JP2012114231A - Light emitting component, light emitter, and manufacturing method of the light emitting component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting component which improves adhesion of a sealing resin without changing material composition while maintaining light resistance of the sealing resin and a gas shut off function of a primer layer, and to provide a manufacturing method of the light emitting component.SOLUTION: A light emitting element and a primer layer having an excellent gas shut off function are sealed with a sealing resin having excellent light resistance. Further, the primer layer is formed so as to have a multilayer structure composed of a gas shut off layer and an adhesion layer improving the adhesion of the sealing resin. This structure improves the adhesion of the sealing resin.

Description

  The present invention relates to a light emitting component on which a light emitting element is mounted, a method for manufacturing the light emitting component, a light emitting device using the light emitting component, and a sealing method for a sealing resin.

  A blue LED (Light Emitting Diode) element was developed in the 1990s, and a white LED combining a blue LED element and a YAG (Yttrium Aluminum Garnet) phosphor that emits yellow light with high efficiency in response to light from the blue LED element. Was developed. As a result, development aimed at stabilizing the chromaticity of white and increasing the brightness has been progressing toward application development to general illumination using LEDs and a backlight light source for TV. In these developments, improvement in heat resistance and light resistance of the sealing resin for sealing the LED element has become a major issue. In a white LED, deterioration of peripheral members due to blue light having a short wavelength and a large energy emitted from an LED element to be used becomes a problem.

  Further, when an epoxy resin is used as the sealing resin, the wavelength emitted from the LED element is short and the energy is large. For this reason, deterioration such as discoloration of the sealing resin is severe, and high luminance emission cannot be maintained for a long time.

  Silicone resin is used as a sealing resin that can withstand the demand for long-time high luminance light emission. However, many silicone resins have excellent light resistance but poor gas barrier properties. When the gas barrier property of the sealing resin is poor, for example, dew condensation occurs between the sealing resin and the substrate or the package interface due to the permeation of water vapor, causing deterioration of the wiring pattern and device electrodes and short circuit. For this reason, it is necessary to have corrosion resistance in gas for in-vehicle applications and the like, but if the sealing resin has a poor gas barrier property, the stable operability of the LED element cannot be satisfied.

  On the other hand, some silicone resins are modified with a resin having a good gas barrier property, but the light resistance is lowered, so it is difficult to find an optimal sealing resin. In addition, since the silicone resin has low adhesiveness, the resin peels off due to the difference in thermal expansion coefficient at the interface with the peripheral member due to heat generation of the light emitting element, etc., causing deterioration of characteristics as a light emitting component such as a decrease in light emission luminance. .

  As a technique to improve this, by forming a primer layer with high gas barrier property on the peripheral member and sealing it with a silicone resin from above, the gas barrier property is improved and the adhesion between the substrate and the primer layer is improved. An LED package is disclosed (Patent Document 1).

JP 2010-10279 A

  When the primer layer is formed in the light emitting component, the adhesion between the substrate and the primer layer is improved. However, since the adhesiveness of the silicone resin itself is weak, there is a problem that the adhesiveness between the primer layer and the silicone resin is not sufficient.

  Accordingly, an object of the present invention is to form an adhesion layer that improves the adhesion between the primer layer and the sealing resin, thereby maintaining the functions of the light resistance of the sealing resin and the gas barrier property of the primer layer. It is providing the light emitting component which improves the adhesiveness of a stop resin, and its manufacturing method.

The present invention employs the following means in order to solve the above problems.
The light-emitting component according to the invention includes a substrate, a light-emitting element mounted on the substrate, a primer layer that covers at least a part of the substrate and the surface of the light-emitting element, and a sealing resin that covers the primer layer. A light-emitting component, wherein the primer layer is formed of a resin having gas barrier properties, and the sealing resin has light resistance and transmits light emitted from the light-emitting element, and the primer layer The adhesion layer includes at least one adhesion layer, and the adhesion layer is made of a resin that transmits light emitted from the light emitting element and reacts at each interface between the primer layer and the sealing resin. It is characterized by.

  The light-emitting component according to the present invention forms an adhesion layer that reacts at each interface between the primer layer and the sealing resin, thereby maintaining the light resistance of the sealing resin and the gas barrier property of the primer layer. Adhesion between the layer and the sealing resin can be improved.

In the light-emitting component according to the present invention, the resin of the adhesion layer has a functional group that binds to the primer layer and the sealing resin, respectively.
Thereby, since the adhesion layer can bind and react with the primer layer and the sealing resin, the adhesion with the sealing resin is reliably improved.

In the light-emitting component according to the present invention, the adhesion layer is formed of a first resin having a gas barrier property and a second resin that transmits light emitted from the light-emitting element. The resin has functional groups that bind to the functional groups of the primer layer and the second resin, and the second resin binds to functional groups of the sealing resin and the first resin. It has a functional group.
As a result, the first resin that binds and reacts with the primer layer and the second resin that binds and reacts with the sealing resin are bonded and the adhesion between the primer layer and the sealing resin is reliably improved. Can do.

In the light-emitting component according to the present invention, the adhesion layer is composed of two or more layers, and the molar concentration ratio of the first resin in each layer decreases from the primer layer toward the sealing resin. It is characterized by going.
Thereby, the affinity of one layer that adheres to the primer layer of the adhesion layer to the primer layer, the affinity to each layer of the adhesion layer, and the affinity of one layer that adheres to the sealing resin of the adhesion layer to the sealing resin are high. Therefore, the adhesion between the primer layer and the sealing resin can be further improved. Therefore, the light-emitting component according to the present invention is less likely to cause interface peeling and has high durability.

