JP2012227450A - Replacement method of unit wiring board of aggregate substrate, and aggregate substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate conversion of a product sheet to a good one by attaching a good unit wiring board to a place where a defective unit wiring board is removed in the product sheet with good positional accuracy.SOLUTION: An adhesive sheet sticking area is formed in a scrap part 3 of a product sheet 1. After a positioning jig is set to stand up in a product outline punching cavity 9 on the periphery of a defective unit wiring board, a double-sided adhesive sheet 12 is stuck to a defective unit wiring board 2A, joint parts and an adhesive sheet sticking area. Then, by cutting the joint parts and leaving part of the double-sided adhesive sheet 12 in the adhesive sheet sticking area, the defective unit wiring board 2A is separated and removed from the product sheet 1, and a good unit wiring board 2B is positioned to the place where the defective unit wiring board 2A has been removed, by using a positioning jig 7. A sticking area for a good unit wiring board 2B and the adhesive sheet sticking area of the scrap part 3 are adhered and fixed via the double-sided adhesive sheet 12.

Description

  The present invention relates to a unit wiring board replacement method for an assembly board in which a plurality of unit wiring boards are imposed on a product sheet, and an assembly board, and in particular, a defective unit wiring board existing in a product sheet is replaced with a good unit wiring board. The present invention relates to a unit wiring board replacement method for a collective substrate and a collective substrate, in which the product sheet is replaced with a non-defective product.

  Conventionally, various techniques for dealing with a case where a defective unit wiring board exists in a collective substrate composed of a plurality of unit wiring boards have been reported. For example, when there is a defective unit wiring board in a collective board where a plurality of unit wiring boards are applied to the same product sheet, when mounting components automatically, the defective unit wiring board Disclosed is a technology that displays defects so that expensive parts are not mounted, reads the defective unit wiring board with an image recognition device, etc., skips the location of the defective unit wiring board, and mounts the components only on the good unit wiring board. (See Patent Document 1).

  However, skipping the defective unit wiring board and mounting the components are factors that reduce the productivity of the mounting work, and an expensive image recognition device or the like must be installed in the component mounting apparatus, which reduces the equipment cost. It will also be a factor that greatly increases. Therefore, if there are more than a predetermined number of defective unit wiring boards in a collective board with multiple unit wiring boards on the same product sheet, discard the entire product sheet without using it. Has been done.

  In particular, when mounting a component using an inexpensive component mounting apparatus not equipped with a mechanism for identifying a defective unit wiring board, if even one defective unit wiring board exists in the product sheet, discard the product sheet However, component mounting is performed only on product sheets that are non-defective unit wiring boards. However, in this method, if there is even one defective unit wiring board in the product sheet, the entire product sheet, that is, the entire product sheet including many non-defective unit wiring boards must be discarded. It becomes a factor leading to up.

  Also disclosed is a technique for replacing a defective unit wiring board from a product sheet in which unit wiring boards are continuously arranged to make the product sheet a non-defective product (see Patent Document 2). According to this, in the collective substrate in which the circuit pattern portions are continuously arranged on the product sheet, the normal circuit pattern can be obtained by removing the defective circuit pattern portion by using the positioning means, the substrate fixing means and the adhesive means. Other unit wiring boards with printed portions can be bonded and fixed with high accuracy.

  Furthermore, a technique for replacing a defective unit wiring board from a collective board in which a plurality of unit wiring boards are arranged in a row is also disclosed (see Patent Documents 3 and 7). According to this, it is necessary to fit the replaced unit wiring board to a predetermined position of the collective substrate or to fill the gap at the side end of the fitted unit wiring board with the adhesive.

  On the other hand, there is also disclosed a technique in which a defective unit wiring board is cut out from a frame or scrap portion of a collective substrate, and then a non-defective unit wiring board is fitted into the cut out portion and coupled by a bridge (see Patent Document 4). In addition, by attaching multiple unit wiring boards to the product sheet frame with a detachable separation bridge, removing only the defective unit wiring board and replacing it with a non-defective unit wiring board, the good unit wiring that has been discarded so far A technique using a plate is also disclosed (see Patent Document 5). Furthermore, a method is also disclosed in which the connection after changing to a non-defective unit wiring board is performed with an adhesive at the bridge portion (see Patent Document 6).

