JP2012503355A - 容量性マイクロマシン超音波トランスデューサ - Google Patents
容量性マイクロマシン超音波トランスデューサ Download PDFInfo
- Publication number
- JP2012503355A JP2012503355A JP2011526605A JP2011526605A JP2012503355A JP 2012503355 A JP2012503355 A JP 2012503355A JP 2011526605 A JP2011526605 A JP 2011526605A JP 2011526605 A JP2011526605 A JP 2011526605A JP 2012503355 A JP2012503355 A JP 2012503355A
- Authority
- JP
- Japan
- Prior art keywords
- transducer
- electrode
- sublayer
- cavity
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60B—VEHICLE WHEELS; CASTORS; AXLES FOR WHEELS OR CASTORS; INCREASING WHEEL ADHESION
- B60B1/00—Spoked wheels; Spokes thereof
- B60B1/02—Wheels with wire or other tension spokes
- B60B1/0261—Wheels with wire or other tension spokes characterised by spoke form
- B60B1/0292—Wheels with wire or other tension spokes characterised by spoke form the spoke being bent at both ends
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/002—Electrostatic motors
- H02N1/006—Electrostatic motors of the gap-closing type
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/06—Influence generators
- H02N1/08—Influence generators with conductive charge carrier, i.e. capacitor machines
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
Description
Claims (15)
- 容量性マイクロマシン超音波トランスデューサであって、
シリコン基板と、
キャビティと、
前記シリコン基板と前記キャビティとの間に配される第1の電極であって、前記キャビティより下に配される第1の電極と、
前記キャビティより上に、前記第1の電極と対向して配されるメンブレンと、
前記キャビティより上に、前記第1の電極と対向して配される第2の電極であって、前記第2の電極は、前記メンブレン内に又はその近傍に配され、前記第1の電極及び前記第2の電極は、電圧を供給されるように構成される、第2の電極と、
前記第1の電極と前記第2の電極との間に配される第1の絶縁層であって、誘電体を含む第1の絶縁層と、
を有するトランスデューサ。 - 前記トランスデューサは、前記第2の電極と前記キャビティとの間に配される第2の絶縁層を有し、前記第1の絶縁層は、前記第1の電極と前記キャビティとの間に配され、前記第2の絶縁層は、誘電体を含む、請求項1に記載のトランスデューサ。
- 前記第1の絶縁層は、第1のサブレイヤを有し、前記第1のサブレイヤは、酸化物を含む、請求項1又は2に記載のトランスデューサ。
- 前記誘電体は、窒化物、酸化アルミニウム又は酸化ハフニウムを含む層のような高k層である、請求項1乃至3のいずれか1項に記載のトランスデューサ。
- 前記第1の絶縁層は、第1のサブレイヤを有し、前記第1のサブレイヤは、少なくとも5nmの厚さを有する、請求項1乃至4のいずれか1項に記載のトランスデューサ。
- 前記第1の絶縁層は、酸化物を含む第1のサブレイヤ及び窒化物を含む第2のサブレイヤを有する、請求項1乃至5のいずれか1項に記載のトランスデューサ。
- 前記第1の絶縁層は、酸化物を含む第1のサブレイヤ、窒化物を含む第2のサブレイヤ及び酸化物を含む第3のサブレイヤを有する、請求項1乃至6のいずれか1項に記載のトランスデューサ。
- 前記第1の絶縁層は、金属を含む第1のサブレイヤ、酸化物を含む第2のサブレイヤ及び窒化物を含む第3のサブレイヤを有する、請求項1乃至5のいずれか1項に記載のトランスデューサ。
- 前記第2のサブレイヤは、前記第1のサブレイヤと前記第3のサブレイヤとの間に配される、請求項7又は8のいずれか1項に記載のトランスデューサ。
- 前記キャビティは、真空キャビティであり、又は1気圧以下の圧力を有する、請求項1乃至9のいずれか1項に記載のトランスデューサ。
- 前記第2の電極が、前記メンブレンに組み込まれている、請求項1乃至10のいずれか1項に記載のトランスデューサ。
- 前記トランスデューサは、崩壊トランスデューサタイプ、事前崩壊トランスデューサタイプ、屈曲トランスデューサタイプ及びこれらのタイプの組み合わせを含むトランスデューサタイプのグループからの少なくとも1つのトランスデューサタイプである、請求項1乃至11のいずれか1項に記載のトランスデューサ。
- 超音波を生成し又は検出するシステムであって、請求項1乃至12のいずれか1項に記載のトランスデューサを有するシステム。
- 請求項1乃至12のいずれか1項に記載のトランスデューサの線形アレイ又は2次元アレイを有する、請求項13に記載のシステム。
- 請求項1乃至12のいずれか1項に記載のトランスデューサを製造する方法であって、CMOS製造プロセスを用いて前記トランスデューサを製造するステップを含み、前記トランスデューサは、CMOSプロセスの間の後処理フィーチャとして製造されることができる、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08305553.3 | 2008-09-16 | ||
EP08305553 | 2008-09-16 | ||
PCT/IB2009/053914 WO2010032156A2 (en) | 2008-09-16 | 2009-09-08 | Capacitive micromachined ultrasound transducer |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012503355A true JP2012503355A (ja) | 2012-02-02 |
