JP2012229454A5 - - Google Patents
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- Publication number
- JP2012229454A5 JP2012229454A5 JP2011096591A JP2011096591A JP2012229454A5 JP 2012229454 A5 JP2012229454 A5 JP 2012229454A5 JP 2011096591 A JP2011096591 A JP 2011096591A JP 2011096591 A JP2011096591 A JP 2011096591A JP 2012229454 A5 JP2012229454 A5 JP 2012229454A5
- Authority
- JP
- Japan
- Prior art keywords
- sputtering target
- alloy
- contained
- producing
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 claims 11
- 238000005477 sputtering target Methods 0.000 claims 10
- 229910045601 alloy Inorganic materials 0.000 claims 6
- 239000000956 alloy Substances 0.000 claims 6
- 239000002994 raw material Substances 0.000 claims 6
- 229910052787 antimony Inorganic materials 0.000 claims 5
- 150000001875 compounds Chemical class 0.000 claims 5
- 229910052802 copper Inorganic materials 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 3
- 229910005542 GaSb Inorganic materials 0.000 claims 2
- 229910052733 gallium Inorganic materials 0.000 claims 2
- 239000012535 impurity Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910000807 Ga alloy Inorganic materials 0.000 claims 1
- -1 NaF compound Chemical class 0.000 claims 1
- 229910000905 alloy phase Inorganic materials 0.000 claims 1
- 229910002056 binary alloy Inorganic materials 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011096591A JP5153911B2 (ja) | 2011-04-22 | 2011-04-22 | スパッタリングターゲット及びその製造方法 |
| EP12774193.2A EP2700735B1 (en) | 2011-04-22 | 2012-04-20 | Sputtering target and method for producing same |
| CN201280003518.XA CN103261473B (zh) | 2011-04-22 | 2012-04-20 | 溅射靶及其制造方法 |
| TW101114153A TWI438296B (zh) | 2011-04-22 | 2012-04-20 | Sputtering target and its manufacturing method |
| US14/111,504 US9528181B2 (en) | 2011-04-22 | 2012-04-20 | Sputtering target and method for producing same |
| PCT/JP2012/061301 WO2012144655A1 (ja) | 2011-04-22 | 2012-04-20 | スパッタリングターゲット及びその製造方法 |
| KR1020137011164A KR101358345B1 (ko) | 2011-04-22 | 2012-04-20 | 스퍼터링 타겟 및 그 제조방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011096591A JP5153911B2 (ja) | 2011-04-22 | 2011-04-22 | スパッタリングターゲット及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012229454A JP2012229454A (ja) | 2012-11-22 |
| JP2012229454A5 true JP2012229454A5 (cg-RX-API-DMAC7.html) | 2013-01-10 |
| JP5153911B2 JP5153911B2 (ja) | 2013-02-27 |
Family
ID=47041745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011096591A Expired - Fee Related JP5153911B2 (ja) | 2011-04-22 | 2011-04-22 | スパッタリングターゲット及びその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9528181B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2700735B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5153911B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101358345B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN103261473B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI438296B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2012144655A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9822430B2 (en) | 2012-02-29 | 2017-11-21 | The United States Of America As Represented By The Secretary Of The Army | High-density thermodynamically stable nanostructured copper-based bulk metallic systems, and methods of making the same |
| JP5594618B1 (ja) * | 2013-02-25 | 2014-09-24 | 三菱マテリアル株式会社 | スパッタリングターゲット及びその製造方法 |
| JP6176535B2 (ja) * | 2013-02-25 | 2017-08-09 | 三菱マテリアル株式会社 | スパッタリングターゲット及びその製造方法 |
| JP6651438B2 (ja) * | 2013-09-27 | 2020-02-19 | プランゼー エスエー | 銅−ガリウムスパッタリングターゲット |
| CN108772567A (zh) * | 2018-06-29 | 2018-11-09 | 米亚索乐装备集成（福建）有限公司 | 一种用于cig靶材打底层的合金材料、cig靶材及其制备方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1157652A (en) * | 1966-06-15 | 1969-07-09 | Ass Elect Ind | Hardened Copper-Bismuth Base Alloys |
| JP3249408B2 (ja) | 1996-10-25 | 2002-01-21 | 昭和シェル石油株式会社 | 薄膜太陽電池の薄膜光吸収層の製造方法及び製造装置 |
| JP2002064062A (ja) * | 2000-08-17 | 2002-02-28 | Honda Motor Co Ltd | 化合物半導体の成膜方法 |
| WO2005005683A1 (ja) | 2003-07-15 | 2005-01-20 | Nikko Materials Co., Ltd. | スパッタリングターゲット及び光記録媒体 |
| US7803209B2 (en) | 2004-11-30 | 2010-09-28 | Nippon Mining & Metals Co., Ltd | Sb-Te alloy sintered compact sputtering target |
| JP2006351142A (ja) * | 2005-06-20 | 2006-12-28 | Sony Corp | 光記録媒体およびその製造方法ならびにスパッタリングターゲット |
| TWI432592B (zh) | 2007-04-27 | 2014-04-01 | Honeywell Int Inc | 具有降低預燒時間之濺鍍靶，其製造方法及其用途 |
| JP5192990B2 (ja) * | 2008-11-11 | 2013-05-08 | 光洋應用材料科技股▲分▼有限公司 | 銅−ガリウム合金スパッタリングターゲット及びそのスパッタリングターゲットの製造方法並びに関連用途 |
| US20100116341A1 (en) * | 2008-11-12 | 2010-05-13 | Solar Applied Materials Technology Corp. | Copper-gallium allay sputtering target, method for fabricating the same and related applications |
| JP5643524B2 (ja) * | 2009-04-14 | 2014-12-17 | 株式会社コベルコ科研 | Ｃｕ−Ｇａ合金スパッタリングターゲットおよびその製造方法 |
| JP2010280944A (ja) * | 2009-06-04 | 2010-12-16 | Hitachi Cable Ltd | Ｃｕ−Ｇａ合金、スパッタリングターゲット、Ｃｕ−Ｇａ合金の製造方法、スパッタリングターゲットの製造方法 |
| JP4793504B2 (ja) * | 2009-11-06 | 2011-10-12 | 三菱マテリアル株式会社 | スパッタリングターゲット及びその製造方法 |
-
2011
- 2011-04-22 JP JP2011096591A patent/JP5153911B2/ja not_active Expired - Fee Related
-
2012
- 2012-04-20 EP EP12774193.2A patent/EP2700735B1/en not_active Not-in-force
- 2012-04-20 CN CN201280003518.XA patent/CN103261473B/zh not_active Expired - Fee Related
- 2012-04-20 US US14/111,504 patent/US9528181B2/en not_active Expired - Fee Related
- 2012-04-20 WO PCT/JP2012/061301 patent/WO2012144655A1/ja not_active Ceased
- 2012-04-20 TW TW101114153A patent/TWI438296B/zh not_active IP Right Cessation
- 2012-04-20 KR KR1020137011164A patent/KR101358345B1/ko not_active Expired - Fee Related
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