JP-A-11-191668 JP 2000-252605 A Japanese Patent Laid-Open No. 10-247656 JP-A 64-44889 JP 2001-203482 A JP 2005-38953 A JP 2010-40949 A

  However, all of the techniques described in Patent Documents 3 to 7 are to be coupled at the side end wall of the unit wiring board, or to be fitted to the frame. For this reason, it is applied only when a rigid printed wiring board having a certain thickness or a rigid frame is used. For a flexible wiring board (Flexible Printed Circuit, FPC) that is thin and flexible. Cannot be used. In addition, since the positional accuracy is becoming stricter due to the recent increase in the density of component mounting, when the defective unit wiring board and the non-defective unit wiring board existing in the product sheet are replaced, the fine positional accuracy is cleared. Such a replacement technique is necessary.

  In Patent Document 7, for example, in a product sheet in which thin flexible unit wiring boards (flexible wiring boards FPC) are continuously arranged, a defective unit wiring board is replaced with a non-defective unit wiring board to make the product sheet non-defective. Techniques to do this are disclosed. In this technique, a positioning guide hole is first drilled in the scrap portion of the product sheet, and after the area including the defective unit wiring board and not including the guide hole is cut and removed, the other area including the guide hole is defective. A method is adopted in which non-defective unit wiring boards cut in the same shape as the unit wiring board are positioned and bonded together by guide holes.

  According to this method, it is possible to replace a defective unit wiring board with a non-defective unit wiring board with high positional accuracy, and it is possible to use a product sheet that has been discarded so far as a non-defective product. However, depending on the product shape, it becomes difficult to provide a guide hole for positioning in the scrap portion.

  In addition, when the good unit wiring board is positioned and bonded together with the guide hole, an overlapping portion is generated, and an adhesive means is inserted in the overlapping portion. In this case, it is very difficult to use a micro-sized flexible wiring board FPC. Work is forced. In addition, when the adhesive is dropped with a dispenser, a small-sized adhesive sheet must be attached, which requires advanced techniques and is difficult.

  Therefore, a technology that should be solved in order to easily make a product sheet good even if it is a flexible wiring board with a small size by attaching a good unit wiring board to the location where the defective unit wiring board is removed on the product sheet with high positional accuracy. The present invention aims to solve this problem.

  The present invention has been proposed in order to achieve the above object, and the invention according to claim 1 is a product sheet of a collective substrate in which a plurality of unit wiring boards are formed by punching out a portion excluding a joint portion in a product sheet. When there is a defective unit wiring board, a method of replacing the defective unit wiring board with a non-defective unit wiring board is a unit wiring board replacement method for a collective board, and a plurality of locations in a scrap part that is a peripheral part of the unit wiring board of a product sheet. A first step of forming an adhesive sheet bonding area in the vicinity of the joint part, a second step of standing an alignment jig in a product outer shape punching cavity around the defective unit wiring board, and the defective unit A third step of attaching the double-sided adhesive sheet to the wiring board, joint part and adhesive sheet bonding area; A fourth step of separating and removing the defective unit wiring board from the product sheet in a state in which a part of the double-sided adhesive sheet remains in the adhesive sheet bonding area, and the wiring board main body is the defective A non-defective unit wiring board having the same shape as the unit wiring board and having a bonding area corresponding to the adhesive sheet bonding area is positioned with a positioning jig at the defective unit wiring board removal portion, and the good unit A unit wiring board replacement method for a collective board, comprising: a fifth step of bonding and fixing a bonding area of a wiring board and an adhesive sheet bonding area of the scrap portion through the double-sided adhesive sheet I will provide a.

  According to this method, adhesive sheet bonding areas are formed in the vicinity of the joints at a plurality of locations in the scrap part in advance, and when a defective unit wiring board is found, a product outline punching cavity around the defective unit wiring board Set up an alignment jig. Next, after pasting the double-sided adhesive sheet on the defective unit wiring board, joint part and adhesive sheet bonding area, cut the joint part and leave part of the double-sided adhesive sheet in the adhesive sheet bonding area In such a state, the defective unit wiring board is separated and removed from the product sheet.

