JP2012514071A - ナノ結晶および生成された組成物をカプセル化するための方法 - Google Patents
ナノ結晶および生成された組成物をカプセル化するための方法 Download PDFInfo
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- JP2012514071A JP2012514071A JP2011543486A JP2011543486A JP2012514071A JP 2012514071 A JP2012514071 A JP 2012514071A JP 2011543486 A JP2011543486 A JP 2011543486A JP 2011543486 A JP2011543486 A JP 2011543486A JP 2012514071 A JP2012514071 A JP 2012514071A
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Images
Classifications
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- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- B82Y40/00—Manufacture or treatment of nanostructures
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
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- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
- C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
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- C09K11/562—Chalcogenides
- C09K11/565—Chalcogenides with zinc cadmium
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
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- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/70—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing phosphorus
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
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- H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
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- H01—ELECTRIC ELEMENTS
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- H01L21/02518—Deposited layers
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
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Applications Claiming Priority (1)
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PCT/US2008/014112 WO2010077226A1 (en) | 2008-12-30 | 2008-12-30 | Methods for encapsulating nanocrystals and resulting compositions |
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JP2011543486A Pending JP2012514071A (ja) | 2008-12-30 | 2008-12-30 | ナノ結晶および生成された組成物をカプセル化するための方法 |
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EP (1) | EP2370993A1 (zh) |
JP (1) | JP2012514071A (zh) |
KR (1) | KR20110111391A (zh) |
CN (1) | CN102257599A (zh) |
WO (1) | WO2010077226A1 (zh) |
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KR20150041086A (ko) * | 2012-08-06 | 2015-04-15 | 코닌클리케 필립스 엔.브이. | 고체 조명용의 고도로 안정된 qd들의 복합물들 및 개시제 없는 중합을 통한 그 제조 방법 |
JP2015149469A (ja) * | 2014-02-05 | 2015-08-20 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | バックライトアセンブリ |
JP2015204153A (ja) * | 2014-04-11 | 2015-11-16 | 日本電気硝子株式会社 | 発光デバイスの製造方法 |
JP2017513230A (ja) * | 2014-04-04 | 2017-05-25 | コーニング精密素材株式会社Corning Precision Materials Co., Ltd. | 発光ダイオードの色変換用基板及びその製造方法 |
JP2017120358A (ja) * | 2015-09-30 | 2017-07-06 | 大日本印刷株式会社 | 光波長変換シート、これを備えるバックライト装置、画像表示装置、および光波長変換シートの製造方法 |
JP2019200395A (ja) * | 2018-05-18 | 2019-11-21 | シャープ株式会社 | 立体表示装置 |
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US20130092964A1 (en) * | 2011-10-13 | 2013-04-18 | Intematix Corporation | Highly reliable photoluminescent materials having a thick and uniform titanium dioxide coating |
KR101362263B1 (ko) * | 2012-01-30 | 2014-02-13 | 국민대학교산학협력단 | 광산란을 최소화하는 형광체-기지 복합체 분말 및 이를 포함하는 led 구조체 |
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- 2008-12-30 JP JP2011543486A patent/JP2012514071A/ja active Pending
- 2008-12-30 EP EP08879303A patent/EP2370993A1/en not_active Withdrawn
- 2008-12-30 CN CN2008801324161A patent/CN102257599A/zh active Pending
- 2008-12-30 WO PCT/US2008/014112 patent/WO2010077226A1/en active Application Filing
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KR20150041086A (ko) * | 2012-08-06 | 2015-04-15 | 코닌클리케 필립스 엔.브이. | 고체 조명용의 고도로 안정된 qd들의 복합물들 및 개시제 없는 중합을 통한 그 제조 방법 |
JP2015527717A (ja) * | 2012-08-06 | 2015-09-17 | コーニンクレッカ フィリップス エヌ ヴェ | 固体照明に対する高安定なqd複合体及び開始剤のない重合を介したその作製方法 |
KR102093258B1 (ko) | 2012-08-06 | 2020-03-26 | 루미리즈 홀딩 비.브이. | 고체 조명용의 고도로 안정된 qd들의 복합물들 및 개시제 없는 중합을 통한 그 제조 방법 |
JP2015149469A (ja) * | 2014-02-05 | 2015-08-20 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | バックライトアセンブリ |
JP2017513230A (ja) * | 2014-04-04 | 2017-05-25 | コーニング精密素材株式会社Corning Precision Materials Co., Ltd. | 発光ダイオードの色変換用基板及びその製造方法 |
JP2015204153A (ja) * | 2014-04-11 | 2015-11-16 | 日本電気硝子株式会社 | 発光デバイスの製造方法 |
JP2017120358A (ja) * | 2015-09-30 | 2017-07-06 | 大日本印刷株式会社 | 光波長変換シート、これを備えるバックライト装置、画像表示装置、および光波長変換シートの製造方法 |
JP2019200395A (ja) * | 2018-05-18 | 2019-11-21 | シャープ株式会社 | 立体表示装置 |
JP7079146B2 (ja) | 2018-05-18 | 2022-06-01 | シャープ株式会社 | 立体表示装置 |
Also Published As
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CN102257599A (zh) | 2011-11-23 |
KR20110111391A (ko) | 2011-10-11 |
WO2010077226A1 (en) | 2010-07-08 |
EP2370993A1 (en) | 2011-10-05 |
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