JP2012129547A - 基板載置台、基板処理装置、および温度制御方法 - Google Patents

基板載置台、基板処理装置、および温度制御方法 Download PDF

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Publication number
JP2012129547A
JP2012129547A JP2012039440A JP2012039440A JP2012129547A JP 2012129547 A JP2012129547 A JP 2012129547A JP 2012039440 A JP2012039440 A JP 2012039440A JP 2012039440 A JP2012039440 A JP 2012039440A JP 2012129547 A JP2012129547 A JP 2012129547A
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Prior art keywords
substrate
heat transfer
transfer gas
mounting table
substrate mounting
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Pending
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JP2012039440A
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Japanese (ja)
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JP2012129547A5 (enExample
Inventor
Yasuharu Sasaki
康晴 佐々木
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2012039440A priority Critical patent/JP2012129547A/ja
Publication of JP2012129547A publication Critical patent/JP2012129547A/ja
Publication of JP2012129547A5 publication Critical patent/JP2012129547A5/ja
Pending legal-status Critical Current

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2012039440A 2012-02-25 2012-02-25 基板載置台、基板処理装置、および温度制御方法 Pending JP2012129547A (ja)

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JP2007227708A Division JP2009060011A (ja) 2007-09-03 2007-09-03 基板載置台、基板処理装置、及び温度制御方法

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JP2012129547A5 JP2012129547A5 (enExample) 2012-09-06

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016541116A (ja) * 2013-11-22 2016-12-28 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 静電チャック表面向けのパッド設計
JP2017183381A (ja) * 2016-03-29 2017-10-05 日本特殊陶業株式会社 保持装置
KR20200078360A (ko) 2018-12-21 2020-07-01 토토 가부시키가이샤 정전 척
KR20210007859A (ko) 2019-07-10 2021-01-20 도쿄엘렉트론가부시키가이샤 기판 적재대, 기판 처리 장치 및 온도 제어 방법
US11145532B2 (en) 2018-12-21 2021-10-12 Toto Ltd. Electrostatic chuck
US11393708B2 (en) 2018-12-21 2022-07-19 Toto Ltd. Electrostatic chuck
JP2022164340A (ja) * 2021-04-16 2022-10-27 日本特殊陶業株式会社 保持装置
US12106994B2 (en) 2020-05-25 2024-10-01 Ngk Insulators, Ltd. Electrostatic chuck

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05234944A (ja) * 1992-02-19 1993-09-10 Hitachi Ltd ウエハ温度制御方法及び装置
JPH07201956A (ja) * 1993-12-28 1995-08-04 Nippon Steel Corp ウエハ冷却装置
JPH07335630A (ja) * 1994-06-13 1995-12-22 Hitachi Ltd 真空処理装置
JPH08236508A (ja) * 1995-11-10 1996-09-13 Hitachi Ltd 基板処理方法および基板処理装置
JPH11204626A (ja) * 1998-01-16 1999-07-30 Anelva Corp 真空処理装置
JPH11243077A (ja) * 1997-12-26 1999-09-07 Hitachi Ltd プラズマ処理方法およびプラズマ処理装置
JPH11330215A (ja) * 1998-05-20 1999-11-30 Matsushita Electric Ind Co Ltd 基板温度制御方法及び装置
JP2002141332A (ja) * 2000-10-30 2002-05-17 Hitachi Ltd 半導体製造装置
JP2004259825A (ja) * 2003-02-25 2004-09-16 Hitachi High-Technologies Corp プラズマ処理装置
JP2007201355A (ja) * 2006-01-30 2007-08-09 Hitachi High-Technologies Corp ウエハ載置用電極

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05234944A (ja) * 1992-02-19 1993-09-10 Hitachi Ltd ウエハ温度制御方法及び装置
JPH07201956A (ja) * 1993-12-28 1995-08-04 Nippon Steel Corp ウエハ冷却装置
JPH07335630A (ja) * 1994-06-13 1995-12-22 Hitachi Ltd 真空処理装置
JPH08236508A (ja) * 1995-11-10 1996-09-13 Hitachi Ltd 基板処理方法および基板処理装置
JPH11243077A (ja) * 1997-12-26 1999-09-07 Hitachi Ltd プラズマ処理方法およびプラズマ処理装置
JPH11204626A (ja) * 1998-01-16 1999-07-30 Anelva Corp 真空処理装置
JPH11330215A (ja) * 1998-05-20 1999-11-30 Matsushita Electric Ind Co Ltd 基板温度制御方法及び装置
JP2002141332A (ja) * 2000-10-30 2002-05-17 Hitachi Ltd 半導体製造装置
JP2004259825A (ja) * 2003-02-25 2004-09-16 Hitachi High-Technologies Corp プラズマ処理装置
JP2007201355A (ja) * 2006-01-30 2007-08-09 Hitachi High-Technologies Corp ウエハ載置用電極

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016541116A (ja) * 2013-11-22 2016-12-28 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 静電チャック表面向けのパッド設計
JP2017183381A (ja) * 2016-03-29 2017-10-05 日本特殊陶業株式会社 保持装置
KR20200078360A (ko) 2018-12-21 2020-07-01 토토 가부시키가이샤 정전 척
US12557596B2 (en) 2018-12-21 2026-02-17 Toto, Ltd. Electrostatic chuck
US11145532B2 (en) 2018-12-21 2021-10-12 Toto Ltd. Electrostatic chuck
US11393708B2 (en) 2018-12-21 2022-07-19 Toto Ltd. Electrostatic chuck
US11450538B2 (en) 2019-07-10 2022-09-20 Tokyo Electron Limited Substrate stage, substrate processing apparatus, and temperature control method
US11854843B2 (en) 2019-07-10 2023-12-26 Tokyo Electron Limited Substrate stage, substrate processing apparatus, and temperature control method
US20240047241A1 (en) * 2019-07-10 2024-02-08 Tokyo Electron Limited Substrate stage, substrate processing apparatus, and temperature control method
KR20250072920A (ko) 2019-07-10 2025-05-26 도쿄엘렉트론가부시키가이샤 기판 적재대, 기판 처리 장치 및 온도 제어 방법
KR20210007859A (ko) 2019-07-10 2021-01-20 도쿄엘렉트론가부시키가이샤 기판 적재대, 기판 처리 장치 및 온도 제어 방법
US12106994B2 (en) 2020-05-25 2024-10-01 Ngk Insulators, Ltd. Electrostatic chuck
JP2022164340A (ja) * 2021-04-16 2022-10-27 日本特殊陶業株式会社 保持装置
JP7606917B2 (ja) 2021-04-16 2024-12-26 日本特殊陶業株式会社 保持装置

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