JP2012508970A5 - - Google Patents

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Publication number
JP2012508970A5
JP2012508970A5 JP2011535869A JP2011535869A JP2012508970A5 JP 2012508970 A5 JP2012508970 A5 JP 2012508970A5 JP 2011535869 A JP2011535869 A JP 2011535869A JP 2011535869 A JP2011535869 A JP 2011535869A JP 2012508970 A5 JP2012508970 A5 JP 2012508970A5
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optoelectronic component
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semiconductor chip
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JP2011535869A
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Japanese (ja)
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JP5544369B2 (ja
JP2012508970A (ja
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Priority claimed from DE102008057140A external-priority patent/DE102008057140A1/de
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JP2011535869A 2008-11-13 2009-11-02 オプトエレクトロニクス部品 Expired - Fee Related JP5544369B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008057140.7 2008-11-13
DE102008057140A DE102008057140A1 (de) 2008-11-13 2008-11-13 Optoelektronisches Bauelement
PCT/DE2009/001548 WO2010054622A2 (de) 2008-11-13 2009-11-02 Optoelektronisches bauelement

Publications (3)

Publication Number Publication Date
JP2012508970A JP2012508970A (ja) 2012-04-12
JP2012508970A5 true JP2012508970A5 (enExample) 2012-12-20
JP5544369B2 JP5544369B2 (ja) 2014-07-09

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Family Applications (1)

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JP2011535869A Expired - Fee Related JP5544369B2 (ja) 2008-11-13 2009-11-02 オプトエレクトロニクス部品

Country Status (7)

