JP2013003031A5 - - Google Patents
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- Publication number
- JP2013003031A5 JP2013003031A5 JP2011136010A JP2011136010A JP2013003031A5 JP 2013003031 A5 JP2013003031 A5 JP 2013003031A5 JP 2011136010 A JP2011136010 A JP 2011136010A JP 2011136010 A JP2011136010 A JP 2011136010A JP 2013003031 A5 JP2013003031 A5 JP 2013003031A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- substrate
- forming
- pressure sensor
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 22
- 238000004519 manufacturing process Methods 0.000 claims 9
- 239000004065 semiconductor Substances 0.000 claims 7
- 238000007789 sealing Methods 0.000 claims 6
- 238000000034 method Methods 0.000 claims 5
- 238000005530 etching Methods 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011136010A JP5828378B2 (ja) | 2011-06-20 | 2011-06-20 | 圧力センサーデバイスの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011136010A JP5828378B2 (ja) | 2011-06-20 | 2011-06-20 | 圧力センサーデバイスの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013003031A JP2013003031A (ja) | 2013-01-07 |
| JP2013003031A5 true JP2013003031A5 (enExample) | 2014-07-31 |
| JP5828378B2 JP5828378B2 (ja) | 2015-12-02 |
Family
ID=47671738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011136010A Expired - Fee Related JP5828378B2 (ja) | 2011-06-20 | 2011-06-20 | 圧力センサーデバイスの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5828378B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6824504B2 (ja) * | 2015-03-06 | 2021-02-03 | 株式会社ＢｌｕｅＳｐｉｎ | 磁気メモリ、磁気メモリへのデータ書き込み方法及び半導体装置 |
| JP6541066B2 (ja) * | 2015-06-08 | 2019-07-10 | セイコーＮｐｃ株式会社 | 圧力センサ |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5177661A (en) * | 1989-01-13 | 1993-01-05 | Kopin Corporation | SOI diaphgram sensor |
| EP0702221A3 (en) * | 1994-09-14 | 1997-05-21 | Delco Electronics Corp | Sensor integrated on a chip |
| US6928879B2 (en) * | 2003-02-26 | 2005-08-16 | Robert Bosch Gmbh | Episeal pressure sensor and method for making an episeal pressure sensor |
| JP2009139340A (ja) * | 2007-12-10 | 2009-06-25 | Seiko Epson Corp | 圧力センサの製造方法、圧力センサ、半導体装置、電子機器 |
| JP5220866B2 (ja) * | 2008-11-17 | 2013-06-26 | アルプス電気株式会社 | 半導体圧力センサ |
-
2011
- 2011-06-20 JP JP2011136010A patent/JP5828378B2/ja not_active Expired - Fee Related
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