JP2012234880A - Package for housing element, and semiconductor device including the package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for housing an element and a semiconductor device including the package that prevents a lead terminal from separating off from an input output terminal and a wiring board due to thermal expansion or contraction of the wiring board and a base body on which the wiring board is mounted during the use of the package.SOLUTION: A package 1 for housing an element comprises: a base body 5 having a mount region on which a semiconductor element 3 is mounted; an input output terminal 9 having a first insulation member 13 and a first wiring conductor 15 disposed on a top surface of the first insulation member 13; a wiring board 11 having a second insulation member 17 and a second wiring conductor 19 disposed on a top surface of the second insulation member 17; and a connection wire 21 located between the input output terminal 9 and the wiring board 11 and connected to the first wiring conductor 15 and the second wiring conductor 19. The connection wire 21 comprises a plurality of linear lead wires 23 connected to the first wiring conductor 15 and the second wiring conductor 19.

Description

  The present invention relates to an element storage package for storing semiconductor elements typified by LD (laser diode) and PD (photodiode), and a semiconductor device including the same.

  For example, a package described in Patent Document 1 is known as an element storage package (hereinafter also simply referred to as a package) for storing semiconductor elements. The package described in Patent Document 1 includes an input / output terminal for electrically connecting a semiconductor element placed in the package and an external electric circuit board. The input / output terminals and the semiconductor element are electrically connected by wires.

JP 2004-349568 A

  When a high-frequency signal is transmitted to a semiconductor element via a lead terminal such as an input / output terminal and a wire, a noise component is added when the signal is transmitted at the lead terminal, and transmission characteristics deteriorate. In view of this, it is conceivable to arrange a wiring board between the semiconductor element and the input / output terminal to shorten the connection distance by the lead terminal. By disposing the wiring board, the connection distance by the lead terminal can be shortened.

  In recent years, there has been a demand for transmitting a signal with a higher frequency component such as a frequency component of several hundred GHz band. Therefore, it is required to further shorten the connection distance by the lead terminal. Although the connection distance can be further shortened by making the lead terminal have a linear shape, it may be difficult to stably transmit a signal. This is due to the following reason.

  When the package is used, pressure is applied to the lead terminal due to thermal expansion and contraction of the wiring board and the base on which the wiring board is placed. If the lead terminal is simply linear, the lead terminal is less likely to be deformed, and stress tends to concentrate on the joint between the lead terminal, the input / output terminal, and the wiring board. Therefore, there is a possibility that the lead terminal may be peeled off from the input / output terminal and the wiring board.

  The present invention has been made in view of the above problems, and an element storage package capable of stably transmitting a signal even with a signal having a higher frequency component, and a semiconductor device using the same The purpose is to provide.

An element storage package according to one aspect of the present invention includes a base having a mounting area on which a semiconductor element is mounted on an upper surface, and an inner surface disposed on the upper surface of the base so as to surround the mounting area. Inserted into the opening of the frame having a frame having an opening on the peripheral surface and the outer peripheral surface, and a first insulating member and a first wiring conductor disposed on the upper surface of the first insulating member An input / output terminal, a second insulating member, and a second wiring conductor disposed on the upper surface of the second insulating member, the upper surface of the base, the mounting area and the input / output terminal A wiring board located between the input / output terminal and the wiring board; and a connection wiring connected to the first wiring conductor and the second wiring conductor. The connection wiring is composed of a plurality of lead wirings respectively connected to the first wiring conductor and the second wiring conductor. The plurality of lead wires are connected to the first wiring conductor or the second wiring conductor at both ends thereof, and the first wiring conductor and the second wiring member are connected between the connecting portions. It has the linear wiring part which electrically connects a wiring conductor, It is characterized by the above-mentioned.