  Then, the defective unit wiring board is removed from the non-defective unit wiring board having the same shape as that of the defective unit wiring board and having a bonding area corresponding to the adhesive sheet bonding area on the scrap part side. Place it at a location and position it with an alignment jig. Thereafter, the bonding area of the non-defective unit wiring board and the adhesive sheet bonding area of the scrap portion are bonded and fixed via the double-sided adhesive sheet. As a result, the non-defective unit wiring board is replaced with high positional accuracy at the defective unit wiring board removal portion of the product sheet.

  According to a second aspect of the present invention, there is provided a unit wiring board replacement method for an aggregate board according to the first aspect, wherein the unit wiring board is a flexible wiring board.

  According to this method, even when a defective flexible wiring board is mixed in the product sheet, only the defective flexible wiring board can be replaced with a non-defective flexible wiring board.

  According to a third aspect of the present invention, the circuit metal foil and the cover film formed on the unit wiring board take off the bonding portion between the bonding area of the non-defective unit wiring board and the adhesive sheet bonding area of the scrap portion. The method for replacing a unit wiring board of a collective substrate according to claim 1, wherein the method is replaced.

  According to this method, since the circuit metal foil and the cover film formed on the unit wiring board have been removed from the adhesive bonding portion between the adhesive sheet bonding area and the adhesive sheet bonding area, Only a change in the thickness of the bonded joint is minimized.

  The invention according to claim 4 is the unit wiring board replacement method for a collective substrate according to claim 1, wherein the double-sided adhesive sheet is a double-sided adhesive sheet with a release film having a peeling half-cut. provide.

  According to this method, after the double-sided adhesive sheet is attached to the defective unit wiring board, the release film is peeled off from the double-sided adhesive sheet, and then the defective unit wiring board is punched from the product sheet to be separated and removed. In this case, since the release film has a half cut, the release film can be easily peeled off.

  In the invention according to claim 5, when there is a defective unit wiring board in the product sheet of the collective substrate in which a portion excluding the joint portion is punched to form a plurality of unit wiring boards, the defective unit wiring board is punched and removed. A collective substrate for fixing and replacing a non-defective unit wiring board at a location, wherein an adhesive sheet bonding area is formed in the vicinity of a joint portion at a plurality of locations in a scrap portion that is a peripheral portion of the unit wiring board of the product sheet, and a defective unit The non-defective unit wiring board is positioned with an alignment jig erected in the cavity of the product outer shape on the outer periphery of the wiring board, and the bonding area provided on the non-defective unit wiring board and the adhesive sheet bonding area of the scrap part are Provided is a collective substrate characterized by being bonded and fixed through a double-sided adhesive sheet.

  According to this configuration, after positioning the non-defective unit wiring board with the alignment jig, the adhesive sheet bonding area on the scrap portion side and the bonding area on the non-defective unit wiring board side are fixed via the double-sided adhesive sheet. . Thereby, in place of the defective unit wiring board in the product sheet, the non-defective unit wiring board is replaced with high positional accuracy.

  The invention according to claim 6 provides the collective board according to claim 5, wherein the unit wiring board is a flexible wiring board.

  According to this configuration, when a defective flexible wiring board is mixed in the product sheet, only the defective flexible wiring board can be replaced with a non-defective flexible wiring board.

  In the invention according to claim 7, the adhesive sheet bonding area of the scrap portion is formed at a plurality of locations facing the unit wiring board, and the double-sided adhesive sheet is spaced apart on both sides in the facing direction. 6. The collective substrate according to claim 5, wherein the collective substrate is divided.

  According to this configuration, the double-sided adhesive sheet to be attached to the defective unit wiring board has a divided shape that is separated in the facing direction of the adhesive sheet bonding area of the scrap portion, that is, the facing direction in the double-sided adhesive sheet What cut | disconnected the intermediate part can be used.

