JP2012169534A5 - - Google Patents

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Publication number
JP2012169534A5
JP2012169534A5 JP2011030909A JP2011030909A JP2012169534A5 JP 2012169534 A5 JP2012169534 A5 JP 2012169534A5 JP 2011030909 A JP2011030909 A JP 2011030909A JP 2011030909 A JP2011030909 A JP 2011030909A JP 2012169534 A5 JP2012169534 A5 JP 2012169534A5
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JP
Japan
Prior art keywords
substrate
processing apparatus
substrate processing
moving
unit
Prior art date
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Pending
Application number
JP2011030909A
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English (en)
Japanese (ja)
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JP2012169534A (ja
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Priority to JP2011030909A priority Critical patent/JP2012169534A/ja
Priority claimed from JP2011030909A external-priority patent/JP2012169534A/ja
Publication of JP2012169534A publication Critical patent/JP2012169534A/ja
Publication of JP2012169534A5 publication Critical patent/JP2012169534A5/ja
Pending legal-status Critical Current

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JP2011030909A 2011-02-16 2011-02-16 基板処理装置及び半導体装置の製造方法 Pending JP2012169534A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011030909A JP2012169534A (ja) 2011-02-16 2011-02-16 基板処理装置及び半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011030909A JP2012169534A (ja) 2011-02-16 2011-02-16 基板処理装置及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2012169534A JP2012169534A (ja) 2012-09-06
JP2012169534A5 true JP2012169534A5 (enExample) 2014-04-03

Family

ID=46973389

Family Applications (1)

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JP2011030909A Pending JP2012169534A (ja) 2011-02-16 2011-02-16 基板処理装置及び半導体装置の製造方法

Country Status (1)

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JP (1) JP2012169534A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6031304B2 (ja) * 2012-09-19 2016-11-24 株式会社日立国際電気 基板処理装置及び基板処理方法
KR101453776B1 (ko) 2013-03-21 2014-10-22 주식회사 에스에프이 칩 본딩 장치
JP6505851B2 (ja) 2015-08-28 2019-04-24 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置および半導体装置の製造方法
JP2025107031A (ja) 2024-01-05 2025-07-17 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、及びプログラム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09181141A (ja) * 1995-12-22 1997-07-11 Dainippon Screen Mfg Co Ltd 基板搬送装置および中間受渡し装置
JP2004165579A (ja) * 2002-09-18 2004-06-10 Seiko Instruments Inc 真空処理装置
US9111972B2 (en) * 2004-07-13 2015-08-18 Hitachi Kokusai Electric Inc. Substrate processing apparatus and manufacturing method for a semiconductor device
JP5164416B2 (ja) * 2007-04-16 2013-03-21 株式会社日立国際電気 基板処理装置、収納容器の搬送方法および半導体装置の製造方法

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