JP2012114164A - Board and method of manufacturing board - Google Patents

Board and method of manufacturing board Download PDF

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Publication number
JP2012114164A
JP2012114164A JP2010260494A JP2010260494A JP2012114164A JP 2012114164 A JP2012114164 A JP 2012114164A JP 2010260494 A JP2010260494 A JP 2010260494A JP 2010260494 A JP2010260494 A JP 2010260494A JP 2012114164 A JP2012114164 A JP 2012114164A
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Prior art keywords
circuit board
printed circuit
board
substrate
injection
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JP2010260494A
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JP5697020B2 (en
Inventor
Hisataro Abe
久太郎 阿部
Hiroyuki Fukai
寛之 深井
Naomi Takahashi
直美 高橋
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Furukawa Electric Co Ltd
Furukawa Automotive Systems Inc
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Furukawa Electric Co Ltd
Furukawa Automotive Systems Inc
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Priority to JP2010260494A priority Critical patent/JP5697020B2/en
Priority to EP11768652.7A priority patent/EP2560466A4/en
Priority to CN201180018513XA priority patent/CN102835193A/en
Priority to PCT/JP2011/051412 priority patent/WO2011129130A1/en
Publication of JP2012114164A publication Critical patent/JP2012114164A/en
Priority to US13/649,517 priority patent/US20130033842A1/en
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Publication of JP5697020B2 publication Critical patent/JP5697020B2/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate

Abstract

PROBLEM TO BE SOLVED: To provide a board usable with a large current, such as a DC-DC converter, and a method of manufacturing a board, which enable small electronic components to be arranged on the single board.SOLUTION: A board 1 is a board having a transformer 3 and a choke coil 5 which can be used, for example, as an automotive DC-DC converter. The board 1 is so constructed that electronic components are mounted on an injection-molded substrate 2 in which internal circuit conductors are exposed out at electronic component mounting portions 7, a printed board mounting portion 11 and conductive portions 10a, and the other regions are coated in a resin 9. The printed board mounting portion 11 is a region where a printed board 15 is mounted. A conductive portion 10b of the printed board 15 is soldered or otherwise bonded to the conductive portion 10a of the printed board mounting portion 11 via an electronic component 17.

Description

本発明は自動車等に用いられるＤＣ−ＤＣコンバータ等の基板および基板の製造方法に関するものである。   The present invention relates to a substrate such as a DC-DC converter used in an automobile or the like and a method for manufacturing the substrate.

自動車に用いられるＤＣ−ＤＣコンバータは、電圧変換用のトランスや平滑化用のチョークコイル等の複数の部品から構成されるが、高電圧・大電流が負荷されるため、それぞれのパーツを別々に製造後、それらが接続されて用いられている（特許文献１）。   DC-DC converters used in automobiles are composed of multiple components such as transformers for voltage conversion and choke coils for smoothing. However, because they are loaded with high voltage and large current, each part is separated separately. After manufacturing, they are connected and used (Patent Document 1).

特開２００５−１４３２１５号公報JP 2005-143215 A

しかし、このような構成は、装置の大型化を招くため、よりコンパクトなＤＣ−ＤＣコンバータが要求されている。一方、前述の各部品を同一の基板上に配置する方法がある。通常、このような電気回路を有する基板は、複数の回路および絶縁体が層構造で構成される。   However, such a configuration leads to an increase in the size of the device, so that a more compact DC-DC converter is required. On the other hand, there is a method of arranging the above-described components on the same substrate. Usually, a substrate having such an electric circuit includes a plurality of circuits and insulators having a layer structure.

しかし、通常の基板は、回路をメッキやエッチング等により形成するため、大電流が流れるＤＣ−ＤＣコンバータに対しては、回路が大電流に耐えることができない。すなわち、このような大電流に耐えるためには導体層厚さを例えば０．４ｍｍ以上とすることが望ましいが、従来の方法では、導体層厚さが厚くなりすぎるため、導体層の形成に時間を要するという問題があった。   However, since an ordinary substrate forms a circuit by plating, etching, or the like, the circuit cannot withstand a large current for a DC-DC converter in which a large current flows. That is, in order to withstand such a large current, it is desirable to set the conductor layer thickness to, for example, 0.4 mm or more. However, in the conventional method, since the conductor layer thickness becomes too thick, it takes time to form the conductor layer. There was a problem of requiring.

一方、このような大電流用の基板としては、プレス加工により導体部を形成し、射出成型によって絶縁部を形成する射出成型基板がある。導体部がプレス加工によって構成されるため、例えば、ＤＣ−ＤＣコンバータのような大電流にも耐えることができる。   On the other hand, as a substrate for such a large current, there is an injection molded substrate in which a conductor portion is formed by pressing and an insulating portion is formed by injection molding. Since a conductor part is comprised by press work, it can also endure a large current like a DC-DC converter, for example.

しかしながら、射出成型基板は、絶縁部が射出成型の金型によって形成される。したがって、微細な基板表面の導体露出部を形成することが困難である。たとえば、セラミックコンデンサ等の小型の電子部品を搭載するためには、コンデンサの電極と接続される微細な導体露出部を形成する必要があるが、射出成型では、樹脂の漏れ等の問題があり、このような微細な形状を形成することが困難である。また、プレス加工では細かな導体の加工が困難であるため、細かなパターンを有する回路を構成することが困難であるという問題がある。したがって、装置の小型の障害となっていた。   However, the injection-molded substrate has an insulating portion formed by an injection mold. Therefore, it is difficult to form a conductor exposed portion on a fine substrate surface. For example, in order to mount a small electronic component such as a ceramic capacitor, it is necessary to form a fine conductor exposed portion connected to the electrode of the capacitor, but injection molding has problems such as resin leakage, It is difficult to form such a fine shape. Further, since it is difficult to process fine conductors by pressing, there is a problem that it is difficult to configure a circuit having a fine pattern. Therefore, it has become a small obstacle of the apparatus.