  Since the defective unit wiring board can be replaced with a non-defective unit wiring board on the product sheet, the product sheet that has been conventionally disposed of can be easily made non-defective, and the non-defective unit wiring can be obtained. Since the accuracy of the replacement position of the plate can be secured, it can be adapted to high-density mounting of electronic components.

  In the invention described in claim 2, since only the defective flexible wiring board can be replaced with a non-defective flexible wiring board, in addition to the effect of the invention described in claim 1, the replacement work of the non-defective flexible wiring board can be performed easily and quickly. This makes it possible to improve the quality of product sheets.

  Since invention of Claim 3 can suppress to the minimum that the thickness of the adhesion joining part of an adhesive sheet bonding area and an adhesive sheet bonding area changes, in addition to the effect of the invention of Claim 1 As a result, it is possible to prevent the occurrence of a conveyance defect when mounting electronic components and to easily cope with high-density mounting.

  Since the invention of claim 4 uses a double-sided adhesive sheet with a release film with a half-cut for peeling, in addition to the effect of the invention of claim 1, the release film can be easily peeled off. In addition, the adhesive strength of the double-sided adhesive sheet is increased, and the fixing strength of the non-defective unit wiring board to the product sheet can be improved.

  In the invention according to claim 5, since the defective unit wiring board can be replaced with a non-defective unit wiring board on the product sheet, the product sheet that has been conventionally discarded can be easily made good. In addition, since the accuracy of the replacement position of the good unit wiring board is improved, it can be easily adapted to high-density mounting of electronic components.

  In the invention described in claim 6, since only the defective flexible wiring board can be replaced with a non-defective flexible wiring board, in addition to the effect of the invention described in claim 5, the replacement work of the non-defective flexible wiring board is efficiently performed. The product sheet can be improved.

  Since the invention according to claim 7 can use the double-sided adhesive sheet obtained by cutting away the intermediate portion in the opposite direction, the amount of use of the double-sided adhesive sheet can be reduced in addition to the effect of the invention according to claim 5. In addition, the double-sided adhesive sheet can be easily and quickly bonded, and the adhesive strength of the double-sided adhesive sheet to the adhesive sheet bonding area can be increased.

The top view of the aggregate substrate applied to this invention. The top view explaining the product sheet | seat and product unit external shape which concern on Example 1 of this invention. The process figure explaining a state when bonding the double-sided adhesive sheet which concerns on Example 1 of this invention. AA sectional view of the product sheet shown in FIG. Process drawing explaining a state when the defective unit wiring board according to the first embodiment of the present invention is punched and removed. The process drawing explaining the state when the good unit wiring board which concerns on Example 1 of this invention is positioned and bonded together. BB sectional drawing of the product sheet | seat shown in FIG. The process drawing which shows the unit wiring board replacement | exchange method of the aggregate substrate which concerns on Example 2 of this invention. Process drawing which shows the unit wiring board replacement | exchange method of the aggregate substrate which concerns on Example 3 of this invention.

  The present invention achieves the object of easily making a product sheet non-defective even if it is a micro-sized flexible wiring board by attaching a non-defective unit wiring board to a location where a defective unit wiring board is removed on the product sheet with high positional accuracy. Therefore, when there is a defective unit wiring board in the product sheet of the collective substrate formed by punching out the part other than the joint portion in the product sheet, the defective unit wiring board is replaced with a non-defective unit wiring board. 1st step of forming an adhesive sheet bonding area in the vicinity of joint portions at a plurality of locations in a scrap portion that is a peripheral portion of a unit wiring board of a product sheet, A second step of erecting an alignment jig in the product outer shape punching cavity around the defective unit wiring board; A third step of affixing a double-sided adhesive sheet to the defective unit wiring board, the joint part and the adhesive sheet bonding area; and cutting the joint part to form a double-sided adhesive sheet in the adhesive sheet bonding area. A fourth step of separating and removing the defective unit wiring board from the product sheet in a state in which the part remains, and the wiring board body has the same shape as the defective unit wiring board, and the adhesive sheet is bonded together A non-defective unit wiring board having a sticking area corresponding to the area is positioned with an alignment jig at the defective unit wiring board removal portion, and the sticking area of the non-defective unit wiring board and the adhesive sheet bonding area of the scrap part Is realized by a unit wiring board replacement method for a collective board, which includes a fifth step of bonding and fixing via a double-sided adhesive sheet.

  Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a collective substrate applied to the present invention. As shown in the figure, a plurality of unit wiring boards 2, 2... Are continuously formed in a long shape on a product sheet 1 of a collective substrate. Therefore, by using an insert machine or the like, electronic components and the like can be automatically and continuously mounted on each unit wiring board 2, 2,. When a defective unit wiring board is present in the plurality of unit wiring boards 2, 2..., In order to make the product sheet 1 nondefective, the defective unit wiring board is removed from the product sheet 1. It can be replaced with a prepared good unit wiring board. The collective substrate is not limited to a long shape but can be applied to a flat sheet.

  As shown in FIG. 2, the product sheet 1 includes, for example, a unit wiring board 2 that is a flexible wiring board, a frame-shaped scrap portion 3 that forms an outer peripheral portion of the unit wiring board 2, and the scrap portion 3 and unit wiring. It consists of joint parts 4a and 4b that connect the central part of the horizontal side of the plate 2. A broken line 5 in the product sheet 1 indicates a product unit outer shape that is an outer shape of the unit wiring board 2. Specifically, the unit wiring board 2 is formed by punching out portions of the product sheet 1 except for the joint portions 4a and 4b with a mold.

  As shown in FIG. 3, when the defective unit wiring board 2A exists in the product sheet 1, the defective unit wiring board 2A is removed to make the product sheet 1 good, and the good unit wiring is used instead. Replace with a plate (reference numeral 2B in FIG. 6).

  The unit wiring board replacement method according to the present embodiment will be described below. First, as shown in FIG. 3, adhesive sheet bonding areas 6 a and 6 b are formed in advance at locations corresponding to the joint portions 4 a and 4 b in the scrap portion 3. The adhesive sheet bonding areas 6a and 6b are formed so as to face each other in the vertical direction of the defective unit wiring board 2A (unit wiring board 2) by being formed continuously with the joint portions 4a and 4b. In the case of a product sheet formed only with a non-defective unit wiring board, if the defective unit wiring board 2A is found as it is, a plurality of sheets facing each other on both the left and right sides of the defective unit wiring board 2A (four in FIG. 3) The positioning jig 7 having the positioning member is prepared, and this is erected in the product outer shape punching cavity 9 on the outer peripheral side of the defective unit wiring board 2A.

  As shown in FIG. 4, the alignment jig 7 is installed at a predetermined position on the jig base 8 that supports the product sheet 1. In this case, the positioning jig 7 is set so that the inner surface of the alignment jig 7 contacts the laterally outer surface of the defective unit wiring board 2A. Next, a double-sided adhesive sheet (hereinafter referred to as an adhesive sheet) 12 is attached to the surfaces of the defective unit wiring board 2A, the joint portions 4a and 4b, and the adhesive sheet bonding areas 6a and 6b.

  As the adhesive sheet 12, a sheet having a release film 11 attached to the surface thereof is used. The adhesive sheet 12 has a shape and dimension corresponding to the shape of the defective unit wiring board 2A (product unit outer shape portion 5) and the shapes of the joint portions 4a and 4b and the adhesive sheet bonding areas 6a and 6b. In addition, the area of the parts 16a and 16b corresponding to the adhesive sheet bonding areas 6a and 6b in the adhesive sheet 12 is set to be smaller than the adhesive sheet bonding areas 6a and 6b.

  Next, after removing the release film 11 from the surface of the adhesive sheet 12, the defective unit wiring board 2A is separated from the product sheet 1 by cutting with a punching die at the joint portions 4a and 4b as shown in FIG. Remove. In this case, the joint portions 4a and 4b are separated and removed from the product sheet 1 together with the defective unit wiring board 2A in a state where the joint parts 4a and 4b are coupled to the defective unit wiring board 2A. Thereby, as shown in FIG. 6, the portions 16 a and 16 b on both sides in the longitudinal direction of the adhesive sheet 12 remain in the adhesive sheet bonding areas 6 a and 6 b on the scrap part 3 side.

