JP2012216765A5 - - Google Patents
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- JP2012216765A5 JP2012216765A5 JP2011287693A JP2011287693A JP2012216765A5 JP 2012216765 A5 JP2012216765 A5 JP 2012216765A5 JP 2011287693 A JP2011287693 A JP 2011287693A JP 2011287693 A JP2011287693 A JP 2011287693A JP 2012216765 A5 JP2012216765 A5 JP 2012216765A5
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- JP
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- Prior art keywords
- film
- forming
- target
- condition
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- Prior art date
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011287693A JP5788785B2 (ja) | 2011-01-27 | 2011-12-28 | Cu配線の形成方法および成膜システム |
US13/359,138 US8859422B2 (en) | 2011-01-27 | 2012-01-26 | Method of forming copper wiring and method and system for forming copper film |
KR1020120008241A KR101357531B1 (ko) | 2011-01-27 | 2012-01-27 | Cu 배선의 형성 방법 및 Cu막의 성막 방법, 성막 시스템, 및 기억 매체 |
US14/297,726 US20140287163A1 (en) | 2011-01-27 | 2014-06-06 | Method of forming copper wiring and method and system for forming copper film |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011015664 | 2011-01-27 | ||
JP2011015664 | 2011-01-27 | ||
JP2011077499 | 2011-03-31 | ||
JP2011077499 | 2011-03-31 | ||
JP2011287693A JP5788785B2 (ja) | 2011-01-27 | 2011-12-28 | Cu配線の形成方法および成膜システム |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012216765A JP2012216765A (ja) | 2012-11-08 |
JP2012216765A5 true JP2012216765A5 (ru) | 2014-08-21 |
JP5788785B2 JP5788785B2 (ja) | 2015-10-07 |
Family
ID=47269237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011287693A Active JP5788785B2 (ja) | 2011-01-27 | 2011-12-28 | Cu配線の形成方法および成膜システム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5788785B2 (ru) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6013901B2 (ja) * | 2012-12-20 | 2016-10-25 | 東京エレクトロン株式会社 | Cu配線の形成方法 |
JP6139298B2 (ja) * | 2013-06-28 | 2017-05-31 | 東京エレクトロン株式会社 | Cu配線の形成方法 |
JP6268036B2 (ja) * | 2014-05-16 | 2018-01-24 | 東京エレクトロン株式会社 | Cu配線の製造方法 |
JP6385856B2 (ja) * | 2015-02-26 | 2018-09-05 | 東京エレクトロン株式会社 | Cu配線の形成方法および半導体装置の製造方法 |
JP2021136269A (ja) | 2020-02-25 | 2021-09-13 | キオクシア株式会社 | 半導体装置 |
JP7111380B2 (ja) * | 2020-04-01 | 2022-08-02 | 株式会社シンクロン | スパッタ装置及びこれを用いた成膜方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2914644B2 (ja) * | 1993-09-22 | 1999-07-05 | アネルバ株式会社 | 集積回路の配線方法及び集積回路における穴又は溝の埋め込み配線方法並びにマルチチャンバー基板処理装置 |
JP3337876B2 (ja) * | 1994-06-21 | 2002-10-28 | 株式会社東芝 | 半導体装置の製造方法 |
JP3501265B2 (ja) * | 1997-10-30 | 2004-03-02 | 富士通株式会社 | 半導体装置の製造方法 |
US6140228A (en) * | 1997-11-13 | 2000-10-31 | Cypress Semiconductor Corporation | Low temperature metallization process |
JP3244058B2 (ja) * | 1998-07-28 | 2002-01-07 | 日本電気株式会社 | 半導体装置の製造方法 |
WO2001045149A1 (en) * | 1999-12-15 | 2001-06-21 | Genitech Co., Ltd. | Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst |
US6884329B2 (en) * | 2003-01-10 | 2005-04-26 | Applied Materials, Inc. | Diffusion enhanced ion plating for copper fill |
JP4455214B2 (ja) * | 2004-08-05 | 2010-04-21 | Necエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
US20080190760A1 (en) * | 2007-02-08 | 2008-08-14 | Applied Materials, Inc. | Resputtered copper seed layer |
JP2009105289A (ja) * | 2007-10-24 | 2009-05-14 | Tokyo Electron Ltd | Cu配線の形成方法 |
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2011
- 2011-12-28 JP JP2011287693A patent/JP5788785B2/ja active Active
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