JP5628178B2 JP5628178B2 (ja) | 2014-11-19 |
Family
ID=42039961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011526605A Active JP5628178B2 (ja) | 2008-09-16 | 2009-09-08 | 容量性マイクロマシン超音波トランスデューサ |
Country Status (6)
Country | Link |
---|---|
US (2) | US9132693B2 (ja) |
EP (1) | EP2326432A2 (ja) |
JP (1) | JP5628178B2 (ja) |
CN (1) | CN102159334A (ja) |
RU (1) | RU2511671C2 (ja) |
WO (1) | WO2010032156A2 (ja) |
Families Citing this family (100)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2021846B1 (en) | 2006-05-19 | 2017-05-03 | Koninklijke Philips N.V. | Ablation device with optimized input power profile |
US8974445B2 (en) | 2009-01-09 | 2015-03-10 | Recor Medical, Inc. | Methods and apparatus for treatment of cardiac valve insufficiency |
FR2962926B1 (fr) * | 2010-07-23 | 2015-01-02 | Univ Tours Francois Rabelais | Procede et dispositif de generation d'ultrasons mettant en oeuvre des cmuts, et procede et systeme d'imagerie medicale. |
WO2012014010A1 (en) * | 2010-07-26 | 2012-02-02 | Selim Olcum | System and method for operating capacitive micromachined ultrasonic transducers |
JP5875244B2 (ja) | 2011-04-06 | 2016-03-02 | キヤノン株式会社 | 電気機械変換装置及びその作製方法 |
JP6141826B2 (ja) | 2011-04-13 | 2017-06-07 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | Cmutデバイスにおける温度補償 |
AT509922B1 (de) * | 2011-06-24 | 2013-10-15 | Avl List Gmbh | Kapazitiver ultraschallwandler |
US8794075B2 (en) * | 2011-08-11 | 2014-08-05 | Nxp, B.V. | Multilayered NONON membrane in a MEMS sensor |
JP5961697B2 (ja) * | 2011-10-28 | 2016-08-02 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | プラグを備える事前圧壊された容量マイクロマシン・トランスデューサセル |
RU2603518C2 (ru) * | 2011-10-28 | 2016-11-27 | Конинклейке Филипс Н.В. | Предварительно сжатая ячейка емкостного микрообработанного преобразователя с напряженным слоем |
EP2747905B1 (en) | 2011-11-17 | 2021-10-20 | Koninklijke Philips N.V. | Pre-collapsed capacitive micro-machined transducer cell with annular-shaped collapsed region |
JP6069798B2 (ja) * | 2011-12-20 | 2017-02-01 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 超音波トランスデューサデバイス及びこれを製造する方法 |
WO2013111040A1 (en) | 2012-01-27 | 2013-08-01 | Koninklijke Philips N.V. | Capacitive micro-machined transducer and method of manufacturing the same |
BR112014018080A8 (pt) | 2012-01-27 | 2017-07-11 | Koninklijke Philips Nv | Método de fabricação de um transdutor microusinado capacitivo, e, transdutor microusinado capacitivo |
EP2855035B1 (en) | 2012-05-31 | 2017-03-01 | Koninklijke Philips N.V. | Wafer and method of manufacturing the same |
EP2874825B1 (en) * | 2012-07-18 | 2019-01-16 | Koninklijke Philips N.V. | Driver device and driving method for driving a load, in particular an ultrasound transducer |
US9364862B2 (en) | 2012-11-02 | 2016-06-14 | University Of Windsor | Ultrasonic sensor microarray and method of manufacturing same |
US9035532B2 (en) * | 2012-11-02 | 2015-05-19 | University Of Windsor | Ultrasonic sensor microarray and method of manufacturing same |