本発明は、このような問題に鑑みてなされたもので、ＤＣ−ＤＣコンバータのような大電流にも使用可能な基板であって、小型電子部品を１枚の基板上に配置可能な基板および基板の製造方法を提供することを目的とする。   The present invention has been made in view of such problems, and is a substrate that can be used for a large current, such as a DC-DC converter, and a substrate on which a small electronic component can be arranged on a single substrate, and An object is to provide a method for manufacturing a substrate.

前述した目的を達するために第１の発明は、回路導体の表面に対して樹脂が射出成型された射出成型基板と、プリント基板と、第１の電子部品と、を具備し、前記射出成型基板には、第２の電子部品が搭載されるプリント基板搭載部が形成され、前記プリント基板が、前記プリント基板搭載部に搭載された状態で、前記プリント基板の上面に露出するプリント基板側導体部と、前記射出成型基板の上面に露出する射出成型基板側導体部とが、前記第１の電子部品を介して電気的に接合されることを特徴とする基板である。   In order to achieve the above-mentioned object, the first invention comprises an injection-molded substrate in which a resin is injection-molded on the surface of a circuit conductor, a printed circuit board, and a first electronic component. Includes a printed circuit board mounting portion on which a second electronic component is mounted, and the printed circuit board side conductor is exposed on the upper surface of the printed circuit board in a state where the printed circuit board is mounted on the printed circuit board mounting section. And the injection-molded board-side conductor exposed on the upper surface of the injection-molded board are electrically joined via the first electronic component.

前記射出成型基板側導体部には、半田を載せるための凹部が形成されてもよい。この場合、前記凹部の大きさは、接続対象となる前記プリント基板側導体部の大きさ以上の大きさにすることが望ましい。   A recess for placing solder may be formed on the injection-molded board side conductor. In this case, it is desirable that the size of the concave portion is larger than the size of the printed circuit board side conductor portion to be connected.

前記プリント基板は、周囲に隙間を空けた状態で前記プリント基板搭載部に搭載され、前記プリント基板搭載部には、前記プリント基板の位置決め用の位置決め部材が設けられてもよい。   The printed circuit board may be mounted on the printed circuit board mounting unit with a gap around the printed circuit board, and the printed circuit board mounting unit may be provided with a positioning member for positioning the printed circuit board.

前記プリント基板は、略矩形であり、前記プリント基板と前記射出成型基板とを接続する前記第１の電子部品が、前記プリント基板の対向する辺にそれぞれ設けられる場合において、対向する辺のそれぞれの前記第１の電子部品が、互いにずれた位置に配置されてもよい。   The printed circuit board is substantially rectangular, and when the first electronic components that connect the printed circuit board and the injection-molded circuit board are provided on opposite sides of the printed board, respectively, The first electronic components may be arranged at positions shifted from each other.

前記射出成型基板の内部には、前記プリント基板搭載部をまたがるように、補強板が設けられてもよい。   A reinforcing plate may be provided inside the injection-molded substrate so as to straddle the printed board mounting portion.

第１の発明によれば、例えばプレス加工された回路導体と、射出成型により形成された樹脂とからなる射出成型基板であるため、回路導体の厚さを厚くすることができ、このため大電流での使用に耐える基板を得ることができる。また、射出成型基板上には、プリント基板が搭載されるプリント基板搭載部が形成されるため、小型電子部品を搭載するプリント基板をも同一基板上に搭載することができる。このため、小型電子部品はプリント基板上に従来の方法で搭載し、大型の電子部品およびプリント基板自体は射出成型基板に搭載することで、微細な導体露出部等の射出成型が不要となる。   According to the first invention, for example, an injection-molded substrate made of a pressed circuit conductor and a resin formed by injection molding, the thickness of the circuit conductor can be increased. It is possible to obtain a substrate that can withstand use in Further, since the printed board mounting portion on which the printed board is mounted is formed on the injection molded board, the printed board on which the small electronic component is mounted can be mounted on the same board. For this reason, a small electronic component is mounted on a printed circuit board by a conventional method, and a large electronic component and the printed circuit board itself are mounted on an injection-molded circuit board, thereby eliminating the need for injection molding such as a fine conductor exposed portion.

また、プリント基板と射出成型基板とが、基板の上面側において電子部品によって接合されるため、射出成型基板側に別途電子部品を設置して、電子部品とプリント基板を配線やコネクタ等によって接続する必要がなく、より小型化が可能となる。また、プリント基板と射出成型基板との接続部が、基板上面側であるため、接続部を容易に視認することができる。   In addition, since the printed circuit board and the injection molded board are joined by electronic components on the upper surface side of the board, a separate electronic component is installed on the injection molded board side, and the electronic components and the printed circuit board are connected by wiring, connectors, or the like. There is no need, and further miniaturization becomes possible. Moreover, since the connection part of a printed circuit board and an injection molding board | substrate is a board | substrate upper surface side, a connection part can be visually recognized easily.

また、射出成型基板側の接続部である導体部に半田を載せることが可能な凹部が形成されるため、リフロー炉等によって半田付けを行う際に、比較的大きな面積を有する射出成型基板側の導体露出部に半田が流れてしまうことを防止することができる。この際、凹部の大きさを、接続対象となるプリント基板側の導体部以上の大きさにすることで、プリント基板と射出成型基板との位置ずれによる半田不良を防止することができる。   In addition, since a recess is formed in which a solder can be placed on the conductor portion which is a connection portion on the injection molded substrate side, when performing soldering in a reflow furnace or the like, the injection molded substrate side having a relatively large area is used. It is possible to prevent the solder from flowing into the conductor exposed portion. At this time, by setting the size of the concave portion to be equal to or larger than the conductor portion on the printed circuit board side to be connected, it is possible to prevent a solder failure due to the positional deviation between the printed circuit board and the injection molded circuit board.

また、プリント基板搭載部に、プリント基板の位置決めを行うためのガイドやピン等の位置決め部材を設けておくことで、プリント基板を射出成型基板の正確な位置に配置することができる。   Further, by providing the printed board mounting portion with positioning members such as guides and pins for positioning the printed board, the printed board can be arranged at an accurate position of the injection molded board.

