JP2013016605A - 基板搬送装置、基板搬送方法および塗布装置 - Google Patents

基板搬送装置、基板搬送方法および塗布装置 Download PDF

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Publication number
JP2013016605A
JP2013016605A JP2011147841A JP2011147841A JP2013016605A JP 2013016605 A JP2013016605 A JP 2013016605A JP 2011147841 A JP2011147841 A JP 2011147841A JP 2011147841 A JP2011147841 A JP 2011147841A JP 2013016605 A JP2013016605 A JP 2013016605A
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JP
Japan
Prior art keywords
substrate
unprocessed substrate
unprocessed
support member
movable support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011147841A
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English (en)
Japanese (ja)
Inventor
Yasuhiro Takimoto
泰弘 瀧本
Katsunori Takahashi
克典 高橋
Seishi Oishi
誠士 大石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Tatsumo KK
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Tatsumo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd, Tatsumo KK filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2011147841A priority Critical patent/JP2013016605A/ja
Priority to KR1020120064949A priority patent/KR101381548B1/ko
Publication of JP2013016605A publication Critical patent/JP2013016605A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
JP2011147841A 2011-07-04 2011-07-04 基板搬送装置、基板搬送方法および塗布装置 Pending JP2013016605A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011147841A JP2013016605A (ja) 2011-07-04 2011-07-04 基板搬送装置、基板搬送方法および塗布装置
KR1020120064949A KR101381548B1 (ko) 2011-07-04 2012-06-18 기판 반송 장치, 기판 반송 방법 및 도포 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011147841A JP2013016605A (ja) 2011-07-04 2011-07-04 基板搬送装置、基板搬送方法および塗布装置

Publications (1)

Publication Number Publication Date
JP2013016605A true JP2013016605A (ja) 2013-01-24

Family

ID=47689001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011147841A Pending JP2013016605A (ja) 2011-07-04 2011-07-04 基板搬送装置、基板搬送方法および塗布装置

Country Status (2)

Country Link
JP (1) JP2013016605A (ko)
KR (1) KR101381548B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020155507A (ja) * 2019-03-19 2020-09-24 大日本印刷株式会社 被加工基板、インプリントモールド用基板及びインプリントモールド

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6093627U (ja) * 1983-11-30 1985-06-26 安藤電気株式会社 ウエハの搬送機構
JPS63213355A (ja) * 1987-02-27 1988-09-06 Dainippon Screen Mfg Co Ltd 基板移載装置
JPH06170310A (ja) * 1992-12-10 1994-06-21 Tokyo Ohka Kogyo Co Ltd 塗布装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57158635U (ko) * 1981-03-31 1982-10-05
KR100292075B1 (ko) 1998-12-29 2001-07-12 윤종용 반도체소자제조용웨이퍼처리장치
JP2009026859A (ja) 2007-07-18 2009-02-05 Olympus Corp 基板検査装置
JP2010192685A (ja) 2009-02-18 2010-09-02 Tokyo Electron Ltd 基板搬送装置及び基板処理システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6093627U (ja) * 1983-11-30 1985-06-26 安藤電気株式会社 ウエハの搬送機構
JPS63213355A (ja) * 1987-02-27 1988-09-06 Dainippon Screen Mfg Co Ltd 基板移載装置
JPH06170310A (ja) * 1992-12-10 1994-06-21 Tokyo Ohka Kogyo Co Ltd 塗布装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020155507A (ja) * 2019-03-19 2020-09-24 大日本印刷株式会社 被加工基板、インプリントモールド用基板及びインプリントモールド
JP7205325B2 (ja) 2019-03-19 2023-01-17 大日本印刷株式会社 被加工基板、インプリントモールド用基板及びインプリントモールド

Also Published As

Publication number Publication date
KR20130004876A (ko) 2013-01-14
KR101381548B1 (ko) 2014-04-07

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