In the light-emitting component according to the present invention, the thickness of one layer of the adhesion layer is 0.05 μm or more and 20 μm or less.
If the thickness of one layer of the adhesion layer is 0.05 μm or more, it can contribute to improvement of adhesiveness. Moreover, if the thickness of one layer of the adhesion layer is 20 μm or less, the light resistance can be sufficiently maintained.

In the light-emitting component according to the present invention, the thickness of the primer layer is 0.2 μm or more and 90 μm or less, and the total thickness of the primer layer and the adhesion layer is 100 μm or less. To do.
Thereby, gas barrier properties can be maintained without affecting the light resistance of the sealing resin.

In the light-emitting component according to the present invention, the sealing resin is made of a silicone resin, and the primer layer is made of an acrylic resin or a modified silicone resin.
Thereby, a light emitting component can be comprised with the sealing resin which has light resistance, and the primer layer which has gas-blocking property.

In the light-emitting component according to the present invention, the sealing resin has a refractive index lower than the refractive index of the primer layer, the adhesion layer is a multilayer of two or more layers, and the refractive index of each layer of the adhesion layer However, it is characterized by becoming lower from the primer layer toward the sealing resin.
Thereby, since the total reflection of the light emitted from the light emitting element can be prevented between the respective layers, the efficiency of extracting the light from the light emitting element to the outside of the light emitting component can be improved.

Moreover, a light-emitting device can be manufactured using the light-emitting component according to the present invention.
The method for manufacturing a light-emitting component according to the present invention includes a light-emitting element mounting step of mounting a light-emitting element on a substrate, a primer layer made of a resin having gas barrier properties, at least a part of the substrate, and the light-emitting element The primer layer forming step formed on the surface of the substrate, and at least one adhesion layer formed of a resin that transmits light emitted from the light emitting element and reacts at each interface of the primer layer and the sealing resin An adhesive layer forming step of forming on the primer layer, and a satirical resin forming step of forming a sealing resin that transmits light emitted from the light emitting element on the adhesive layer.

  In the method for manufacturing a light-emitting component according to the present invention, in the adhesion layer forming step, a functional group included in the adhesion layer is bonded to a functional group included in the primer layer. The functional group of the layer is bonded to the functional group of the sealing resin.

  In the method for manufacturing a light emitting component according to the present invention, in the adhesion layer forming step, the adhesion layer includes a first resin having a gas barrier property and a second resin that transmits light emitted from the light emitting element. And the first resin and the second resin are formed by bonding with a functional group of each resin.

  The light-emitting component according to the present invention forms an adhesion layer that reacts at each interface between the primer layer and the sealing resin, thereby maintaining the light resistance of the sealing resin and the gas barrier property of the primer layer. Adhesion between the layer and the sealing resin can be improved.

It is a figure which shows the light emitting component which concerns on 1st embodiment of this invention. It is a figure which shows the comparison of the adhesive strength of the light emitting component which concerns on 1st embodiment of this invention, and the adhesive strength of the light emitting component when there is no adhesion layer. It is a figure which shows an electrode formation process among the processes which manufacture the light emitting component which concerns on 1st embodiment of this invention. It is a figure which shows a light emitting element mounting process among the processes which manufacture the light emitting component which concerns on 1st embodiment of this invention. It is explanatory drawing which shows a primer layer formation process among the processes of manufacturing the light emitting component which concerns on 1st embodiment of this invention. It is explanatory drawing which shows a sealing resin formation process among the processes which manufacture the light emitting component which concerns on 1st embodiment of this invention. It is a figure which shows the light emitting component which concerns on 2nd embodiment of this invention. It is a figure which shows the light emitting component which concerns on 3rd embodiment of this invention. It is a figure which shows the light emitting component which concerns on 4th embodiment of this invention. It is a figure which shows an electrode formation process among the processes of manufacturing the light emitting component which concerns on 4th embodiment of this invention. It is a figure which shows a light emitting element mounting process among the processes which manufacture the light emitting component which concerns on 4th embodiment of this invention. It is a figure which shows a primer layer formation process among the processes which manufacture the light emitting component which concerns on 4th embodiment of this invention. It is a figure which shows sealing resin formation among the processes which manufacture the light emitting component which concerns on 4th embodiment of this invention. It is a figure which shows the light emitting component which concerns on 5th embodiment of this invention. It is a figure which shows an electrode formation process among the processes which manufacture the light emitting component which concerns on 5th embodiment of this invention. It is a figure which shows a light emitting element mounting process among the processes of manufacturing the light emitting component which concerns on 5th embodiment of this invention. It is a figure which shows a primer layer formation process among the processes which manufacture the light emitting component which concerns on 5th embodiment of this invention. It is a figure which shows sealing resin formation among the processes which manufacture the light emitting component which concerns on 5th embodiment of this invention. It is a figure which shows the light emitting component individualization process among the processes which manufacture the light emitting component which concerns on 5th embodiment of this invention.

  Below, the light emitting component carrying the light emitting element of this invention is demonstrated using embodiment. It should be noted that the present invention is not limited to the following embodiments as long as the gist thereof is not exceeded.

1st Embodiment which concerns on this invention is described based on drawing.
Fig.1 (a) is the figure which showed the light emitting component which mounted the light emitting element which is 1st embodiment which concerns on this invention from the upper surface direction of the light-emitting device, FIG.1 (b) is A in FIG.1 (a). It is a figure showing -A cross section.
As shown in FIG. 1B, the light emitting component 10 includes a light emitting element 5 disposed on one surface of the substrate 2.