また、プリント基板と射出成型基板との接続の際に、プリント基板の対向する辺において互いにずれた位置で接続することで、射出成型基板とプリント基板との熱膨張の大きさの違いに伴う応力を分散させることができる。このため、温度変化に伴う、プリント基板と射出成型基板との接続部への応力を小さくすることができ、半田の破損等を防止することができる。   Also, when connecting the printed circuit board and the injection-molded circuit board, the stress caused by the difference in thermal expansion between the injection-molded circuit board and the printed circuit board by connecting the printed circuit board and the printed circuit board at positions shifted from each other on the opposite sides. Can be dispersed. For this reason, the stress to the connection part of a printed circuit board and an injection molding board | substrate accompanying a temperature change can be made small, and breakage of a solder etc. can be prevented.

また、プリント基板搭載部の下部には、当該プリント基板搭載部の長手方向に対してまたがるように、射出成型基板に埋設される補強板が設けられることで、プリント基板搭載部に生じる反りなどの変形を防止することができる。   In addition, the lower part of the printed circuit board mounting part is provided with a reinforcing plate embedded in the injection molded substrate so as to straddle the longitudinal direction of the printed circuit board mounting part. Deformation can be prevented.

第２の発明は、導体である回路素材を接合して、回路導体を形成し、前記回路導体の表面に対して樹脂を射出成型して、表面にプリント基板搭載部を有する射出成型基板を成型し、前記プリント基板搭載部にプリント基板を設置し、前記プリント基板の上面に露出するプリント基板側導体部と、前記射出成型基板の上面に露出する射出成型基板側導体部とに、それぞれ半田と、第１の電子部品を設置し、リフロー炉において、前記第１の電子部品を、前記プリント基板側導体部と前記射出成型基板側導体部とに同時にはんだ付けして、前記第１の電子部品によって前記プリント基板を前記射出成型基板に接合することを特徴とする基板の製造方法である。   2nd invention joins the circuit material which is a conductor, forms a circuit conductor, injection-molds resin with respect to the surface of the said circuit conductor, and molds the injection-molded board | substrate which has a printed circuit board mounting part on the surface A printed circuit board mounted on the printed circuit board mounting portion, and a printed circuit board side conductor portion exposed on the upper surface of the printed circuit board and an injection molded substrate side conductor portion exposed on the upper surface of the injection molded substrate, respectively, with solder and The first electronic component is installed, and in the reflow furnace, the first electronic component is soldered to the printed circuit board side conductor portion and the injection molded substrate side conductor portion at the same time. The printed circuit board is joined to the injection-molded board by the method described above.

前記プリント基板の上に、複数の第２の電子部品と半田を配置し、前記第２の電子部品のはんだ付けと同時に、前記第２の電子部品を前記プリント基板上に接合してもよい。   A plurality of second electronic components and solder may be arranged on the printed circuit board, and the second electronic components may be bonded onto the printed circuit board simultaneously with the soldering of the second electronic components.

第２の発明によれば、製造が容易であり、大電流にも耐えることができ、また、小型電子部品であっても同一基板上に確実に配置可能な基板の製造方法を得ることができる。   According to the second aspect of the present invention, it is possible to obtain a method for manufacturing a substrate that is easy to manufacture, can withstand a large current, and can be reliably placed on the same substrate even if it is a small electronic component. .

本発明によれば、ＤＣ−ＤＣコンバータのような大電流にも使用可能な基板であって、小型電子部品を１枚の基板上に配置可能な基板および基板の製造方法を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, it is a board | substrate which can be used also for large currents like a DC-DC converter, Comprising: The board | substrate manufacturing method which can arrange | position a small electronic component on one board | substrate can be provided. .

基板１を示す斜視図であり、（ａ）は分解斜視図、（ｂ）は組立斜視図。It is a perspective view which shows the board | substrate 1, (a) is a disassembled perspective view, (b) is an assembly perspective view. 基板１を示す平面図。The top view which shows the board | substrate 1. FIG. プリント基板搭載部１１の断面図であり、図２のＢ部におけるＡ−Ａ線断面図。It is sectional drawing of the printed circuit board mounting part 11, and is the sectional view on the AA line in the B section of FIG. 導体部１０ａ、１０ｂを示す拡大図であり、（ａ）は図３のＣ部拡大図、（ｂ）は電子部品１７等を透視した状態の平面図。It is an enlarged view showing conductor parts 10a and 10b, (a) is the C section enlarged view of Drawing 3, and (b) is a top view in the state where the electronic parts 17 graded through. プリント基板の位置決め構造を示す図であり、（ａ）はプリント基板１５の平面図、（ｂ）は（ａ）のＤ−Ｄ線断面における位置決めピン３１の拡大図、（ｃ）は、位置決めガイド３３を示す図。It is a figure which shows the positioning structure of a printed circuit board, (a) is a top view of the printed circuit board 15, (b) is an enlarged view of the positioning pin 31 in the DD sectional view of (a), (c) is a positioning guide. FIG. プリント基板１５における、電子部品の位置関係を示す図。The figure which shows the positional relationship of an electronic component in the printed circuit board. 基板４０を示す斜視図であり、（ａ）は分解斜視図、（ｂ）は組立斜視図。It is a perspective view which shows the board | substrate 40, (a) is a disassembled perspective view, (b) is an assembly perspective view. 基板４０の平面。A plane of the substrate 40. プリント基板４１を示す平面図。The top view which shows the printed circuit board 41. FIG. プリント基板４１ａを示す図。The figure which shows the printed circuit board 41a.

