JP2012232388A - Dresser for abrasive cloth - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dresser hardly eluting metal composition and free from falling of abrasive grains, when dressing an abrasive cloth.SOLUTION: The dresser for the abrasive cloth is provided wherein a plurality of abrasive grains are fixed in a single layer, onto the surface of a resin supporting material, a metal layer exists between the resin supporting material and the abrasive grains, and the surface of the metal layer on the side contacting the resin supporting material, has irregularities. Preferably, the metal layer exists only between the resin supporting material and the abrasive grain.

Description

  The present invention provides a dresser used to maintain the flatness of the polishing cloth and to remove clogging and foreign matter in a chemical and mechanical planar polishing (hereinafter abbreviated as CMP) process. And a manufacturing method thereof.

  Equipment for polishing the surface of semiconductor wafers, equipment for flattening the surface of wiring and insulating layers in the process of manufacturing integrated circuits, equipment for flattening the surface of Al plates and glass plates used for magnetic hard disk substrates, etc. Then, CMP polishing is used. CMP polishing is, for example, a method of flattening a surface to be polished by pressing the surface to be polished while supplying a slurry liquid containing fine abrasive grains to a rotating substrate to which a urethane polishing pad is attached. It is. As a matter of course, the polishing ability of the polishing pad decreases with the use time. Therefore, in order to suppress this decrease in polishing ability, the surface layer portion of the polishing pad is ground at regular intervals. Thereby, a new surface of the polishing pad can always be brought out on the surface, and the flatness of the polishing pad is maintained. This grinding is called dressing, and the parts used for dressing are called dressers. In general, a dresser is obtained by bonding abrasive grains to a metal substrate by electrodeposition or brazing.

  Conventionally, a dresser is required not to scratch the pad. More recently, metal elution from the components of the dresser is minimized as the depth of focus of the pattern exposure apparatus decreases due to the narrowing of the line / space of the integrated circuit or the recording capacity of the magnetic hard disk increases. Needs are getting higher. This is because the metal component in the dresser is eluted into the slurry during the dressing and the semiconductor wafer or the like is contaminated through the polishing pad.

The following are disclosed as dressers aimed at suppressing metal elution. Patent Document 1 discloses a dresser in which a plate having diamond abrasive grains fixed to the surface of a MgO—SiO ₂ sintered body is attached to a resin substrate. Patent Document 2 discloses a dresser in which diamond abrasive grains are fixed to a resin substrate. Patent Document 3 discloses a dresser in which diamond abrasive grains fixed to a powder sintered body of W, Si, and SiO ₂ are bonded to a resin, a ceramic, and a stainless steel plate. Patent Document 4 discloses a dresser in which abrasive grains formed by forming a diamond film on a substrate made of silicon carbide are fixed. Patent Document 5 discloses a dresser in which a diamond abrasive grain is fixed to a support material made of glass and a ceramic powder composite.

JP 2008-132573 A JP 2001-25957 A JP 2001-179638 A JP 2004-291129 A International Publication No. 2008/062846

  As described above, in order to suppress metal elution, it is disclosed that a ceramic sintered body other than metal or a resin support is used as a member constituting the dresser. However, when diamond abrasive grains are fixed to the ceramic sintered body, there is a problem that the diamond abrasive grains deteriorate due to the reaction between the diamond abrasive grains and the sintered powder. In addition, there is a problem that the manufacturing process becomes complicated in the sintering process. On the other hand, when diamond abrasive grains are fixed to the resin support material, since the fixing force between the resin and diamond is weak, the diamond falls off during dressing, resulting in a problem of frequent scratches.

  An object of the present invention is to provide a dresser in which abrasive grains are less dropped during dressing and preferably metal elution is suppressed.

The gist of the present invention is as follows.
(1) A dresser for a polishing cloth in which a plurality of abrasive grains are fixed to a single layer on the surface of a resin support material, wherein a metal layer is present between the resin support material and the abrasive grains, A dresser for polishing cloth, wherein the surface of the metal layer on the side in contact with the resin support material has an uneven portion.
(2) The dresser for polishing cloth according to (1), wherein the metal layer has a thickness of 0.1 to 20 μm.
(3) The uneven portion of the metal layer has an interval between adjacent concave portions and convex portions of 0.05 μm to 10 μm, and a difference in height between the bottom of the adjacent concave portion and the highest portion of the convex portion is 0. The dresser for polishing cloth according to (1) or (2), wherein the dresser is .05 μm to 15 μm.
(4) The metal layer is made of at least one metal selected from Ti, Ni, Al, Cu, brass, Cr, and Au, according to any one of (1) to (3), Dresser for polishing cloth.
(5) The abrasive cloth dresser according to any one of (1) to (4), wherein a particle diameter of the abrasive grains is 5 μm or more and 300 μm or less.
(6) The abrasive cloth dresser according to any one of (1) to (5), wherein the abrasive grains are diamond abrasive grains.
(7) A method for producing a dresser for an abrasive cloth according to any one of (1) to (6),
A step of forming a metal layer on the surface of the abrasive grains, a step of etching the metal layer to form the concavo-convex portion, and fixing the abrasive grains to the resin support through the etched metal layer And a process for producing a dresser for a polishing cloth.

  The dresser for polishing cloth of the present invention has a sufficient fixing force between the resin support material and the abrasive grains, and can prevent the abrasive grains from falling off. Moreover, since the falling of abrasive grains can be suppressed, the occurrence of scratches can also be suppressed. For this reason, if the dresser of the present invention is applied to a pad conditioner for CMP polishing, the quality of the product substrate can be improved and high productivity can be maintained.

FIG. 1A is a schematic cross-sectional view of the dresser for polishing cloth of the present invention, and FIG. 1B is a schematic view showing the interface between the metal layer of the dresser for polishing cloth of the present invention and the resin support material. is there.

  Depending on the area of one dresser surface, several to tens of thousands of single crystal abrasive grains (for example, diamond abrasive grains, preferably artificial diamond abrasive grains) are usually fixed. Since diamond has covalently bonded carbon atoms, its surface is usually stable. Therefore, even if it contacts with resin, a diamond and resin cannot be chemically bonded. Therefore, even if the diamond abrasive grains are fixed to the resin, a sufficient bonding force has not been obtained.

  The inventors of the present invention covered the abrasive grains with a metal layer, provided fine irregularities on the surface of the metal layer, and fixed it to the resin. As a result, the resin enters the irregularities on the surface of the metal layer, and it has been found that the abrasive grains can be fixed with a sufficient fixing force by the anchor effect at the interface between the resin and the metal layer, and the present invention has been completed.