  In the element storage package according to one aspect of the present invention, the connection wiring includes a plurality of lead wirings connected to the first wiring conductor and the second wiring conductor, respectively, and the plurality of lead wirings have both ends thereof. A connecting portion connected to the first wiring conductor or the second wiring conductor, and a linear shape that is located between the connecting portions and electrically connects the first wiring conductor and the second wiring conductor. Wiring part. Therefore, since the connection distance by the connection wiring can be shortened, signal transmission characteristics can be improved. Furthermore, since the connection portion is not simply a linear shape, but consists of a plurality of lead wires, a large signal is transmitted through the connection wires as compared with the case of using one large lead wire. Can be easily deformed.

1 is an exploded perspective view showing an element storage package and a semiconductor device including the same according to a first embodiment. FIG. 2 is a plan view of the element storage package shown in FIG. 1. FIG. 3 is an enlarged plan view showing a region A of the element storage package shown in FIG. 2. (A) is a perspective view which shows the lead wiring in the element storage package shown in FIG. (B) is XX sectional drawing in Fig.4 (a). (C) is the YY sectional view in Drawing 4 (a). It is a disassembled perspective view which shows the element storage package concerning 2nd Embodiment, and a semiconductor device provided with the same. FIG. 6 is a plan view of the element storage package shown in FIG. 5. FIG. 7 is an enlarged plan view showing a region B of the element storage package shown in FIG. 6.

  Hereinafter, an element storage package (hereinafter also simply referred to as a package) according to each embodiment and a semiconductor device including the same will be described in detail with reference to the drawings. However, in the drawings referred to below, for convenience of explanation, among the constituent members of the embodiment, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the element storage package according to the present invention can include arbitrary constituent members not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1 to 3, the element storage package 1 according to the present embodiment includes a base 5 having a mounting area on which the semiconductor element 3 is mounted on the upper surface, and a mounting area on the upper surface of the base 5. A frame 7 having openings on the inner and outer peripheral surfaces, an input / output terminal 9 inserted in the opening of the frame 7, and an upper surface of the base 5. A wiring board 11 positioned between the mounting area and the input / output terminal 9 and a connection wiring 21 positioned between the input / output terminal 9 and the wiring board 11 are provided.

The input / output terminal 9 includes a first insulating member 13 and a first wiring conductor 15 disposed on the upper surface of the first insulating member 13. The wiring board 11 has a second insulating member 17 and a second wiring conductor 19 disposed on the upper surface of the second insulating member 17. The connection wiring 21 includes a plurality of lead wirings 23 respectively connected to the first wiring conductor 15 and the second wiring conductor 19, and is connected to the first wiring conductor 15 and the second wiring conductor 19.

  As shown in FIG. 4, each of the plurality of lead wirings 23 is connected to the first wiring conductor 15 or the second wiring conductor 19 at both ends thereof, and the connection part 23 a. It has a linear wiring portion 23b that is located between and electrically connects the first wiring conductor 15 and the second wiring conductor 19.

  In the package 1 of the present embodiment, each of the plurality of lead wirings 23 is connected to the first wiring conductor 15 or the second wiring conductor 19 at both ends thereof, and the connection part 23a. Since the first wiring conductor 15 and the second wiring conductor 19 are located between them and have a linear wiring portion 23b that electrically connects the first wiring conductor 15 and the second wiring conductor 19, the connection distance by the connection wiring 21 can be shortened. Therefore, the signal transmission characteristics can be improved. Further, since the connection wiring 21 is not simply a linear shape, but is composed of a plurality of lead wirings 23, a large signal is sent to the connection wiring 21 as compared with the case where one large lead wiring is used. It can be easily deformed while being transmitted.

  The base body 5 in the present embodiment has a square plate shape, and has a mounting area on which the semiconductor element 3 is mounted. In the present embodiment, the placement region means a region that overlaps the semiconductor element 3 when the base 5 is viewed in plan.

  In the present embodiment, the placement region is formed at the center of the main surface. However, since the region where the semiconductor element 3 is placed is used as the placement region, for example, the placement region is placed at the end of the upper surface of the base 5. There is no problem even if the placement area is formed. Further, the base 5 in the package of the present embodiment has one placement area, but the base 5 has a plurality of placement areas, and the semiconductor element 3 is placed in each placement area. Also good.