  Then, a non-defective unit wiring board 2B having substantially the same shape as the defective unit wiring board 2A is attached to the defective unit wiring board removal portion of the product sheet 1, as shown in FIG. The non-defective unit wiring board 2B includes a wiring board body 22, joints 24a and 24b, and adhesive sheet bonding areas (sticking areas) 26a and 26b. The wiring body 22 is the product shown in FIG. It has the same shape as the unit outer portion 5. Further, the joint portions 24a, 24b and the adhesive sheet bonding areas 26a, 26b of the non-defective unit wiring board 2B are respectively connected to the joint portions 14a, 14b of the adhesive sheet 12 and the adhesive sheet bonding area 16a, shown in FIG. It has a size and shape substantially the same as the size and shape of 16b.

  Here, when attaching the non-defective unit wiring board 2B to the product sheet 1, as shown in FIG. 4, the non-defective unit wiring board 2B for the scrap portion 3 is used by using the alignment jig 7 standing on the jig base 8. Perform position alignment. As a result, the adhesive sheet bonding area 26a, 26b on the non-defective unit wiring board 2B side is matched with the adhesive sheet bonding area 6a, 6b on the scrap part 3 side, and then the adhesive sheet bonding area 6a, The adhesive sheet bonding areas 6a and 6b on the scrap part 3 side and the adhesive sheet bonding areas 26a and 26b of the non-defective unit wiring board 2B are connected via the bonding areas 16a and 16b of the adhesive sheet 12 remaining in 6b. Glue.

  FIG. 7 shows a state where the adhesive sheet bonding area 26b of the non-defective unit wiring board 2B is bonded to the adhesive sheet bonding area 6b on the scrap part 3 side via the bonding area 16b of the adhesive sheet 12. Show. As shown in the figure, the scrap part 3 and the non-defective unit wiring board 2B are configured by laminating circuit metal foils 18 and 18 and cover films 19 and 19 on both front and back surfaces of the insulating base 17, but these adhesives The sheet bonding areas 6b and 26b are composed only of the insulating base 17, and the circuit metal foils 18 and 18 and the cover films 19 and 19 are removed.

  In the present invention, the joint portions between the adhesive sheet bonding areas 6a and 6b on the scrap part 3 side and the adhesive sheet bonding areas 26a and 26b of the non-defective unit wiring board 2B are the circuit metal foils 18 and 18 and the cover film 19. , 19 is removed, the thickness change of the joint portion is minimized. Accordingly, it is possible to prevent the occurrence of conveyance troubles when mounting electronic components.

  As described above, according to the present invention, when attaching a good unit wiring board after removing the defective unit wiring board, after positioning the good unit wiring board with an alignment jig, the adhesive sheet is placed at a predetermined position of the scrap portion. Therefore, a product sheet that has been conventionally discarded can be easily made into a non-defective product. In this case, since the accuracy of the replacement position of the good unit wiring board is greatly improved, it can be flexibly adapted to high-density mounting of electronic components.

  In addition, even if there are many small flexible wiring boards of minute size in the product sheet, only the defective flexible wiring board can be easily and quickly replaced with a non-defective flexible wiring board. Can be performed efficiently.

  In addition, when using an adhesive sheet with a release film, the release film is peeled off, and the non-defective unit wiring board is bonded and fixed to the clean adhesive surface of the adhesive sheet. The fixing strength of the wiring board can be increased.

  In Example 1, in FIG. 2, the joint portions 4a and 4b are arranged so as to face each other in the longitudinal direction of the unit wiring board 2, but the unit wiring board 2 is stably attached to the scrap portion 3. If it can be held, the position need not be specified.

  In the collective substrate according to the first embodiment, as the adhesive sheet 12, one sheet corresponding to the shapes of the defective unit wiring board 2A, the joint portions 4a and 4b, and the adhesive sheet bonding areas 6a and 6b is used. In the collective substrate according to the second embodiment, a two-part configuration type adhesive sheet is used, and the other configuration is the same as that of the collective substrate according to the first embodiment.

