JP2012521888A5 - - Google Patents

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Publication number
JP2012521888A5
JP2012521888A5 JP2012502069A JP2012502069A JP2012521888A5 JP 2012521888 A5 JP2012521888 A5 JP 2012521888A5 JP 2012502069 A JP2012502069 A JP 2012502069A JP 2012502069 A JP2012502069 A JP 2012502069A JP 2012521888 A5 JP2012521888 A5 JP 2012521888A5
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JP
Japan
Prior art keywords
routing
tool path
routings
laser
sheet material
Prior art date
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Application number
JP2012502069A
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English (en)
Japanese (ja)
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JP5634497B2 (ja
JP2012521888A (ja
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Publication date
Priority claimed from US12/413,084 external-priority patent/US8729427B2/en
Application filed filed Critical
Publication of JP2012521888A publication Critical patent/JP2012521888A/ja
Publication of JP2012521888A5 publication Critical patent/JP2012521888A5/ja
Application granted granted Critical
Publication of JP5634497B2 publication Critical patent/JP5634497B2/ja
Active legal-status Critical Current
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JP2012502069A 2009-03-27 2010-02-26 レーザー使用による材料除去中の熱効果の最小化方法 Active JP5634497B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/413,084 US8729427B2 (en) 2009-03-27 2009-03-27 Minimizing thermal effect during material removal using a laser
US12/413,084 2009-03-27
PCT/US2010/025639 WO2010110991A2 (en) 2009-03-27 2010-02-26 Minimizing thermal effect during material removal using a laser

Publications (3)

Publication Number Publication Date
JP2012521888A JP2012521888A (ja) 2012-09-20
JP2012521888A5 true JP2012521888A5 (cg-RX-API-DMAC7.html) 2013-04-11
JP5634497B2 JP5634497B2 (ja) 2014-12-03

Family

ID=42781749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012502069A Active JP5634497B2 (ja) 2009-03-27 2010-02-26 レーザー使用による材料除去中の熱効果の最小化方法

Country Status (6)

Country Link
US (1) US8729427B2 (cg-RX-API-DMAC7.html)
JP (1) JP5634497B2 (cg-RX-API-DMAC7.html)
KR (1) KR101729671B1 (cg-RX-API-DMAC7.html)
CN (1) CN102348529B (cg-RX-API-DMAC7.html)
TW (1) TWI535516B (cg-RX-API-DMAC7.html)
WO (1) WO2010110991A2 (cg-RX-API-DMAC7.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7633033B2 (en) 2004-01-09 2009-12-15 General Lasertronics Corporation Color sensing for laser decoating
US8536483B2 (en) 2007-03-22 2013-09-17 General Lasertronics Corporation Methods for stripping and modifying surfaces with laser-induced ablation
US8383984B2 (en) 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
US10112257B1 (en) 2010-07-09 2018-10-30 General Lasertronics Corporation Coating ablating apparatus with coating removal detection
US8591753B2 (en) * 2010-07-26 2013-11-26 Hamamatsu Photonics K.K. Laser processing method
EP2658716A1 (en) 2010-12-30 2013-11-06 3M Innovative Properties Company Laser cutting method and articles produced therewith
JP2012196689A (ja) * 2011-03-22 2012-10-18 Fujitsu Ltd レーザ加工方法及びそのプログラム
US9895771B2 (en) 2012-02-28 2018-02-20 General Lasertronics Corporation Laser ablation for the environmentally beneficial removal of surface coatings
US9387041B2 (en) * 2013-03-15 2016-07-12 University Of North Texas Laser-assisted machining (LAM) of hard tissues and bones
US10188519B2 (en) 2013-03-15 2019-01-29 University Of North Texas Laser-assisted machining (LAM) of hard tissues and bones
KR102199211B1 (ko) * 2013-10-11 2021-01-07 삼성디스플레이 주식회사 레이저 가공 장치 및 이를 이용한 가공 방법
US10086597B2 (en) 2014-01-21 2018-10-02 General Lasertronics Corporation Laser film debonding method
KR102859580B1 (ko) * 2023-05-25 2025-09-12 현대모비스 주식회사 레이저 라우팅 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1015610B (zh) * 1990-05-03 1992-02-26 江西省机械工业设计研究院 钢结硬质合金模具激光切割工艺
JP2720669B2 (ja) 1991-11-11 1998-03-04 株式会社大林組 レーザービームによる厚板の溶断方法
DE4316012C2 (de) * 1993-05-13 1998-09-24 Gehring Gmbh & Co Maschf Verfahren zur Feinbearbeitung von Werkstück-Oberflächen
JP3534807B2 (ja) 1994-02-28 2004-06-07 三菱電機株式会社 レーザ切断方法
JP3159593B2 (ja) * 1994-02-28 2001-04-23 三菱電機株式会社 レーザ加工方法及びその装置
US6987786B2 (en) * 1998-07-02 2006-01-17 Gsi Group Corporation Controlling laser polarization
JP3518405B2 (ja) * 1999-04-02 2004-04-12 三菱電機株式会社 レーザ加工方法及びレーザ加工装置
ATE282526T1 (de) * 2001-05-25 2004-12-15 Stork Prints Austria Gmbh Verfahren und vorrichtung zur herstellung einer druckform
SG108262A1 (en) * 2001-07-06 2005-01-28 Inst Data Storage Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
JP3753657B2 (ja) * 2001-12-27 2006-03-08 本田技研工業株式会社 ツインスポットパルスレーザ溶接方法および装置
JP2005161322A (ja) 2003-11-28 2005-06-23 Seiko Epson Corp 硬質材料の加工方法
US20060097430A1 (en) * 2004-11-05 2006-05-11 Li Xiaochun UV pulsed laser machining apparatus and method
JP2007277636A (ja) * 2006-04-06 2007-10-25 Yamazaki Mazak Corp レーザ焼入れ方法
US8624157B2 (en) 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
US9029731B2 (en) * 2007-01-26 2015-05-12 Electro Scientific Industries, Inc. Methods and systems for laser processing continuously moving sheet material
US7817685B2 (en) * 2007-01-26 2010-10-19 Electro Scientific Industries, Inc. Methods and systems for generating pulse trains for material processing
JP2009049390A (ja) * 2007-07-25 2009-03-05 Rohm Co Ltd 窒化物半導体素子およびその製造方法

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