  A semiconductor element 3 is disposed in the mounting region on the upper surface of the base 5. Signals can be input / output between the semiconductor element 3 and an external wiring (not shown) via the input / output terminal 9 or the like. As described above, since the semiconductor element 3 is disposed on the upper surface of the base body 5, the base body 5 is required to have high insulation properties at least in a portion where the semiconductor element 3 is disposed. . The base 5 according to the present embodiment is produced by laminating a plurality of insulating members. The semiconductor element 3 is disposed in the mounting region of the base body 5. Examples of the insulating member include a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body, or a glass ceramic. Materials can be used.

  A mixing member is prepared by mixing the raw material powder containing these glass powder and ceramic powder, an organic solvent, and a binder. A plurality of ceramic green sheets are produced by forming the mixed member into a sheet. A plurality of laminated bodies are produced by laminating the produced ceramic green sheets. The base body 5 is produced by integrally firing a plurality of laminated bodies at a temperature of about 1600 degrees.

  The base 5 is not limited to a configuration in which a plurality of insulating members are stacked. The base 5 may be composed of one insulating member. Moreover, since it is calculated | required that the base | substrate 5 has high insulation at least in the part by which the semiconductor element 3 is arrange | positioned, it is good also as a structure which laminated | stacked the insulating member on the metal member, for example. In particular, when high heat dissipation is required for the base 5, the base 5 is preferably configured as described above. This is because the metal member has high heat dissipation. By adopting a configuration in which an insulating member is laminated on a metal member, the heat dissipation of the base 5 can be enhanced.

  Specifically, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used as the metal member. A metal member constituting the substrate 5 can be produced by subjecting such an ingot of the metal member to a metal working method such as a rolling method or a punching method.

  Further, as described above, since the base 5 is required to have high insulating properties at least in a portion where the semiconductor element 3 is disposed, the base 5 is provided as in the package 1 of the present embodiment. However, it is preferable to include a mounting substrate 25 for mounting the semiconductor element 3 disposed on the mounting region. This is because the difference in height between the semiconductor element 3 and the wiring board 11 can be reduced, so that these electrical connections can be easily performed.

  As the mounting substrate 25, it is preferable to use a member having good insulation like the insulating member. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, and an aluminum nitride material are used. Ceramic materials such as sintered bodies and silicon nitride-based sintered bodies, or glass ceramic materials can be used.

  The package 1 of the present embodiment includes a frame body 7 disposed on the upper surface of the base body 5 so as to surround the mounting area. The frame body 7 has openings that open to the inner peripheral surface and the outer peripheral surface. The opening in the present embodiment is formed in the frame body 7 in order to insert the input / output terminal 9. Therefore, like the opening in the present embodiment, a recess opening on the inner peripheral surface and the outer peripheral surface of the frame body 7 is formed on the lower surface side of the frame body 7, and a through hole is formed by this recess and the upper surface of the substrate 5. And it is good also as an opening part. Further, through holes may be formed in the frame body 7 so as to open in the inner peripheral surface and the outer peripheral surface of the frame body 7, thereby forming an opening. The through hole can be formed in the frame body 7 by, for example, drilling.

  As the frame 7, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used. The metal member constituting the frame body 7 can be manufactured by subjecting such an ingot of the metal member to a metal processing method such as a rolling method or a punching method. A ceramic member may be used as the frame body 7. Further, the frame body 7 may be composed of one member, but may be a laminated structure of a plurality of members.

  When the frame body 7 made of a metal member is provided, the first wiring conductor 15 and the frame are formed in the opening of the frame body 7 in order to ensure insulation between the frame body 7 and the first wiring conductor 15. It is preferable that an insulating member is disposed between the body 7 and the body 7.

  The element storage package 1 of this embodiment includes a joining member (not shown) that is located between the base body 5 and the frame body 7 and joins the base body 5 and the frame body 7. For example, a brazing material can be used as the joining member. Exemplary brazing materials include silver brazing.

