WO2014204828A3 - Thermal interface nanocomposite - Google Patents

Thermal interface nanocomposite Download PDF

Info

Publication number
WO2014204828A3
WO2014204828A3 PCT/US2014/042459 US2014042459W WO2014204828A3 WO 2014204828 A3 WO2014204828 A3 WO 2014204828A3 US 2014042459 W US2014042459 W US 2014042459W WO 2014204828 A3 WO2014204828 A3 WO 2014204828A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermal interface
nanocomposite
heat removal
tim
tim layer
Prior art date
Application number
PCT/US2014/042459
Other languages
French (fr)
Other versions
WO2014204828A2 (en
Inventor
Nurit ATAR
Eitan GROSSMAN
Irina GUZMAN
Bruno Sfez
Original Assignee
Soreq Nuclear Research Center
Klein, David
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soreq Nuclear Research Center, Klein, David filed Critical Soreq Nuclear Research Center
Publication of WO2014204828A2 publication Critical patent/WO2014204828A2/en
Publication of WO2014204828A3 publication Critical patent/WO2014204828A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A thermal interface materials (TIM) device includes a heat removal and spreading device (100) made of a heat conducting material. A TIM layer (102, 202) is located on the heat removal and spreading device (100) and includes aligned carbon nanotubes (CNTs) embedded in an organic solid matrix. The TIM layer (102, 202) is positioned between the heat removal device (100) and a base surface of an integrated circuit device. The TIM layer (102, 202) may be adhesive.
PCT/US2014/042459 2013-06-20 2014-06-16 Thermal interface nanocomposite WO2014204828A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361837185P 2013-06-20 2013-06-20
US61/837,185 2013-06-20

Publications (2)

Publication Number Publication Date
WO2014204828A2 WO2014204828A2 (en) 2014-12-24
WO2014204828A3 true WO2014204828A3 (en) 2015-03-12

Family

ID=51205575

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2014/042459 WO2014204828A2 (en) 2013-06-20 2014-06-16 Thermal interface nanocomposite

Country Status (1)

Country Link
WO (1) WO2014204828A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9896389B2 (en) 2015-11-11 2018-02-20 International Business Machines Corporation Heat-generating multi-compartment microcapsules
US10309692B2 (en) 2015-11-11 2019-06-04 International Business Machines Corporation Self-heating thermal interface material
US9856404B2 (en) 2015-11-11 2018-01-02 International Business Machines Corporation Self-heating sealant or adhesive employing multi-compartment microcapsules
US10278284B2 (en) 2016-08-25 2019-04-30 International Business Machines Corporation Laminate materials with embedded heat-generating multi-compartment microcapsules
US9878039B1 (en) 2016-09-01 2018-01-30 International Business Machines Corporation Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction
US10328535B2 (en) 2016-11-07 2019-06-25 International Business Machines Corporation Self-heating solder flux material
US10357921B2 (en) 2017-05-24 2019-07-23 International Business Machines Corporation Light generating microcapsules for photo-curing
US10900908B2 (en) 2017-05-24 2021-01-26 International Business Machines Corporation Chemiluminescence for tamper event detection
US10392452B2 (en) 2017-06-23 2019-08-27 International Business Machines Corporation Light generating microcapsules for self-healing polymer applications

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060255450A1 (en) * 2005-05-11 2006-11-16 Molecular Nanosystems, Inc. Devices incorporating carbon nanotube thermal pads
US20080131722A1 (en) * 2006-03-21 2008-06-05 Ephraim Suhir Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
US20090232991A1 (en) * 2008-03-17 2009-09-17 The Research Foundation Of State University Of New York Composite thermal interface material system and method using nano-scale components
US20110090650A1 (en) * 2009-10-20 2011-04-21 Shinko Electric Industries Co., Ltd. Thermal conductive member, manufacturing method of the thermal conductive member, heat radiating component, and semiconductor package
US8435606B1 (en) * 2008-08-01 2013-05-07 Hrl Laboratories, Llc Polymer-infused carbon nanotube array and method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060255450A1 (en) * 2005-05-11 2006-11-16 Molecular Nanosystems, Inc. Devices incorporating carbon nanotube thermal pads
US20080131722A1 (en) * 2006-03-21 2008-06-05 Ephraim Suhir Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
US20090232991A1 (en) * 2008-03-17 2009-09-17 The Research Foundation Of State University Of New York Composite thermal interface material system and method using nano-scale components
US8435606B1 (en) * 2008-08-01 2013-05-07 Hrl Laboratories, Llc Polymer-infused carbon nanotube array and method
US20110090650A1 (en) * 2009-10-20 2011-04-21 Shinko Electric Industries Co., Ltd. Thermal conductive member, manufacturing method of the thermal conductive member, heat radiating component, and semiconductor package

Also Published As

Publication number Publication date
WO2014204828A2 (en) 2014-12-24

Similar Documents

Publication Publication Date Title
WO2014204828A3 (en) Thermal interface nanocomposite
TW200615501A (en) Thermal interface incorporating nanotubes
WO2014018491A3 (en) Systems, structures and materials for electronic device cooling
JP2012124175A5 (en)
WO2009035906A3 (en) Composite, thermal interface material containing the composite, and methods for their preparation and use
WO2009035907A3 (en) Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
SG10201403193RA (en) Methods for establishing thermal joints between heat spreaders or lids and heat sources
JP2014063723A5 (en) Display device
JP2010103508A5 (en) Semiconductor device
IN2015DN03284A (en)
IN2015DN02878A (en)
WO2008051552A3 (en) Organic semiconductor materials and methods of preparing and use thereof
WO2014140811A3 (en) Thermal management in electronic devices with yielding substrates
MY151538A (en) Light-emitting device with improved electrode structures
EP2784639A3 (en) Touch panel and touch device with the same
WO2007137099A3 (en) Double layer carbon nanotube-based structures and methods for removing heat from solid-state devices
TW200802762A (en) Heat sink, electronic device, and tuner apparatus
WO2014143364A3 (en) Co-formed element with low conductivity layer
WO2014138428A3 (en) Test system with localized heating and method of manufacture thereof
WO2010114766A3 (en) Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems
MY163250A (en) MAGNETIC STACK INCLUDING MgO-Ti(ON) INTERLAYER
EP2842642A3 (en) Ultrasonic probe and method of manufacturing the same
JP2014206814A5 (en)
WO2013138832A3 (en) Device for detecting critical states of a surface
EP2752880A3 (en) Graphene electronic devices and methods of manufacturing the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14739608

Country of ref document: EP

Kind code of ref document: A2

122 Ep: pct application non-entry in european phase

Ref document number: 14739608

Country of ref document: EP

Kind code of ref document: A2