JP2012513673A - ウエハレベルの白色ledの色補正 - Google Patents
ウエハレベルの白色ledの色補正 Download PDFInfo
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
【選択図】図7d
Description
[黄色/緑色]
(Sr,Ca,Ba)(Al,Ga)2S4:Eu2+
Ba2(Mg,Zn)Si2O7:Eu2+
Gd0.46Sr0.31Al1.23OxF1.38:Eu2+ 0.06
(Ba1−x−ySrxCay)SiO4:EuBa2SiO4:Eu2+
[赤色]
Lu2O3:Eu3+
(Sr2−xLax)(Ce1−xEux)O4
Sr2Ce1−xEuxO4
Sr2−xEuxCeO4
SrTiO3:Pr3+,Ga3+
CaAlSiN3:Eu2+
Sr2Si5N8:Eu2+
Claims (20)
- 複数の発光ダイオード(LED)チップ(複数のLEDチップ)を製造する方法であって、
複数のLEDを準備する段階と、
それぞれが、前記複数のLEDのうちの少なくとも1つの上に配される複数のスペーサを形成する段階と、
前記LEDを、変換材料でコーティングする段階と、
を有し、
前記複数のスペーサのそれぞれにより、前記複数のLEDチップのそれぞれが、電気信号に応じて、目標波長に対して特定の標準偏差の範囲内の波長の光を放出するように、前記複数のLEDのうちの対応するLEDを覆う前記変換材料の量が減少する、
方法。 - 前記複数のLEDのうちの対応するLEDを覆う前記複数のスペーサのそれぞれの体積は、前記複数のLEDのうちの対応するLEDの発光波長と、前記目標波長とに関連する、
請求項1に記載の方法。 - 前記複数のスペーサのそれぞれは、前記複数のLEDから放出される光に対して実質的に透明な材料を含む、
請求項1に記載の方法。 - 前記標準偏差は、マカダムの標準楕円またはCIE図を用いて算出される、
請求項1に記載の方法。 - 前記複数のLEDチップのそれぞれから放出される光は、前記LEDおよび前記変換材料からの発光を含む、
請求項1に記載の方法。 - 前記複数のLEDチップは、白色光を放出する、
請求項1に記載の方法。 - 前記複数のスペーサを形成する段階の前に、前記複数のLEDのうちの少なくとも一部の発光特性を測定する段階と、
それぞれの前記発光特性に基づいて、前記複数のLEDのうち、発光特性が測定された少なくとも一部のLED上の前記複数のスペーサのそれぞれの体積を決定する段階と、
をさらに有する、
請求項1に記載の方法。 - 前記複数のスペーサのそれぞれの体積は、前記複数のLEDチップのそれぞれに前記標準偏差内の波長の光を放出させるために必要な前記変換材料の減少量に相当する、
請求項1に記載の方法。 - 前記複数のLEDを個片化して、ウエハから、個々のLEDチップまたは複数のLEDチップのグループを作製する段階をさらに有する、
請求項1に記載の方法。 - 前記複数のLEDを覆う前記コーティングを平坦化する段階をさらに有する、
請求項1に記載の方法。 - 前記複数のスペーサのそれぞれは、均一な層、不均一な層、円錐形状、ピラミッド形状、半球形状および柱状からなる群から選択される形状を有する、
請求項1に記載の方法。 - ウエハ上の複数の発光ダイオード(複数のLED)と、
それぞれが、前記複数のLEDのうちの少なくとも1つの上に配される複数のスペーサと、
前記複数のLEDおよび前記複数のスペーサを少なくとも部分的に覆う変換材料と、
を備え、
前記複数のLEDから放出された少なくとも一部の光は、前記変換材料を通過して変換され、
前記複数のスペーサを備えない類似のLEDチップの場合には、少なくともいくつかのLEDチップが特定の標準偏差の範囲外の波長を有する光を放出するのに対して、前記複数のスペーサを備えることで、LEDチップが前記標準偏差の範囲内の波長を有する光を放出する、
LEDチップウエハ。 - 前記複数のLEDを覆う前記複数のスペーサのそれぞれの体積は、前記複数のLEDのうちの対応するLEDの発光波長と、前記LEDチップに前記標準偏差の範囲内の光を放出させるために必要な前記複数のLEDを覆う前記変換材料の減少量とに関連する、
請求項12に記載のLEDチップウエハ。 - それぞれが、前記複数のLEDのひとつと電気的に接続され、前記変換材料の表面に露出する複数の台座をさらに備える、
請求項12に記載のLEDチップウエハ。 - 表面に、前記複数のLEDがフリップチップ実装されるサブマウントをさらに備える、
請求項12に記載のLEDチップウエハ。 - 前記複数のスペーサが、前記複数のLEDから放出される光に対して透明である、
請求項12に記載のLEDチップウエハ。 - 発光ダイオード(LED)と、
前記LED上のスペーサと、
前記スペーサ上を被覆し、前記LEDを少なくとも部分的に覆う蛍光体と、
を備え、
前記LEDによって放出される光のうちの少なくとも一部が、前記蛍光体によって変換され、
前記スペーサは、
前記LEDから放出される光に対して透明であり、
前記スペーサがなければ前記蛍光体によって占められていたであろう空間を占める体積を有し、
LEDチップが目標波長の光を放出するように、前記LEDを覆う蛍光体のコーティングの量を減少させる、
LEDチップ。 - 前記LEDからの光と、前記蛍光体からの光とが合成された白色光を放出する、
請求項17に記載のLEDチップ。 - 電極と、
前記電極上に形成された台座と、
をさらに備え、
前記台座は、前記コーティングの表面に向かって延伸して、前記表面から露出する、
請求項17に記載のLEDチップ。 - 表面に、前記LEDがフリップチップ実装されるサブマウントをさらに備える、
請求項17に記載のLEDチップ。
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PCT/US2009/006625 WO2010074734A2 (en) | 2008-12-23 | 2009-12-18 | Color correction for wafer level white leds |
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JP5785499B2 (ja) | 2015-09-30 |
US20100155750A1 (en) | 2010-06-24 |
CN102334205B (zh) | 2015-06-17 |
US8193544B2 (en) | 2012-06-05 |
US20110121344A1 (en) | 2011-05-26 |
WO2010074734A2 (en) | 2010-07-01 |
WO2010074734A3 (en) | 2010-10-21 |
EP2377170A2 (en) | 2011-10-19 |
US7897419B2 (en) | 2011-03-01 |
CN102334205A (zh) | 2012-01-25 |
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