以下、図面を参照しながら、本発明の実施形態について説明する。図１、図２は、基板１を示す図であり、図１（ａ）は分解斜視図、図１（ｂ）は組立斜視図、図２は平面図である。なお、図１、図２においては、半田等の図示を省略する。基板１は、トランス３、チョークコイル５等を有する例えば自動車用のＤＣ−ＤＣコンバータとして用いられる基板である。基板１には、電子部品搭載部７、プリント基板搭載部１１が形成され、導体部１０ａにおいて内部の回路導体が外部に露出し、その他の部位が樹脂９によって被覆された射出成型基板２に、電子部品等が搭載されたものである。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are views showing a substrate 1, in which FIG. 1A is an exploded perspective view, FIG. 1B is an assembled perspective view, and FIG. 2 is a plan view. In FIGS. 1 and 2, illustration of solder and the like is omitted. The board | substrate 1 is a board | substrate used as a DC-DC converter for motor vehicles which has the transformer 3, the choke coil 5, etc., for example. An electronic component mounting portion 7 and a printed circuit board mounting portion 11 are formed on the substrate 1, and an internal circuit conductor is exposed to the outside in the conductor portion 10 a, and the other parts are coated on the injection molded substrate 2 covered with the resin 9. Electronic parts etc. are mounted.

基板１（射出成型基板２）に設けられるトランス３は、電圧変換用のコイルであり、外部より入力された電流をトランス３で降圧し、降圧された交流電流を電子部品１３ａ（ダイオード）によって整流し、整流された電流をチョークコイル５および図示しないコンデンサで構成された平滑回路によって平滑化して外部に出力する。電子部品搭載部７は、電子部品等を搭載する部位であり、電子部品１３ａは、例えば導体部１０ａ等によって基板１と電気的に接続される。プリント基板搭載部１１は、プリント基板を搭載する部位であり、プリント基板１５は、導体部１０ｂによって射出成型基板２の導体部１０ａと電気的に接続される。   A transformer 3 provided on the substrate 1 (injection molded substrate 2) is a voltage conversion coil, and a current input from the outside is stepped down by the transformer 3, and the stepped-down alternating current is rectified by an electronic component 13a (diode). Then, the rectified current is smoothed by a smoothing circuit constituted by the choke coil 5 and a capacitor (not shown) and output to the outside. The electronic component mounting portion 7 is a portion on which an electronic component or the like is mounted, and the electronic component 13a is electrically connected to the substrate 1 by a conductor portion 10a or the like, for example. The printed circuit board mounting part 11 is a part for mounting a printed circuit board, and the printed circuit board 15 is electrically connected to the conductor part 10a of the injection-molded circuit board 2 by the conductor part 10b.

なお、本発明の基板としては、図示したような、トランス３、チョークコイル５を有するＤＣ−ＤＣコンバータに限られず、その他大電流が流れる基板に対しては、当然に適用可能である。すなわち、図に示すような配置および形状に限られることはなく、その他の部品等を適宜搭載することや、配置および形状を適宜変更することが可能なことは言うまでもない。   The substrate of the present invention is not limited to the DC-DC converter having the transformer 3 and the choke coil 5 as shown in the drawing, and can naturally be applied to other substrates through which a large current flows. That is, the arrangement and shape are not limited to those shown in the figure, and it goes without saying that other components and the like can be appropriately mounted, and the arrangement and shape can be appropriately changed.

プリント基板１５には、第２の電子部品である複数の電子部品１３ｂが搭載される。プリント基板１５の表面には、導体部１０ｂが露出する。導体部１０ｂは、後述する第１の電子部品である電子部品１７との接続部である。ここで、出力電流が大きい電源回路において出力を平滑にする必要がある場合に、電源とグラウンド（ＧＮＤ）間に複数の小型コンデンサを搭載する場合がある。このような回路を構成する小型コンデンサの電極は小さく、前述した射出成型によっては、微細な接続部（回路導体露出部）を形成することが困難である。   A plurality of electronic components 13b, which are second electronic components, are mounted on the printed circuit board 15. The conductor portion 10 b is exposed on the surface of the printed board 15. The conductor part 10b is a connection part with the electronic component 17 which is the 1st electronic component mentioned later. Here, when it is necessary to smooth the output in a power supply circuit with a large output current, a plurality of small capacitors may be mounted between the power supply and the ground (GND). The electrode of the small capacitor constituting such a circuit is small, and it is difficult to form a fine connection portion (circuit conductor exposed portion) by the above-described injection molding.

したがって、このような回路は、従来のガラスエポキシ基板を用いて構成する。すなわち、ガラスエポキシ基板は、電解銅箔を層状に形成し、層間接続のためのスルーホールにメッキを施して形成する。なお、このようなガラスエポキシ製のプリント基板の導体部には、１０５μｍ以下の電解銅箔が一般に用いられる。また、２０μｍのスルーホールメッキを施すとすると、回路導体としては１２５μｍ以下となる。   Therefore, such a circuit is configured using a conventional glass epoxy substrate. That is, the glass epoxy substrate is formed by forming an electrolytic copper foil in layers and plating the through holes for interlayer connection. An electrolytic copper foil of 105 μm or less is generally used for the conductor portion of such a glass epoxy printed board. Further, if 20 μm through-hole plating is applied, the circuit conductor is 125 μm or less.

すなわち、プリント基板１５は、たとえば、ガラスエポキシ基板上に、複数の電子部品１３ｂとして小型のセラッミクコンデンサが搭載される。セラミックコンデンサは、プリント基板１５と電気的に接続される。   That is, the printed circuit board 15 is mounted with a small ceramic capacitor as a plurality of electronic components 13b on a glass epoxy board, for example. The ceramic capacitor is electrically connected to the printed board 15.

また、プリント基板１５とプリント基板搭載部１１の導体部１０ａとの接合は、電子部品１７を介して半田等によって行われる。したがって、基板１における回路として機能する。このようにしてなる基板１では、信号系の小電流はプリント基板１５上の回路（小型コンデンサ等）を利用するとともに、パワー系の大電流は射出成型基板の回路導体を利用することができる。したがって、１枚の基板上にこれら回路を全て搭載できるため、基板同士のケーブル等による接続が不要となり、低コストおよび小型化が達成できる。   Further, the printed circuit board 15 and the conductor part 10 a of the printed circuit board mounting part 11 are joined by solder or the like via the electronic component 17. Therefore, it functions as a circuit in the substrate 1. In the substrate 1 thus configured, a small signal current uses a circuit (such as a small capacitor) on the printed circuit board 15, and a large power current can use a circuit conductor of an injection molded substrate. Therefore, since all these circuits can be mounted on one board, connection between the boards by a cable or the like is not necessary, and low cost and downsizing can be achieved.

