JP2012172178A5 - - Google Patents

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Publication number
JP2012172178A5
JP2012172178A5 JP2011033496A JP2011033496A JP2012172178A5 JP 2012172178 A5 JP2012172178 A5 JP 2012172178A5 JP 2011033496 A JP2011033496 A JP 2011033496A JP 2011033496 A JP2011033496 A JP 2011033496A JP 2012172178 A5 JP2012172178 A5 JP 2012172178A5
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JP
Japan
Prior art keywords
alloy material
mass
range
fills
substrates
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Application number
JP2011033496A
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English (en)
Japanese (ja)
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JP2012172178A (ja
JP5667467B2 (ja
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Priority to JP2011033496A priority Critical patent/JP5667467B2/ja
Priority claimed from JP2011033496A external-priority patent/JP5667467B2/ja
Publication of JP2012172178A publication Critical patent/JP2012172178A/ja
Publication of JP2012172178A5 publication Critical patent/JP2012172178A5/ja
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Publication of JP5667467B2 publication Critical patent/JP5667467B2/ja
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JP2011033496A 2011-02-18 2011-02-18 合金材料、回路基板、電子デバイス及びその製造方法 Active JP5667467B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011033496A JP5667467B2 (ja) 2011-02-18 2011-02-18 合金材料、回路基板、電子デバイス及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011033496A JP5667467B2 (ja) 2011-02-18 2011-02-18 合金材料、回路基板、電子デバイス及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012172178A JP2012172178A (ja) 2012-09-10
JP2012172178A5 true JP2012172178A5 (enExample) 2014-03-06
JP5667467B2 JP5667467B2 (ja) 2015-02-12

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ID=46975373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011033496A Active JP5667467B2 (ja) 2011-02-18 2011-02-18 合金材料、回路基板、電子デバイス及びその製造方法

Country Status (1)

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JP (1) JP5667467B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107405729A (zh) * 2015-03-31 2017-11-28 住友金属矿山股份有限公司 焊膏
WO2017065236A1 (ja) * 2015-10-15 2017-04-20 住友精密工業株式会社 充填方法および充填装置
CN106001982A (zh) * 2016-07-08 2016-10-12 重庆科技学院 一种高熔点无铅铋银锡钎料及其制备方法
JP7487471B2 (ja) * 2019-12-13 2024-05-21 株式会社レゾナック 金属ペースト、導電体、並びに、貫通電極を有する基体及びその製造方法
JP7417696B1 (ja) 2022-08-01 2024-01-18 千住金属工業株式会社 金属及び電子装置
JP7534693B1 (ja) 2023-12-14 2024-08-15 千住金属工業株式会社 金属及び電子装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3671815B2 (ja) * 2000-06-12 2005-07-13 株式会社村田製作所 はんだ組成物およびはんだ付け物品
EP1399600B1 (en) * 2001-05-28 2007-01-17 Honeywell International Inc. Compositions, methods and devices for high temperature lead-free solder
JP5067163B2 (ja) * 2005-11-11 2012-11-07 千住金属工業株式会社 ソルダペーストとはんだ継手
WO2008033828A1 (en) * 2006-09-13 2008-03-20 Honeywell International Inc. Modified solder alloys for electrical interconnects, methods of production and uses thereof
JP4444995B2 (ja) * 2007-08-10 2010-03-31 有限会社ナプラ 基板配線用導電性組成物、回路基板及び電子デバイス
JP5194326B2 (ja) * 2008-12-27 2013-05-08 千住金属工業株式会社 Ｂｉ−Ｓｎ系リール巻きはんだ線およびはんだ線の製造方法
CN103079751B (zh) * 2010-06-30 2019-03-26 千住金属工业株式会社 Bi-Sn系高温焊料合金

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