1. Polishing Cloth Dresser The polishing cloth dresser of the present invention has a resin support and a plurality of abrasive grains fixed to a single layer on the surface thereof. The dresser for abrasive cloth of this invention is typically shown in FIG. As shown in FIG. 1A, a metal layer 2 exists between the resin support material 3 and the abrasive grains 1. Further, as shown in FIG. 1B, the surface of the metal layer 2 in contact with the resin support member 3 has an uneven portion. The resin support material 3 enters the unevenness of the metal layer 2, and the two are bonded by the anchor effect. Therefore, according to this invention, the dresser for abrasive cloth excellent in the adhering force of the abrasive grain 1 is implement | achieved. Of course, the dresser for polishing cloth of the present invention may be provided with other members as required.

(About metal layers)
The metal layer in the dresser for polishing cloth of the present invention is a layer provided between the resin support material and the abrasive grains. From the viewpoint of preventing the metal component from eluting when dressing with the dresser for polishing cloth, a metal layer may be provided on the exposed surface of the support material, but the metal component is eluted during dressing. In order to suppress it, it is preferable to dispose the metal layer only on a part of the exposed surface of the support material or not to arrange it as much as possible.

  The metal layer has an uneven portion on the surface in contact with the resin. The thickness of the metal layer is preferably 0.1 μm to 20 μm. Here, the thickness of the metal layer means an average thickness. If the metal layer is too thin, it becomes difficult for a suitable uneven portion to exist on the surface, and the anchor effect at the interface between the resin support material and the metal layer is lowered. Moreover, even if the thickness of the metal layer is increased to form a large uneven portion, the anchor effect is not further improved. The thickness of the metal layer is an average thickness observed when the cross-section of the dresser for polishing cloth is directly observed by SEM or TEM.

  In the concavo-convex portion, the distance between adjacent concave portions and convex portions is preferably 0.05 μm to 10 μm. If the interval is less than 0.05 μm, it is difficult to form the uneven portion and it is difficult to obtain the anchor effect. On the other hand, if it exceeds 10 μm, the slope of the surface from the lowest part of the concave part to the highest part of the convex part becomes gentle, so that the anchor effect tends to be lowered. In addition, the space | interval of an adjacent recessed part and a convex part means the space | interval of the lowest part of an adjacent recessed part, and the highest part of a convex part.

  In the concavo-convex portion, the difference in height between the bottom of adjacent concave portions and the highest portion of the convex portions is preferably 0.05 μm to 15 μm. When the difference in height is less than 0.05 μm, even if an uneven portion is formed on the surface of the metal layer, the amount of resin entering is small, and it is difficult to obtain a sufficient anchor effect. Further, even if the above difference exceeds 15 μm, there is no further improvement in the anchor effect.

  If the uneven portions of the metal layer, which is a feature of the present invention, are present on all surfaces of the metal layer in contact with the resin support material, the anchor effect is maximized and more preferable, but the metal layer is in contact with the resin. A sufficient anchor effect can be obtained if it is present in an area portion of at least 50% or more of the surface area of the metal layer.

  The thickness of the metal layer, the interval between the concave and convex portions adjacent to each other in the concavo-convex portion, and the difference in height between the bottom portion of the adjacent concave portion and the highest portion of the convex portion are averages of values measured for each of the ten abrasive grains. Value. In the actual measurement method, a portion where the cross section can be observed by FIB processing is cut out from the surface portion of the abrasive grain, and direct observation by SEM or TEM is performed.

  The metal layer covering the abrasive grain surface is preferably composed of at least one metal selected from Ti, Ni, Al, Cu, brass, Cr, and Au. These metal layers can be formed on the surface of the abrasive grains by a wet process such as solution plating or a dry process such as sputtering or CVD. Moreover, these metals are excellent also in the adhesiveness with the diamond abrasive grain surface, and a fine uneven part can be easily formed on the surface of the metal layer.

  The metal layer covering the abrasive grains may be a single layer. Thereby, the dresser for abrasive cloth of this invention can be obtained. However, in order to increase the fixing force or to improve the workability of the surface of the metal layer, the metal layer covering the abrasive grains is more preferably a laminate of a plurality of metal layers.

  As a specific example of the laminate, the surface of diamond abrasive grains is coated with a Ti metal layer, and the carbon atoms and Ti atoms of diamond are reacted and chemically bonded. Then, the Ti metal layer is covered with a Ni metal layer or the like. Thereby, a chemical bond between Ti and Ni is also generated, which is more preferable because the bonding force between the diamond abrasive grains themselves and the metal layer can be increased.

  Alternatively, a metal layer that is easily chemically bonded to the abrasive grains may be formed on the abrasive grain side, and a metal layer that is likely to form an uneven portion may be formed on the resin layer side. Thereby, the bond strength between the abrasive grains and the metal layer can be increased, and the metal workability can be improved.

(About abrasive grains)
The abrasive grains in the dresser for polishing cloth according to the present invention may be single crystal grains having grinding ability, such as diamond, cubic boron nitride, boron carbide, silicon carbide, and aluminum oxide. Among these abrasive grains, diamond abrasive grains have a high grinding ability. However, conventionally, even if diamond abrasive grains are fixed to a resin support material, sufficient bonding strength has not been obtained. On the other hand, in the present invention, the diamond abrasive grains can be firmly fixed to the resin, which is preferable from the viewpoint of the effect.

  The grain size of the diamond abrasive grains is preferably 5 μm or more and 300 μm or less. The size of the abrasive grains used is appropriately selected according to the object to be polished by CMP. In the case of CMP polishing of a semiconductor integrated circuit, a blocky type which is a relatively large single crystal diamond abrasive grain and whose diamond surface is a crystal wall surface is used. On the other hand, in the case of CMP polishing of a magnetic hard disk substrate such as Al or glass, relatively small single crystal diamond abrasive grains are used.

  If the diameter of the diamond abrasive grains is less than 5 μm, the number of irregularities on the surface of the metal layer provided on each diamond abrasive grain is reduced, so that the anchor effect at the interface between the metal layer and the resin support material is achieved. May be reduced. On the other hand, when the particle diameter exceeds 300 μm, the unevenness of the pad after polishing by the dresser for polishing cloth becomes large, and the flatness of the dressed pad tends to be lowered. Therefore, if the grain size of the abrasive grains is 10 μm or more and 200 μm or less, it is more preferable from the viewpoint of easy manufacture of a polishing cloth dresser and pad flatness after polishing with the polishing pad.

(Resin support material)
The material of the resin support material in the dresser for polishing cloth of the present invention is not particularly limited, but a thermoplastic resin that has fluidity at a warm temperature and is solidified at room temperature is suitable. As will be described later, with the resin in a fluid state, the resin is brought into contact with the abrasive grains coated with the metal layer, and the abrasive grains and the resin are brought into close contact with each other, thereby producing the dresser for polishing cloth of the present invention. be able to.

  The CMP dresser is used in an acidic or alkaline slurry. Therefore, it is preferable that the resin constituting the support material has acid resistance and alkali resistance. Examples of such a resin include super engineering plastics such as polyphenylene sulfide (PPS), liquid crystal polymer (LCP), polyamide (PA), polycarbonate (PC), polybutylene terephthalate (PBT), and polyethylene terephthalate (PET). Engineering plastics and general-purpose plastics can be applied.