  When a defective unit wiring board is present in the product sheet, the product sheet can be made non-defective by the unit wiring board replacement method for the collective board described in the first embodiment. That is, as shown in FIG. 8, first, adhesive sheet bonding areas 6a and 6b are formed in the scrap portion 3 of the product sheet 1, and the alignment jig 7 is positioned in the product outer shape punching cavity 5 on the outer periphery of the defective unit wiring board 2A. Is set up. Next, the adhesive sheet 28 with the two-divided release film 27 prepared in advance is attached to the defective unit wiring board 2A, the joint portions 4a and 4b, and the adhesive sheet bonding areas 6a and 6b.

  Unlike the first embodiment, the adhesive sheet 28 has a portion corresponding to the middle portion in the vertical direction of the defective unit wiring board 2A removed, and is divided and formed so as to be separated from both the upper and lower sides in the vertical direction of the defective unit wiring board 2A. Has been. Then, after the bonding step of the adhesive sheet 28, the release film 27 is peeled off from the adhesive sheet 28, and the joint portions 4a and 4b are punched and cut.

  As a result, the defective unit wiring board 2A is separated and removed from the product sheet 1 with a part of the adhesive sheet 28 remaining in the adhesive sheet bonding areas 6a and 6b. Thereafter, the step of positioning the non-defective unit wiring board with the alignment jig 7, the step of bonding and fixing the non-defective unit wiring board and the scrap portion 3 with the remaining portion of the adhesive sheet 28, and the like are the same as in the first embodiment. Therefore, the description is omitted.

  According to the present Example 2, since the adhesive sheet 28 is divided into two in the facing direction of the adhesive sheet bonding area, that is, the one in which the intermediate portion in the facing direction in the adhesive sheet 28 is cut off, The amount of the adhesive sheet 28 can be reduced, the process of attaching the adhesive sheet 28 to the adhesive sheet bonding areas 6a and 6b is facilitated, and the bonding to the adhesive sheet bonding areas 6a and 6b is facilitated. The adhesive strength of the agent sheet 28 can be increased.

  Unlike the first and second embodiments, the third embodiment is characterized in that a half-cut portion is provided in a release film attached to an adhesive sheet, and other configurations are related to the first embodiment. It is the same as the collective substrate.

  When a defective unit wiring board is present in the product sheet, as shown in FIG. 9, adhesive sheet bonding areas 6a and 6b are formed in the scrap portion 3 of the product sheet 1, and the product on the outer periphery of the defective unit wiring board 2A. An alignment jig 7 is erected in the outer shape punching cavity 5. Next, the adhesive sheet 29 with the release film 30 prepared in advance is attached to the defective unit wiring board 2A, the joint portions 4a and 4b, and the adhesive sheet bonding areas 6a and 6b.

  In this case, the release film 30 of the adhesive sheet 29 is provided with a half-cut portion 31 for a pull tab at the longitudinal center portion of the adhesive sheet 29. In the third embodiment, the half cut portion 31 is not a straight line, but is formed into a curve that easily peels the release film 30, for example, a curve having arc-shaped portions that protrude in opposite directions in the longitudinal direction of the adhesive sheet 29.

  Then, after the bonding step of the adhesive sheet 28, the release film 27 is peeled off from the adhesive sheet 28, and then the joint portions 4a and 4b are cut to form the adhesive sheet in the adhesive sheet bonding areas 6a and 6b. The defective unit wiring board 2A is separated and removed from the product sheet 1 with a part of 28 remaining.

  Thereafter, the step of positioning the non-defective unit wiring board with the alignment jig 7, the step of bonding and fixing the non-defective unit wiring board and the scrap portion 3 with the remaining portion of the adhesive sheet 28, and the like are the same as in the first embodiment. Therefore, the description is omitted.