なお、プリント基板１５上への電子部品１３ｂの搭載は、所定位置にクリーム状の半田を印刷し、小型コンデンサ等の部品を所定位置に設置した後、リフロー炉を通して半田を溶融して接合をすればよい。   The electronic component 13b is mounted on the printed circuit board 15 by printing cream-like solder at a predetermined position, placing a component such as a small capacitor at a predetermined position, and then melting the solder through a reflow furnace to join the parts. That's fine.

プリント基板搭載部１５の下方には、補強板１９が射出成型基板２に埋設される。補強板１９は、プリント基板１５（プリント基板搭載部１１）の長手方向に対して、プリント基板搭載部１１全体をまたがるように形成される。プリント基板搭載部１１は、プリント基板１５を搭載可能なように凹部となり、周囲と比較して強度的に弱くなる。このため、温度変化や機械的な応力によって反りなどの変形を生じる恐れがある。補強板９は、この変形を防止するためのものである。なお、補強板９としては、樹脂９よりも硬質な樹脂や金属等を用いることができる。また、補強板９は、プリント基板搭載部１５全体を覆うように設けてもよい。   A reinforcing plate 19 is embedded in the injection-molded substrate 2 below the printed board mounting portion 15. The reinforcing plate 19 is formed so as to straddle the entire printed circuit board mounting portion 11 with respect to the longitudinal direction of the printed circuit board 15 (printed circuit board mounting portion 11). The printed circuit board mounting part 11 becomes a recess so that the printed circuit board 15 can be mounted, and becomes weaker in strength than the surroundings. For this reason, there is a risk of deformation such as warping due to temperature change or mechanical stress. The reinforcing plate 9 is for preventing this deformation. In addition, as the reinforcing plate 9, a resin or metal harder than the resin 9 can be used. Further, the reinforcing plate 9 may be provided so as to cover the entire printed circuit board mounting portion 15.

基板１は以下のように製造される。まず、銅板等の導体である回路素材をプレスにより打ち抜き、必要な曲げ加工を施して所望の形状に形成する。銅板等には、必要に応じてＳｎメッキ等を施してもよい。次いで、複数の回路素材同士を溶接、または絶縁部材等を介して接合して回路導体を形成する。回路導体は、平面のみではなく、複数層に層状に形成されてもよい。   The substrate 1 is manufactured as follows. First, a circuit material, which is a conductor such as a copper plate, is punched out by pressing, and necessary bending is performed to form a desired shape. You may give Sn plating etc. to a copper plate etc. as needed. Next, a plurality of circuit materials are welded or joined together via an insulating member or the like to form a circuit conductor. The circuit conductor may be formed not only in a plane but also in a plurality of layers.

得られた回路導体を所定位置にピン等で射出成型金型に固定し、樹脂を射出して射出成型を行う。この際、必要な導体露出部以外の部位が樹脂９により被覆され、また、回路素材同士の層間等にも樹脂が射出される。このようにして射出成型基板２が形成される。   The obtained circuit conductor is fixed at a predetermined position to the injection mold with a pin or the like, and resin is injected to perform injection molding. At this time, portions other than the necessary conductor exposed portions are covered with the resin 9, and the resin is also injected into the interlayer between the circuit materials. In this way, the injection molded substrate 2 is formed.

樹脂９としては、絶縁性があり、射出成型が可能であればよく、例えば、液晶ポリマー、ポリフェニレンスルファイド、ポリブチレンテレフタレート、ポリエーテルサルフォン、ポリエーテルエーテルケトン、ポリフタルアミド等が使用できる。   The resin 9 is only required to be insulative and injection-moldable. For example, liquid crystal polymer, polyphenylene sulfide, polybutylene terephthalate, polyethersulfone, polyetheretherketone, polyphthalamide and the like can be used.

なお、導体回路素材としては、例えば４００μｍ以上の厚さの銅板等が用いられる。４００μｍ未満では、大電流に耐えることが難しく、また、射出成型時の樹脂圧によって変形等の恐れがあるためである。なお、導体回路素材の厚さとしてさらに望ましくは、４００μｍ〜１０００μｍである。厚すぎると、コスト及び重量等が増加し、コンパクトな基板を形成することができなくなるためである。   As the conductor circuit material, for example, a copper plate having a thickness of 400 μm or more is used. If it is less than 400 μm, it is difficult to withstand a large current, and there is a risk of deformation due to the resin pressure during injection molding. The thickness of the conductor circuit material is more preferably 400 μm to 1000 μm. If it is too thick, the cost and weight increase, and it becomes impossible to form a compact substrate.

次に、電子搭載部７に電子部品１３ａを搭載する。また、同時に、プリント基板搭載部１１に、プリント基板１５を搭載する。電子部品１３ａと電子搭載部７の導体部１０ａとの接合と、電子部品１７とプリント基板搭載部の導体部１０ａおよび導体部１０ｂとの接続は、例えば半田等を用いることができる。すなわち、それぞれの電子部品の接続部に、あらかじめペースト状等の半田クリーム等を配置し、全体をリフロー炉等によって加熱して、一括して電子部品を接続することができる。   Next, the electronic component 13 a is mounted on the electronic mounting portion 7. At the same time, the printed circuit board 15 is mounted on the printed circuit board mounting portion 11. For example, solder or the like can be used for joining the electronic component 13a and the conductor portion 10a of the electronic mounting portion 7 and connecting the electronic component 17 to the conductor portion 10a and the conductor portion 10b of the printed board mounting portion. That is, a solder cream or the like in the form of a paste is disposed in advance at the connection parts of the respective electronic components, and the whole is heated by a reflow furnace or the like, so that the electronic components can be connected together.