  The resin constituting the support material may contain silica particles, alumina particles, alumina fibers, SiC fibers, carbon fibers, and glass fibers. Thereby, the rigidity of the resin support material can be increased. By containing these fibers in the resin, the coefficient of thermal expansion can be adjusted to approach the coefficient of thermal expansion of the metal layer coated with abrasive grains, and the adhesion between the metal layer and the resin support material can be improved. it can.

  The shape of the resin support material is not particularly limited, and may be a polygonal shape such as an octagon or an icosahedron. Usually, in pad grinding using a dresser for polishing cloth, the pad is ground while the resin support material itself rotates, so that a disk shape is preferable in order to ensure uniform grindability.

2. Method for Producing Polishing Cloth Dresser The polishing cloth dresser of the present invention is not particularly limited. For example, 1) the abrasive grain surface is coated with a metal layer, and 2) the metal layer surface is subjected to etching, etc. 3) It is obtained by bringing a resin into contact with abrasive grains formed and coated with a metal layer having an uneven portion.

(Formation of metal layer)
As a method of coating a predetermined metal layer with a predetermined thickness on the diamond abrasive grain surface, there are known methods such as a) a wet process such as solution plating, or b) a dry process such as sputtering or CVD. The thickness of the metal layer covering the abrasive grains can be controlled by the processing time of each of the above methods.

  In order to coat the abrasive grains with the metal layer by sputtering, the abrasive grains are spread on a metal plate or a glass plate and then placed at a position facing the target in the chamber of the sputtering apparatus. When sputtering is performed in this state, the metal atoms ejected from the target reach only about half of the surface of the abrasive grains and do not reach about half of the surface of the abrasive grains. Therefore, about half of the surface of each abrasive grain is covered with the metal layer. In this way, only half of the abrasive grains may be covered with the metal layer.

  The thickness of the metal layer covering the abrasive grains is preferably 0.1 μm to 20 μm. If it is less than 0.1 μm, it is difficult to form a suitable uneven portion on the surface. Therefore, when the thickness of the metal layer is less than 0.1 μm, the anchor effect at the interface between the resin support material and the metal layer is lowered. Moreover, even if it exceeds 20 μm, further improvement of the anchor effect cannot be expected. Therefore, if the thickness of the metal layer is in the range of 3 μm to 20 μm, a suitable uneven portion can be stably formed, and by making the thickness within this range, a more stable anchor effect can be obtained.

  When the abrasive grains are coated with a Ti metal layer, sputtering is performed using a metallic Ti target, or the abrasive grains are treated by a pyrosol method in which a solution containing Ti ions is sprayed onto abrasive grains heated to a predetermined temperature. It is preferable to form a Ti metal layer. In particular, when diamond abrasive grains are coated with a Ti metal layer by these treatments, Ti atoms are chemically bonded to C atoms of diamond abrasive grains, so that the adhesion between them is good.

  It is also possible to coat the abrasive grains with a Ti metal layer and then coat with an Ni metal layer. When a Ti metal layer is present on the surface of the abrasive grains, a Ni metal layer can be formed by electroplating. When the abrasive grain surface is directly coated with a Ni metal layer, the Ni metal layer can be formed by an electroless Ni plating method using a hypophosphorous acid aqueous solution or the like. In this case, a Ni-P alloy metal layer is obtained.

  In the case where the abrasive grains are coated with an Al metal layer, a method may be applied in which the abrasive grains are put in a mesh container made of stainless steel, soaked in molten Al metal, and then pulled up. However, it is difficult to control the thickness of the Al metal layer by this method. Therefore, sputtering is more suitable for forming the Al metal layer.

  When the abrasive grains are coated with a Cu metal layer, the Cu metal layer can be formed on the abrasive grains using an electroless Cu plating method. It is also possible to coat the abrasive grains with a Ti metal layer by the above-described method, then perform electroplating, and further coat with a Cu metal layer.

  The abrasive grains may be coated with brass. Brass is an alloy of Cu 60-70 mass% and Zn 30-40 mass%. A metal layer made of brass is obtained by plating. The brass plating can be obtained from a Cu-Zn alloy plating bath having a predetermined concentration ratio. Also, a metal layer made of brass plating is formed on the abrasive grain surface by performing alloying heat treatment after separately performing Cu plating and Zn plating on the abrasive grain surface so as to have a predetermined mass ratio. Is done. Cu plating can be performed by the method mentioned above. When the Zn plating is formed on the Cu plating, an electroplating method can be used.

  When the abrasive grains are coated with a Cr metal layer, the Cr metal layer can be formed on the abrasive grains by sputtering using metal Cr as a target. Further, abrasive grains plated with Ti, Ni, Cu, or brass in advance may be coated with a Cr metal layer by electroplating.

  When the abrasive grains are coated with an Au alloy layer, an Au—Cu alloy or an Au—Ni alloy is suitable as the Au alloy. When the abrasive grains are coated with the Au—Cu alloy layer, Au electroplating or Au—Cu alloy electroplating is performed on the abrasive grains plated with Cu in advance by electroless plating. The Au—Cu alloy has high hardness when about 60 mass% of Au is present. When the abrasive grains are coated with the Au-Ni alloy layer, Au electroplating or Au-Ni alloy electroplating is performed on the abrasive grains that have been previously plated with Ni by electroless plating.

(Formation of irregularities)
An uneven portion is imparted to a metal layer formed with a predetermined thickness on the surface of the abrasive grains. Examples of the method for providing the uneven portion include a wet etching method and an electrolytic etching method according to each metal. In the wet etching method, by adjusting the concentration of the etching solution, the etching time, etc., the distance between the adjacent concave and convex portions of the concave and convex portions, the height between the bottom of the adjacent concave portions and the highest portion of the convex portions, The difference can be adjusted. Also, in the electrolytic etching method, by adjusting the type of electrolytic solution, current density, etc., the distance between the adjacent concave and convex portions of the concave and convex portions, and the height between the bottom of the adjacent concave portions and the highest portion of the convex portions The difference between can be adjusted.

  As described above, it is preferable to control the interval between the concave and convex portions adjacent to the concave and convex portions on the surface of the metal layer to be in the range of 0.05 μm to 10 μm, and between the bottom of the adjacent concave portions and the highest portion of the convex portions. It is preferable to control the height difference in the range of 0.05 μm to 15 μm.

  In order to form uneven portions on the Ti metal layer covering the abrasive grains by wet etching, for example, the abrasive grains coated with the Ti metal layer are immersed in an aqueous solution containing nitric acid and hydrofluoric acid in a container, Stir for hours. By changing the concentration of nitric acid and hydrofluoric acid and the immersion time, the gap between the concave and convex portions of the concave and convex portions, and the difference in height between the bottom of the adjacent concave portions and the highest portion of the convex portions can be adjusted. .

