JP2012528935A - コーティング装置およびコーティング方法 - Google Patents
コーティング装置およびコーティング方法 Download PDFInfo
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- JP2012528935A JP2012528935A JP2012513530A JP2012513530A JP2012528935A JP 2012528935 A JP2012528935 A JP 2012528935A JP 2012513530 A JP2012513530 A JP 2012513530A JP 2012513530 A JP2012513530 A JP 2012513530A JP 2012528935 A JP2012528935 A JP 2012528935A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/16—Centrifugal pumps for displacing without appreciable compression
- F04D17/168—Pumps specially adapted to produce a vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- Mechanical Engineering (AREA)
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- Organic Chemistry (AREA)
- Metallurgy (AREA)
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- Chemical Kinetics & Catalysis (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (16)
- 基板(30)を受容することを目的とした少なくとも1つの排気可能な受容器(10)と、少なくとも1つのガス前駆体を前記受容器(10)内に導入することができる少なくとも1つのガス供給デバイス(20、21、22)と、端部が固定点(42)において保持要素(43)に固定される、少なくとも1つの加熱可能な活性化要素(41)を含む少なくとも1つの活性化デバイス(40)とを含むコーティング装置(1)であって、遮蔽要素(50)が存在し、遮蔽要素(50)によって前記ガス前駆体の作用から少なくとも部分的に少なくとも前記固定点(42)を保護することができ、前記遮蔽要素(50)は第1の側および第2の側に長手方向の範囲を有し、前記第1の側は前記保持要素上に配置され、前記遮蔽要素(50)の前記第2の側に、少なくとも1つの出口ポート(53)を有する閉止要素(52)が配置されるコーティング装置(1)において、少なくとも1つの隔壁(55)が前記遮蔽要素(50)の内部に配置され、前記遮蔽要素(50)の前記内部容積(56)を第1の部分容積(56a)と第2の部分容積(56b)とに分離することを特徴とするコーティング装置(1)。
- 前記遮蔽要素(50)は、その長手方向の軸(51)に沿って可変断面を有することを特徴とする請求項1に記載のコーティング装置(1)。
- 前記遮蔽要素(50)の少なくとも一部が前記保持要素(43)に分離可能に連結されることを特徴とする請求項1または2に記載のコーティング装置(1)。
- 前記遮蔽要素(50)は、真空ポンプに連結可能なガス排出ポート(57)を有することを特徴とする請求項1〜3のいずれか1項に記載のコーティング装置(1)。
- 前記遮蔽要素(50)は、それを介して反応性ガスおよび/または不活性ガスが導入されうるガス供給ポート(58)を有することを特徴とする請求項4に記載のコーティング装置(1)。
- 前記遮蔽要素(50)は、前記保持要素(43)から、および/または前記活性化要素(41)から電気的に絶縁されることを特徴とする請求項1〜5のいずれか1項に記載のコーティング装置(1)。
- 前記遮蔽要素(50)は、その内部にリブ(59)を有することを特徴とする請求項1〜6のいずれか1項に記載のコーティング装置(1)。
- 前記遮蔽要素(50)に収着材(60)が設けられることを特徴とする請求項1〜7のいずれか1項に記載のコーティング装置(1)。
- 前記収着材(60)は、ゼオライトおよび/または発泡金属および/またはチタン膜を含むことを特徴とする請求項8に記載のコーティング装置(1)。
- 前記遮蔽要素(50)は加熱可能であることを特徴とする請求項1〜9のいずれか1項に記載のコーティング装置(1)。
- 基板(30)のコーティング(105)を製作するための方法であって、前記基板を排気可能な受容器(10)内に導入し、少なくとも1つのガス前駆体が少なくとも1つのガス供給デバイス(20、21、22)を介して前記受容器(10)内に導入され、端部が固定点(42)において保持要素(43)に固定される、少なくとも1つの加熱可能な活性化要素(41)を含む少なくとも1つの活性化デバイス(40)によって活性化され、遮蔽要素(50)が存在し、遮蔽要素(50)によって少なくとも前記固定点(42)が少なくとも部分的に前記ガス前駆体の作用から保護され、前記遮蔽要素(50)は第1の側および第2の側に長手方向の範囲を有し、前記第1の側は前記保持要素上に配置され、前記遮蔽要素(50)の前記第2の側に、少なくとも1つの出口ポート(53)を有する閉止要素(52)が配置される方法において、前記遮蔽要素(50)は前記遮蔽要素(50)の内部容積(56)を第1の部分容積(56a)と第2の部分容積(56b)とに分離する少なくとも1つの隔壁(55)を有することを特徴とする方法。
- 前記遮蔽要素(50)は加熱される請求項11に記載の方法。
- 不活性ガスおよび/または反応性ガスが前記遮蔽要素(50)の前記内部容積(56)の少なくとも部分容積内に導入される請求項11または12に記載の方法。
- 前記遮蔽要素(50)の前記内部容積(56)の少なくとも1つの部分容積が排気される請求項13に記載の方法。
- ガス排出部が前記遮蔽要素(50)の前記内部容積(56)の少なくとも部分容積内において点火される請求項11〜14のいずれか1項に記載の方法。
- 前記遮蔽要素(50)の前記内部表面の少なくとも1つの部分表面に収着材が設けられる請求項11〜15のいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009023472.1 | 2009-06-02 | ||
DE102009023472.1A DE102009023472B4 (de) | 2009-06-02 | 2009-06-02 | Beschichtungsanlage und Beschichtungsverfahren |
PCT/EP2010/056621 WO2010139541A1 (de) | 2009-06-02 | 2010-05-13 | Beschichtungsanlage und beschichtungsverfahren |
Publications (2)
Publication Number | Publication Date |
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JP2012528935A true JP2012528935A (ja) | 2012-11-15 |
JP5540083B2 JP5540083B2 (ja) | 2014-07-02 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012513530A Expired - Fee Related JP5540083B2 (ja) | 2009-06-02 | 2010-05-13 | コーティング装置およびコーティング方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8940367B2 (ja) |
EP (1) | EP2438205B1 (ja) |
JP (1) | JP5540083B2 (ja) |
KR (1) | KR20120014195A (ja) |