WO2014080310A2 (en) | 2012-11-20 | 2014-05-30 | Koninklijke Philips N.V. | Capacitive micro-machined transducer and method of manufacturing the same |
KR101358286B1 (ko) * | 2012-11-26 | 2014-02-12 | 서울대학교산학협력단 | 액체와의 접촉면 변화를 이용한 에너지 전환 장치 |
CN103368458B (zh) * | 2012-11-30 | 2016-01-20 | 北京纳米能源与系统研究所 | 脉冲发电机和发电机组 |
US9470710B2 (en) | 2013-02-27 | 2016-10-18 | Texas Instruments Incorporated | Capacitive MEMS sensor devices |
US9351081B2 (en) * | 2013-02-27 | 2016-05-24 | Texas Instruments Incorporated | Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug |
US9857457B2 (en) | 2013-03-14 | 2018-01-02 | University Of Windsor | Ultrasonic sensor microarray and its method of manufacture |
JP6616296B2 (ja) * | 2013-07-16 | 2019-12-04 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | Mut指紋idシステム |
US9187316B2 (en) | 2013-07-19 | 2015-11-17 | University Of Windsor | Ultrasonic sensor microarray and method of manufacturing same |
EP3049194B1 (en) * | 2013-09-24 | 2022-06-29 | Koninklijke Philips N.V. | Cmut device manufacturing method, cmut device and apparatus |
US20150082890A1 (en) * | 2013-09-26 | 2015-03-26 | Intel Corporation | Biometric sensors for personal devices |
WO2015071387A1 (en) * | 2013-11-18 | 2015-05-21 | Koninklijke Philips N.V. | Ultrasound transducer assembly |
US9834434B2 (en) * | 2013-11-19 | 2017-12-05 | Canon Kabushiki Kaisha | Capacitive transducer and method of manufacturing the same |
EP3079837B1 (en) * | 2013-12-12 | 2023-02-08 | Koninklijke Philips N.V. | Monolithically integrated three electrode cmut device |
WO2015120132A1 (en) * | 2014-02-07 | 2015-08-13 | The Regents Of The University Of California | Frequency tuning and/or frequency tracking of a mechanical system with low sensitivity to electrical feedthrough |
WO2016037912A1 (en) | 2014-09-11 | 2016-03-17 | Koninklijke Philips N.V. | Wide band through-body ultrasonic communication system |
US9613246B1 (en) * | 2014-09-16 | 2017-04-04 | Apple Inc. | Multiple scan element array ultrasonic biometric scanner |
US9952095B1 (en) | 2014-09-29 | 2018-04-24 | Apple Inc. | Methods and systems for modulation and demodulation of optical signals |
US9747488B2 (en) | 2014-09-30 | 2017-08-29 | Apple Inc. | Active sensing element for acoustic imaging systems |
US9824254B1 (en) | 2014-09-30 | 2017-11-21 | Apple Inc. | Biometric sensing device with discrete ultrasonic transducers |
US9984271B1 (en) | 2014-09-30 | 2018-05-29 | Apple Inc. | Ultrasonic fingerprint sensor in display bezel |
US10133904B2 (en) | 2014-09-30 | 2018-11-20 | Apple Inc. | Fully-addressable sensor array for acoustic imaging systems |
US9904836B2 (en) | 2014-09-30 | 2018-02-27 | Apple Inc. | Reducing edge effects within segmented acoustic imaging systems |
US9607203B1 (en) | 2014-09-30 | 2017-03-28 | Apple Inc. | Biometric sensing device with discrete ultrasonic transducers |
US9979955B1 (en) | 2014-09-30 | 2018-05-22 | Apple Inc. | Calibration methods for near-field acoustic imaging systems |
US10674999B2 (en) | 2014-11-25 | 2020-06-09 | Koninklijke Philips N.V. | Ultrasound system and method |
