JP2012169361A5 - - Google Patents

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Publication number
JP2012169361A5
JP2012169361A5 JP2011027606A JP2011027606A JP2012169361A5 JP 2012169361 A5 JP2012169361 A5 JP 2012169361A5 JP 2011027606 A JP2011027606 A JP 2011027606A JP 2011027606 A JP2011027606 A JP 2011027606A JP 2012169361 A5 JP2012169361 A5 JP 2012169361A5
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JP
Japan
Prior art keywords
substrate
stage
mirror finish
mirror
appearance
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JP2011027606A
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English (en)
Japanese (ja)
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JP2012169361A (ja
JP5950269B2 (ja
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Priority to JP2011027606A priority Critical patent/JP5950269B2/ja
Priority claimed from JP2011027606A external-priority patent/JP5950269B2/ja
Publication of JP2012169361A publication Critical patent/JP2012169361A/ja
Publication of JP2012169361A5 publication Critical patent/JP2012169361A5/ja
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Publication of JP5950269B2 publication Critical patent/JP5950269B2/ja
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JP2011027606A 2011-02-10 2011-02-10 基板加工方法及び基板 Active JP5950269B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011027606A JP5950269B2 (ja) 2011-02-10 2011-02-10 基板加工方法及び基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011027606A JP5950269B2 (ja) 2011-02-10 2011-02-10 基板加工方法及び基板

Publications (3)

Publication Number Publication Date
JP2012169361A JP2012169361A (ja) 2012-09-06
JP2012169361A5 true JP2012169361A5 (cg-RX-API-DMAC10.html) 2014-04-03
JP5950269B2 JP5950269B2 (ja) 2016-07-13

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ID=46973266

Family Applications (1)

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JP2011027606A Active JP5950269B2 (ja) 2011-02-10 2011-02-10 基板加工方法及び基板

Country Status (1)

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JP (1) JP5950269B2 (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014013107A1 (de) 2013-10-08 2015-04-09 Siltectra Gmbh Neuartiges Waferherstellungsverfahren
DE102015000449A1 (de) 2015-01-15 2016-07-21 Siltectra Gmbh Festkörperteilung mittels Stoffumwandlung
JP6298695B2 (ja) * 2014-04-16 2018-03-20 信越ポリマー株式会社 原盤製造方法及び原盤
JP2016035965A (ja) * 2014-08-01 2016-03-17 リンテック株式会社 板状部材の分割装置および板状部材の分割方法
MY199526A (en) 2014-11-27 2023-11-03 Siltectra Gmbh Solid body division by conversion of substances
EP4234156B1 (de) 2014-11-27 2025-10-29 Siltectra GmbH Laserbasiertes trennverfahren
JP7832062B2 (ja) * 2022-06-27 2026-03-17 株式会社ディスコ ウエーハの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4128204B2 (ja) * 2000-09-13 2008-07-30 浜松ホトニクス株式会社 レーザ加工方法
JP2005294656A (ja) * 2004-04-02 2005-10-20 Sharp Corp 基板製造方法及び基板製造装置
JP2010021398A (ja) * 2008-07-11 2010-01-28 Disco Abrasive Syst Ltd ウェーハの処理方法
JP2010155259A (ja) * 2008-12-26 2010-07-15 Seiko Epson Corp 溝形成方法
EP2418041B1 (en) * 2009-04-07 2024-09-18 Hamamatsu Photonics K.K. Laser machining device and laser machining method
JP5398332B2 (ja) * 2009-04-16 2014-01-29 信越ポリマー株式会社 半導体ウェーハの製造方法及びその装置
JP5456382B2 (ja) * 2009-06-17 2014-03-26 信越ポリマー株式会社 半導体ウェーハの製造方法及びその装置

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