JP2012529744A - 導電コーティングの気相リフロー接合のためのシステム及び方法 - Google Patents
導電コーティングの気相リフロー接合のためのシステム及び方法 Download PDFInfo
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- JP2012529744A JP2012529744A JP2012514940A JP2012514940A JP2012529744A JP 2012529744 A JP2012529744 A JP 2012529744A JP 2012514940 A JP2012514940 A JP 2012514940A JP 2012514940 A JP2012514940 A JP 2012514940A JP 2012529744 A JP2012529744 A JP 2012529744A
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- JP
- Japan
- Prior art keywords
- reflow chamber
- reflow
- electrical component
- chain
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Coating With Molten Metal (AREA)
Abstract
Description
102 電気部品
106 連鎖状物
124 成形後の電気部品
128 めっきステーション
130 リフロー室
134 経路
136 めっき後の電気部品
138 導電コーティング
206 入口ポート
208 出口ポート
220 加熱飽和気体
226 加熱部材
228 冷却部材
230 凝結物
252 冷却部材
Claims (12)
- 入口ポート(206)及び出口ポート(208)を有するリフロー室(130)を具備する、電気部品を製造するためのシステム(100)であって、
前記入口ポートは、導電コーティング(138)を有する電気部品(102)の相互接続された連鎖状物(106)を前記リフロー室内に受容し、
前記出口ポートは、前記リフロー室から前記連鎖状物を排出し、
前記リフロー室は、相互接続された電気部品(136)の前記連鎖状物を前記リフロー室を通って所定の経路(134)に沿って配向させ、
前記リフロー室は、前記連鎖状物が前記リフロー室を通って前記経路に沿って前記電気部品の周囲に前記導電コーティングをリフロー接合すると、前記導電コーティングを加熱するよう加熱気体(220)を保持するよう構成されていることを特徴とするシステム。 - 前記導電コーティングは、錫及び錫合金のうち少なくとも一方からなることを特徴とする請求項1記載のシステム。
- 前記加熱飽和気体は不活性ガスであることを特徴とする請求項1記載のシステム。
- 前記入口ポート及び前記出口ポートの少なくとも一方は、前記加熱気体を凝結させ、前記リフロー室から前記加熱気体が逃げるのを防止するよう構成された冷却部材(228,252)を具備することを特徴とする請求項1記載のシステム。
- 前記システムは、前記リフロー室内に加熱部材(226)をさらに具備し、
前記リフロー室は、前記加熱気体の凝結物(230)を収集する形状に形成され、
前記加熱部材は、前記凝結物を加熱し、追加の加熱気体を発生させるようこうせいされていることを特徴とする請求項1記載のシステム。 - 前記システムは、前記電気部品が前記リフロー室を通過する前に、前記電気部品上の前記導電コーティングを供給するよう構成されためっきステーション(128)をさらに具備することを特徴とする請求項1記載のシステム。
- 前記導電コーティングは、亜鉛及び亜鉛合金のうち少なくとも一方からなることを特徴とする請求項1記載のシステム。
- リフロー室を通って、導電コーティングを有し相互接続された電気部品の連続した連鎖状物を通過させる工程と、
前記電気部品の周囲に前記導電コーティングをリフロー接合するよう加熱気体で前記リフロー室内で前記導電コーティングを加熱する工程と
を具備することを特徴とする電気部品の製造方法。 - 前記通過工程は、所定の経路に沿って前記リフロー室を通って前記連鎖状物を移動させ、この結果、前記連鎖状物の下流部分は、前記連鎖状物の上流部分を前記リフロー室内に導入する前に、前記リフロー室から除去されることを特徴とする請求項8記載の電気部品の製造方法。
- 前記連鎖状物上の加熱気体の凝結物を収集する工程と、
前記リフロー室内に追加の加熱気体を供給するために、前記凝結物を加熱する工程と
をさらに具備することを特徴とする請求項8記載の電気部品の製造方法。 - 前記加熱気体を凝結させ、前記リフロー室から前記加熱気体が排出するのを防止するために、前記リフロー室の1個以上のポートで前記加熱気体を冷却する工程をさらに具備することを特徴とする請求項8記載の電気部品の製造方法。
- 前記連鎖状物からの気体の凝結物の除去、及び前記導電コーティングの固化の少なくとも一方をするために、前記連鎖状物が前記リフロー室を通過した後に、前記導電コーティングを冷却する工程をさらに具備することを特徴とする請求項11記載の電気部品の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/480,046 | 2009-06-08 | ||
US12/480,046 US20100308103A1 (en) | 2009-06-08 | 2009-06-08 | System and method for vapor phase reflow of a conductive coating |
PCT/US2010/001644 WO2010144126A2 (en) | 2009-06-08 | 2010-06-08 | System and method for vapor phase reflow of a conductive coating |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2012529744A true JP2012529744A (ja) | 2012-11-22 |
Family
ID=43128310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012514940A Pending JP2012529744A (ja) | 2009-06-08 | 2010-06-08 | 導電コーティングの気相リフロー接合のためのシステム及び方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100308103A1 (ja) |
EP (1) | EP2440683A2 (ja) |
JP (1) | JP2012529744A (ja) |
CN (1) | CN102459691A (ja) |
WO (1) | WO2010144126A2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6188671B2 (ja) * | 2014-12-12 | 2017-08-30 | 株式会社Ssテクノ | 水蒸気リフロー装置及び水蒸気リフロー方法 |
