JP2012519966A5 - - Google Patents

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Publication number
JP2012519966A5
JP2012519966A5 JP2011553159A JP2011553159A JP2012519966A5 JP 2012519966 A5 JP2012519966 A5 JP 2012519966A5 JP 2011553159 A JP2011553159 A JP 2011553159A JP 2011553159 A JP2011553159 A JP 2011553159A JP 2012519966 A5 JP2012519966 A5 JP 2012519966A5
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Japan
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target
array
narrow
mounting
emitting device
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JP2011553159A
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Japanese (ja)
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JP5827569B2 (ja
JP2012519966A (ja
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Priority claimed from PCT/US2010/026447 external-priority patent/WO2010102263A1/en
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Publication of JP2012519966A5 publication Critical patent/JP2012519966A5/ja
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JP2011553159A 2009-03-05 2010-03-05 面発光半導体装置によるデジタル熱注入 Active JP5827569B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15779909P 2009-03-05 2009-03-05
US61/157,799 2009-03-05
US22476509P 2009-07-10 2009-07-10
US61/224,765 2009-07-10
PCT/US2010/026447 WO2010102263A1 (en) 2009-03-05 2010-03-05 Digital heat injection by way of surface emitting semi-conductor devices

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015095259A Division JP2015207766A (ja) 2009-03-05 2015-05-07 面発光半導体装置によるデジタル熱注入

Publications (3)

Publication Number Publication Date
JP2012519966A JP2012519966A (ja) 2012-08-30
JP2012519966A5 true JP2012519966A5 (https=) 2013-07-04
JP5827569B2 JP5827569B2 (ja) 2015-12-02

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JP2011553159A Active JP5827569B2 (ja) 2009-03-05 2010-03-05 面発光半導体装置によるデジタル熱注入
JP2015095259A Pending JP2015207766A (ja) 2009-03-05 2015-05-07 面発光半導体装置によるデジタル熱注入

Family Applications After (1)

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JP2015095259A Pending JP2015207766A (ja) 2009-03-05 2015-05-07 面発光半導体装置によるデジタル熱注入

Country Status (12)

Country Link
US (1) US9282851B2 (https=)
EP (1) EP2404353A4 (https=)
JP (2) JP5827569B2 (https=)
KR (1) KR101769312B1 (https=)
CN (2) CN102405568A (https=)
AU (1) AU2010221086A1 (https=)
BR (1) BRPI1010249A2 (https=)
CA (1) CA2754572C (https=)
MX (1) MX2011009327A (https=)
RU (1) RU2011140351A (https=)
SG (1) SG174246A1 (https=)
WO (1) WO2010102263A1 (https=)

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