なお、プリント基板１５上の電子部品１３ｂも、電子部品１３ａ、１７等と同時に半田接合することもできる。この場合には、プリント基板１５上の電子部品１３ｂの接続部に、あらかじめ半田クリームおよび電子部品１３ｂを配置し、全体をリフロー炉で加熱することで、電子部品１３ａ、１３ｂ、１７が一括してそれぞれの接続部に接合される。   The electronic component 13b on the printed circuit board 15 can be soldered simultaneously with the electronic components 13a, 17 and the like. In this case, the solder cream and the electronic component 13b are arranged in advance at the connection portion of the electronic component 13b on the printed circuit board 15, and the whole is heated in a reflow furnace, so that the electronic components 13a, 13b, and 17 are batched. It is joined to each connection part.

次に、プリント基板搭載部１１における、プリント基板１５と射出成型基板２との接続構造について詳細に説明する。図３は、図２のＢ部におけるＡ−Ａ線断面図である。プリント基板搭載部１１は、プリント基板１５が搭載可能に、表面側に形成された凹部であり、プリント基板１５の大きさよりもわずかに大きく形成される。プリント基板１１の少なくとも１辺側には、帯状または部分的に、射出成型基板２の内部の回路導体２１が露出する導体部１０ａが形成される。すなわち、導体部１０ａは、基板１の上面側に露出する。   Next, the connection structure between the printed board 15 and the injection molded board 2 in the printed board mounting portion 11 will be described in detail. FIG. 3 is a cross-sectional view taken along line AA in the portion B of FIG. The printed circuit board mounting portion 11 is a recess formed on the front surface side so that the printed circuit board 15 can be mounted, and is formed slightly larger than the size of the printed circuit board 15. On at least one side of the printed circuit board 11, a conductor portion 10 a that exposes the circuit conductor 21 inside the injection-molded circuit board 2 is formed in a band shape or partially. That is, the conductor portion 10 a is exposed on the upper surface side of the substrate 1.

一方、プリント基板１５の上面側にも、内部の回路と導通する導体部１０ｂが適宜配置される。ここで、プリント基板１５をプリント基板搭載部１１に搭載すると、プリント基板１５（導体部１０ｂ）の上面と、プリント基板搭載部１１における導体部１０ａの上面とが略同一平面上に位置する。   On the other hand, on the upper surface side of the printed circuit board 15, a conductor portion 10 b that is electrically connected to an internal circuit is appropriately disposed. Here, when the printed circuit board 15 is mounted on the printed circuit board mounting portion 11, the upper surface of the printed circuit board 15 (conductor portion 10 b) and the upper surface of the conductor portion 10 a in the printed circuit board mounting portion 11 are positioned on substantially the same plane.

プリント基板１５と射出成形基板２との接続は、電子部品１７を介して行われる。すなわち、電子部品１７の一方の導体部が、プリント基板１５上の導体部１０ｂの上に配置され、他方の導体部が、プリント基板搭載部１１（射出成型基板２）の導体部１０ａの上に配置される。この状態で、それぞれが半田２３によって電気的に接続される。したがって、プリント基板１５の回路は、電子部品１７を介して射出成型基板２側の回路と接続されるとともに、プリント基板１５が射出成型基板２に固定される。   The connection between the printed board 15 and the injection-molded board 2 is performed via the electronic component 17. That is, one conductor portion of the electronic component 17 is disposed on the conductor portion 10b on the printed circuit board 15, and the other conductor portion is disposed on the conductor portion 10a of the printed circuit board mounting portion 11 (injection molded substrate 2). Be placed. In this state, each is electrically connected by the solder 23. Accordingly, the circuit of the printed board 15 is connected to the circuit on the injection molded board 2 side through the electronic component 17 and the printed board 15 is fixed to the injection molded board 2.

なお、プリント基板搭載部１１の導体部１０ａは、射出成型基板２の上面から段状に下がった位置に設けられ、電子部品１７が射出成型基板２の上面に大きく突出しない例を示したが、本発明はこれに限られず、導体部１０ａを射出成型基板２の上面と一致させるようにしてもよい。   In addition, although the conductor part 10a of the printed circuit board mounting part 11 was provided in the position which fell in the step shape from the upper surface of the injection molding board | substrate 2, the example in which the electronic component 17 did not protrude largely on the upper surface of the injection molding board | substrate 2 was shown, The present invention is not limited to this, and the conductor portion 10a may be made to coincide with the upper surface of the injection-molded substrate 2.

図４（ａ）は、図３のＣ部拡大図であり、電子部品１７と導体部１０ａ、１０ｂと接合される半田２３近傍を示す図である。また、図４（ｂ）は、導体部１０ａ、１０ｂの平面図であり、電子部品１７および半田２３を透視した状態を示す図である。   FIG. 4A is an enlarged view of a portion C in FIG. 3 and shows the vicinity of the solder 23 joined to the electronic component 17 and the conductor portions 10a and 10b. FIG. 4B is a plan view of the conductor portions 10a and 10b and shows a state in which the electronic component 17 and the solder 23 are seen through.

プリント基板１５に形成される導体部１０ｂは、通常のガラスエポキシ基板のように印刷（エッチング）等によって形成することができるため、精度も高く細かな形状に形成することができる。一方、導体部１０ａは、射出成型により形成されるため、微細な形状を形成することが困難であり、導体部１０ｂと比較して大きな面積を有する。したがって、電子部品１７との接続に用いられる半田２３が、接続部以外の範囲に流れてしまう恐れがある。   Since the conductor portion 10b formed on the printed board 15 can be formed by printing (etching) or the like like a normal glass epoxy board, it can be formed in a fine shape with high accuracy. On the other hand, since the conductor portion 10a is formed by injection molding, it is difficult to form a fine shape and has a larger area than the conductor portion 10b. Therefore, the solder 23 used for connection with the electronic component 17 may flow to a range other than the connection portion.

