JP2012169361A5 - - Google Patents
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- JP2012169361A5 JP2012169361A5 JP2011027606A JP2011027606A JP2012169361A5 JP 2012169361 A5 JP2012169361 A5 JP 2012169361A5 JP 2011027606 A JP2011027606 A JP 2011027606A JP 2011027606 A JP2011027606 A JP 2011027606A JP 2012169361 A5 JP2012169361 A5 JP 2012169361A5
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- 239000000758 substrate Substances 0.000 claims description 11
- 238000003672 processing method Methods 0.000 claims 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011027606A JP5950269B2 (ja) | 2011-02-10 | 2011-02-10 | 基板加工方法及び基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011027606A JP5950269B2 (ja) | 2011-02-10 | 2011-02-10 | 基板加工方法及び基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012169361A JP2012169361A (ja) | 2012-09-06 |
| JP2012169361A5 true JP2012169361A5 (OSRAM) | 2014-04-03 |
| JP5950269B2 JP5950269B2 (ja) | 2016-07-13 |
Family
ID=46973266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011027606A Active JP5950269B2 (ja) | 2011-02-10 | 2011-02-10 | 基板加工方法及び基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5950269B2 (OSRAM) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014013107A1 (de) | 2013-10-08 | 2015-04-09 | Siltectra Gmbh | Neuartiges Waferherstellungsverfahren |
| DE102015000449A1 (de) | 2015-01-15 | 2016-07-21 | Siltectra Gmbh | Festkörperteilung mittels Stoffumwandlung |
| JP6298695B2 (ja) * | 2014-04-16 | 2018-03-20 | 信越ポリマー株式会社 | 原盤製造方法及び原盤 |
| JP2016035965A (ja) * | 2014-08-01 | 2016-03-17 | リンテック株式会社 | 板状部材の分割装置および板状部材の分割方法 |
| EP3399542B1 (de) | 2014-11-27 | 2023-04-12 | Siltectra GmbH | Festkörperteilung mittels stoffumwandlung |
| US10930560B2 (en) | 2014-11-27 | 2021-02-23 | Siltectra Gmbh | Laser-based separation method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4128204B2 (ja) * | 2000-09-13 | 2008-07-30 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| JP2005294656A (ja) * | 2004-04-02 | 2005-10-20 | Sharp Corp | 基板製造方法及び基板製造装置 |
| JP2010021398A (ja) * | 2008-07-11 | 2010-01-28 | Disco Abrasive Syst Ltd | ウェーハの処理方法 |
| JP2010155259A (ja) * | 2008-12-26 | 2010-07-15 | Seiko Epson Corp | 溝形成方法 |
| KR101769158B1 (ko) * | 2009-04-07 | 2017-08-17 | 하마마츠 포토닉스 가부시키가이샤 | 레이저 가공 장치 및 레이저 가공 방법 |
| JP5398332B2 (ja) * | 2009-04-16 | 2014-01-29 | 信越ポリマー株式会社 | 半導体ウェーハの製造方法及びその装置 |
| JP5456382B2 (ja) * | 2009-06-17 | 2014-03-26 | 信越ポリマー株式会社 | 半導体ウェーハの製造方法及びその装置 |
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2011
- 2011-02-10 JP JP2011027606A patent/JP5950269B2/ja active Active