JP2006332441A - Method of mounting processing for flexible circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for fixing the pieces of a flexible circuit board to a conveyance mending tool with high precision. <P>SOLUTION: A flexible circuit board sheet on which the pieces of a flexible circuit board are formed and guide holes are formed at predetermined positions, and a low adhesive sheet on which guide holes are formed at positions corresponding to the guide holes of the flexible circuit board, are prepared. The low adhesive sheet is overlapped on the flexible circuit board sheet, and cut lines are formed along the outlines of the pieces of the flexible circuit board in the flexible circuit board sheet. The pieces of the flexible circuit board are left on the low adhesive sheet by removing the unnecessary section of the flexible circuit board, and a conveyance mending tool formed with the guide holes and an adhesive layer on one face is prepared. The low adhesive sheet is abutted to the adhesive layer of the conveyance mending tool with the pieces of the flexible circuit board interposed by using the guide holes, and the pieces of the flexible circuit board are adhered to the face of the conveyance mending tool by removing only the low adhesive sheet. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a processing method for mounting a flexible circuit board (hereinafter referred to as FPC), and more particularly to a method of positioning and temporarily fixing an FPC on a component mounting conveying jig.

  FPCs that are widely used with the increase in the density of electronic circuits have a flexible structure and cannot be equipped with components as they are. For this reason, a method is adopted in which mounting accuracy is increased to a necessary level by attaching parts to a metal plate and a resin plate (hereinafter referred to as a conveyance jig) for conveyance, and fixing them to a necessary level. ing.

Conventionally, as shown in Patent Documents 1 and 2, each FPC piece is positioned through a guide pin of a conveying jig through a guide hole provided in each FPC to fix the surface of the conveying jig. It is adhered to the adhesive layer. In order to position a large number of FPCs, the FPC is positioned using a large number of small-diameter guide pins, and component mounting is performed.
Japanese Patent Laid-Open No. 2002-314240 JP 2004-71863 A

  According to this method, the positioning accuracy of the FPC is determined by adding the dimensional accuracy of the conveying jig, the positional accuracy between the guide hole and the circuit pattern opened in the FPC, and the positional deviation when fixing the FPC to the conveying jig. The For this reason, there is a large variation in the amount of displacement due to the working method.

  The misalignment when fixing to the transport jig is caused by the softness that is an essential characteristic of the FPC, and even if there is a guide pin, the FPC itself is deformed and the misalignment can be avoided. There is no problem.

  Further, the component mounting process for the FPC, when disassembled, includes cream solder printing, component mounting, and reflow processes. Among them, the approximate time required for the process is that the solder paste printing is 15 seconds / 1 conveying jig or more, but the component mounting is completed in 0.2 to 0.3 seconds / 1 component even if it is not so fast, 10 points Even if these parts are mounted, the process is completed in about 3 seconds. In many cases, the reflow process can be adjusted by the conveyance speed. As a result, since the efficiency of the component mounting process is extremely deteriorated, a method of mounting a component by fixing a large number of FPCs to a conveying jig is generally performed.

  However, as described above, it is very difficult to position the FPC with respect to the conveying jig with reference to the guide hole or the outer shape provided in the FPC. In the case of FPC, although the positional accuracy between the guide hole and the circuit pattern (or outer contour) is different for each product, a positional deviation of ± 0.1 mm or more often occurs.

  For this reason, in cream solder printing, which uses a method of recognizing as a sheet, the positions of other FPCs faced on one conveyance jig are fixed in order to recognize the position at two locations in the conveyance jig. In some cases, printing is performed without being performed, and a problem relating to the printing position may occur.

  The present invention has been made in consideration of the above-described points, and an object thereof is to provide a method for fixing an FPC to a conveying jig with high positional accuracy.