Country Link
US (1) US8558259B2 (enExample)
EP (1) EP2316130A2 (enExample)
JP (1) JP5544369B2 (enExample)
KR (1) KR20110084307A (enExample)
CN (1) CN102217065B (enExample)
DE (1) DE102008057140A1 (enExample)
WO (1) WO2010054622A2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8486761B2 (en) * 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices
US8319247B2 (en) 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
DE102010038396B4 (de) 2010-07-26 2021-08-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Leuchtvorrichung damit
JP5612991B2 (ja) 2010-09-30 2014-10-22 シャープ株式会社 発光装置及びこれを備えた照明装置
CN103299422B (zh) * 2010-12-29 2016-11-02 3M创新有限公司 具有宽带输出和可控颜色的远程荧光粉led装置
US20140022761A1 (en) * 2011-01-21 2014-01-23 Osram Sylvania Inc. Luminescent Converter and LED Light Source Containing Same
DE102011003989A1 (de) * 2011-02-11 2012-08-16 Osram Ag Leuchtvorrichtung
DE102011100710A1 (de) * 2011-05-06 2012-11-08 Osram Opto Semiconductors Gmbh Konversionselement für Leuchtdioden und Herstellungsverfahren
DE102012102859A1 (de) 2012-04-02 2013-11-14 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement umfassend eine Konverterträgerschicht, und Verfahren zur Herstellung eines optoelektronischen Bauelements umfassend eine Konverterträgerschicht
DE102012205469A1 (de) * 2012-04-03 2013-10-10 Osram Gmbh Leuchtvorrichtung und verfahren zum betreiben einer leuchtvorrichtung
DE102013211525A1 (de) 2013-06-19 2014-12-24 Osram Gmbh LED-Modul mit LED-Chips
JP2015115506A (ja) * 2013-12-12 2015-06-22 パナソニックＩｐマネジメント株式会社 照明光源
JP2014187392A (ja) * 2014-06-23 2014-10-02 Sharp Corp 発光装置及びこれを備えた照明装置
JP2016009761A (ja) * 2014-06-24 2016-01-18 株式会社小糸製作所 発光モジュール
JP2016051845A (ja) * 2014-09-01 2016-04-11 株式会社ジャパンディスプレイ 表示装置
KR20170073224A (ko) * 2015-12-18 2017-06-28 주식회사 트레이스 3차원 돔형 터치 패턴을 이용한 터치 스크린
JP6986698B2 (ja) * 2017-06-28 2021-12-22 パナソニックＩｐマネジメント株式会社 発光装置及びそれを備える光学分析システム
DE102018124751B4 (de) * 2018-10-08 2023-11-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5836676A (en) * 1996-05-07 1998-11-17 Koha Co., Ltd. Light emitting display apparatus
US6513949B1 (en) * 1999-12-02 2003-02-04 Koninklijke Philips Electronics N.V. LED/phosphor-LED hybrid lighting systems
US6577073B2 (en) * 2000-05-31 2003-06-10 Matsushita Electric Industrial Co., Ltd. Led lamp
US6737801B2 (en) * 2000-06-28 2004-05-18 The Fox Group, Inc. Integrated color LED chip
US6635987B1 (en) * 2000-09-26 2003-10-21 General Electric Company High power white LED lamp structure using unique phosphor application for LED lighting products
US6639360B2 (en) * 2001-01-31 2003-10-28 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
KR20090115810A (ko) * 2001-12-29 2009-11-06 항조우 후양 신잉 띠앤즈 리미티드 Ｌｅｄ 및 ｌｅｄ램프
US7800121B2 (en) * 2002-08-30 2010-09-21 Lumination Llc Light emitting diode component
US7554258B2 (en) 2002-10-22 2009-06-30 Osram Opto Semiconductors Gmbh Light source having an LED and a luminescence conversion body and method for producing the luminescence conversion body
CA2517009A1 (en) 2003-02-26 2004-09-10 Cree, Inc. White light source using emitting diode and phosphor and method of fabrication
US7102152B2 (en) * 2004-10-14 2006-09-05 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Device and method for emitting output light using quantum dots and non-quantum fluorescent material
US7586127B2 (en) * 2004-03-29 2009-09-08 Stanley Electric Co., Ltd. Light emitting diode
WO2005104247A1 (ja) * 2004-04-19 2005-11-03 Matsushita Electric Industrial Co., Ltd. Ｌｅｄ照明光源の製造方法およびｌｅｄ照明光源
DE102004047640A1 (de) * 2004-09-30 2006-04-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Gehäuse für ein optoelektronisches Bauelement
US7858408B2 (en) 2004-11-15 2010-12-28 Koninklijke Philips Electronics N.V. LED with phosphor tile and overmolded phosphor in lens
US7344902B2 (en) * 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
DE102005022832A1 (de) * 2005-05-11 2006-11-16 Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg Scheinwerfer für Film- und Videoaufnahmen
DE102005033005A1 (de) * 2005-07-14 2007-01-18 Osram Opto Semiconductors Gmbh Optoelektronischer Chip
JP3979424B2 (ja) * 2005-09-09 2007-09-19 松下電工株式会社 発光装置
CN1949507A (zh) 2005-10-12 2007-04-18 林志泽 可调整色温的发光二极管装置
TW200721526A (en) * 2005-11-16 2007-06-01 Iled Photoelectronics Inc LED structure with three wavelength
US8465175B2 (en) * 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
CN101846247B (zh) * 2005-12-22 2013-04-17 松下电器产业株式会社 具有led的照明器具
FR2896944B1 (fr) 2006-01-31 2008-05-02 Commissariat Energie Atomique Dispositif d'emission de lumiere avec controle chromatique
US8998433B2 (en) * 2006-03-08 2015-04-07 Intematix Corporation Light emitting device utilizing remote wavelength conversion with improved color characteristics
US20070241661A1 (en) * 2006-04-12 2007-10-18 Yin Chua B High light output lamps having a phosphor embedded glass/ceramic layer
DE102006027307B4 (de) 2006-06-06 2014-08-07 Schott Ag Verfahren zur Herstellung einer Sinterglaskeramik und deren Verwendung
US8120247B2 (en) * 2006-06-21 2012-02-21 Koninklijke Philips Electronics N.V. Light emitting device with a plurality of uniform diameter ceramic spherical color converter elements
US7842960B2 (en) * 2006-09-06 2010-11-30 Lumination Llc Light emitting packages and methods of making same
CN101536199A (zh) * 2006-11-10 2009-09-16 皇家飞利浦电子股份有限公司 包括单片陶瓷发光转换器的照明系统
US7889421B2 (en) * 2006-11-17 2011-02-15 Rensselaer Polytechnic Institute High-power white LEDs and manufacturing method thereof
JP2008135459A (ja) * 2006-11-27 2008-06-12 M & S Fine Tec Kk Ｌｅｄ光源および液晶表示装置用バックライトシステム
KR20080048112A (ko) * 2006-11-28 2008-06-02 삼성전자주식회사 발광 다이오드와 이를 구비한 백라이트 유닛 및액정표시장치
US20080145960A1 (en) * 2006-12-15 2008-06-19 Gelcore, Llc Super thin LED package for the backlighting applications and fabrication method
US20080144322A1 (en) * 2006-12-15 2008-06-19 Aizar Abdul Karim Norfidathul LED Light Source Having Flexible Reflectors
US7781783B2 (en) * 2007-02-07 2010-08-24 SemiLEDs Optoelectronics Co., Ltd. White light LED device
KR101396588B1 (ko) * 2007-03-19 2014-05-20 서울반도체 주식회사 다양한 색온도를 갖는 발광 장치
US7777412B2 (en) * 2007-03-22 2010-08-17 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Phosphor converted LED with improved uniformity and having lower phosphor requirements
JP2007194675A (ja) * 2007-04-26 2007-08-02 Kyocera Corp 発光装置
TW200847469A (en) * 2007-05-23 2008-12-01 Tysun Inc Substrates of curved surface for light emitting diodes
KR101134996B1 (ko) * 2007-07-26 2012-04-09 파나소닉 주식회사 Ｌｅｄ 조명 디바이스
US20090050910A1 (en) * 2007-08-21 2009-02-26 Edison Opto Corporation Flat panel based light emitting diode package structure
US9374876B2 (en) * 2007-08-24 2016-06-21 Martin A. Alpert Multi-chip light emitting diode light device
WO2009028612A1 (ja) * 2007-08-28 2009-03-05 Panasonic Electric Works Co., Ltd. 発光装置
US7802901B2 (en) * 2007-09-25 2010-09-28 Cree, Inc. LED multi-chip lighting units and related methods
DE102007049799A1 (de) 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
KR100891810B1 (ko) * 2007-11-06 2009-04-07 삼성전기주식회사 백색 발광 소자
KR20090055272A (ko) * 2007-11-28 2009-06-02 삼성전자주식회사 Ｌｅｄ패키지, 이의 제조 방법 및 이를 포함하는 백라이트어셈블리
KR20110028307A (ko) * 2008-05-29 2011-03-17 크리 인코포레이티드 근거리장 영역 혼합을 갖는 광원
DE102008045331A1 (de) 2008-09-01 2010-03-04 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US9425172B2 (en) * 2008-10-24 2016-08-23 Cree, Inc. Light emitter array

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