  The board | substrate 2 is equipped with the hollow part which has an inclined surface which spreads toward an opening end from a bottom face inside. Moreover, the board | substrate 2 has insulation, for example, is formed with any one among resin, glass, and a ceramic. The substrate 2 is preferably made of any one of light-reflective resin, ceramic, and glass. In the present embodiment, the substrate 2 is made of resin. In this case, since the light irradiated from the light emitting element 5 is reflected by the substrate 2, attenuation of the light irradiated from the light emitting element 5 can be prevented.

  The substrate 2 also includes two substrate through holes that penetrate from one surface of the substrate 2 to the surface opposite to the one surface. The through electrodes 3 are formed in the two substrate through holes, respectively. The through electrode 3 is formed of, for example, silver paste. Further, electrode pads 4 are respectively formed on the two through electrodes 3 on one surface of the substrate 2. The electrode pad 4 is made of metal and is formed by a printing technique or a lithography technique. The electrode pad 4 may be made of a highly reflective material such as silver. As a result, the light emitting component 10 is formed from one surface of the substrate toward the surface opposite to the one surface, and two extraction electrodes that are electrically connected to different electrode pads, that is, the through electrodes in the present embodiment. It has a configuration that is equipped.

  Further, the light emitting element 5 is disposed in the recess, is connected to the bonding wire 6, and is disposed on one electrode pad 4. The bonding wire 6 is formed of, for example, gold and aluminum wires that are easy to process and have low electrical resistance. The bonding wire 6 is connected to the other electrode pad 4. That is, the light emitting element 5 is electrically connected to the two through electrodes 3. Specifically, in the light emitting element 5, an anode electrode (not shown) is connected to one electrode pad 4 formed on the through electrode 3, and the other electrode pad formed on the substrate 2 by the bonding wire 6. A cathode electrode (not shown) is connected to 4.

Moreover, the light emitting element 5 is a blue LED element which has a main light emission peak in a blue wavelength range with a wavelength of 400 nm or more and 500 nm or less as an example. The light emitting element 5 is not limited to the blue LED element. For example, red / yellow / green / ultraviolet LED and organic EL.
The light-emitting component 10 includes a light-emitting element 5, an electrode pad 4, a layered primer layer 7 that covers one surface of the substrate 2 and the inclined surface of the recess.

  The primer layer 7 is made of a material whose main component is a gas barrier resin. In this case, the primer layer 7 is an acrylic resin having a gas barrier property, or a modified silicone resin having a gas barrier property in which at least one of acryloyl group, epoxy group, amino group, carboxyl group, and alkoxy group is introduced. Can be formed.

  The primer layer 7 can be preferably composed of an acrylic resin having the following formula (1).

ここで、Ｒ１は、例えばアルキル基、フルオロアルキル基から選ばれる基で構成する。また、Ｒ２は、加水分解性シリル基、シラノール基、不飽和基を有するシリル基、ヒドロシリル基、アルコキシ基等の珪素基から選ばれる基で構成する。また、ａは自然数である。

Here, R1 is composed of a group selected from, for example, an alkyl group and a fluoroalkyl group. R2 is composed of a group selected from silicon groups such as hydrolyzable silyl groups, silanol groups, silyl groups having an unsaturated group, hydrosilyl groups, and alkoxy groups. A is a natural number.

  Further, the light emitting component 10 includes an adhesion layer 9 that covers the primer layer 7 and adheres closely to the primer layer 7.

  In addition, the light emitting component 10 covers and closely adheres to the adhesion layer 9 and is a sealing resin made of a material mainly composed of a light-resistant resin that fills the depression of the substrate 2 and seals the light emitting element 5. 8 has. In this case, the sealing resin 8 may be a light-resistant resin such as a silicone resin having the following formula (2).

ここで、Ｒ３は、例えばアルキル基で構成する。また、Ｒ４は、例えば、ビニル基、活性水素、アミノ基、エポキシ基、アルコキシ基から選ばれる基で構成する。また、Ｒ５、Ｒ６は、それぞれ独立したエトキシ基、メトキシ基などのアルコキシ基、またはフルオロアルキル基から選ばれる基で構成する。また、ｂは自然数である。

Here, R3 is composed of, for example, an alkyl group. R4 is composed of, for example, a group selected from a vinyl group, active hydrogen, amino group, epoxy group, and alkoxy group. R5 and R6 are each composed of an independent ethoxy group, an alkoxy group such as a methoxy group, or a group selected from a fluoroalkyl group. B is a natural number.

Moreover, the length of the polymer of Formula (1) and Formula (2) can be adjusted by adding the molecule | numerator which stops superposition | polymerization.
In addition, the adhesion layer 9 is characterized by having functional groups that respectively bond to the functional groups of the primer layer 7 and the sealing resin 8.

  At this time, in the case where the primer layer 7 is a resin constituted by the formula (1), for example, if the adhesion layer 9 has a portion constituted by the formula (1), the polymerization reaction can be performed by a polymerization initiator or the like. it can. However, if the adhesion layer 9 is a resin having good affinity with the primer layer 7, the adhesion layer 9 does not necessarily have a functional group that binds to the primer layer 7.

  At this time, when the sealing resin is a resin constituted by the formula (2), for example, if the adhesion layer 9 has a portion constituted by the formula (2), the functional groups constituting R5 and R6 After the hydrolysis, dehydration condensation can be carried out, or the dehydration condensation can be carried out as it is. However, if the adhesion layer 9 is a resin having good affinity with the sealing resin 8, the adhesion layer 9 does not necessarily have a functional group that binds to the sealing resin 8.

The adhesion layer 9 can be composed of a first resin having a gas barrier property and a second resin that transmits light emitted from the light emitting element 5. At this time, the 1st resin has a functional group couple | bonded with the functional group which the primer layer 7 and 2nd resin have.
In addition, the second resin has a functional group that binds to the functional group of the sealing resin 8 and the first resin.
At this time, the first resin can be composed of an acrylic resin of the following formula (3).

