JP2012216765A5 - - Google Patents

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Publication number
JP2012216765A5
JP2012216765A5 JP2011287693A JP2011287693A JP2012216765A5 JP 2012216765 A5 JP2012216765 A5 JP 2012216765A5 JP 2011287693 A JP2011287693 A JP 2011287693A JP 2011287693 A JP2011287693 A JP 2011287693A JP 2012216765 A5 JP2012216765 A5 JP 2012216765A5
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JP
Japan
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film
forming
target
condition
under
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JP2011287693A
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English (en)
Japanese (ja)
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JP5788785B2 (ja
JP2012216765A (ja
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Priority to JP2011287693A priority Critical patent/JP5788785B2/ja
Priority claimed from JP2011287693A external-priority patent/JP5788785B2/ja
Priority to US13/359,138 priority patent/US8859422B2/en
Priority to KR1020120008241A priority patent/KR101357531B1/ko
Publication of JP2012216765A publication Critical patent/JP2012216765A/ja
Priority to US14/297,726 priority patent/US20140287163A1/en
Publication of JP2012216765A5 publication Critical patent/JP2012216765A5/ja
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Publication of JP5788785B2 publication Critical patent/JP5788785B2/ja
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JP2011287693A 2011-01-27 2011-12-28 Ｃｕ配線の形成方法および成膜システム Active JP5788785B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011287693A JP5788785B2 (ja) 2011-01-27 2011-12-28 Ｃｕ配線の形成方法および成膜システム
US13/359,138 US8859422B2 (en) 2011-01-27 2012-01-26 Method of forming copper wiring and method and system for forming copper film
KR1020120008241A KR101357531B1 (ko) 2011-01-27 2012-01-27 Ｃｕ 배선의 형성 방법 및 Ｃｕ막의 성막 방법, 성막 시스템, 및 기억 매체
US14/297,726 US20140287163A1 (en) 2011-01-27 2014-06-06 Method of forming copper wiring and method and system for forming copper film

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2011015664 2011-01-27
JP2011015664 2011-01-27
JP2011077499 2011-03-31
JP2011077499 2011-03-31
JP2011287693A JP5788785B2 (ja) 2011-01-27 2011-12-28 Ｃｕ配線の形成方法および成膜システム

Publications (3)

Publication Number Publication Date
JP2012216765A JP2012216765A (ja) 2012-11-08
JP2012216765A5 true JP2012216765A5 (es) 2014-08-21
JP5788785B2 JP5788785B2 (ja) 2015-10-07

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JP2011287693A Active JP5788785B2 (ja) 2011-01-27 2011-12-28 Ｃｕ配線の形成方法および成膜システム

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JP (1) JP5788785B2 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6013901B2 (ja) * 2012-12-20 2016-10-25 東京エレクトロン株式会社 Ｃｕ配線の形成方法
JP6139298B2 (ja) * 2013-06-28 2017-05-31 東京エレクトロン株式会社 Ｃｕ配線の形成方法
JP6268036B2 (ja) * 2014-05-16 2018-01-24 東京エレクトロン株式会社 Ｃｕ配線の製造方法
JP6385856B2 (ja) 2015-02-26 2018-09-05 東京エレクトロン株式会社 Ｃｕ配線の形成方法および半導体装置の製造方法
JP2021136269A (ja) 2020-02-25 2021-09-13 キオクシア株式会社 半導体装置
JP7111380B2 (ja) * 2020-04-01 2022-08-02 株式会社シンクロン スパッタ装置及びこれを用いた成膜方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2914644B2 (ja) * 1993-09-22 1999-07-05 アネルバ株式会社 集積回路の配線方法及び集積回路における穴又は溝の埋め込み配線方法並びにマルチチャンバー基板処理装置
JP3337876B2 (ja) * 1994-06-21 2002-10-28 株式会社東芝 半導体装置の製造方法
JP3501265B2 (ja) * 1997-10-30 2004-03-02 富士通株式会社 半導体装置の製造方法
US6140228A (en) * 1997-11-13 2000-10-31 Cypress Semiconductor Corporation Low temperature metallization process
JP3244058B2 (ja) * 1998-07-28 2002-01-07 日本電気株式会社 半導体装置の製造方法
EP1247292B1 (en) * 1999-12-15 2009-02-04 Genitech Co., Ltd. Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst
US6884329B2 (en) * 2003-01-10 2005-04-26 Applied Materials, Inc. Diffusion enhanced ion plating for copper fill
JP4455214B2 (ja) * 2004-08-05 2010-04-21 Ｎｅｃエレクトロニクス株式会社 半導体装置およびその製造方法
US20080190760A1 (en) * 2007-02-08 2008-08-14 Applied Materials, Inc. Resputtered copper seed layer
JP2009105289A (ja) * 2007-10-24 2009-05-14 Tokyo Electron Ltd Ｃｕ配線の形成方法

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