  Moreover, in order to form the uneven | corrugated | grooved part by an electrolytic etching method in Ti metal layer, a pair of platinum electrode is put into the mixed solution of methyl alcohol, ethylene glycol, and perchloric acid in a container, for example, and the platinum electrode of an anode side Abrasive grains coated with a Ti metal layer may be disposed so as to be in contact with each other, and a DC voltage of several tens of volts may be applied between the electrodes. By adjusting the mixing ratio of methyl alcohol, ethylene glycol and perchloric acid, and the applied voltage, the distance between the concave and convex portions of the concave and convex portions, the height of the bottom of the adjacent concave portions and the highest portion of the convex portions You can change the difference.

  In order to form the concavo-convex portion on the Ni metal layer covering the abrasive grains, for example, wet etching may be performed with an aqueous solution of nitric acid and glacial acetic acid. Alternatively, electrolytic etching may be performed with an aqueous ammonium persulfate solution.

  In order to form the concavo-convex portion on the Al metal layer covering the abrasive grains, for example, wet etching may be performed with an aqueous solution of hydrochloric acid, nitric acid, and hydrofluoric acid. Alternatively, electrolytic etching may be performed with a borohydrofluoric acid aqueous solution.

  In order to form the concavo-convex portion on the Cu metal layer or brass metal layer covering the abrasive grains, for example, wet etching may be performed with an aqueous solution of ammonium persulfate and hydrochloric acid. Alternatively, electrolytic etching may be performed with a phosphoric acid aqueous solution.

  In order to form the concavo-convex portion in the Cr metal layer covering the abrasive grains, for example, wet etching may be performed with an aqueous solution of nitric acid and hydrochloric acid. Alternatively, electrolytic etching may be performed with an aqueous solution of oxalic acid.

  In order to form the concavo-convex portion on the Au metal layer covering the abrasive grains, for example, wet etching may be performed with an aqueous solution of nitric acid and hydrochloric acid. Alternatively, electrolytic etching may be performed with an aqueous hydrochloric acid solution.

(Formation of resin support material)
The resin-made support material is formed by bringing a resin in a fluid state into contact with the abrasive grains and applying pressure to bring it into close contact. Accordingly, the resin can enter the uneven portion on the surface of the metal layer. For example, abrasive grains coated with a metal layer are temporarily fixed on a substrate; a fluid resin heated under high pressure conditions is brought into contact with the abrasive grains of the substrate on which the abrasive grains are temporarily fixed to make a resin A support material is formed. The abrasive grains temporarily fixed to the substrate are preferably patterned in the same manner as the arrangement pattern of the abrasive grains of the dresser. By arranging an adhesive such as an adhesive tape on the substrate in advance, the abrasive grains can be temporarily fixed.

  The pattern of the abrasive grain arrangement may be random or regular. In the case of regular arrangement, abrasive grains may be arranged at each vertex of a matrix such as a triangle, quadrangle, pentagon, or hexagon. Moreover, it is possible to arrange abrasive grains in various pattern areas. In order to place the abrasive grains, for example, the abrasive grains are dropped onto a substrate that can be set in a mold of an injection molding machine through an opening of a sieve having an opening at a predetermined position, and the abrasive grains are arranged at a predetermined position on the substrate. do it.

  In addition, when the abrasive grains coated with a ferromagnetic Ni metal layer are placed on a substrate placed on a magnet, the Ni metal layer covering the abrasive grains is disposed facing the magnet, so the arrangement direction is It's aligned. And the board | substrate which stuck the adhesive tape is piled up, and an abrasive grain is made to adhere to an adhesive tape. Thereby, the abrasive grain part which is not coat | covered with the metal layer adheres to an adhesive tape, and the abrasive grain part coat | covered with the metal layer is exposed without adhering to an adhesive tape. If the abrasive grains and the resin in this state are integrated, the abrasive grain portion coated with the metal layer contacts the resin, and the abrasive grain portion not covered with the metal layer does not contact the resin. Thereafter, if the substrate is removed, the abrasive grains not covered with the metal layer are exposed. Therefore, it is not necessary to remove the metal layer.

  As a method of bringing the resin into contact with the abrasive grains, an injection molding method or a warm die pressing method is suitable. In particular, the injection molding method is preferable because of its excellent productivity. In order to improve the adhesion of the resin to the uneven portion on the surface of the metal layer, it is more desirable to remove the gas in the vicinity of the uneven portion by vacuum degassing or the like before the resin contacts the uneven portion. That is, it is preferable to make it the pressure reduction conditions.

  Adjustment of the height of the abrasive grains exposed from the resin support (abrasive protrusion height) can be adjusted in the state of the abrasive grains temporarily fixed to the substrate. For example, when temporarily fixing abrasive grains to the double-sided tape on the substrate, if the thickness of the double-sided tape is about half of the grain size of the abrasive grains, embedding the abrasive grains in the double-sided tape results in about half of the abrasive grains. Exposed from double-sided tape. Thereafter, when the resin is brought into contact with the temporarily fixed abrasive and brought into close contact therewith, the abrasive part embedded in the double-sided tape protrudes without being covered with the resin support material. As a result, a dresser in which half of the abrasive grains protrude while the abrasive grains and the resin are integrated is obtained.

  When the abrasive particles and the resin that are metal-coated on the entire surface are integrated with each other, the abrasive grain portions protruding from the resin support material are also covered with the metal layer. That is, the metal layer 2 is also covered at a portion of the abrasive grain 1 shown in the schematic diagram of FIG. In this case, it is possible to dissolve and remove only the metal layer of the abrasive grain portion protruding from the resin support material with a wet etching solution corresponding to the metal layer covering the abrasive grain. In addition, by integrating the abrasive grains coated with the metal layer and the resin and then performing dummy dressing, only the metal layer at the abrasive grain portion protruding from the resin support material can be removed. By performing this dummy dressing while flowing a slurry such as colloidal silica, the metal layer can be efficiently removed.

  By removing the metal layer covering the diamond abrasive grains at the portion protruding from the resin support material, the pad grinding speed is improved. Moreover, it can suppress that a metal component elutes at the time of pad grinding.

  Hereinafter, based on an Example, this invention is demonstrated in detail.

[Example 1]
(Formation of metal layer)
The surface of single crystal artificial diamond abrasive grains having an average particle diameter d of 150 μm was coated with Ni metal by electroless plating. The Ni electroless plating bath contained nickel chloride: 50 g / L, sodium hypophosphite: 10 g / L, sodium citrate: 10 g / L, pH 4 and bath temperature 90 ° C. The plating bath was stirred with a stirrer. In the method of actually measuring the thickness of the metal layer, a portion where the cross section can be observed by FIB processing is cut out from the surface portion of the abrasive grain, and directly observed by SEM or TEM.