また、第２の樹脂は、下記の式（４）のシリコーン系樹脂で構成することができる。

The second resin can be composed of a silicone resin of the following formula (4).

ここで、式（３）のＲ７〜Ｒ９は、それぞれ独立したメチル基、アルキル基、フルオロアルキル基などから選ばれる基であり、第２の樹脂と結合しない官能基で構成されている。また、Ｒ１０は、活性水素、水酸基、カルボキシル基、アミノ基、エポキシ基、ビニル基などから選ばれる基で構成され、式（４）のＲ１４と結合することができる。

Here, R7 to R9 in the formula (3) are groups independently selected from a methyl group, an alkyl group, a fluoroalkyl group, and the like, and are composed of functional groups that do not bind to the second resin. R10 is composed of a group selected from active hydrogen, a hydroxyl group, a carboxyl group, an amino group, an epoxy group, a vinyl group, and the like, and can be bonded to R14 in the formula (4).

  In addition, R11 to R13 in the formula (4) are groups selected from an independent methyl group, alkyl group, fluoroalkyl group, and the like, and are composed of functional groups that do not bind to the first resin. R14 is composed of a group selected from a hydroxyl group, a vinyl group, an epoxy group, an amino group, a carboxyl group, active hydrogen, and the like, and can be bonded to R10 in the formula (3).

  The first resin is formed by adding a polymerization initiator or the like and proceeding the polymerization reaction of each molecule. The second resin can polymerize each molecule by, for example, dehydration condensation after hydrolysis of a group selected from a vinyl group, active hydrogen, amino group, epoxy group, and alkoxy group, or dehydration condensation as it is. .

  The bond between R10 and R14 can be combined with the polymerization reaction of R14 by dehydration condensation of R10 simultaneously with the polymerization reaction of the first resin and the second resin.

  In addition, R4 and R8 can be polymerized by dehydration condensation of hydroxyl groups in which R10 and R14 are composed of hydroxyl groups, separately from the polymerization reaction of the first resin and the second resin. Further, for example, one of R10 and R14 can be composed of an epoxy group such as a glycidoxy group and the other can be composed of a hydroxyl group, an amino group, a carboxyl group, or active hydrogen, and R10 and R14 can be subjected to addition polymerization. Alternatively, one of R10 and R14 can be composed of active hydrogen and the other is composed of a vinyl group, and can be polymerized with a platinum catalyst. When either R10 or R14 is composed of active hydrogen, R10 is preferably composed of active hydrogen. In the above case, the first resin and the second resin can be polymerized separately. Further, since R4 and R8 are bonded separately from the polymerization reaction, R4 and R8 can be bonded.

  Further, the ratio of m in the formula (3) is preferably 0.1% to 10%. When m is 0.1% or less, bonding is insufficient and the effect is small. Moreover, when m is 10% or more, the resin is hardened more than necessary, and it is not possible to cope with inhibition of gas barrier properties and expansion / contraction due to heat, which may cause cracks. Further, the ratio of y in the formula (4) is preferably 0.1% to 10%. When y is 0.1% or less, bonding is insufficient and the effect is small. Further, when y is 10% or more, the resin is hardened more than necessary, and it is not possible to cope with inhibition of gas barrier properties and expansion / contraction due to heat, which may cause cracks.

  Note that when the affinity between the first resin and the second resin is high, the reaction for bonding the first resin and the second resin is not necessarily performed.

  Further, the thickness of the primer layer 7 is desirably 0.2 μm or more and 90 μm or less. When the thickness of the primer layer 7 is 0.2 μm or more, the gas barrier property can be sufficiently maintained. In addition, when the thickness of the primer layer 7 is 90 μm or less, the light resistance can be sufficiently maintained without considering the influence of the thickness.

  Moreover, it is desirable that the thickness of the adhesion layer 9 is 0.05 μm or more and 20 μm or less. When the thickness of the adhesion layer 9 is 0.05 μm or more, there is an effect that contributes to an improvement in adhesiveness. Further, when the thickness of the adhesion layer 9 is 20 μm or less, the light resistance can be sufficiently maintained without considering the influence of the thickness.

  Furthermore, the total thickness of the primer layer 7 and the adhesion layer 9 is preferably 100 μm or less. In this case, sufficient light resistance can be maintained without much consideration of the influence of thickness.

  In the above case, the adhesiveness of the sealing resin 8 can be further improved while reliably maintaining the light resistance of the sealing resin 8 and the gas barrier properties of the primer layer 7. In addition, when the light-emitting element 5 is a blue light-emitting element, the primer layer 7 changes color when irradiated with high-energy light having a particularly short wavelength such as blue light and ultraviolet light emitted from the light-emitting element 5 for a long time. Causes light loss. Therefore, it is desirable that the primer layer 7 be as thin as possible to minimize optical loss. Note that the thickness of the primer layer 7 is not necessarily limited to the above range, and the thickness can be easily adjusted, so that it can be appropriately changed according to the type of the light emitting element.

Moreover, when the light emitting element 5 is the blue light emitting element 5, the sealing resin 8 may contain a phosphor and a filler (not shown) that convert the wavelength of light from the light emitting element 5.
As the phosphor, when the light emitting element 5 is a blue light emitting element, for example, a yellow phosphor having an average particle diameter of 5 μm and high luminous efficiency such as (Ba · Sr) 2 SiO 4: Eu can be used. This yellow phosphor absorbs blue light emitted from the blue light emitting element 5 and emits yellow fluorescence having a light emission peak in a wavelength region of 550 nm to 600 nm.