WO2016091985A1 (en) | 2014-12-11 | 2016-06-16 | Koninklijke Philips N.V. | Catheter transducer with staggered columns of micromachined ultrasonic transducers |
WO2017001636A1 (en) | 2015-06-30 | 2017-01-05 | Koninklijke Philips N.V. | Ultrasound system and ultrasonic pulse transmission method |
JP6932085B2 (ja) | 2015-07-02 | 2021-09-08 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | マルチモード容量性マイクロマシン超音波トランスデューサ並びに関連するデバイス、システム及び方法 |
US9997425B2 (en) | 2015-07-14 | 2018-06-12 | University Of Windsor | Layered benzocyclobutene interconnected circuit and method of manufacturing same |
WO2017025598A1 (en) | 2015-08-11 | 2017-02-16 | Koninklijke Philips N.V. | Capacitive micromachined ultrasonic transducers with increased patient safety |
CN107921479B (zh) | 2015-08-11 | 2020-06-23 | 皇家飞利浦有限公司 | 具有过电流保护的电容式微加工超声换能器 |
WO2017025438A1 (en) | 2015-08-11 | 2017-02-16 | Koninklijke Philips N.V. | Capacitive micromachined ultrasonic transducers with increased lifetime |
US11048902B2 (en) | 2015-08-20 | 2021-06-29 | Appple Inc. | Acoustic imaging system architecture |
CN108027437B (zh) | 2015-09-10 | 2022-07-05 | 皇家飞利浦有限公司 | 具有宽深度和详细查看的超声系统 |
US10275633B1 (en) | 2015-09-29 | 2019-04-30 | Apple Inc. | Acoustic imaging system for spatial demodulation of acoustic waves |
JP6309034B2 (ja) * | 2016-01-18 | 2018-04-11 | キヤノン株式会社 | 電気機械変換装置及びその作製方法 |
WO2017182344A1 (en) | 2016-04-19 | 2017-10-26 | Koninklijke Philips N.V. | Ultrasound transducer positioning |
WO2017182416A1 (en) | 2016-04-19 | 2017-10-26 | Koninklijke Philips N.V. | Ultrasound transducer positioning |
US11529120B2 (en) | 2016-04-26 | 2022-12-20 | Koninklijke Philips N.V. | Ultrasound device contacting |
WO2017186781A1 (en) | 2016-04-26 | 2017-11-02 | Koninklijke Philips N.V. | Ultrasound device contacting |
US10315222B2 (en) | 2016-05-04 | 2019-06-11 | Invensense, Inc. | Two-dimensional array of CMOS control elements |
US10670716B2 (en) | 2016-05-04 | 2020-06-02 | Invensense, Inc. | Operating a two-dimensional array of ultrasonic transducers |
US10445547B2 (en) | 2016-05-04 | 2019-10-15 | Invensense, Inc. | Device mountable packaging of ultrasonic transducers |
US10452887B2 (en) | 2016-05-10 | 2019-10-22 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers |
US10562070B2 (en) | 2016-05-10 | 2020-02-18 | Invensense, Inc. | Receive operation of an ultrasonic sensor |
US11673165B2 (en) | 2016-05-10 | 2023-06-13 | Invensense, Inc. | Ultrasonic transducer operable in a surface acoustic wave (SAW) mode |
US10539539B2 (en) | 2016-05-10 | 2020-01-21 | Invensense, Inc. | Operation of an ultrasonic sensor |
US10441975B2 (en) | 2016-05-10 | 2019-10-15 | Invensense, Inc. | Supplemental sensor modes and systems for ultrasonic transducers |
US10706835B2 (en) | 2016-05-10 | 2020-07-07 | Invensense, Inc. | Transmit beamforming of a two-dimensional array of ultrasonic transducers |
WO2018077962A1 (en) | 2016-10-27 | 2018-05-03 | Koninklijke Philips N.V. | An ultrasound system with a tissue type analyzer |