  According to the third embodiment, the peeling half-cut portion 31 of the release film 30 has arc-shaped portions that protrude in opposite directions in the longitudinal direction of the adhesive sheet 29, so that the location becomes a finger hook, and the release film 30 There is an effect that the peeling can be easily performed, and the productivity when the unit wiring board is replaced can be improved.

  The present invention is not limited to these examples, and various modifications can be made without departing from the spirit of the present invention, and the present invention naturally extends to the modifications. .

  The present invention can be effectively used for various collective boards as long as it is a collective board on which a plurality of unit wiring boards are formed, regardless of the type, structure, shape, etc. of the unit wiring boards.

DESCRIPTION OF SYMBOLS 1 Collective board product sheet 2 Unit wiring board 2A Defective unit wiring board 2B Non-defective unit wiring board 3 Scrap part 4a, 4b Joint part 5 Product unit external part 6a, 6b Adhesive sheet bonding area 7 Alignment jig 8 Jig stand 9 Product outline punching cavity 11 Release film 12 (Both sides) Adhesive sheet 14a, 14b Joint part 16a, 16b Bonding area 17 Insulating base 18 Circuit metal foil 19 Cover film 22 Wiring board body part 24a, 24b Joint part 26a, 26b Adhesion Agent sheet bonding area (sticking area)
28, 29 Double-sided adhesive sheet 30 Release film 31 Half cut part

Claims (7)

When there is a defective unit wiring board in the product sheet of the assembly board in which a plurality of unit wiring boards are formed by punching out parts other than the joint portion in the product sheet, the assembly board is to replace the defective unit wiring board with a good unit wiring board The unit wiring board replacement method of
A first step of forming adhesive sheet bonding areas in the vicinity of joints at a plurality of locations in a scrap part, which is a peripheral part of a unit wiring board of a product sheet, and alignment with a product outer shape punching cavity around the defective unit wiring board A second step of erecting a jig, a third step of attaching a double-sided adhesive sheet to the defective unit wiring board, the joint portion, and an adhesive sheet bonding area; and cutting the joint portion into the adhesive A fourth step of separating and removing the defective unit wiring board from the product sheet in a state where a part of the double-sided adhesive sheet is left in the sheet bonding area, and the wiring board body has the same shape as the defective unit wiring board And a non-defective unit wiring board having a bonding area corresponding to the adhesive sheet laminating area to the defective unit wiring board removal portion. Including a fifth step of positioning with a setting jig and bonding and fixing the bonding area of the non-defective unit wiring board and the adhesive sheet bonding area of the scrap portion via the double-sided adhesive sheet. A method of replacing a unit wiring board of a collective board as a feature.   2. The unit wiring board replacement method for an aggregate board according to claim 1, wherein the unit wiring board is a flexible wiring board.   The bonding portion between the non-defective unit wiring board adhering area and the adhesive sheet bonding area of the scrap portion has the circuit metal foil and the cover film formed on the unit wiring board removed. The method for replacing a unit wiring board of a collective board according to claim 1.   2. The unit wiring board replacement method for a collective substrate according to claim 1, wherein the double-sided adhesive sheet is a double-sided adhesive sheet with a release film having a half-cut for peeling. If there is a defective unit wiring board in the product sheet of the assembly board where a plurality of unit wiring boards are formed by punching out the parts other than the joint part in the product sheet, the non-defective unit wiring is removed by punching and removing the defective unit wiring board. A collective board for fixing and replacing a board,
An alignment jig in which adhesive sheet bonding areas are formed in the vicinity of joints at a plurality of locations in the scrap part, which is the peripheral part of the unit wiring board of the product sheet, and is erected in the product outer shape punching cavity around the defective unit wiring board. Non-defective unit wiring board is positioned, and the bonding area provided on the non-defective unit wiring board and the adhesive sheet bonding area of the scrap part are bonded and fixed via a double-sided adhesive sheet .   6. The collective board according to claim 5, wherein the unit wiring board is a flexible wiring board. The adhesive sheet bonding area of the scrap part is formed at a plurality of locations facing the unit wiring board, and the double-sided adhesive sheet is divided and formed so as to be separated on both sides in the facing direction. The collective substrate according to claim 5.

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