JP2012164956A5 - - Google Patents

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Publication number
JP2012164956A5
JP2012164956A5 JP2011223051A JP2011223051A JP2012164956A5 JP 2012164956 A5 JP2012164956 A5 JP 2012164956A5 JP 2011223051 A JP2011223051 A JP 2011223051A JP 2011223051 A JP2011223051 A JP 2011223051A JP 2012164956 A5 JP2012164956 A5 JP 2012164956A5
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JP
Japan
Prior art keywords
electronic component
substrate
support device
component support
placement region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011223051A
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English (en)
Japanese (ja)
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JP5709719B2 (ja
JP2012164956A (ja
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Publication date
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Priority to JP2011223051A priority Critical patent/JP5709719B2/ja
Priority claimed from JP2011223051A external-priority patent/JP5709719B2/ja
Publication of JP2012164956A publication Critical patent/JP2012164956A/ja
Publication of JP2012164956A5 publication Critical patent/JP2012164956A5/ja
Application granted granted Critical
Publication of JP5709719B2 publication Critical patent/JP5709719B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011223051A 2011-01-18 2011-10-07 電子部品支持装置及び電子デバイス Expired - Fee Related JP5709719B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011223051A JP5709719B2 (ja) 2011-01-18 2011-10-07 電子部品支持装置及び電子デバイス

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011007519 2011-01-18
JP2011007519 2011-01-18
JP2011223051A JP5709719B2 (ja) 2011-01-18 2011-10-07 電子部品支持装置及び電子デバイス

Publications (3)

Publication Number Publication Date
JP2012164956A JP2012164956A (ja) 2012-08-30
JP2012164956A5 true JP2012164956A5 (cg-RX-API-DMAC7.html) 2014-10-23
JP5709719B2 JP5709719B2 (ja) 2015-04-30

Family

ID=46844012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011223051A Expired - Fee Related JP5709719B2 (ja) 2011-01-18 2011-10-07 電子部品支持装置及び電子デバイス

Country Status (1)

Country Link
JP (1) JP5709719B2 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104272446B (zh) 2012-08-30 2016-11-09 松下知识产权经营株式会社 电子部件封装体及其制造方法
JP5651807B2 (ja) * 2012-09-05 2015-01-14 パナソニックＩｐマネジメント株式会社 半導体装置およびその製造方法
US9524917B2 (en) * 2014-04-23 2016-12-20 Optiz, Inc. Chip level heat dissipation using silicon
WO2020004459A1 (ja) * 2018-06-26 2020-01-02 京セラ株式会社 電子素子搭載用基板、電子装置および電子モジュール
CN114614228A (zh) * 2020-12-09 2022-06-10 深南电路股份有限公司 耦合器及电子设备
KR102855264B1 (ko) * 2022-11-22 2025-09-03 앱솔릭스 인코포레이티드 패키징 기판 및 이를 포함하는 반도체 패키지

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008294253A (ja) * 2007-05-25 2008-12-04 Ngk Spark Plug Co Ltd 発光素子実装用配線基板
JP2009117489A (ja) * 2007-11-02 2009-05-28 Sharp Corp 半導体素子パッケージ及び実装基板
JP5357706B2 (ja) * 2009-11-10 2013-12-04 パナソニック株式会社 半導体実装構造体

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