HK1172481A1 - Method of replacing unit circuit board on integrated substrate and the integrated substrate - Google Patents

Method of replacing unit circuit board on integrated substrate and the integrated substrate

Info

Publication number
HK1172481A1
HK1172481A1 HK12113143.5A HK12113143A HK1172481A1 HK 1172481 A1 HK1172481 A1 HK 1172481A1 HK 12113143 A HK12113143 A HK 12113143A HK 1172481 A1 HK1172481 A1 HK 1172481A1
Authority
HK
Hong Kong
Prior art keywords
integrated substrate
circuit board
unit circuit
replacing unit
integrated
Prior art date
Application number
HK12113143.5A
Other languages
Chinese (zh)
Inventor
容史 星野
Original Assignee
日本梅克特隆株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本梅克特隆株式會社 filed Critical 日本梅克特隆株式會社
Publication of HK1172481A1 publication Critical patent/HK1172481A1/en

Links

HK12113143.5A 2011-04-21 2012-12-20 Method of replacing unit circuit board on integrated substrate and the integrated substrate HK1172481A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011095544A JP5581260B2 (en) 2011-04-21 2011-04-21 Method for replacing unit wiring board of collective substrate and collective substrate

Publications (1)

Publication Number Publication Date
HK1172481A1 true HK1172481A1 (en) 2013-04-19

Family

ID=47032779

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12113143.5A HK1172481A1 (en) 2011-04-21 2012-12-20 Method of replacing unit circuit board on integrated substrate and the integrated substrate

Country Status (4)

Country Link
JP (1) JP5581260B2 (en)
CN (1) CN102752963B (en)
HK (1) HK1172481A1 (en)
TW (1) TWI445472B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104619130B (en) * 2013-11-05 2018-06-19 健鼎（无锡）电子有限公司 Circuit board implantation structure and the method for transplanting circuit board
CN106612588A (en) * 2015-10-23 2017-05-03 中兴通讯股份有限公司 Splicing PCB subunit transplanting method and splicing PCB
CN109964545B (en) * 2016-11-17 2021-08-10 住友电工印刷电路株式会社 Method for manufacturing flexible printed wiring board, plate-like jig, tool for attaching and detaching individual pieces thereof, and apparatus for manufacturing flexible printed wiring board
CN106961800B (en) * 2017-03-21 2019-03-29 奥士康精密电路（惠州）有限公司 Double IC clamp production method on a kind of PCB
CN106941762B (en) * 2017-04-20 2020-07-07 苏州市华扬电子股份有限公司 Manufacturing method of flexible circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6391803A (en) * 1986-10-03 1988-04-22 Alps Electric Co Ltd Manufacture of magnetic head
JPH03163896A (en) * 1989-11-21 1991-07-15 Nec Corp Manufacture of electronic circuit module
JPH118461A (en) * 1997-06-17 1999-01-12 Sayaka:Kk Package-cutting method
CN1413074A (en) * 2001-10-16 2003-04-23 旭贸股份有限公司 Method for recovering printed circuit board by utilizing stepped adhesion structure
JP5033079B2 (en) * 2008-08-07 2012-09-26 日本メクトロン株式会社 Method for replacing unit wiring board of collective substrate, and collective substrate
JP5243990B2 (en) * 2009-02-18 2013-07-24 日東電工株式会社 Double-sided adhesive sheet
CN101932198A (en) * 2010-06-10 2010-12-29 瀚宇博德科技（江阴）有限公司 Manufacturing method for transplanting printed circuit board and structure thereof

Also Published As

Publication number Publication date
TW201244566A (en) 2012-11-01
JP5581260B2 (en) 2014-08-27
TWI445472B (en) 2014-07-11
JP2012227450A (en) 2012-11-15
CN102752963B (en) 2016-08-03
CN102752963A (en) 2012-10-24

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