  Next, the adhesive strength between the primer layer and the sealing resin in the light emitting component of this embodiment will be described.

  FIG. 2 shows a comparison between the adhesive strength between the primer layer and the sealing resin in the light emitting component of this embodiment and the adhesive strength between the primer layer and the sealing resin in the light emitting component when there is no conventional adhesion layer. FIG. Note that FIG. 2 shows the adhesive strength in this embodiment when the adhesive strength between the primer layer and the sealing resin is 1 when there is no adhesion layer.

  As shown in FIG. 2, the adhesive strength in this embodiment can improve the adhesive strength of a primer layer and sealing resin compared with the case where there is no adhesion layer.

  The adhesion layer may be composed of two or more layers. In this case, the molar concentration of the first resin in each layer can be reduced from the primer layer toward the sealing resin.

  With such a configuration, the affinity of one layer that adheres to the primer layer of the adhesion layer to the primer layer, the affinity to each layer of the adhesion layer, and the one layer that adheres to the sealing resin of the adhesion layer to the sealing resin The affinity of each increases. Therefore, the adhesiveness between the primer layer and the sealing resin can be improved. As a result, the light emitting component according to the present embodiment is less likely to cause interface peeling and the like and has high durability.

  For example, the adhesion layer 9 includes the first layer formed on the primer layer, the second layer formed on the first layer, the first resin of the third layer formed on the second layer, and the second layer. The molar ratio of the resin is 8: 2, 5: 5, and 2: 8, respectively. At this time, the primer layer 7 has a higher refractive index than the sealing resin 8. The adhesion layer 9 has a refractive index lower than that of the primer layer 7 and higher than that of the sealing resin 8. Therefore, with this configuration, the refractive index can be lowered from the primer layer 7 toward the sealing resin 8. Thereby, since reflection of the light emitted from the light emitting element can be reduced between the respective layers, the efficiency of taking out the light from the light emitting element to the outside of the light emitting component can be improved.

  In each layer of the adhesion layer 9, by adding metal particles that increase the refractive index, the primer resin 7 to the sealing resin 8 can be obtained without changing the molar concentration ratio of the first resin and the second resin. The refractive index can be lowered toward.

  Moreover, although the example in which the adhesion layer 9 is composed of three layers has been shown, the number of the adhesion layers 9 of the present invention is not limited to three.

Next, the manufacturing method of the light emitting component of this embodiment is demonstrated. 2 to 5 are process diagrams showing a method for manufacturing the light-emitting component 10.
FIG. 3 shows an electrode forming process by processing the substrate 2.

  First, Fig.3 (a) is a figure which shows the board | substrate 2 which consists of glass. The board | substrate 2 is equipped with the hollow part which has an inclined surface which spreads toward the opening end from 1 surface inside. The material of the substrate 2 is not limited to glass, and insulating resin, ceramic, or the like can be used.

  FIG. 3B is a diagram illustrating a substrate through-hole forming step in which two substrate through-holes are formed through the substrate 2 from one surface of the substrate 2 to the surface opposite to the first surface. In the step of FIG. 2B, a substrate through hole for forming a through electrode in the substrate 2 is formed by machining or etching.

  FIG. 3C is a diagram illustrating an electrode formation process in which the through electrodes 3 are formed in the two substrate through holes of the substrate 2 and the electrode pads 4 are formed on the two through electrodes 3, respectively. In the step shown in FIG. 3C, a silver paste or the like is applied to the two substrate through holes formed in the step shown in FIG. Thereby, two extraction electrodes are formed from one surface of the substrate toward the surface opposite to the one surface. In addition, on one surface of the substrate 2, electrode pads 4 made of metal are formed on the two through electrodes 3 by a printing technique or a lithography technique, respectively. In addition, since the silver paste which forms the penetration electrode 3 has good thermal conductivity, the heat generated from the light emitting element can be efficiently radiated. Any metal other than silver paste may be used as long as it has heat dissipation.

  FIG. 4 is a diagram showing a light emitting element mounting process in which the light emitting element 5 is arranged on any one of the electrode pads 4 and the two through electrodes 3 serving as extraction electrodes are electrically connected to the light emitting element 5.

  FIG. 4A is a diagram showing a process of disposing the light emitting element 5 on one electrode pad 4 and electrically connecting the one through electrode 3 and the light emitting element. In the step of FIG. 4A, an anode electrode (not shown) of the light emitting element 5 is connected to one electrode pad 4. The heat generated in the light emitting element 5 can be radiated to the outside through the through electrode 3.

  FIG. 4B is a diagram illustrating a process of electrically connecting the other through electrode 3 and the light emitting element. In the step of FIG. 4B, a cathode wire (not shown) of the light-emitting element 5 and a bonding wire 6 are connected to the other electrode pad 4 using a wire bonding apparatus, and the cathode electrode (see FIG. (Not shown) and the other electrode pad 4 are electrically connected. The bonding wire 6 is formed of, for example, gold and aluminum wires that are easy to process and have low electrical resistance.

  In FIG. 5, the primer layer 7 mainly composed of a resin having gas barrier properties covers the surface of the substrate 2, the inclined surface of the depression and the surface of the light emitting element 5, and the surface of the primer layer 7 is covered with the adhesion layer 9. It is a figure which shows the primer layer formation process which forms the cover, the primer layer 7, and the contact | adherence layer 9, and the contact | adherence layer formation process.

  FIG. 5A is a diagram showing a process of covering the surface of the substrate 2, the inclined surface of the depression and the surface of the light emitting element 5 with the primer layer 7. 5A, the primer layer 7 having a flat surface is formed by a dipping method, a spray method, a dispenser method or the like, and the surface of the substrate 1, the inclined surface of the recess, the light emitting element 5 and the electrode pad 4 are formed. Cover the exposed areas. At this time, there is no problem even if the primer layer 7 is formed on the surface of the substrate 2 other than the recessed portion of the substrate 2.