In order to achieve the above object, in the present invention,
A flexible circuit board sheet in which individual pieces of a flexible circuit board are formed and guide holes are formed at predetermined positions, and a low adhesive having a guide hole at a position corresponding to the guide holes of the flexible circuit board sheet Prepare a sheet,
Overlaying the low adhesive sheet on the flexible circuit board sheet using the guide hole,
Cutting along the contours of the flexible circuit board pieces in the flexible circuit board sheet;
Unnecessary portions of the flexible circuit board sheet are removed to leave pieces of the flexible circuit board on the low adhesive sheet,
Prepare a conveying jig having a plate shape and having a guide hole at a position corresponding to the predetermined position in the low adhesive sheet, and having an adhesive layer on one surface,
The low-adhesion sheet is brought into contact with the adhesive layer of the conveying jig by sandwiching the pieces of the flexible circuit board using the guide holes,
A flexible circuit board mounting method, wherein only the low adhesive sheet is removed and the pieces of the flexible circuit board are attached to the surface of the conveying jig;
Is to provide.

  In the present invention, as described above, the FPC sheet is aligned with the low adhesive sheet and overlapped, and then the FPC sheet is cut to remove unnecessary portions of the FPC sheet, and then the low adhesive sheet is positioned on the conveying jig. Since the low pressure-sensitive adhesive sheet is peeled off after being combined and superposed, the FPC pieces can be attached to a predetermined position of the conveying jig in the same alignment state as when the FPC sheet was on the FPC sheet.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

Embodiment 1

  1 to 8 are process diagrams sequentially showing processes in the first embodiment of the present invention. FIG. 1 is a plan view showing a state in which a plurality of FPC pieces 1 are formed on an FPC sheet 2. Usually, a predetermined number of FPC pieces 1 are arranged in an array on the FPC sheet 2. In the case of illustration, 12 FPC pieces 1 are arranged in 2 rows and 6 columns.

  Guide holes 3 are formed at the four corners of the FPC sheet 2, and the FPC sheet 2 is aligned using the guide holes 3. The number of guide holes 3 is an appropriate number of 2 or more.

  2 (a) and 2 (b) are a plan view and a side perspective view showing a state where the low-adhesion sheet 4 is loaded in the positioning jig 10 used in the present invention. In FIG. 2A, the low adhesive sheet 4 shown in FIG. 1 is shown in a vertically inverted state. In FIG. 2B, the positioning jig 10 is placed in the guide hole 3 of the low adhesive sheet 4. The guide pin 11 is shown as being inserted. The guide pin 11 is implanted in the positioning jig 10.

  As described above, when the FPC sheet 2 is superposed on the adhesive layer 4 b of the low adhesive sheet 4, the FPC pieces 1 adhere to the adhesive layer 4 b of the low adhesive sheet 4.

  3 (a) and 3 (b) show a state in which the FPC sheet 2 and the low adhesive sheet 4 are attached from the side of the FPC sheet 2 through the steps shown in FIGS. 2 (a) and 2 (b). It is the top view and cross-sectional block diagram which show. In this state, the low adhesive sheet 4 is laid under the FPC sheet 2 and overlaps.

  FIG. 4 shows a state in which a blade 20 is applied to the FPC sheet 2 and a cut is made between the FPC piece 1 and the FPC sheet 2 in order to remove unnecessary portions of the FPC sheet 2. In this case, the blade 20 cuts not only through the FPC sheet 2 but also through the adhesive layer 4b of the low adhesive sheet 4 to the middle of the base film 4a.

  As a result, the FPC piece 1 and the FPC sheet 2 are cut off, and the low adhesive sheet 4 is not cut.

  FIG. 5 shows a state where an unnecessary portion of the FPC sheet 2 is then peeled off. The FPC pieces 1 adhere to the adhesive layer of the low adhesive sheet 4 and remain on the low adhesive sheet 4.

  At this time, since the FPC piece 1 and the FPC sheet 2 are completely separated by the blade 20, unnecessary portions of the FPC can be removed without destroying the positional relationship between the FPC pieces 1. 1 will be in the state stuck on the low adhesive sheet 4.

  6 (a) and 6 (b) show the conveyance jig on the low adhesive sheet 4 to which the FPC piece 1 is pasted by the cooperation of the guide hole 3 and the guide pin 11 through the process shown in FIG. FIG. 6A is a plan view seen from the back side of the low adhesive sheet 4, and FIG. 6B is a side perspective view thereof.

  In this state, the FPC piece 1 is sandwiched between the low pressure-sensitive adhesive sheet 4 and the pressure-sensitive adhesive layer 12b of the conveying jig 12, and adheres to both.