CN110106471B (zh) * | 2019-06-18 | 2021-01-22 | 京东方科技集团股份有限公司 | 一种导流机构、坩埚装置、蒸镀设备及蒸镀方法 |
CN110508725B (zh) * | 2019-08-16 | 2021-01-01 | 广州凌鼎建筑工程有限公司 | 一种钢筋网成型工艺 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5418070A (en) * | 1977-07-01 | 1979-02-09 | Western Electric Co | Method of restreaming solder on coated flexible circuit and device therefor |
JPS6224859A (ja) * | 1985-07-24 | 1987-02-02 | Kenji Kondo | はんだ付け装置 |
JPS62151265A (ja) * | 1985-12-26 | 1987-07-06 | Tamura Seisakusho Co Ltd | 気相式はんだ付け装置 |
JPH02156058A (ja) * | 1988-12-08 | 1990-06-15 | Nec Corp | 亜鉛めっきのウィスカー対策方法 |
JPH02274852A (ja) * | 1989-04-17 | 1990-11-09 | Nec Corp | 錫めっきのウィスカ対策方法 |
JP2003019590A (ja) * | 2001-07-05 | 2003-01-21 | Nihon Dennetsu Keiki Co Ltd | リフローはんだ付け方法 |
JP2007066896A (ja) * | 2005-08-26 | 2007-03-15 | Tyco Electronics Corp | 電気コンタクトの製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3866307A (en) * | 1973-09-07 | 1975-02-18 | Western Electric Co | Method for soldering, fusing or brazing |
US4256512A (en) * | 1977-07-01 | 1981-03-17 | Bell Telephone Laboratories, Incorporated | Flexible circuit reflow soldering machine |
US4580716A (en) * | 1984-10-17 | 1986-04-08 | Rca Corporation | Apparatus and method for vapor phase solder reflow |
JPS61238464A (ja) * | 1985-04-13 | 1986-10-23 | Eiichi Miyake | 物品加熱装置 |
EP0205309B1 (en) * | 1985-06-08 | 1990-09-05 | Nihon Den-Netsu Keiki Co., Ltd. | Vapor phase soldering apparatus |
US4838476A (en) * | 1987-11-12 | 1989-06-13 | Fluocon Technologies Inc. | Vapour phase treatment process and apparatus |
US5980785A (en) * | 1997-10-02 | 1999-11-09 | Ormet Corporation | Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements |
DE10025472C2 (de) * | 2000-05-23 | 2003-04-24 | Rehm Anlagenbau Gmbh | Dampfphasenlötanlage mit überhitztem Dampf |
-
2009
- 2009-06-08 US US12/480,046 patent/US20100308103A1/en not_active Abandoned
-
2010
- 2010-06-08 JP JP2012514940A patent/JP2012529744A/ja active Pending
- 2010-06-08 EP EP10727523A patent/EP2440683A2/en not_active Withdrawn
- 2010-06-08 WO PCT/US2010/001644 patent/WO2010144126A2/en active Application Filing
- 2010-06-08 CN CN201080025365XA patent/CN102459691A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5418070A (en) * | 1977-07-01 | 1979-02-09 | Western Electric Co | Method of restreaming solder on coated flexible circuit and device therefor |
JPS6224859A (ja) * | 1985-07-24 | 1987-02-02 | Kenji Kondo | はんだ付け装置 |
JPS62151265A (ja) * | 1985-12-26 | 1987-07-06 | Tamura Seisakusho Co Ltd | 気相式はんだ付け装置 |
JPH02156058A (ja) * | 1988-12-08 | 1990-06-15 | Nec Corp | 亜鉛めっきのウィスカー対策方法 |
JPH02274852A (ja) * | 1989-04-17 | 1990-11-09 | Nec Corp | 錫めっきのウィスカ対策方法 |
JP2003019590A (ja) * | 2001-07-05 | 2003-01-21 | Nihon Dennetsu Keiki Co Ltd | リフローはんだ付け方法 |
JP2007066896A (ja) * | 2005-08-26 | 2007-03-15 | Tyco Electronics Corp | 電気コンタクトの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2010144126A2 (en) | 2010-12-16 |
US20100308103A1 (en) | 2010-12-09 |
WO2010144126A3 (en) | 2011-04-07 |
EP2440683A2 (en) | 2012-04-18 |
CN102459691A (zh) | 2012-05-16 |
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