FIG. 6 is a diagram showing a step of covering the surface of the flat primer layer 7 with an adhesion layer 9 in the step of FIG.
The process of FIG. 5B is formed by the same method as the process of FIG. 5A, and there is no problem even if the adhesion layer 9 is formed on the surface of the substrate 2 other than the recessed portion of the substrate 2.

FIG. 6 is a diagram showing a sealing resin forming step of covering the adhesion layer 9 with a sealing resin 8 made of a material whose main component is light-resistant resin.
As shown in FIG. 6, the sealing resin 8 is formed by filling the depression portion of the substrate 2 on the adhesion layer 9 formed in the concave portion of the substrate 2 and heating. Thereby, the light emitting component which improved adhesiveness with sealing resin can be formed.

Next, 2nd embodiment which concerns on this invention is described based on FIG.
FIG. 7 illustrates a cross section of the light emitting component 10 in the second embodiment according to the present invention. The detailed description of the same configuration as that of the first embodiment is omitted. The light emitting component 10 in the second embodiment is the same as that in the first embodiment except that the metal reflection film 16 is formed on the inclined surface of the recess of the substrate 2 and the primer layer 7 is formed thereon. .

  The metal reflective film 16 is either Ag formed by sputtering or vacuum deposition, or an Ag alloy containing at least one metal of Nd, Bi, Pt, Au, Cu, Mg, Ti, Ta, and Pd. It is a film made of these. The light irradiated from the light emitting element 5 is reflected by the metal reflection film 16. For this reason, the metal reflection film 16 has a higher reflectance than the reflectance on the surface of the substrate 2, so that the light irradiated from the light emitting element 5 can be prevented from being further attenuated. Thereby, more light can be emitted from the light emitting component 10.

Next, a third embodiment according to the present invention will be described with reference to FIG.
FIG. 8 illustrates a cross section of the light emitting component 10 according to the third embodiment of the present invention. The detailed description of the same configuration as that of the first embodiment is omitted. In the light emitting component 10 according to the third embodiment, the flip chip type light emitting element 11 is disposed on the two electrode pads 4, so that the two electrode pads 4 and the light emitting element 11 can be formed without using bonding wires. Except for being electrically connected, it is the same as in the first embodiment.

  Since the light emitting element 11 is mounted without using a bonding wire, the non-uniformity of the primer layer 7 can be reduced. Thereby, it is easy to control the film thickness of the primer layer 7, and the productivity at the time of mass production can be improved.

  FIG. 9 illustrates a cross section of the light emitting component 20 in the fourth embodiment according to the present invention. The detailed description of the same configuration as that of the first embodiment is omitted.

  The light-emitting component 20 is formed from one surface of the substrate 22 toward the surface opposite to the one surface, and is used as two extraction electrodes that are electrically connected to different electrode pads 24, respectively. Two lead-out electrodes 23 are formed to cover the surface of the substrate up to the surface opposite to the surface. Further, the lead-out electrode 23 is connected to the electrode pad 24 at an end portion on one surface side of the substrate.

  The light emitting component 20 includes a reflecting member 17 formed on one surface of the substrate. The reflection member 17 has a reflection member through hole penetrating from the surface on the one surface side of the substrate 22 to the surface opposite to the surface on the one surface side. The reflecting member 17 is configured by an inclined surface whose side surface on the reflecting member through-hole side extends from the surface on the one surface side of the substrate toward the surface opposite to the surface on the one surface side. Further, the substrate 22 and the reflection member 17 are joined via the routing electrode 23 and the adhesive layer 21.

  The primer layer 27 covers one surface of the substrate 22, the surface of the light emitting component 25, the exposed portion of the electrode pad 24, and the inclined surface of the reflecting member 17. Moreover, the light emitting element is arrange | positioned in the reflection member through-hole.

  In this embodiment, since the through electrode formed in the substrate through hole is not used as the extraction electrode, the substrate 22 can be easily created. That is, it is not necessary to form a substrate through hole in the substrate 22, and the quality of the light emitting component can be improved. Further, the lead-out electrode 23 and the electrode pad 24 can be formed by the same method, for example, sputtering or vacuum deposition. In addition, when the substrate is flat, it is easy to create a lead-out electrode, so that the efficiency in mass production can be improved. Further, when the reflecting member is formed of a member having good thermal conductivity, the heat from the light emitting element 25 can be efficiently released.

Next, the manufacturing method of the light emitting component of this embodiment is demonstrated. 10 to 13 are process diagrams showing a method for manufacturing the light-emitting component 20.
FIG. 10 is a diagram showing an electrode forming process and a light emitting element mounting process by processing the substrate 22.

  FIG. 10A shows a substrate 22 made of glass. The material of the substrate 22 is not limited to glass, and resin, ceramic, or the like can be used.

  FIG. 10B shows that the substrate 22 covers the surface of the substrate from the one surface of the substrate to the surface opposite to the one surface, that is, one surface from one surface of the substrate 22 through the side surface. FIG. 5 is a diagram showing an electrode forming process in which two lead-out electrodes 23 connected to the opposite surface are formed, and an electrode pad 24 is formed at the end of one side of the substrate 22 of the lead-out electrode 23. In the step of FIG. 10B, the lead electrode 23 is formed on the substrate 22 by sputtering, vacuum deposition, or the like. In addition, the electrode pad can be formed by sputtering or vacuum vapor deposition as well as the lead electrode and can be formed by a printing technique. By forming the lead-out electrode 23 and the electrode pad 24 with the same material, the manufacturing process can be shortened. The lead-out electrode 23 and the electrode pad 24 can be formed of a material having good thermal conductivity such as silver.