そこで、本発明では、導体部１０ａに凹部２５を設けることで、半田２３が周囲に流れることを防止する。すなわち、導体部１０ａの電子部品１７との接続部には、あらかじめ凹部２５が形成される。凹部２５の範囲（大きさ）は、接続対象となる導体部１０ｂの範囲（大きさ）以上に広く（大きく）設定される。したがって、プリント基板１５がプリント基板搭載部１１に対して多少ずれて搭載されても、この位置ずれを吸収することができる。   Therefore, in the present invention, the recesses 25 are provided in the conductor portion 10a to prevent the solder 23 from flowing to the surroundings. That is, the concave portion 25 is formed in advance in the connection portion between the conductor portion 10a and the electronic component 17. The range (size) of the recess 25 is set wider (larger) than the range (size) of the conductor portion 10b to be connected. Therefore, even if the printed circuit board 15 is mounted with a slight shift with respect to the printed circuit board mounting portion 11, this positional shift can be absorbed.

なお、図４（ｂ）に示すように、プリント基板１５をプリント基板搭載部１１に搭載した状態において、プリント基板１５の周囲には、わずかに隙間２７が形成される。プリント基板１５と射出成型基板２（樹脂９）との熱膨張差等による変形等により、プリント基板等に過剰な力が付与されないようにするためである。   As shown in FIG. 4B, a slight gap 27 is formed around the printed circuit board 15 in a state where the printed circuit board 15 is mounted on the printed circuit board mounting portion 11. This is to prevent an excessive force from being applied to the printed circuit board or the like due to deformation due to a difference in thermal expansion between the printed circuit board 15 and the injection molded substrate 2 (resin 9).

また、プリント基板搭載部１１に位置決め部材を設けてもよい。図５（ａ）は平面図、図５（ｂ）は位置決めピン３１近傍における図５（ａ）のＤ−Ｄ線断面図である。位置決め部材としては、例えば、図５（ａ）に示すように、プリント基板１５の一部（例えば対角線上に一対）孔２９を設け、プリント基板搭載部１１に、これと対応する位置決めピン３１を設けてもよい。   Further, a positioning member may be provided on the printed board mounting portion 11. 5A is a plan view, and FIG. 5B is a cross-sectional view taken along the line DD of FIG. 5A in the vicinity of the positioning pin 31. As the positioning member, for example, as shown in FIG. 5A, a part (for example, a pair on a diagonal line) of the printed board 15 is provided with a hole 29, and a positioning pin 31 corresponding thereto is provided on the printed board mounting portion 11. It may be provided.

すなわち、プリント基板搭載部１１の所定の位置に位置決めピン３１を樹脂９によって一体で形成し、位置決めピン３１に対応し、位置決めピン３１の外径よりもやや内径の大きな孔２９を有するプリント基板１５をプリント基板搭載部１１に設置することで、プリント基板１５がプリン基板搭載部１１に対して正確な位置で搭載される。   That is, the positioning pin 31 is integrally formed with the resin 9 at a predetermined position of the printed board mounting portion 11, and the printed board 15 has a hole 29 corresponding to the positioning pin 31 and having a slightly larger inner diameter than the outer diameter of the positioning pin 31. Is mounted on the printed circuit board mounting unit 11, so that the printed circuit board 15 is mounted on the printed circuit board mounting unit 11 at an accurate position.

なお、位置決め部材としては、位置決めピン３１に限られず、図５（ｃ）に示すように、位置決めガイド３３を形成してもよい。位置決めガイド３３は、プリント基板１５の角部の外形に対応し、プリント基板１５の対角線上に少なくとも一対形成される。位置決めガイド３３によってプリント基板１５の外周の位置を規制することで、プリント基板１５をプリン基板搭載部１１に対して正確な位置で搭載することができる。   The positioning member is not limited to the positioning pin 31, and a positioning guide 33 may be formed as shown in FIG. The positioning guides 33 correspond to the outer shape of the corners of the printed circuit board 15 and are formed at least as a pair on the diagonal line of the printed circuit board 15. By restricting the position of the outer periphery of the printed circuit board 15 by the positioning guide 33, the printed circuit board 15 can be mounted on the printed circuit board mounting portion 11 at an accurate position.

次に、プリント基板１５と射出成型基板２とを接続する電子部品１７の配置について説明する。図６は、プリント基板１５における、電子部品の位置関係を示す図である。前述の通り、電子部品１７は、プリント基板１５（導電部１０ｂ）と射出成型基板２（導電部１０ａ）にまたがるように設置されてそれぞれ接合される。   Next, the arrangement of the electronic component 17 that connects the printed board 15 and the injection molded board 2 will be described. FIG. 6 is a diagram illustrating the positional relationship of electronic components on the printed circuit board 15. As described above, the electronic components 17 are installed so as to straddle the printed circuit board 15 (conductive portion 10b) and the injection-molded substrate 2 (conductive portion 10a), and are joined to each other.

図６の例では、略矩形のプリント基板１５の各辺に対して、電子部品１７ａ〜１７ｇまでが配置される。ここで、ある一辺（例えば図における上側の辺）に電子部品１７ａが配置され、これと対向する辺（図における下側の辺）に電子部品１７ｂ、１７ｃが形成されるとする。この場合、プリント基板１５の当該辺に対する電子部品１７ａ、１７ｂ、１７ｃそれぞれの位置（それぞれの電子部品の当該辺に垂直な中心線）は、それぞれ図中Ｌ、Ｍ、Ｎであらわされる。この場合、それぞれの電子部品１７ａ、１７ｂ、１７ｃの位置Ｌ、Ｍ、Ｎは、互いにずれた位置となり、重なりあうことはない。   In the example of FIG. 6, electronic components 17 a to 17 g are arranged for each side of the substantially rectangular printed board 15. Here, it is assumed that the electronic component 17a is arranged on one side (for example, the upper side in the drawing), and the electronic components 17b and 17c are formed on the side (the lower side in the drawing) opposite to the electronic component 17a. In this case, the positions of the electronic components 17a, 17b, and 17c with respect to the corresponding side of the printed circuit board 15 (center lines perpendicular to the corresponding side of the respective electronic components) are represented by L, M, and N in the drawing, respectively. In this case, the positions L, M, and N of the electronic components 17a, 17b, and 17c are shifted from each other and do not overlap each other.