  FIG. 7 shows a state in which the low adhesive sheet 4 located on the uppermost part on the conveying jig 12 starts to peel from the conveying jig 12 following the state of FIG. In this case, the FPC piece 1 adheres to the adhesive layer 12 b of the transport jig 12 having a higher adhesive strength in an adhesive state and remains on the transport jig 12. As a result, the FPC piece 1 is in a state of being transferred from the low adhesive sheet 4 to the conveying jig 12.

  Here, for example, “Magic Resin (registered trademark)” manufactured by Daisho Electronics Co., Ltd. can be used for the adhesive layer 12b of the conveying jig 12. The pressure-sensitive adhesive layer 12b can withstand repeated use, and is applied and processed on the upper surface of a substrate such as a resin.

  FIG. 8 is a plan view of the conveying jig 12 in a state where the low adhesive sheet 4 is completely removed thereafter. The FPC piece 1 is adhesively held on the adhesive layer 12b of the conveying jig 12 in the same state as in FIG.

  The FPC pieces 1 adhere to predetermined positions of the conveying jig 12 in a state where the mutual positional relationship between the FPC pieces arranged on the FPC sheet is held by the low adhesive sheet 4. This is because it is inherited in the form of being transferred as it is.

  As described above, since the FPC pieces 1 are held at predetermined positions of the conveying jig 12, when FPCs are automatically mounted, a large number of aligned FPCs can be sequentially processed, and a component mounting process is performed. The efficiency of can be greatly improved.

FIG. 1 is a plan view showing a state in which an FPC is pasted on a low adhesive sheet used in Embodiment 1 of the present invention. FIGS. 2A and 2B are a plan view and a side perspective view showing a state in which FPC is attached to the low-adhesion sheet and the conveying jig that are also used in Embodiment 1 of the present invention. FIGS. 3A and 3B are a plan view and a cross-sectional configuration diagram showing a state in which an FPC piece is stuck on a low adhesive sheet. Sectional drawing which showed the process of cut | disconnecting an FPC piece and an FPC sheet with a cutter in the state which stuck the FPC piece on the low adhesion sheet. The figure which shows the process of removing the unnecessary part of a FPC sheet from a low adhesion sheet. 6 (a) and 6 (b) are a plan view and a side perspective view showing a state in which a conveying jig is superposed on an FPC piece stuck on a low adhesive sheet, following FIG. The side view which shows the state which started the peeling of the low adhesion sheet from the conveyance jig following the state of FIG. The top view of the conveyance jig after finishing the state of FIG.

Explanation of symbols

1 FPC piece, 2 FPC sheet, 3 guide holes, 4 low adhesive sheet,
4a base film, 4b adhesive layer, 10 positioning jig,
11 Guide pin, 12a Conveying jig base, 12b Adhesive layer, 20 Cutlery.

Claims (2)

A flexible circuit board sheet in which individual pieces of a flexible circuit board are formed and guide holes are formed at predetermined positions, and a low adhesive having a guide hole at a position corresponding to the guide holes of the flexible circuit board sheet Prepare a sheet,
Overlaying the low adhesive sheet on the flexible circuit board sheet using the guide hole,
Cutting along the contours of the flexible circuit board pieces in the flexible circuit board sheet;
Unnecessary portions of the flexible circuit board sheet are removed to leave pieces of the flexible circuit board on the low adhesive sheet,
Prepare a conveying jig having a plate shape and having a guide hole at a position corresponding to the predetermined position in the low adhesive sheet, and having an adhesive layer on one surface,
The low-adhesion sheet is brought into contact with the adhesive layer of the conveying jig by sandwiching the pieces of the flexible circuit board using the guide holes,
A mounting method for a flexible circuit board, wherein only the low adhesive sheet is removed and the pieces of the flexible circuit board are adhered to the surface of the conveying jig. In the mounting processing method of the flexible circuit board according to claim 1,
Prepare a positioning jig with a guide pin inserted through the guide hole,
Mounting the flexible circuit board, wherein the positioning jig is used when the flexible circuit board sheet and the low adhesive sheet are overlaid and when the low adhesive sheet is overlaid on the conveying jig. Processing method.

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