CA2754572C - Digital heat injection by way of surface emitting semi-conductor devices - Google Patents

Digital heat injection by way of surface emitting semi-conductor devices Download PDF

Info

Publication number
CA2754572C
CA2754572C CA2754572A CA2754572A CA2754572C CA 2754572 C CA2754572 C CA 2754572C CA 2754572 A CA2754572 A CA 2754572A CA 2754572 A CA2754572 A CA 2754572A CA 2754572 C CA2754572 C CA 2754572C
Authority
CA
Canada
Prior art keywords
array
devices
irradiation
target
laser diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA2754572A
Other languages
English (en)
French (fr)
Other versions
CA2754572A1 (en
Inventor
Don W. Cochran
Benjamin D. Johnson
Jonathan M. Katz
Mark W. Moore
Noel E. Morgan
Denwood F. Ross
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pressco Technology Inc
Original Assignee
Pressco Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pressco Technology Inc filed Critical Pressco Technology Inc
Publication of CA2754572A1 publication Critical patent/CA2754572A1/en
Application granted granted Critical
Publication of CA2754572C publication Critical patent/CA2754572C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00—Baking; Roasting; Grilling; Frying
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23L—FOODS, FOODSTUFFS OR NON-ALCOHOLIC BEVERAGES, NOT OTHERWISE PROVIDED FOR; PREPARATION OR TREATMENT THEREOF
    • A23L5/00—Preparation or treatment of foods or foodstuffs, in general; Food or foodstuffs obtained thereby; Materials therefor
    • A23L5/10—General methods of cooking foods, e.g. by roasting or frying
    • A23L5/15—General methods of cooking foods, e.g. by roasting or frying using wave energy, irradiation, electrical means or magnetic fields, e.g. oven cooking or roasting using radiant dry heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/42—Component parts, details or accessories; Auxiliary operations
    • B29C49/64—Heating or cooling preforms, parisons or blown articles
    • B29C49/68—Ovens specially adapted for heating preforms or parisons
    • B29C49/6835—Ovens specially adapted for heating preforms or parisons using reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/1082—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region with a special facet structure, e.g. structured, non planar, oblique
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
    • H01S5/1203—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers over only a part of the length of the active region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4043—Edge-emitting structures with vertically stacked active layers
    • H01S5/405—Two-dimensional arrays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0057—Heating devices using lamps for industrial applications for plastic handling and treatment

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Food Science & Technology (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Nutrition Science (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Semiconductor Lasers (AREA)
  • Radiation-Therapy Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CA2754572A 2009-03-05 2010-03-05 Digital heat injection by way of surface emitting semi-conductor devices Expired - Fee Related CA2754572C (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15779909P 2009-03-05 2009-03-05
US61/157,799 2009-03-05
US22476509P 2009-07-10 2009-07-10
US61/224,765 2009-07-10
PCT/US2010/026447 WO2010102263A1 (en) 2009-03-05 2010-03-05 Digital heat injection by way of surface emitting semi-conductor devices

Publications (2)

Publication Number Publication Date
CA2754572A1 CA2754572A1 (en) 2010-09-10
CA2754572C true CA2754572C (en) 2017-10-24

Family

ID=42710031

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2754572A Expired - Fee Related CA2754572C (en) 2009-03-05 2010-03-05 Digital heat injection by way of surface emitting semi-conductor devices

Country Status (12)