  FIG. 10C shows a reflection member through-hole penetrating from a surface on one surface side of the substrate 22 to a surface opposite to the surface on the one surface side, and the side surface on the reflection member through-hole side is one of the substrate. It is a figure which shows the process of joining to the 1st surface of a board | substrate the reflecting member comprised by the inclined surface which spreads toward the surface on the opposite side to the surface of 1 surface side from the surface side surface. In FIG. 10C, the reflecting member 17 is joined to the substrate 22 via the lead electrode 23 and the adhesive layer 21, and a reflecting member that reflects light from the light emitting element is disposed.

  The reflecting member 17 is made of a metal material such as silver or aluminum having a good visible light reflectivity. Further, the reflecting member 17 may be formed by forming a metal film such as silver or aluminum on the surface of resin, ceramic, glass or the like. Further, the reflection member 17 may be a metal film mixed with a substance that reflects visible light. The adhesive layer 21 can be made of an adhesive having electrical insulation and good thermal conductivity. Thereby, the heat generated from the light emitting element can be efficiently radiated.

  FIG. 11 is a diagram showing a light emitting element mounting step in which the light emitting element 25 is disposed on any one of the electrode pads 24 and the two lead-out electrodes 23 and the light emitting element 25 are electrically connected.

  FIG. 11A is a diagram showing a process of disposing the light emitting element 25 on one electrode pad 24 and electrically connecting the one electrode wiring 23 and the light emitting element 25. In the step of FIG. 11A, an anode electrode (not shown) of the light emitting element 25 is connected to one electrode pad 24. The heat generated in the light emitting element 25 can be radiated to the outside through the routing electrode 23.

  FIG. 11B is a diagram showing a process of electrically connecting the other routing electrode 23 and the light emitting element 25. In the step of FIG. 11B, a bonding wire 26 is connected to the other electrode pad 24 using a cathode electrode (not shown) of the light emitting element 25 and a wire bonding apparatus, and the cathode electrode (see FIG. (Not shown) and the other electrode pad 24 are electrically connected. The bonding wire 26 is formed of, for example, gold and aluminum wires that are easy to process and have low electrical resistance.

12A and 12B are diagrams showing a primer layer forming step and an adhesion layer forming step, which are the same steps as those in the first embodiment.
FIG. 13 is a diagram illustrating a sealing resin forming process, which is the same process as in the first embodiment. Thereby, a light emitting component can be formed.

  In the first embodiment, the light emitting component can be composed of a substrate and a reflecting member as shown in the present embodiment. In this case, since the substrate and the reflecting member can be formed of different members as in this embodiment, they can be formed of optimum members as in this embodiment.

Next, a fifth embodiment according to the present invention will be described with reference to FIG.
FIG. 14 illustrates a cross section of the light emitting component 30 in the fifth embodiment according to the present invention. The detailed description of the same configuration as that of the first embodiment is omitted.

  The light emitting component 30 is different from that of the first embodiment in that a recess is not formed on the substrate. Since the substrate 32 is flat, the step of forming the primer layer 37, the adhesion layer 39, and the sealing resin 38 can be easily performed with less resin bias. In addition, a plurality of light emitting elements 35 can be mounted on the substrate 32 and can be cut into individual light emitting components 30 after resin sealing. Thereby, since mass production of the light emitting component 30 can be facilitated, productivity can be improved.

  Next, the manufacturing method of the light emitting component of this embodiment is demonstrated. 15 to 19 are process diagrams showing a method for manufacturing the light-emitting component 30.

FIG. 15 shows an electrode forming process by processing the substrate 32.
First, FIG. 15A shows a substrate 2 made of glass. The material of the substrate 32 is not limited to glass, and resin, ceramic, or the like can be used.

  FIG. 15B is a diagram illustrating a substrate through-hole forming step in which a plurality of substrate through-holes are formed through the substrate 32 from one surface of the substrate 32 to the surface opposite to the first surface. In the step of FIG. 15B, a plurality of substrate through holes for forming a plurality of through electrodes in the substrate 32 are formed by machining or etching.

  FIG. 15C is a diagram illustrating an electrode forming process in which the through electrodes 33 are formed in the plurality of substrate through holes of the substrate 32 and the electrode pads 34 are formed on the through electrodes 33, respectively. In the step of FIG. 15C, a silver paste or the like is applied to the plurality of substrate through holes formed in the step of FIG. Further, an electrode pad 34 made of metal is formed on the through electrode 33 by a printing technique or a lithography technique. In addition, since the silver paste which forms the penetration electrode 33 has good heat conductivity, the heat | fever generated from a light emitting element can be thermally radiated efficiently. Any metal other than silver paste may be used as long as it has heat dissipation.

  FIG. 16 is a diagram showing a light emitting element mounting process, which is the same process as in the first embodiment except that a plurality of light emitting elements 35 are simultaneously arranged on the electrode pad 34.

  FIG. 17 is a diagram showing a primer layer forming step in which one surface of the substrate 32 and the surface of the light emitting element 35 are covered with the primer layer gas blocking layer 37, and an adhesion layer forming step in which the surface of the primer layer 37 is covered with the adhesion layer 39. is there.

  FIG. 17A is a diagram illustrating a process of covering one surface of the substrate 32 and the surface of the light emitting element 35 with the primer layer 37. 17A, a primer layer 37 having a flat surface is formed by a dipping method, a spray method, a dispenser method, or the like, and the primer layer 37 forms one surface of the substrate 32, the light emitting element 35, and the electrode pad 34. Cover the exposed areas. At this time, since the primer layer 37 is uniformly formed, it can be easily formed.