  Input / output terminals 9 are inserted and fixed in the openings of the frame 7 in the package 1 of the present embodiment. The input / output terminal 9 includes a first insulating member 13 and a first wiring conductor 15 disposed on the upper surface of the first insulating member 13. The input / output terminal 9 in the present embodiment has a plurality of first wiring conductors 15. The plurality of first wiring conductors 15 are located from the inside to the outside of the region surrounded by the frame body 7. Thereby, electrical connection can be achieved between the inside and the outside of the region surrounded by the frame body 7. The plurality of first wiring conductors 15 are arranged at predetermined intervals so as not to be electrically short-circuited with each other.

As the first insulating member 13, it is preferable to use a member having good insulation like the insulating member. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body,
Ceramic materials such as aluminum nitride sintered bodies and silicon nitride sintered bodies, or glass ceramic materials can be used.

  As the first wiring conductor 15, it is preferable to use a member having good conductivity. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold can be used as the first wiring conductor 15. The above metal materials may be used alone or as an alloy.

  In addition, the input / output terminal 9 in this embodiment has a pair of ground conductors 27 disposed on the upper surface of the first insulating member 13 so as to sandwich the first wiring conductor 15 therebetween. Thus, the 1st wiring conductor 15 and a pair of grounding conductor 27 are arrange | positioned, Therefore The 1st wiring conductor 15 can be used as a coplanar conductor.

  The distance between the first wiring conductor 15 and the pair of ground conductors 27 at the input / output terminal 9 is a signal noise component while suppressing an electrical short circuit between the first wiring conductor 15 and the pair of ground conductors 27. Is preferably about 0.3 to 1.5 mm.

  The first wiring conductor 15 is a member for electrically connecting an external wiring (not shown) and the semiconductor element 3 via the connection wiring 21 or the like. For this reason, the first wiring conductor 15 in the present embodiment is disposed only on the main surface of the substrate, but is not particularly limited thereto. For example, a part of the first wiring conductor 15 may be embedded in the first insulating member 13.

  In particular, when a part of the first wiring conductor 15 is embedded in the first insulating member 13, an insulating member is interposed between the plurality of first wiring conductors 15 in the embedded portion. Thus, the first insulating member 13 is present. Therefore, the insulation between the plurality of first wiring conductors 15 can be enhanced. When a part of the first wiring conductor 15 is embedded in the first insulating member 13, the first wiring conductor 15 is pulled out from the side surface of the input / output terminal 9, and the side surface of the input / output terminal 9 is You may electrically connect with the lead terminal 29 in the exposed part.

  As the lead terminal 29, it is preferable to use a member having good conductivity like the first wiring conductor 15. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold can be used as the lead terminal 29. The above metal materials may be used alone or as an alloy.

  In addition, the package 1 of the present embodiment includes a wiring substrate 11 that is located on the upper surface of the base 5 and between the mounting region and the input / output terminal 9. The wiring board 11 has a second insulating member 17 and a second wiring conductor 19 disposed on the upper surface of the second insulating member 17. The second wiring conductor 19 is a member for electrically connecting the semiconductor element 3 and the first wiring conductor 15 in the input / output terminal 9.

  As the second insulating member 17, it is preferable to use a member having good insulating properties similarly to the insulating member constituting the base 5. For example, an aluminum oxide sintered body, a mullite sintered body, and a silicon carbide material are used. Ceramic materials such as sintered bodies, aluminum nitride sintered bodies and silicon nitride sintered bodies, or glass ceramic materials can be used. An exemplary size of the second insulating member 17 is a square plate-shaped member having a side of about 1 to 10 mm and a thickness of about 0.1 to 5 mm when viewed in plan.

As the second wiring conductor 19, it is preferable to use a member having good conductivity similarly to the first wiring conductor 15. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold can be used as the second wiring conductor 19. The above metal materials may be used alone or as an alloy.