(Formation of irregularities)
The abrasive grains on which the Ni metal layer was formed were immersed in an etching solution obtained by diluting a solution of nitric acid: glacial acetic acid = 1: 1 with distilled water to form uneven portions on the surface of the Ni metal layer. The gap between the concave and convex portions adjacent to each other in the concavo-convex portion and the difference in height between the bottom of the adjacent concave portion and the highest portion of the convex portion were controlled by the solution concentration of the etching solution and the immersion time. Table 1 shows the concentration (%) of the etching solution and the immersion time (seconds).

  The gap between the adjacent concave and convex portions of the concavo-convex portion, and the difference in height between the bottom of the adjacent concave portion and the highest portion of the convex portion was measured for each of the 10 abrasive grains, and the average value of these values was used. . The thickness of the metal layer was the average thickness measured. The method of actually measuring the distance between the concave and convex portions adjacent to each other in the concavo-convex portion and the height difference between the bottom of the adjacent concave portion and the highest portion of the convex portion is a portion where the cross-section can be observed by FIB processing from the abrasive grain surface portion. It was directly observed by cutting, SEM, or TEM.

(Formation of resin support material)
Abrasive grains having irregularities formed on the surface of the metal layer were temporarily fixed on a SUS304 plate having a diameter of 100 mm and a thickness of 2 mm. First, a heat-resistant double-sided tape was affixed on a SUS304 plate. As the double-sided tape, a 100 μm thick heat-resistant double-sided tape was used. Abrasive grains were placed on the attached double-sided tape in the following procedure. About 70 μm corresponding to about half of the diameter (height) of the abrasive grains was pressed into the heat-resistant tape. The temporarily fixed abrasive grains were patterned so as to be located at each vertex of the square matrix, and the interval between the abrasive grains was set to 0.4 mm.

  Specifically, abrasive grains were arranged in a ring-shaped region between a circle having a radius of 25 mm and a circle having a radius of 48 mm drawn on one surface of the metal support material. More specifically, this ring-shaped region is divided into four arc-shaped regions at an equal angle (90 °), and diamond abrasive grains are arranged in the gap (2 mm width) between adjacent arc-shaped regions. I didn't. In each arc-shaped region, diamond abrasive grains were regularly arranged so as to be located at each vertex of the square matrix. The specific arrangement procedure of the abrasive grains was performed by preparing a sieve having the same pattern as the above-described abrasive grain arrangement and having a hole that allows the abrasive grains to pass through, and dropping the abrasive grains from the sieve mesh.

Next, a SUS304 plate in which abrasive grains were arranged in a predetermined manner was set on the bottom surface of a mold of an injection molding machine. The abrasive grains of the set SUS304 plate faced the resin inflow side. The diameter of the bottom surface of the mold was 100 mm, and the inner volume of the mold was a cylindrical shape. The resin used was polyphenylene sulfide (PPS). Resin was introduced under the conditions of a mold temperature of 120 ° C., a cylinder temperature of the injection molding machine of 340 ° C., and an injection pressure of 98 MPa (1000 kgf / cm ² ) to integrate the abrasive grains and the resin. The amount of resin inflow in one shot was adjusted so that the thickness of the resin support material was 4 mm.

  By removing the SUS304 plate, a dresser for polishing cloth in which diamond abrasive grains were arranged at predetermined positions on a resin substrate having a diameter of 100 mm and a thickness of 4 mm was obtained. The height of the abrasive grains exposed from the resin substrate (abrasive grain protrusion height) was about 70 μm. The metal layer covering the abrasive grain surface exposed from the resin was removed by dipping in a solution of nitric acid: 40% hydrofluoric acid = 80: 3.

(Evaluation)
The metal elution amount, pad grinding speed, pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured by the following methods.

-Metal elution amount The amount of metal elution into the slurry is 1 dressing cloth dresser prepared in 1000 mL of a solution of commercially available W2000 (Cabot, tungsten slurry) mixed with 4% hydrogen peroxide. After immersion for 5 days, the metal elements, Ti, Ni, Al, Cu, Zn, Cr and Au in the slurry were measured by ICP emission spectroscopic analysis. Table 1 shows the total amount of these elements.

-Pad grinding speed, pad flatness after pad grinding, and number of diamond abrasive grains falling off The pad was ground using the prepared dressing cloth for polishing cloth. The pad was made of foamed polyurethane and the pad diameter was 250 mm. This pad was affixed on the polishing machine. The polishing cloth dresser obtained by the above method was fixed to a device having a rotating mechanism and a swinging mechanism in the radial direction of the pad, and a load of 2.0 kg was applied by the pressurizing mechanism and pressed against the pad.

  While the center of the dresser for polishing cloth was adjusted to the center of the pad, it was swung in the radial direction within a range of 30 mm to 90 mm from the center of the pad. The pad rotation speed was 90 rpm, the dresser rotation speed was 80 rpm, and the oscillation was 10 reciprocations / minute. The pad rotation direction and the dresser rotation direction were the same. Water was supplied to such an extent that the entire ground surface was covered with a water film.

  At the time when 5 minutes had elapsed after the start of grinding, the grinding was interrupted once, and the pad thickness was measured. The pad thickness was measured with a micrometer along two diameters perpendicular to each other. One diameter was divided into 10 equal intervals, and the average of 20 thickness measurement values near the center of the equally divided portion was determined to obtain the pad thickness. Grinding was continued again, and the pad thickness was measured in the same manner when 10 hours had elapsed.

  The pad grinding rate was determined from the decrease in pad thickness between 5 minutes and 10 hours later. The pad flatness was evaluated as a value obtained by subtracting the minimum value from the maximum value among the 20 pad thickness values measured after grinding for 10 hours. Furthermore, the dresser after use was determined from the observation with a stereomicroscope.

[Examples 2 to 19]
Polishing in the same manner as in Example 1 except that the immersion time of the diamond abrasive grains in the Ni plating bath was adjusted to change the thickness of the metal layer, and the conditions for forming the irregularities were changed as shown in Table 1. A cloth dresser was prepared. However, the plating bath containing the abrasive grains was stirred with a stirrer and immersed in a new plating bath when the immersion time exceeded 1800 seconds.

[Example 20]
A 0.1 μm Ti metal layer was formed on the abrasive grain surface by a pyrosol method. A Ni metal layer was formed on the Ti metal layer by electroless plating, and uneven portions were formed under the formation conditions shown in Table 1. Otherwise, a dresser for polishing cloth was produced in the same manner as in Example 1.

[Examples 21 to 36]
Polishing in the same manner as in Example 20, except that the immersion time of the diamond abrasive grains in the Ni plating bath was adjusted to change the thickness of the metal layer, and the conditions for forming the irregularities were changed as shown in Table 1. A cloth dresser was prepared. However, the plating bath containing the abrasive grains was stirred with a stirrer and immersed in a new plating bath when the immersion time exceeded 1800 seconds.

