパワー半導体モジュールと、
前記直流電流を平滑化するコンデンサモジュールと、
前記パワー半導体素子の交流電流の出力を前記モータへ伝達するためのバスバーと、
前記パワー半導体素子のスイッチング処理を制御する制御回路部と、
冷媒を流す流路を形成する流路形成体とを備え、
前記パワー半導体モジュールは、第1放熱部と前記パワー半導体素子を介して前記第1放熱部と対向する第2放熱部と、を有し、
前記流路形成体の流路は、隔壁を設けることでU字形状の流路を形成し、U字形状により形成される第1及び第2の流路に流れる冷却媒体の流れ方向と垂直の方向に前記パワー半導体モジュールを前記流路内に挿入するための開口部を、前記流路形成体の側面に設け、
前記パワー半導体モジュールは、第1放熱部と第2放熱部が上下になる配置関係で前記開口部に挿入されることを特徴とする電力変換装置。
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Also Published As
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EP2738930A4 (en) | 2015-05-20 |
US20140160822A1 (en) | 2014-06-12 |
CN103733495A (zh) | 2014-04-16 |
EP2782433B1 (en) | 2019-03-06 |
CN103733495B (zh) | 2016-04-06 |
EP2782433A3 (en) | 2015-05-06 |
WO2013015319A1 (ja) | 2013-01-31 |
EP2738930B1 (en) | 2017-08-23 |
US9301434B2 (en) | 2016-03-29 |
EP2782433A2 (en) | 2014-09-24 |
EP2738930A1 (en) | 2014-06-04 |
JP5506749B2 (ja) | 2014-05-28 |
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