  The package 1 according to the present embodiment includes a connection wiring 21 positioned between the input / output terminal 9 and the wiring board 11. The connection wiring 21 includes a plurality of lead wirings 23 respectively connected to the first wiring conductor 15 and the second wiring conductor 19, and is connected to the first wiring conductor 15 and the second wiring conductor 19. The lead wiring 23 is joined to the first wiring conductor 15 and the second wiring conductor 19 via a joining member such as a brazing material.

  Further, each of the plurality of lead wirings 23 is located between the connection parts 23a and the connection parts 23a that are respectively connected to the first wiring conductor 15 or the second wiring conductor 19 at both ends thereof and the first wiring conductors 23a. The wiring conductor 15 and the second wiring conductor 19 are connected to each other with a linear wiring portion 23b.

  In the package 1 of the present embodiment, since the lead wiring 23 has a linear wiring portion 23b, the connection wiring 21 is larger than the case where one large lead wiring is used as described above. It can be easily deformed while transmitting a signal.

  In addition, the linear wiring part 23b in the package 1 of this embodiment means not the loop shape like the conventional wire bonding but the structure extended | stretched linearly as follows. That is, a configuration in which a so-called loop height indicated by a difference between a height of a part connected to the connection part 23a in the wiring part 23b and a height at the highest part in the wiring part 23b is equal to or less than a thickness of the wiring part 23b. means. For example, when the thickness of the wiring part 23b is 0.03 mm, the loop height is 0.03 mm or less.

  The wiring conductor in the package 1 of the present embodiment has three lead wirings 23, but is not limited to this. Since the connection wiring 21 only needs to have a plurality of lead wirings 23, there is no problem even in a configuration having two lead wirings 23 or a configuration having four or more lead wirings 23. .

  As the lead wiring 23, it is preferable to use a member having good conductivity similarly to the first wiring conductor 15. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold can be used as the lead wiring 23. The above metal materials may be used alone or as an alloy.

  As shown in FIG. 4B, the lead wire 23 in the package 1 of the present embodiment has a circular cross section perpendicular to the extending direction of the lead wire 23 in the wiring portion 23b, as shown in FIG. As shown, the cross section perpendicular to the extending direction of the lead wiring 23 in the connection portion 23a is a quadrangular shape.

  Since the cross section perpendicular to the extending direction of the lead wiring 23 in the wiring part 23b is circular, the durability of the wiring part 23b can be improved, so that the wiring is caused by thermal expansion and contraction of the base 5 and the like. Even if the part 23b is deformed, the possibility that the wiring part 23b is disconnected can be suppressed. In addition, the bonding property between the lead wiring 23 and the first wiring conductor 15 and the second wiring conductor 19 is improved by having a quadrangular cross section perpendicular to the extending direction of the lead wiring 23 in the connection portion 23a. Can do.

Furthermore, the connection part 23a is located on the 1st wiring conductor 15 or the 2nd wiring conductor 19, when the whole is planarly viewed. In this way, the connection part 23 a is joined to the first wiring conductor 15 and the second wiring conductor 19, so that the lead wiring 23, the first wiring conductor 15, and the second wiring conductor 23 are joined together. Bondability with the wiring conductor 19 can be improved. Further, even if the lead wiring 23 is deformed, the lead wiring 23 can be stably deformed in the wiring portion 23b, so that the connection portion 23a is prevented from being broken by the deformation of the connecting portion 23a. it can.

  The plurality of lead wires 23 are arranged in parallel to each other. By arranging the lead wirings 23 in this way, it is possible to secure a space between the adjacent lead wirings 23 without excessively thinning the lead wirings 23. Accordingly, since the lead wiring 23 is easily deformed, the possibility that the connection wiring 21 is disconnected can be reduced.

  The plurality of lead wires 23 have the same width when viewed in plan. When the lead wiring 23 is configured in this way, the possibility that stress is concentrated on a part of the plurality of lead wirings 23 can be reduced, and therefore the possibility that the lead wiring 23 is disconnected can be reduced.

  In addition, among the plurality of lead wires 23 arranged so as to be parallel to each other, the interval between the lead wires 23 located at both ends in the arrangement direction is at least between the first wiring conductor 17 and the second wiring conductor 19. Same as one width. When the lead wiring 23 is configured as described above, it is possible to suppress a decrease in signal transmission characteristics at a connection portion between the connection wiring 21 and the first wiring conductor 15 or the second wiring conductor 19.

  Further, in the connection wiring 21 in the package 1 of the present embodiment, the interval between the lead wirings 23 adjacent to each other is the same. Thus, when the connection wiring 21 has three or more lead wirings 23, it is preferable that the space | interval between the lead wirings 23 adjacent to each other is the same. Thereby, since possibility that stress concentrates on a part of some lead wiring 23 can be made small, possibility that lead wiring 23 will break can be made small.

  The semiconductor device 101 of this embodiment is joined to the element housing package 1 typified by the above embodiment, the semiconductor element 3 placed in the placement area of the element housing package 1, and the frame body 7. In addition, a lid 31 for sealing the semiconductor element 3 is provided.

  In the semiconductor device 101 of this embodiment, the semiconductor element 3 is placed in the placement region of the base 3. Further, the semiconductor element 3 and the second wiring conductor 19, and the first wiring conductor 15 and the second wiring conductor 19 are connected by a conductive wire 35, respectively. A desired output can be obtained from the semiconductor element 3 by inputting an external signal to the semiconductor element 3 through the external wiring, the first wiring conductor 15, the second wiring conductor 19 and the conducting wire 35. Examples of the semiconductor element 3 include a light emitting element that emits light to an optical fiber, typified by an LD element, and a light receiving element that receives light to an optical fiber, typified by a PD element.

  The semiconductor element 3 and the second wiring conductor 19 can be electrically connected by, for example, so-called wire bonding via a conductive wire 35, for example. At this time, it is preferable that the semiconductor element 3 and the second wiring conductor 19 are electrically connected by the conductive wire 35 that is separated from the base body 5.

  Further, in order to suppress a decrease in signal transmission characteristics in the conductive wire 35, the semiconductor element 3 and the second wiring conductor 19 are electrically connected by a plurality of linear conductive wires 35, similarly to the lead wiring 23. It is preferable.

The lid body 31 is bonded to the frame body 7 and provided to seal the semiconductor element 3. The lid body 31 is joined to the upper surface of the frame body 7. The semiconductor element 3 is sealed in a space surrounded by the base body 5, the frame body 7, and the lid body 31. By sealing the semiconductor element 3 in this way, deterioration of the semiconductor element 3 due to the use of the element storage package 1 for a long period of time can be suppressed.

  As the lid 31, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used. The frame body 7 and the lid body 31 can be joined by, for example, a seam welding method. Moreover, you may join the frame 7 and the cover body 31 using a gold- tin solder, for example.

  Next, an element storage package and a semiconductor device according to the second embodiment will be described in detail with reference to the drawings. In addition, in each structure concerning this embodiment, about the structure which has the same function as 1st Embodiment, the same referential mark is attached and the detailed description is abbreviate | omitted.

  As shown in FIGS. 5 to 7, the package 1 according to the present embodiment is similar to the package 1 according to the first embodiment, and includes a base 5 having a mounting area on which the semiconductor element 3 is mounted, and a base 5. A frame body 7 having openings on the inner peripheral surface and the outer peripheral surface, and an input / output terminal 9 inserted in the opening portion of the frame body 7. The wiring board 11 is located between the mounting area and the input / output terminal 9 on the upper surface of the substrate 5, and the connection wiring 21 is located between the input / output terminal 9 and the wiring board 11.

  Further, the input / output terminal 9 includes a first insulating member 13 and a first wiring conductor 15 disposed on the upper surface of the first insulating member 13. The wiring board 11 has a second insulating member 17 and a second wiring conductor 19 disposed on the upper surface of the second insulating member 17.