FIG. 17B is a step of covering the primer layer 37 with the adhesion layer 39.
FIG. 18 is a diagram illustrating a sealing resin forming process, which is the same process as in the first embodiment.

  FIG. 19 is a diagram showing a light-emitting component singulation process in which a plurality of light-emitting components in which the light-emitting element 35 is electrically wired and resin-sealed are separated into individual light-emitting components. As shown in FIG. 19, the light emitting component 30 is separated into pieces by dicing a plurality of light emitting components in which the light emitting element 35 is electrically wired and resin-sealed into individual light emitting components. As a result, a plurality of light emitting components can be collectively formed.

  The light-emitting component of the present invention can be used, for example, in light fixtures such as lighting fixtures, electric bulletin boards, and car headlights. The light-emitting component of the present invention can be used as a light source in an inspection apparatus that observes and inspects an object by transmitting or reflecting light to an inspection object such as a sample. As inspection devices, for example, counterfeit bill identification devices, image processing devices for finding fine scratches and defects on the surface of metals, devices for detecting minute chemical substances such as tissues and DNA in the medical and bio fields, resin curing devices, etc. Can be used.

  In the above-described embodiment, the case where the light-emitting component of the present invention is employed in the surface mount (SMD) type of the light-emitting element has been described. However, the present invention is not limited thereto, and the sealing resin is bonded using a resin that transmits light. Can be employed in the method. That is, in the sealing resin bonding method, the surface of the substrate is covered with a primer layer made of a homogeneous material mainly composed of a gas barrier resin, and a multilayer film comprising a primer gas barrier layer and a primer layer adhesion layer A primer layer forming step for forming the structure and a sealing resin forming step for covering the primer layer with a sealing resin made of a material mainly composed of a light-resistant resin can be provided. Thereby, the adhesiveness of the sealing resin can be improved while maintaining the light resistance of the sealing resin and the gas barrier properties of the primer layer.

2, 22, 32 Substrate 3, 33 Through electrode 4, 24, 34 Electrode pad 5, 25, 35 Light emitting element 6, 26, 36 Bonding wire 7, 27, 37 Primer layer 9, 29, 39 Primer layer adhesion layer 8, 28, 38 Sealing resin 10, 20, 30 Light-emitting component 16 Metal reflective film 17 Reflective member 21 Adhesive layer 23 Lead-out electrode

Claims (13)

A light-emitting component comprising: a substrate; a light-emitting element mounted on the substrate; a primer layer that covers at least a portion of the substrate; and a surface of the light-emitting element; and a sealing resin that covers the primer layer;
The primer layer is formed of a gas barrier resin,
The sealing resin has light resistance, transmits light emitted from the light emitting element, and has at least one adhesion layer between the primer layer,
The light-emitting component, wherein the adhesion layer is formed of a resin that transmits light emitted from a light-emitting element and reacts at interfaces of the primer layer and the sealing resin.   The light-emitting component according to claim 1, wherein the resin of the adhesion layer has a functional group that is bonded to a functional group of the primer layer and the sealing resin. The adhesion layer is formed of a first resin having a gas barrier property and a second resin that transmits light emitted from the light emitting element,
The first resin has a functional group that binds to a functional group of the primer layer and the second resin,
The light-emitting component according to claim 1, wherein the second resin has a functional group that binds to a functional group of the sealing resin and the first resin. The adhesion layer is composed of two or more layers,
The light-emitting component according to claim 3, wherein the molar concentration ratio of the first resin in each layer decreases from the primer layer toward the sealing resin.   5. The light-emitting component according to claim 1, wherein a thickness of one layer of the adhesion layer is 0.05 μm or more and 20 μm or less.   The light emitting component according to claim 5, wherein a thickness of the primer layer is 0.2 μm or more and 90 μm or less, and a total thickness of the primer layer and the adhesion layer is 100 μm or less.   The light emitting component according to claim 1, wherein the sealing resin is formed of a silicone resin, and the primer layer is formed of an acrylic resin or a modified silicone resin. The refractive index of the sealing resin is lower than the refractive index of the primer layer,
The adhesion layer is two or more layers,
The light-emitting component according to claim 7, wherein the refractive index of each layer of the adhesion layer decreases from the primer layer toward the sealing resin.   A light emitting device using the light emitting component according to any one of claims 1 to 8. A light emitting element mounting process for mounting the light emitting element on the substrate;
The primer layer forming step of forming a primer layer composed of a resin having gas barrier properties on at least a part of the substrate and the surface of the light emitting element;
An adhesion layer forming step of forming on the primer layer at least one adhesion layer composed of a resin that transmits light emitted from the light emitting element and reacts at each interface of the primer layer and the sealing resin. When,
Forming a sealing resin that transmits light emitted from the light emitting element on the adhesion layer; and
A method of manufacturing a light emitting component, comprising: In the adhesion layer forming step, the functional group of the adhesion layer is bonded to the functional group of the primer layer,
The method for manufacturing a light-emitting component according to claim 10, wherein in the sealing resin forming step, a functional group included in the adhesion layer is bonded to a functional group included in the sealing resin.   In the adhesion layer forming step, the adhesion layer includes a first resin having a gas barrier property and a second resin that transmits light emitted from the light emitting element, and includes the first resin and the first resin. The method of manufacturing a light-emitting component according to claim 10, wherein the resin of 2 is formed by bonding with a functional group of each resin. In the primer layer forming step, the primer layer is formed of an acrylic resin or a modified silicone resin,
The method for manufacturing a light-emitting component according to claim 10, wherein the sealing resin forming step is formed of a silicone-based resin.

Images