WO2018115226A1 (en) | 2016-12-22 | 2018-06-28 | Koninklijke Philips N.V. | Systems and methods of operation of capacitive radio frequency micro-electromechanical switches |
EP3586093A4 (en) | 2017-02-27 | 2021-01-06 | Butterfly Network, Inc. | CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCERS (CMUT), EQUIPMENT AND ASSOCIATED PROCESSES |
EP3366221A1 (en) | 2017-02-28 | 2018-08-29 | Koninklijke Philips N.V. | An intelligent ultrasound system |
US10474862B2 (en) | 2017-06-01 | 2019-11-12 | Invensense, Inc. | Image generation in an electronic device using ultrasonic transducers |
JP6904814B2 (ja) * | 2017-06-30 | 2021-07-21 | キヤノン株式会社 | 中空構造体の製造方法、及び中空構造体 |
US10984209B2 (en) | 2017-12-01 | 2021-04-20 | Invensense, Inc. | Darkfield modeling |
WO2019109010A1 (en) | 2017-12-01 | 2019-06-06 | Invensense, Inc. | Darkfield tracking |
US10997388B2 (en) | 2017-12-01 | 2021-05-04 | Invensense, Inc. | Darkfield contamination detection |
US11151355B2 (en) | 2018-01-24 | 2021-10-19 | Invensense, Inc. | Generation of an estimated fingerprint |
US10802651B2 (en) | 2018-01-30 | 2020-10-13 | Apple Inc. | Ultrasonic touch detection through display |
US10966683B2 (en) | 2018-03-22 | 2021-04-06 | Exo Imaging Inc. | Integrated ultrasonic transducers |
US10755067B2 (en) | 2018-03-22 | 2020-08-25 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers |
WO2019213449A2 (en) * | 2018-05-03 | 2019-11-07 | Butterfly Network, Inc. | Ultrasound devices |
CN113316486B (zh) | 2018-11-16 | 2022-10-18 | 维蒙股份公司 | 电容式微机械超声换能器及其制造方法 |
US10936843B2 (en) | 2018-12-28 | 2021-03-02 | Invensense, Inc. | Segmented image acquisition |
DE102019203829B4 (de) * | 2019-03-20 | 2020-12-31 | Vitesco Technologies GmbH | Verfahren zum Herstellen einer Fluidsensorvorrichtung und Fluidsensorvorrichtung |
IL286616B2 (en) | 2019-03-25 | 2023-03-01 | Exo Imaging Inc | Manual ultrasound imaging device |
FR3096857B1 (fr) * | 2019-05-29 | 2021-06-25 | Aer | Transducteur electroacoustique capacitif ultrasonore miniaturise fonctionnant a haute tension |
WO2020263875A1 (en) | 2019-06-24 | 2020-12-30 | Invensense, Inc. | Fake finger detection using ridge features |
US11216681B2 (en) | 2019-06-25 | 2022-01-04 | Invensense, Inc. | Fake finger detection based on transient features |
US11176345B2 (en) | 2019-07-17 | 2021-11-16 | Invensense, Inc. | Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness |
US11216632B2 (en) | 2019-07-17 | 2022-01-04 | Invensense, Inc. | Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness |
US20220274133A1 (en) | 2019-07-26 | 2022-09-01 | Vermon Sa | Cmut transducer and method for manufacturing |
US11232549B2 (en) | 2019-08-23 | 2022-01-25 | Invensense, Inc. | Adapting a quality threshold for a fingerprint image |
US11392789B2 (en) | 2019-10-21 | 2022-07-19 | Invensense, Inc. | Fingerprint authentication using a synthetic enrollment image |
US11738369B2 (en) | 2020-02-17 | 2023-08-29 | GE Precision Healthcare LLC | Capactive micromachined transducer having a high contact resistance part |
WO2021183457A1 (en) | 2020-03-09 | 2021-09-16 | Invensense, Inc. | Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness |
US11243300B2 (en) | 2020-03-10 | 2022-02-08 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers and a presence sensor |
US11950512B2 (en) | 2020-03-23 | 2024-04-02 | Apple Inc. | Thin-film acoustic imaging system for imaging through an exterior surface of an electronic device housing |
US11328165B2 (en) | 2020-04-24 | 2022-05-10 | Invensense, Inc. | Pressure-based activation of fingerprint spoof detection |
US11995909B2 (en) | 2020-07-17 | 2024-05-28 | Tdk Corporation | Multipath reflection correction |
US12000967B2 (en) | 2021-03-31 | 2024-06-04 | Apple Inc. | Regional gain control for segmented thin-film acoustic imaging systems |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62178100A (ja) * | 1986-01-31 | 1987-08-05 | Fujitsu Ltd | 圧電振動子 |
JP2003136496A (ja) * | 2001-11-06 | 2003-05-14 | Omron Corp | 静電アクチュエータ及び該アクチュエータを用いた静電マイクロリレーその他の機器 |
JP2004095918A (ja) * | 2002-08-30 | 2004-03-25 | Fasl Japan Ltd | 半導体記憶装置及び半導体装置の製造方法 |
WO2007030522A2 (en) * | 2005-09-09 | 2007-03-15 | Lam Research Corporation | Selectivity etch of films with high dielectric constant with h2 addition |
JP2007074263A (ja) * | 2005-09-06 | 2007-03-22 | Hitachi Ltd | 超音波トランスデューサおよびその製造方法 |
JP2007215177A (ja) * | 2006-02-09 | 2007-08-23 | General Electric Co <Ge> | 容量性マイクロマシン加工超音波トランスジューサ並びにその製作方法 |
JP2007528153A (ja) * | 2004-02-06 | 2007-10-04 | ジョージア テック リサーチ コーポレイション | Cmutデバイス及び製造方法 |
JP2008099036A (ja) * | 2006-10-12 | 2008-04-24 | Olympus Medical Systems Corp | 超音波トランスデューサ、超音波探触子及び超音波診断装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6271620B1 (en) * | 1999-05-20 | 2001-08-07 | Sen Corporation | Acoustic transducer and method of making the same |
KR100505679B1 (ko) * | 2003-03-19 | 2005-08-03 | 삼성전자주식회사 | 반도체 메모리 소자 및 그 제조방법 |
US7274623B2 (en) * | 2004-04-06 | 2007-09-25 | Board Of Trustees Of The Deland Stanford Junior University | Method and system for operating capacitive membrane ultrasonic transducers |
EP1881822A2 (en) | 2005-05-18 | 2008-01-30 | Kolo Technologies, Inc. | Methods for fabricating micro-electro-mechanical devices |
-
2009
- 2009-09-08 US US13/062,744 patent/US9132693B2/en active Active
- 2009-09-08 CN CN2009801358887A patent/CN102159334A/zh active Pending
- 2009-09-08 WO PCT/IB2009/053914 patent/WO2010032156A2/en active Application Filing
- 2009-09-08 EP EP20090787129 patent/EP2326432A2/en not_active Withdrawn
- 2009-09-08 RU RU2011115084/28A patent/RU2511671C2/ru active
- 2009-09-08 JP JP2011526605A patent/JP5628178B2/ja active Active
-
2015
- 2015-02-17 US US14/623,595 patent/US9539854B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62178100A (ja) * | 1986-01-31 | 1987-08-05 | Fujitsu Ltd | 圧電振動子 |
JP2003136496A (ja) * | 2001-11-06 | 2003-05-14 | Omron Corp | 静電アクチュエータ及び該アクチュエータを用いた静電マイクロリレーその他の機器 |
JP2004095918A (ja) * | 2002-08-30 | 2004-03-25 | Fasl Japan Ltd | 半導体記憶装置及び半導体装置の製造方法 |
JP2007528153A (ja) * | 2004-02-06 | 2007-10-04 | ジョージア テック リサーチ コーポレイション | Cmutデバイス及び製造方法 |
JP2007074263A (ja) * | 2005-09-06 | 2007-03-22 | Hitachi Ltd | 超音波トランスデューサおよびその製造方法 |