[Comparative Example 1]
A polishing cloth dresser was prepared in the same manner as in Example 1 except that the metal layer was not formed.

  All the metal elution amounts of the dresser for polishing cloth of the present invention were 0.05 mg / L or less (Examples 1 to 36). As a reference example, when the metal elution amount was measured in a dresser for Ni electrodeposited polishing cloth produced by trial using a conventionally known method, the metal elution amount was 100 to 200 mg / L.

  However, in the case where the distance between the concave and convex portions adjacent to the concave and convex portions is less than 0.05 (see Examples 1, 7, and 24), and when the distance exceeds 10 μm (Examples 18, 33, and 35). The anchor effect at the interface between the metal layer and the resin support was not sufficient, and some diamond abrasive grains dropped off. Moreover, when the difference in height between the bottom of adjacent concave portions and the highest portion of the convex portions is less than 0.05 μm (see Examples 1, 2, 7, 21, 24), a small number of diamond abrasive grains Dropout occurred. Therefore, it is possible to prevent the diamond from falling off by setting the distance between the adjacent concave portion and the convex portion of the concave and convex portions and the height of the bottom portion of the adjacent concave portion and the highest portion of the convex portion to 0.05 μm or more. I understand that. In Comparative Example 1 where no metal layer was formed, a large amount of diamond was dropped.

  In the dresser of the present invention, an excellent pad grinding rate of 4.0 μm / min and an excellent pad flatness of 2.5 μm or less could be obtained (Examples 1 to 36).

[Example 37]
(Formation of metal layer)
Single crystal artificial diamond abrasive grains having an average particle diameter d of 150 μm were coated with a Ti metal layer. Ti coating was performed using a DC magnetron sputtering apparatus, and metal Ti having a purity of 99.9% was used as a target. Diamond abrasive grains were arranged in a single layer on the substrate, and sputtering was stopped once in the course of sputtering, and the direction of the abrasive grains was changed. As a result, there were no abrasive grain parts not covered with the Ti metal layer. Sputtering was performed with an Ar gas of 0.3 Pa and an output of 1000 W. The thickness was controlled by the sputtering time. The coating conditions in Table 2 show the total sputtering time.

(Formation of irregularities)
The abrasive grains were immersed and stirred in an etching solution obtained by diluting 40 mL of nitric acid and 10 mL of 40% hydrofluoric acid with distilled water, thereby forming irregularities on the surface of the Ti metal layer covering the abrasive grains.

(Formation of resin support material)
In the same manner as in Example 1, a resin support material of polyphenylene sulfide (PPS) was formed, and a dresser for polishing cloth was obtained. The metal layer coated on the surface of the abrasive grain exposed from the resin support was immersed in an etching solution bath and removed. The etching solution was a solution in which the concentration of the etching solution used for forming irregularities on the metal layer was 95 to 100%.

(Evaluation)
The metal elution amount, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off of the dresser for polishing cloth obtained in the same manner as in Example 1 were measured. These results are shown in Table 2.

[Examples 38 to 40]
A dresser for an abrasive cloth was produced in the same manner as in Example 37 except that the conditions for forming the Ti metal layer (sputtering time) and the conditions for forming the irregularities were changed as shown in Table 2.

[Example 41]
(Formation of metal layer)
Single crystal artificial diamond abrasive grains having an average particle diameter d of 150 μm were coated with Al. Al coating was also performed by sputtering in the same manner as Ti coating. A metal Al target with a purity of 99.9% was used, and the output was 800 W. The sputtering time was the time shown in Table 2, and the other conditions were the same as in Example 37.

(Formation of irregularities)
Abrasive grains were immersed and stirred in an etching solution in which 75 mL of hydrochloric acid, 25 mL of nitric acid, and 5 mL of 40% hydrofluoric acid were diluted with distilled water to form uneven portions on the surface of the Al metal layer.

(Formation of resin support material)
Using a polyamide (PA), a resin support was formed in the same manner as in Example 1 under the conditions of a mold temperature of 80 ° C., an injection molding machine cylinder temperature of 280 ° C., and an injection pressure of 1310 kgf / cm ^2. Obtained. The metal layer coated on the surface of the abrasive grains exposed from the resin was removed by immersion in an etching solution bath. The etching solution was a solution in which the concentration of the etching solution used for forming irregularities on the metal layer was 95 to 100%.

(Evaluation)
In the same manner as in Example 1, the metal elution amount, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured. These results are shown in Table 2.

[Examples 42 to 45]
A dresser for a polishing pad was produced in the same manner as in Example 41 except that the conditions for forming the Al metal layer (sputtering time) and the conditions for forming the irregularities were changed as shown in Table 2. In the same manner as in Example 41, the metal elution amount, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling out of the resulting dressing cloth dresser were measured. These results are shown in Table 2.

[Example 46]
(Formation of metal layer)
Single crystal artificial diamond abrasive grains having an average particle diameter d of 150 μm were coated with 0.1 μm of Ti metal by a pyrosol method, and a Cu metal layer was formed thereon by electroplating. The Cu plating bath contained 70 g / L of cuprous cyanide, 90 g / L of sodium cyanide and 30 g / L of sodium carbonate, and had a pH of 11 and a bath temperature of 55 ° C. Plating conditions were a current density of 3A / dm ^2.

(Formation of irregularities)
Abrasive grains were immersed and stirred in an etching solution obtained by diluting 10 g of ammonium persulfate and 10 mL of hydrochloric acid with distilled water to form uneven portions on the surface of the Cu metal layer.

(Formation of resin support material)
Polybutylene terephthalate (PBT) was used as the resin. Under the conditions of a mold temperature of 60 ° C., an injection molding machine cylinder temperature of 240 ° C., and an injection pressure of 98 MPa (1000 kgf / cm ² ), a resin support was formed in the same manner as in Example 1 to obtain an abrasive cloth dresser. The metal layer coated on the surface of the abrasive grains exposed from the resin was removed by immersion in an etching solution bath. The etching solution was a solution in which the concentration of the etching solution used for forming irregularities on the metal layer was 95 to 100%.

(Evaluation)
In the same manner as in Example 1, the metal elution amount, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured. These results are shown in Table 2.

[Examples 47 to 53]
A dresser for an abrasive cloth was produced in the same manner as in Example 46 except that the formation conditions of the Cu metal layer (dipping conditions in the plating bath) and the formation conditions of the uneven portions were changed as shown in Table 2. In the same manner as in Example 46, the metal elution amount, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured. These results are shown in Table 2.

[Example 54]
(Formation of metal layer)
The surface of single crystal artificial diamond abrasive grains having an average particle diameter d of 150 μm was coated with Cu by electroless plating. Further, a Zn layer was formed by electroplating. Then, it hold | maintained at 550 degreeC for 5 minute (s) by Ar atmosphere, Cu and Zn were alloyed and it was set as the brass. At this time, the thickness of each plating was controlled so that the mass ratio was Cu 60 to 70% and Zn 30 to 40%.