  And the package 1 of this embodiment differs in the structure of the connection wiring 21 compared with the package 1 of 1st Embodiment. Specifically, the connection wiring 21 in the package 1 of the present embodiment has a flat plate shape and has slits 33 opened on the upper surface and the lower surface.

  Thus, even when the connection wiring 21 is not configured to have a plurality of linear lead wirings 23 but has a slit 33 that opens to the upper surface and the lower surface, the connection wiring 21 is deformed in the portion having the slit 33. As in the package 1 of the first embodiment, the connection wiring 21 is easily deformed while transmitting a large signal as compared with the case of using one large lead wiring. Can be.

  It is preferable that the slits 33 opened on the upper surface and the lower surface of the connection wiring 21 are extended so as to be parallel to a straight line connecting the first wiring conductor 15 and the second wiring conductor 19. As a result, since the region of the connection wiring 21 having the slit 33 and easily deformable can be enlarged, the connection wiring 21 can be further easily deformed.

  On the other hand, in order to improve the bondability between the connection wiring 21 and the first wiring conductor 15 and the second wiring conductor 19, the portion where the slit 33 is formed when the connection wiring 21 is viewed in plan view. It is preferable that the first wiring conductor 15 and the second wiring conductor 19 do not overlap.

  The element storage package and the optical semiconductor device including the element storage package according to each embodiment of the present invention have been described above, but the present invention is not limited to the above-described embodiment. In other words, various modifications and combinations of embodiments may be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Element storage package 3 ... Semiconductor element 5 ... Base | substrate 7 ... Frame 9 ... Input / output terminal 11 ... Wiring board 13 ... 1st insulation member 15 ... First wiring conductor 17 ... second insulating member 19 ... second wiring conductor 21 ... connection wiring 23 ... lead wiring 23a ... connection part 23b ... wiring part 25 ..Mounting substrate 27... Ground conductor 29... Lead terminal 31... Lid 33... Slit 35.

Claims (7)

A substrate having a mounting region on which the semiconductor element is mounted;
A frame having openings on the inner peripheral surface and the outer peripheral surface, disposed on the upper surface of the base body so as to surround the placement region;
An input / output terminal having the first insulating member and the first wiring conductor disposed on the upper surface of the first insulating member, and being inserted into the opening of the frame;
A top surface of the base body having a second insulating member and a second wiring conductor disposed on the top surface of the second insulating member, and located between the placement region and the input / output terminal. A wiring board;
An element storage package comprising a connection wiring located between the input / output terminal and the wiring board and connected to the first wiring conductor and the second wiring conductor;
The connection wiring is composed of a plurality of lead wirings connected to the first wiring conductor and the second wiring conductor, respectively.
The plurality of lead wires are connected to the first wiring conductor or the second wiring conductor at both ends of the plurality of lead wires, and the first wiring conductor is located between the connecting portions. An element storage package comprising: a linear wiring portion that electrically connects the second wiring conductor.   2. The cross section perpendicular to the extending direction of the lead wiring in the wiring portion is circular, and the cross section perpendicular to the extending direction of the lead wiring in the connecting portion is rectangular. The device storage package according to 1.   3. The element storage package according to claim 2, wherein the connection part is located on the first wiring conductor or the second wiring conductor when the whole is viewed in plan. 4.   The device storage package according to claim 1, wherein the plurality of lead wirings are arranged to be parallel to each other.   Among the plurality of lead wires arranged so as to be parallel to each other, an interval between the lead wires located at both ends in the arrangement direction is at least one of the first wiring conductor and the second wiring conductor. The device storage package according to claim 4, wherein the device storage package has the same width.   5. The element storage package according to claim 4, wherein the package has three or more lead wires, and the interval between the lead wires adjacent to each other is the same. The device storage package according to any one of claims 1 to 6,
The semiconductor element placed in the placement area of the element housing package;
A semiconductor device comprising: a lid body that is bonded to the frame body and seals the semiconductor element.