WO2007030522A2 (en) * | 2005-09-09 | 2007-03-15 | Lam Research Corporation | Selectivity etch of films with high dielectric constant with h2 addition |
JP2009508334A (ja) * | 2005-09-09 | 2009-02-26 | ラム リサーチ コーポレーション | H2添加をともなう高誘電率膜の選択エッチング |
JP2007215177A (ja) * | 2006-02-09 | 2007-08-23 | General Electric Co <Ge> | 容量性マイクロマシン加工超音波トランスジューサ並びにその製作方法 |
JP2008099036A (ja) * | 2006-10-12 | 2008-04-24 | Olympus Medical Systems Corp | 超音波トランスデューサ、超音波探触子及び超音波診断装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2010032156A3 (en) | 2010-12-29 |
US9132693B2 (en) | 2015-09-15 |
RU2011115084A (ru) | 2012-10-27 |
CN102159334A (zh) | 2011-08-17 |
JP5628178B2 (ja) | 2014-11-19 |
WO2010032156A2 (en) | 2010-03-25 |
EP2326432A2 (en) | 2011-06-01 |
US9539854B2 (en) | 2017-01-10 |
US20150162851A1 (en) | 2015-06-11 |
US20110163630A1 (en) | 2011-07-07 |
RU2511671C2 (ru) | 2014-04-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5628178B2 (ja) | 容量性マイクロマシン超音波トランスデューサ | |
TWI689461B (zh) | Cmos上的pmut的單石積體 | |
EP1781067B1 (en) | CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER (cMUT) AND ITS PRODUCTION METHOD | |
JP4724501B2 (ja) | 超音波トランスデューサおよびその製造方法 | |
KR101518776B1 (ko) | 전기기계 변환장치 및 그 제조방법 | |
JP4744849B2 (ja) | 半導体装置 | |
US9266716B2 (en) | MEMS acoustic transducer with silicon nitride backplate and silicon sacrificial layer | |
US6271620B1 (en) | Acoustic transducer and method of making the same | |
CN101772383B (zh) | 具有高k电介质的cmut | |
CN101378605B (zh) | 超声波换能器及其制造方法、超声波诊断装置及超声波显微镜 | |
EP3306951A2 (en) | Microphone and method for manufacturing the same | |
US10190930B2 (en) | Micro feedback-chamber sensor and method of manufacturing such sensor | |
CN112384779B (zh) | 微机械压力传感器设备和相应的制造方法 | |
US9227837B2 (en) | Sensor and method for manufacturing a sensor | |
CN110100458A (zh) | 声学微电子装置 | |
KR20180008242A (ko) | 탄성파 필터 장치 | |
US9089055B2 (en) | Electronic device, method of manufacturing the same, and oscillator | |
US20140239770A1 (en) | Capacitive Micromachined Ultrasound Transducers with Pressurized Cavities | |
TW201727732A (zh) | Cmos-mems諧振換能器及其製造方法 | |
JP5240900B2 (ja) | エレクトレット構造及びその形成方法並びにエレクトレット型静電容量センサ | |
JP2008105112A (ja) | Memsデバイス | |
CN218783911U (zh) | 一种mems结构 | |
US10868231B2 (en) | Micromechanical component and production method for a micromechanical component | |
KR20220059848A (ko) | 미소 기계식 공진기 및 이를 채용한 공진기 시스템 | |
JP2010158750A (ja) | Memsデバイス |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120906 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130809 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130827 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20131126 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20131203 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140227 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140902 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20141001 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5628178 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |