JP2012187633A5 - - Google Patents
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- Publication number
- JP2012187633A5 JP2012187633A5 JP2011289127A JP2011289127A JP2012187633A5 JP 2012187633 A5 JP2012187633 A5 JP 2012187633A5 JP 2011289127 A JP2011289127 A JP 2011289127A JP 2011289127 A JP2011289127 A JP 2011289127A JP 2012187633 A5 JP2012187633 A5 JP 2012187633A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- bonded portion
- oxide
- metal
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 22
- 229910052802 copper Inorganic materials 0.000 claims 22
- 239000010949 copper Substances 0.000 claims 22
- 239000002184 metal Substances 0.000 claims 18
- 229910052751 metal Inorganic materials 0.000 claims 18
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims 11
- 239000005751 Copper oxide Substances 0.000 claims 11
- 229910000431 copper oxide Inorganic materials 0.000 claims 11
- 238000000034 method Methods 0.000 claims 10
- 239000000243 solution Substances 0.000 claims 9
- 239000011248 coating agent Substances 0.000 claims 6
- 238000000576 coating method Methods 0.000 claims 6
- 239000000463 material Substances 0.000 claims 6
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 4
- 239000003446 ligand Substances 0.000 claims 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims 2
- 235000011114 ammonium hydroxide Nutrition 0.000 claims 2
- 239000007864 aqueous solution Substances 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000005498 polishing Methods 0.000 claims 2
- 230000035882 stress Effects 0.000 claims 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 1
- 229910001431 copper ion Inorganic materials 0.000 claims 1
- 230000006355 external stress Effects 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011289127A JP2012187633A (ja) | 2010-05-31 | 2011-12-28 | 金属の接合方法 |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010125303 | 2010-05-31 | ||
| JP2010125303 | 2010-05-31 | ||
| JP2011017981 | 2011-01-31 | ||
| JP2011017981 | 2011-01-31 | ||
| JP2011040076 | 2011-02-25 | ||
| JP2011040076 | 2011-02-25 | ||
| JP2011289127A JP2012187633A (ja) | 2010-05-31 | 2011-12-28 | 金属の接合方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011552259A Division JPWO2011152423A1 (ja) | 2010-05-31 | 2011-05-31 | 金属の接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012187633A JP2012187633A (ja) | 2012-10-04 |
| JP2012187633A5 true JP2012187633A5 (enExample) | 2013-07-11 |
Family
ID=45066783
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011552259A Pending JPWO2011152423A1 (ja) | 2010-05-31 | 2011-05-31 | 金属の接合方法 |
| JP2011289127A Pending JP2012187633A (ja) | 2010-05-31 | 2011-12-28 | 金属の接合方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011552259A Pending JPWO2011152423A1 (ja) | 2010-05-31 | 2011-05-31 | 金属の接合方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20120160903A1 (enExample) |
| JP (2) | JPWO2011152423A1 (enExample) |
| CN (1) | CN102665997A (enExample) |
| WO (1) | WO2011152423A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014100711A (ja) * | 2011-02-28 | 2014-06-05 | Sanyo Electric Co Ltd | 金属接合構造および金属接合方法 |
| WO2013021567A1 (ja) * | 2011-08-11 | 2013-02-14 | 三洋電機株式会社 | 金属の接合方法および金属接合構造 |
| JP2014210267A (ja) * | 2011-08-31 | 2014-11-13 | 三洋電機株式会社 | 金属接合装置 |
| JP5984044B2 (ja) * | 2012-04-16 | 2016-09-06 | 須賀 唯知 | 金属触媒下及び不活性ガス雰囲気下で有機酸ガスを用いた表面酸化物除去方法及び接合装置 |
| SG2014014674A (en) * | 2012-09-28 | 2014-06-27 | Ev Group E Thallner Gmbh | Method for coating and bonding substrates |
| CN110310896B (zh) | 2013-07-05 | 2023-08-15 | Ev 集团 E·索尔纳有限责任公司 | 用于接合基板的接触表面的方法 |
| JP6332942B2 (ja) * | 2013-10-18 | 2018-05-30 | 小林 博 | 部品同士ないしは基材同士からなる被接合体の接合方法 |
| TWI686518B (zh) | 2019-07-19 | 2020-03-01 | 國立交通大學 | 具有奈米雙晶銅之電連接結構及其形成方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1535492A (en) * | 1923-12-21 | 1925-04-28 | Passalacqua Augusto | Process for facing sheets or objects of aluminum and the like with sheets of heavy metal |
| JP3345961B2 (ja) * | 1992-06-05 | 2002-11-18 | 松下電器産業株式会社 | 銅または銅合金の低温拡散接合方法およびそれを用いた導電ペーストおよび多層配線基板の製造方法 |
| JPH0615462A (ja) * | 1992-07-02 | 1994-01-25 | Ishikawajima Harima Heavy Ind Co Ltd | 銅製部材の接合方法 |
| JPH1190620A (ja) * | 1997-09-16 | 1999-04-06 | Mazda Motor Corp | 金属部材の接合方法及び接合装置 |
| JP4283567B2 (ja) * | 2003-03-07 | 2009-06-24 | 株式会社オクテック | 金属薄膜の接合方法 |
| CN100471608C (zh) * | 2004-08-04 | 2009-03-25 | 株式会社电装 | 金属接合方法 |
| JP2006095534A (ja) * | 2004-09-28 | 2006-04-13 | Ebara Corp | 接合方法及び装置 |
| JP2006334652A (ja) * | 2005-06-03 | 2006-12-14 | Ebara Corp | 金属接合方法 |
| JP2007019360A (ja) * | 2005-07-11 | 2007-01-25 | Fuji Electric Holdings Co Ltd | 電子部品の実装方法 |
| JP4728845B2 (ja) * | 2005-09-14 | 2011-07-20 | 古河電気工業株式会社 | 圧接接合式ヒートパイプおよびその製造方法 |
| JP4728755B2 (ja) * | 2005-09-22 | 2011-07-20 | ハリマ化成株式会社 | 導電性接合の形成方法 |
| JP2007090394A (ja) * | 2005-09-29 | 2007-04-12 | Tokyo Institute Of Technology | 金属の接合方法 |
-
2011
- 2011-05-31 CN CN2011800035861A patent/CN102665997A/zh active Pending
- 2011-05-31 JP JP2011552259A patent/JPWO2011152423A1/ja active Pending
- 2011-05-31 WO PCT/JP2011/062535 patent/WO2011152423A1/ja not_active Ceased
- 2011-05-31 US US13/392,835 patent/US20120160903A1/en not_active Abandoned
- 2011-12-28 JP JP2011289127A patent/JP2012187633A/ja active Pending
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