JP2012124253A5 - - Google Patents

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Publication number
JP2012124253A5
JP2012124253A5 JP2010272499A JP2010272499A JP2012124253A5 JP 2012124253 A5 JP2012124253 A5 JP 2012124253A5 JP 2010272499 A JP2010272499 A JP 2010272499A JP 2010272499 A JP2010272499 A JP 2010272499A JP 2012124253 A5 JP2012124253 A5 JP 2012124253A5
Authority
JP
Japan
Prior art keywords
plating layer
hole
electrode substrate
layer
energizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010272499A
Other languages
English (en)
Japanese (ja)
Other versions
JP5671317B2 (ja
JP2012124253A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010272499A priority Critical patent/JP5671317B2/ja
Priority claimed from JP2010272499A external-priority patent/JP5671317B2/ja
Publication of JP2012124253A publication Critical patent/JP2012124253A/ja
Publication of JP2012124253A5 publication Critical patent/JP2012124253A5/ja
Application granted granted Critical
Publication of JP5671317B2 publication Critical patent/JP5671317B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010272499A 2010-12-07 2010-12-07 貫通電極基板及びその製造方法 Expired - Fee Related JP5671317B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010272499A JP5671317B2 (ja) 2010-12-07 2010-12-07 貫通電極基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010272499A JP5671317B2 (ja) 2010-12-07 2010-12-07 貫通電極基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012124253A JP2012124253A (ja) 2012-06-28
JP2012124253A5 true JP2012124253A5 (enExample) 2014-01-30
JP5671317B2 JP5671317B2 (ja) 2015-02-18

Family

ID=46505420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010272499A Expired - Fee Related JP5671317B2 (ja) 2010-12-07 2010-12-07 貫通電極基板及びその製造方法

Country Status (1)

Country Link
JP (1) JP5671317B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102178158B1 (ko) * 2018-11-26 2020-11-12 동아대학교 산학협력단 관통공이 매립된 Si 기판의 제조방법
WO2022138151A1 (ja) * 2020-12-23 2022-06-30 富士フイルム株式会社 金属充填微細構造体及び金属充填微細構造体の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4153328B2 (ja) * 2003-02-25 2008-09-24 日本シイエムケイ株式会社 多層プリント配線板の製造方法
JP4800585B2 (ja) * 2004-03-30 2011-10-26 ルネサスエレクトロニクス株式会社 貫通電極の製造方法、シリコンスペーサーの製造方法
JP2007005404A (ja) * 2005-06-21 2007-01-11 Matsushita Electric Works Ltd 半導体基板への貫通配線の形成方法
JP2007067031A (ja) * 2005-08-30 2007-03-15 Tdk Corp 配線基板の製造方法
JP4755545B2 (ja) * 2006-07-11 2011-08-24 新光電気工業株式会社 基板の製造方法

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