Country Link
US (1) US9282851B2 (https=)
EP (1) EP2404353A4 (https=)
JP (2) JP5827569B2 (https=)
KR (1) KR101769312B1 (https=)
CN (2) CN102405568A (https=)
AU (1) AU2010221086A1 (https=)
BR (1) BRPI1010249A2 (https=)
CA (1) CA2754572C (https=)
MX (1) MX2011009327A (https=)
RU (1) RU2011140351A (https=)
SG (1) SG174246A1 (https=)
WO (1) WO2010102263A1 (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10687391B2 (en) 2004-12-03 2020-06-16 Pressco Ip Llc Method and system for digital narrowband, wavelength specific cooking, curing, food preparation, and processing
US7425296B2 (en) 2004-12-03 2008-09-16 Pressco Technology Inc. Method and system for wavelength specific thermal irradiation and treatment
US10857722B2 (en) 2004-12-03 2020-12-08 Pressco Ip Llc Method and system for laser-based, wavelength specific infrared irradiation treatment
SG174246A1 (en) * 2009-03-05 2011-10-28 Pressco Tech Inc Digital heat injection by way of surface emitting semi-conductor devices
KR101779352B1 (ko) * 2009-09-18 2017-09-18 프레스코 테크놀로지 인크. 협대역 방빙 및 얼음 제거 시스템 및 방법
US8815059B2 (en) * 2010-08-31 2014-08-26 Guardian Industries Corp. System and/or method for heat treating conductive coatings using wavelength-tuned infrared radiation
US9332877B2 (en) 2010-06-11 2016-05-10 Pressco Ip Llc Cookware and cook-packs for narrowband irradiation cooking and systems and methods thereof
US9357877B2 (en) 2010-06-11 2016-06-07 Pressco Ip Llc Cookware and cook-packs for narrowband irradiation cooking and systems and methods thereof
GB201114048D0 (en) * 2011-08-16 2011-09-28 Intrinsiq Materials Ltd Curing system
TR201809175T4 (tr) * 2012-01-17 2018-07-23 Koninklijke Philips Nv Bir canlıyı ısıtmak için ısıtma sistemi.
US10760794B2 (en) 2015-09-10 2020-09-01 Brava Home, Inc. In-oven camera
US11388788B2 (en) 2015-09-10 2022-07-12 Brava Home, Inc. In-oven camera and computer vision systems and methods
US11156366B2 (en) 2015-09-10 2021-10-26 Brava Home, Inc. Dynamic heat adjustment of a spectral power distribution configurable cooking instrument
US10085592B1 (en) 2015-09-10 2018-10-02 Brava Home, Inc. Sequential broiling
US10064244B2 (en) 2015-09-10 2018-08-28 Brava Home, Inc. Variable peak wavelength cooking instrument with support tray
AU2017209317A1 (en) * 2016-01-22 2018-08-16 Pressco Ip Llc A system and method for producing an engineered irradiation pattern in a narrowband system
US10465976B2 (en) 2016-05-19 2019-11-05 Bsh Home Appliances Corporation Cooking within a refrigeration cavity
EP3494760B1 (en) * 2016-08-02 2022-10-05 Brava Home, Inc. Cooking instrument with variable peak wavelength and support tray
EP4390779A3 (en) 2016-09-15 2024-11-06 Google LLC Multilayer printed circuit board for reducing quantum signal crosstalk
US10223933B1 (en) 2017-08-09 2019-03-05 Brava Home, Inc. Multizone cooking utilizing a spectral-configurable cooking instrument
CN111527348B (zh) 2017-08-11 2023-03-07 布拉瓦家居公司 可配置的烹饪系统和方法
US12137510B2 (en) 2017-11-06 2024-11-05 Brava Home, Inc. Power density emission manipulation in a cooking instrument
US11206949B1 (en) 2017-11-15 2021-12-28 Brava Home, Inc. High power density toaster
US11422037B2 (en) 2018-03-15 2022-08-23 Brava Home, Inc. Temperature probe systems and methods
US10502430B1 (en) 2018-10-10 2019-12-10 Brava Home, Inc. Particulates detection in a cooking instrument
DE102019106805A1 (de) 2019-03-18 2020-09-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierender halbleiterchip und strahlungsemittierendes halbleiterbauelement
MX2021012817A (es) 2019-04-19 2022-03-04 Photex Inc Sistema y metodo para curar el interior de la lata.
US12280396B2 (en) 2019-04-19 2025-04-22 Photex Inc. Narrowband can manufacturing
JP7336377B2 (ja) * 2019-12-12 2023-08-31 シャープ福山レーザー株式会社 半導体レーザ素子
DE102021129563A1 (de) 2021-11-12 2023-05-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauelement mit integrierter konverterschicht und verfahren zur herstellung eines bauelements

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128587A (ja) * 1985-11-29 1987-06-10 Matsushita Electric Ind Co Ltd 半導体レ−ザ
FR2639150B1 (fr) * 1988-11-15 1991-01-25 Thomson Hybrides Microondes Dispositif optoelectronique de puissance et son procede de realisation
US5238531A (en) 1992-01-17 1993-08-24 Hughes Aircraft Company Apparatus and method for fabricating a chirped grating in a surface emitting distributed feedback semiconductor laser diode device
US5241556A (en) 1992-01-28 1993-08-31 Hughes Aircraft Company Chirped grating surface emitting distributed feedback semiconductor laser
US5282220A (en) * 1992-04-24 1994-01-25 Hughes Aircraft Company Talbot filtered surface emitting distributed feedback semiconductor laser array
US5867521A (en) 1992-11-12 1999-02-02 Raytheon Company Curved grating surface-emitting distributed feedback laser
US5345466A (en) 1992-11-12 1994-09-06 Hughes Aircraft Company Curved grating surface emitting distributed feedback semiconductor laser
US5778018A (en) 1994-10-13 1998-07-07 Nec Corporation VCSELs (vertical-cavity surface emitting lasers) and VCSEL-based devices
US6543693B1 (en) 1995-02-27 2003-04-08 Symbol Technologies, Inc. Bar code readers using surface emitting laser diode
US5610930A (en) 1995-03-02 1997-03-11 Hughes Aircraft Company Voltage adding diode laser array
US6195381B1 (en) 1998-04-27 2001-02-27 Wisconsin Alumni Research Foundation Narrow spectral width high-power distributed feedback semiconductor lasers
US6219365B1 (en) 1998-11-03 2001-04-17 Wisconsin Alumni Research Foundation High performance aluminum free active region semiconductor lasers
DE29900811U1 (de) 1999-01-19 1999-03-18 Sator Laser GmbH, 22525 Hamburg Vorrichtung zum Verschweißen des Endes von rohrartigen Behältern aus Kunststoff, insbesondere von Tuben
AU6628700A (en) 1999-08-13 2001-03-13 Wisconsin Alumni Research Foundation Single mode, single lobe surface emitting distributed feedback semiconductor laser
US6953340B2 (en) 1999-09-24 2005-10-11 Cao Group, Inc. Light for use in activating light-activated materials, the light having a detachable light module containing a heat sink and a semiconductor chip
JP3667188B2 (ja) 2000-03-03 2005-07-06 キヤノン株式会社 電子線励起レーザー装置及びマルチ電子線励起レーザー装置
JP2002026452A (ja) * 2000-07-12 2002-01-25 Toyota Central Res & Dev Lab Inc 面発光型光源及びその製造方法、レーザ加工機用光源
JP2002109769A (ja) 2000-09-29 2002-04-12 Tokai Univ 半導体レーザを搭載した高機能・高密度光学ヘッド
DE20020150U1 (de) * 2000-10-17 2001-03-08 Advanced Photonics Tech Ag Erwärmungsstrecke zum Streckblasen
JP2002147762A (ja) 2000-11-14 2002-05-22 Fuji Photo Film Co Ltd 食品調理器
CA2332190A1 (en) * 2001-01-25 2002-07-25 Efos Inc. Addressable semiconductor array light source for localized radiation delivery
US7061958B2 (en) 2001-10-23 2006-06-13 Krupke William F Diode-pumped alkali lasers (DPALs) and amplifiers (DPAAs) with reduced buffer gas pressures
US7457340B2 (en) 2002-01-18 2008-11-25 Wisconsin Alumni Research Foundation High coherent power, two-dimensional surface-emitting semiconductor diode array laser
EP1502338A1 (en) 2002-04-24 2005-02-02 Alfalight, Inc. Feedback stabilized multi-mode laser and method of stabilizing a multi-mode laser
DE10233015A1 (de) * 2002-07-20 2004-02-05 Mann + Hummel Gmbh Vorrichtung und Verfahren zur Trocknung eines Gasstromes
US8442084B2 (en) 2002-10-03 2013-05-14 Laser Operations Llc High performance vertically emitting lasers
US6845116B2 (en) 2002-10-24 2005-01-18 Wisconsin Alumni Research Foundation Narrow lateral waveguide laser
JP4058635B2 (ja) * 2003-09-18 2008-03-12 セイコーエプソン株式会社 面発光型半導体レーザおよびその製造方法
US20050180482A1 (en) * 2004-01-23 2005-08-18 Osowski Mark L. Very low cost surface emitting laser diode arrays
TR201808671T4 (tr) 2004-10-12 2018-07-23 Compound Photonics U S Corp Yarı iletken lazer diyotu.
FR2878185B1 (fr) * 2004-11-22 2008-11-07 Sidel Sas Procede de fabrication de recipients comprenant une etape de chauffe au moyen d'un faisceau de rayonnement electromagnetique coherent
US7425296B2 (en) * 2004-12-03 2008-09-16 Pressco Technology Inc. Method and system for wavelength specific thermal irradiation and treatment
US10857722B2 (en) 2004-12-03 2020-12-08 Pressco Ip Llc Method and system for laser-based, wavelength specific infrared irradiation treatment
US10687391B2 (en) 2004-12-03 2020-06-16 Pressco Ip Llc Method and system for digital narrowband, wavelength specific cooking, curing, food preparation, and processing
DE102005061334B4 (de) * 2005-12-21 2016-12-29 Khs Corpoplast Gmbh Streckblasanlage und Verfahren zum Streckblasen
US7403552B2 (en) 2006-03-10 2008-07-22 Wisconsin Alumni Research Foundation High efficiency intersubband semiconductor lasers
US7408966B2 (en) 2006-08-18 2008-08-05 Wisconsin Alumni Research Foundation Intersubband quantum box stack lasers
JP2008124358A (ja) 2006-11-15 2008-05-29 Sumitomo Electric Ind Ltd レーザモジュール
US9789631B2 (en) * 2006-12-19 2017-10-17 Koninklijke Philips N.V. System for and method of heating objects in a production line
WO2008103188A1 (en) 2007-02-23 2008-08-28 Alfalight, Inc High efficiency partial distributed feedback (p-dfb) laser
CN103624966B (zh) * 2007-06-08 2018-01-19 普瑞斯克技术公司 一种用于特定波长热照射和处理的方法和系统
SG174246A1 (en) * 2009-03-05 2011-10-28 Pressco Tech Inc Digital heat injection by way of surface emitting semi-conductor devices

Also Published As

Publication number Publication date
JP2015207766A (ja) 2015-11-19
EP2404353A4 (en) 2017-12-13
KR20110126738A (ko) 2011-11-23
JP5827569B2 (ja) 2015-12-02
US9282851B2 (en) 2016-03-15
RU2011140351A (ru) 2013-04-10
CN104873112A (zh) 2015-09-02
US20110002675A1 (en) 2011-01-06
WO2010102263A1 (en) 2010-09-10
AU2010221086A1 (en) 2011-10-06
CA2754572A1 (en) 2010-09-10
MX2011009327A (es) 2012-01-20
SG174246A1 (en) 2011-10-28
JP2012519966A (ja) 2012-08-30
CN102405568A (zh) 2012-04-04
BRPI1010249A2 (pt) 2016-03-22
KR101769312B1 (ko) 2017-08-30
EP2404353A1 (en) 2012-01-11

Similar Documents

Publication Publication Date Title
CA2754572C (en) Digital heat injection by way of surface emitting semi-conductor devices
JP6445213B2 (ja) ラインビーム光源およびラインビーム照射装置ならびにレーザリフトオフ方法
US9388967B2 (en) Edge weighted spacing of LEDs for improved uniformity range
JP5907291B1 (ja) 光照射エレメントおよびライン状光照射装置
AU2015210477B2 (en) Digital heat injection by way of surface emitting semi-conductor devices
US9033555B2 (en) Wrap-around window for lighting module
AU2014201999A1 (en) Digital heat injection by way of surface emitting semi-conductor devices
CN109073167B (zh) 利用窄宽度辐射进行照射固化的方法和系统
HK1169219A (en) Digital heat injection by way of surface emitting semi-conductor devices
KR102766146B1 (ko) 기판 처리 장치 및 기판 처리 방법
CN114025939A (zh) 用于塑料容器制造机的中空体加热单元

Legal Events

Date Code Title Description
EEER Examination request

Effective date: 20150304

MKLA Lapsed

Effective date: 20220907

MKLA Lapsed

Effective date: 20210305