CN (1) | CN102459692B (ja) |
DE (1) | DE102009023472B4 (ja) |
WO (1) | WO2010139541A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9157152B2 (en) * | 2007-03-29 | 2015-10-13 | Tokyo Electron Limited | Vapor deposition system |
DE102008044025A1 (de) * | 2008-11-24 | 2010-08-05 | Cemecon Ag | Vorrichtung und Verfahren zum Beschichten eines Substrats mittels CVD |
DE102009023471B4 (de) * | 2009-06-02 | 2012-08-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Beschichtungsanlage und -verfahren |
US9719629B2 (en) * | 2014-04-08 | 2017-08-01 | Plansee Se | Supporting system for a heating element and heating system |
Citations (4)
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JP2004128322A (ja) * | 2002-10-04 | 2004-04-22 | Anelva Corp | 発熱体cvd装置及び、発熱体cvd装置における発熱体と電力供給機構との間の接続構造 |
JP3780364B2 (ja) * | 2000-09-14 | 2006-05-31 | 国立大学法人北陸先端科学技術大学院大学 | 発熱体cvd装置 |
JP2009215618A (ja) * | 2008-03-11 | 2009-09-24 | Canon Inc | 触媒cvd装置、触媒cvd装置に用いる触媒体の処理方法、及び、触媒cvd装置を用いた成膜方法 |
JP2009235426A (ja) * | 2006-06-22 | 2009-10-15 | Japan Advanced Institute Of Science & Technology Hokuriku | 触媒化学気相堆積法における触媒体の変性防止法 |
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US2637297A (en) * | 1951-11-20 | 1953-05-05 | Atomic Energy Commission | Apparatus for attaching filaments to electrodes in machines for coating with metal vapors |
JPH07254566A (ja) * | 1994-03-16 | 1995-10-03 | Fuji Electric Co Ltd | 薄膜生成装置 |
US20070128861A1 (en) * | 2005-12-05 | 2007-06-07 | Kim Myoung S | CVD apparatus for depositing polysilicon |
US8838186B2 (en) * | 2006-03-17 | 2014-09-16 | Arris Enterprises, Inc. | Method and system for increasing power savings in a DOCSIS device |
US7727590B2 (en) * | 2006-05-18 | 2010-06-01 | California Institute Of Technology | Robust filament assembly for a hot-wire chemical vapor deposition system |
EP2098608A1 (en) | 2008-03-05 | 2009-09-09 | Applied Materials, Inc. | Coating apparatus with rotation module |
JP2009038398A (ja) * | 2008-11-04 | 2009-02-19 | Canon Anelva Corp | シリコン膜及びシリコン窒化膜の製造法 |
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2009
- 2009-06-02 DE DE102009023472.1A patent/DE102009023472B4/de not_active Expired - Fee Related
-
2010
- 2010-05-13 CN CN201080024725.4A patent/CN102459692B/zh not_active Expired - Fee Related
- 2010-05-13 WO PCT/EP2010/056621 patent/WO2010139541A1/de active Application Filing
- 2010-05-13 JP JP2012513530A patent/JP5540083B2/ja not_active Expired - Fee Related
- 2010-05-13 KR KR1020117028960A patent/KR20120014195A/ko not_active Application Discontinuation
- 2010-05-13 EP EP10721467.8A patent/EP2438205B1/de not_active Not-in-force
- 2010-05-13 US US13/375,938 patent/US8940367B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3780364B2 (ja) * | 2000-09-14 | 2006-05-31 | 国立大学法人北陸先端科学技術大学院大学 | 発熱体cvd装置 |
JP2004128322A (ja) * | 2002-10-04 | 2004-04-22 | Anelva Corp | 発熱体cvd装置及び、発熱体cvd装置における発熱体と電力供給機構との間の接続構造 |
JP2009235426A (ja) * | 2006-06-22 | 2009-10-15 | Japan Advanced Institute Of Science & Technology Hokuriku | 触媒化学気相堆積法における触媒体の変性防止法 |
JP2009215618A (ja) * | 2008-03-11 | 2009-09-24 | Canon Inc | 触媒cvd装置、触媒cvd装置に用いる触媒体の処理方法、及び、触媒cvd装置を用いた成膜方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2438205A1 (de) | 2012-04-11 |
DE102009023472A1 (de) | 2010-12-09 |
JP5540083B2 (ja) | 2014-07-02 |
KR20120014195A (ko) | 2012-02-16 |
CN102459692B (zh) | 2014-03-12 |
EP2438205B1 (de) | 2014-10-22 |
CN102459692A (zh) | 2012-05-16 |
DE102009023472B4 (de) | 2014-10-23 |
US20120135144A1 (en) | 2012-05-31 |
WO2010139541A1 (de) | 2010-12-09 |
US8940367B2 (en) | 2015-01-27 |
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