  The electroless plating bath of Cu contains copper sulfate 8-12 g / L, Rossell salt 30-40 g / L, sodium hydroxide 8-10 g / L, and paraformaldehyde 8-12 g / L, pH 13 and temperature 20 ° C. did. The plating thickness was controlled by the immersion time of the diamond abrasive grains.

The Zn electroplating bath contained zinc cyanide 60 g / L, sodium cyanide 35 g / L, and sodium hydroxide 80 g / L, and the bath temperature was 25 ° C. Plating was carried out as a current density of 4A / dm ^2. The plating thickness of Zn was controlled by the plating time.

(Formation of irregularities)
The abrasive grains were immersed in an etching solution obtained by diluting 10 g of ammonium persulfate and 10 mL of hydrochloric acid with distilled water, and stirred to form uneven portions on the surface of the brass alloy layer.

(Formation of resin support material)
Using polyphenylene sulfide (PPS), a resin support was formed in the same manner as in Example 1, and a dresser for polishing cloth was obtained. The metal layer coated on the surface of the abrasive grains exposed from the resin was removed by immersion in an etching solution bath. The etching solution was a solution in which the concentration of the etching solution used for forming irregularities on the metal layer was 95 to 100%.

(Evaluation)
In the same manner as in Example 1, the metal elution amount, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured. These results are shown in Table 2.

[Examples 55 to 57]
Except for changing the formation conditions of the brass alloy layer (immersion time in the Cu plating bath and Zn plating bath) and the formation conditions of the concavo-convex portions as shown in Table 2, the dresser for polishing cloth was changed in the same manner as in Example 54. Produced. In the same manner as in Example 54, the metal elution amount, pad grinding speed, pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured. These results are shown in Table 2.

[Example 58]
(Formation of metal layer)
Single metal artificial diamond abrasive grains having an average particle diameter d of 150 μm were coated with 0.1 μm of Ti metal by a pyrosol method. Further, a Cr metal layer was formed by electroplating. The electroplating bath of Cr contained chromic anhydride 400 g / L, sodium hydroxide 60 g / L, chromium oxide 8 g / L, and sulfuric acid 0.8 g / L, and the bath temperature was 20 ° C. It was plated at a current density of 70A / dm ^2.

(Formation of irregularities)
The abrasive grains were immersed in an etching solution obtained by diluting 20 mL of nitric acid and 60 mL of hydrochloric acid with distilled water and stirred to form uneven portions on the surface of the Cr layer.

(Formation of resin support material)
Polybutylene terephthalate (PBT) was used as the resin. A resin support was formed in the same manner as in Example 1 under conditions of a mold temperature of 60 ° C., an injection molding machine cylinder temperature of 240 ° C., and an injection pressure of 98 MPa (1000 kgf / cm ² ). The metal layer coated on the surface of the abrasive grains exposed from the resin was removed by immersion in an etching solution bath. The etching solution was a solution in which the concentration of the etching solution used for forming irregularities on the metal layer was 95 to 100%.

(Evaluation)
In the same manner as in Example 1, the metal elution amount, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured. These results are shown in Table 2.

[Examples 59 to 65]
A dresser for a polishing cloth was prepared in the same manner as in Example 54 except that the formation conditions of the Cr metal layer (immersion time of Cr in the plating bath) and the formation conditions of the uneven portions were changed as shown in Table 2. In the same manner as in Example 58, the metal elution amount, pad grinding speed, pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured. These results are shown in Table 2.

[Example 66]
(Formation of metal layer)
Single crystal artificial diamond abrasive grains having an average particle diameter d of 150 μm were coated with 0.1 μm of Ti metal by a pyrosol method, and an Au—Cu alloy layer was formed by electroplating. The electroplating bath of Au—Cu alloy contained 3 g / L potassium gold cyanide, 14 g / L copper cyanide, 0.7 g / L thiourea, and 33 g / L potassium cyanide, and the bath temperature was 60 ° C. It was plated at a current density of 1.5A / dm ^2. By this plating, an approximately 50 mass% Au—Cu alloy layer was obtained.

(Formation of irregularities)
Abrasive grains were immersed and stirred in an etching solution in which 10 mL of nitric acid and 100 mL of hydrochloric acid were diluted with distilled water to form uneven portions on the surface of the Cr layer.

(Formation of resin support material)
Polycarbonate (PC) was used as the resin. A resin support was formed in the same manner as in Example 1 under the conditions of a mold temperature of 80 ° C., an injection molding machine cylinder temperature of 300 ° C., and an injection pressure of 147 MPa (1500 kgf / cm ² ). The metal layer coated on the surface of the abrasive grains exposed from the resin was removed by immersion in an etching solution bath. The etching solution was a solution in which the concentration of the etching solution used for forming irregularities on the metal layer was 95 to 100%.

(Evaluation)
In the same manner as in Example 1, the metal elution amount, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured. These results are shown in Table 2.

[Examples 67 to 70]
The dresser for polishing cloth was the same as in Example 66 except that the conditions for forming the Au—Cu alloy layer (the immersion time of Au—Cu in the plating bath) and the conditions for forming the irregularities were changed as shown in Table 2. Was made. In the same manner as in Example 66, the metal elution amount, the pad grinding rate, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured. These results are shown in Table 2.

  The metal elution amounts of Examples 37 to 70 were all 0.05 mg / L or less. Therefore, it can be seen that the metal elution amount can be suppressed by using the dresser for polishing cloth of the present invention.

  However, in the case where the distance between the concave and convex portions adjacent to the concave and convex portions exceeds 10 μm (Examples 53 and 65), the anchor effect at the interface between the metal layer and the resin support material is not sufficient. Diamond abrasive grains fell off. Further, even when the height between the bottom of adjacent concave portions and the highest portion of the convex portions is less than 0.05 (Examples 37, 41, 46, 54, 58, and 66), the anchor effect is not sufficient. Some diamond abrasive grains dropped out. Therefore, it can be seen that the drop-off of diamond can be suppressed by adjusting the interval between the concave and convex portions adjacent to each other and the height between the bottom of the adjacent concave portion and the highest portion of the convex portion. .

  Furthermore, with the dresser of the present invention, an excellent pad grinding rate of 4.0 μm / min and an excellent pad flatness of 2.5 μm or less could be obtained (Examples 37 to 70).

[Example 71]
Single crystal artificial diamond abrasive grains having an average particle diameter of 3 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. However, the diamond abrasive grains were randomly arranged. The interval between diamond abrasive grains was set to about 5 μm. Also, the diamond abrasive grains are temporarily fixed with a gel adhesive, and the abrasive grains are pushed in before the adhesive is solidified so that the protruding height of the abrasive grains is about half of the abrasive grain diameter. Adjusted.

  With respect to the obtained dressing material for polishing cloth, in the same manner as in Example 1, the metal elution amount, the pad grinding speed, the pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured. These results are shown in Table 3.

[Example 72]
Single crystal artificial diamond abrasive grains having an average particle diameter of 6 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. However, the diamond abrasive grains were randomly arranged. The interval between the diamond abrasive grains was set to about 10 μm. Also, the diamond abrasive grains are temporarily fixed with a gel adhesive, and the abrasive grains are pushed in before the adhesive is solidified so that the protruding height of the abrasive grains is about half of the abrasive grain diameter. Adjusted.

  For the resulting polishing cloth dresser, the metal elution amount, pad grinding rate, pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured in the same manner as in Example 1. These results are shown in Table 3.

[Example 73]
Single crystal artificial diamond abrasive grains having an average particle diameter of 12 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. The diamond abrasive grains were arranged at each vertex of the square matrix in the same manner as in Example 1. Moreover, the thickness of the heat-resistant double-sided tape used for temporary fixing was set to half the average particle diameter.

  For the resulting polishing cloth dresser, the metal elution amount, pad grinding rate, pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured in the same manner as in Example 1. These results are shown in Table 3.

[Example 74]
Single crystal artificial diamond abrasive grains having an average particle diameter of 50 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. The diamond abrasive grains were arranged at each vertex of the square matrix in the same manner as in Example 1. Moreover, the thickness of the heat-resistant double-sided tape used for temporary fixing was set to half the average particle diameter.

  For the resulting polishing cloth dresser, the metal elution amount, pad grinding rate, pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured in the same manner as in Example 1. These results are shown in Table 3.

[Example 75]
Single crystal artificial diamond abrasive grains having an average grain size of 85 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. The diamond abrasive grains were arranged at each vertex of the square matrix in the same manner as in Example 1. Moreover, the thickness of the heat-resistant double-sided tape used for temporary fixing was set to half the average particle diameter.

  For the resulting polishing cloth dresser, the metal elution amount, pad grinding rate, pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured in the same manner as in Example 1. These results are shown in Table 3.

[Example 76]
Single crystal artificial diamond abrasive grains having an average particle diameter of 150 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. The diamond abrasive grains were arranged at each vertex of the square matrix in the same manner as in Example 1. Moreover, the thickness of the heat-resistant double-sided tape used for temporary fixing was set to half the average particle diameter.

  For the resulting polishing cloth dresser, the metal elution amount, pad grinding rate, pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured in the same manner as in Example 1. These results are shown in Table 3.

[Example 77]
Single crystal artificial diamond abrasive grains having an average particle diameter of 200 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. The diamond abrasive grains were arranged at each vertex of the square matrix in the same manner as in Example 1. Moreover, the thickness of the heat-resistant double-sided tape used for temporary fixing was set to half the average particle diameter.

  For the resulting polishing cloth dresser, the metal elution amount, pad grinding rate, pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured in the same manner as in Example 1. These results are shown in Table 3.

[Example 78]
Single crystal artificial diamond abrasive grains having an average particle diameter of 280 μm were used. A dresser for an abrasive cloth was produced in the same manner as in Example 1 except that the immersion time of the abrasive grains in the Ni plating bath and the conditions for forming the irregularities were changed as shown in Table 3. The diamond abrasive grains were arranged at each vertex of the square matrix in the same manner as in Example 1. Moreover, the thickness of the heat-resistant double-sided tape used for temporary fixing was set to half the average particle diameter.

  For the resulting polishing cloth dresser, the metal elution amount, pad grinding rate, pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured in the same manner as in Example 1. These results are shown in Table 3.

[Example 79]
Single crystal artificial diamond abrasive grains having an average grain size of 320 μm were used. A dresser for a polishing cloth was produced in the same manner as in Example 1 except that the immersion time of the diamond abrasive grains in the Ni plating bath of the abrasive grains and the conditions for forming the irregularities were changed as shown in Table 3. The diamond abrasive grains were arranged at each vertex of the square matrix in the same manner as in Example 1. Moreover, the thickness of the heat-resistant double-sided tape used for temporary fixing was set to half the average particle diameter.

  For the resulting polishing cloth dresser, the metal elution amount, pad grinding rate, pad flatness after pad grinding, and the number of diamond abrasive grains falling off were measured in the same manner as in Example 1. These results are shown in Table 3.

  The metal elution amounts of Examples 71 to 79 measured in the same manner as in Example 1 were all 0.05 mg / L or less. Therefore, it can be seen that the metal elution amount can be suppressed by using the dresser for polishing cloth of the present invention.

  However, when the diameter of the diamond abrasive grains was less than 5 μm (Example 71), the anchor effect was low, and a small number of diamond abrasive grains fell off. On the other hand, when the abrasive grain system exceeded 300 μm (Example 79), the pad grinding speed was improved, but the flatness exceeded 2.5 μm, which was lower than the other examples.

  With the dresser of the present invention, an excellent pad grinding rate of 4.0 μm / min and an excellent pad flatness of 2.5 μm or less could be obtained (Examples 71 to 79).

  ADVANTAGE OF THE INVENTION According to this invention, the dresser for polishing cloths with few fallen of an abrasive grain and little metal elution when a pad is ground can be obtained. Therefore, the dresser for polishing cloth of the present invention can be applied to dressing polishing pads of various polishing apparatuses.

DESCRIPTION OF SYMBOLS 1 Diamond abrasive grain 2 Metal layer 3 Resin support material

Claims (7)

A polishing cloth dresser in which a plurality of abrasive grains are fixed to a single layer on the surface of a resin support,
A dresser for abrasive cloth, wherein a metal layer is present between the resin support material and the abrasive grains, and the surface of the metal layer on the side in contact with the resin support material has an uneven portion.   The dresser for polishing cloth according to claim 1, wherein the metal layer has a thickness of 0.1 to 20 µm.   The uneven portion of the metal layer has an interval between adjacent concave portions and convex portions of 0.05 μm to 10 μm, and a difference in height between the bottom of the adjacent concave portion and the highest portion of the convex portion is 0.05 μm to The dresser for abrasive cloth according to claim 1, wherein the dresser is 15 μm.   The said metal layer is comprised from at least 1 or more types of metal of Ti, Ni, Al, Cu, brass, Cr, Au, The polishing cloth as described in any one of Claims 1-3 characterized by the above-mentioned. dresser.   The abrasive cloth dresser according to any one of claims 1 to 4, wherein the grain size of the abrasive grains is 5 µm or more and 300 µm or less.   The abrasive cloth dresser according to any one of claims 1 to 5, wherein the abrasive grains are diamond abrasive grains. It is a manufacturing method of the dresser for abrasive cloths as described in any one of Claims 1-6,
Forming a metal layer on the surface of the abrasive grains;
Etching the metal layer to form the irregularities;
Fixing the abrasive grains to a resin support through an etched metal layer;
A method for producing a dresser for polishing cloth, comprising:

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