同様に、ある一辺（例えば図における右側の辺）に電子部品１７ｄ、１７ｅが配置され、これと対向する辺（図における左側の辺）に電子部品１７ｆ、１７ｇが形成されるとする。この場合、プリント基板１５の当該辺に対する電子部品１７ｄ、１７ｅ、１７ｆ、１７ｇそれぞれの位置（それぞれの電子部品の当該辺に垂直な中心線）は、それぞれ図中Ｏ、Ｐ、Ｑ、Ｒであらわされる。この場合、それぞれの電子部品１７ｄ、１７ｅ、１７ｆ、１７ｇの位置Ｏ、Ｐ、Ｑ、Ｒは、互いにずれた位置となり、重なりあうことはない。   Similarly, it is assumed that the electronic components 17d and 17e are arranged on one side (for example, the right side in the drawing), and the electronic components 17f and 17g are formed on the opposite side (left side in the drawing). In this case, the positions of the electronic components 17d, 17e, 17f, and 17g with respect to the corresponding side of the printed circuit board 15 (center lines perpendicular to the corresponding side of the respective electronic components) are represented by O, P, Q, and R in the drawing, respectively. It is. In this case, the positions O, P, Q, and R of the electronic components 17d, 17e, 17f, and 17g are shifted from each other and do not overlap each other.

このように、プリント基板１５と射出成型基板２とを接続する電部品１７が、それぞれ対向する辺に対して互いにずれた位置に配置される。このため、プリント基板１５と射出成型基板２との間の熱膨張係数の違いに伴う変形等に対して、プリント基板１５が、それぞれの辺に平行な任意の直線上の両端で拘束されることがない。したがって、それぞれの電子部品１７の接続部（半田部）に過剰な応力が付与されることを防止することができる。   In this way, the electrical components 17 that connect the printed circuit board 15 and the injection-molded circuit board 2 are arranged at positions shifted from each other with respect to the opposing sides. For this reason, the printed circuit board 15 is restrained at both ends on an arbitrary straight line parallel to each side with respect to deformation or the like due to the difference in thermal expansion coefficient between the printed circuit board 15 and the injection-molded circuit board 2. There is no. Therefore, it is possible to prevent an excessive stress from being applied to the connection portion (solder portion) of each electronic component 17.

以上説明したように、本実施形態の基板１によれば、回路素材をプレスで形成するため、厚銅基板を形成することができ、さらに樹脂９を射出成型により形成するため、製造性に優れ、大電流にも耐えうる基板１を得ることができる。   As described above, according to the substrate 1 of the present embodiment, since the circuit material is formed by pressing, a thick copper substrate can be formed, and furthermore, the resin 9 is formed by injection molding. The substrate 1 that can withstand a large current can be obtained.

プリント基板１５の導電部１０ｂと、射出成型基板２の導電部１０ａとがそれぞれ上面側に形成され、電子部品１７によって接続される。したがって、それぞれの基板が直接接続され、基板の小型化が可能となる。   The conductive portion 10b of the printed circuit board 15 and the conductive portion 10a of the injection-molded substrate 2 are formed on the upper surface side and are connected by the electronic component 17. Accordingly, the respective substrates are directly connected, and the substrate can be miniaturized.

また、電子部品１７の接合が射出成型基板およびプリント基板の上面側となるため、接続部を確認することができる。また、電子部品１３ａ、１３ｂ、１７を一括して半田付けすることもできる。したがって、半田付作業が容易である。   Moreover, since the joining of the electronic component 17 is on the upper surface side of the injection molded board and the printed board, the connection portion can be confirmed. Also, the electronic components 13a, 13b, and 17 can be soldered together. Therefore, the soldering operation is easy.

また、射出成型基板２側の導電部１０ａには、凹部２５が形成されるため、半田２３が周囲に流れることがなく、確実に電子部品等との接続部に半田２３を載せることができる。この際、凹部２５の大きさを、接続対象となるプリント基板１５上の導電部１０ｂの大きさ以上に大きくすることで、プリント基板１５や電子部品１７の多少の位置ずれによる、接続位置のずれを許容することができる。   Further, since the concave portion 25 is formed in the conductive portion 10a on the injection molded substrate 2 side, the solder 23 does not flow around, and the solder 23 can be reliably placed on the connection portion with the electronic component or the like. At this time, by increasing the size of the concave portion 25 to be larger than the size of the conductive portion 10b on the printed circuit board 15 to be connected, the displacement of the connection position due to the slight displacement of the printed circuit board 15 or the electronic component 17 occurs. Can be tolerated.

また、プリント基板搭載部１１にプリント基板１５の位置決め部材が設けられる事で、プリント基板１５をプリント基板搭載部１１の正確な位置に搭載することができる。   Further, since the printed board mounting portion 11 is provided with a positioning member for the printed board 15, the printed board 15 can be mounted at an accurate position of the printed board mounting portion 11.

また、プリント基板１５の対向する辺における電子部品１７が、それぞれ互いにずれた位置に配置されることで、プリント基板１５の各辺に平行な任意の線上におけるプリント基板の外周部との交点が、両方とも電子部品１７によって拘束されることがない。このため、温度変化等によって生じる熱膨張（熱収縮）等に伴う、電子部品１７を接続する半田２３へかかる応力を緩和することができる。   Further, the electronic components 17 on the opposite sides of the printed circuit board 15 are arranged at positions shifted from each other, so that the intersection point with the outer peripheral portion of the printed circuit board on an arbitrary line parallel to each side of the printed circuit board 15 Both are not restrained by the electronic component 17. For this reason, it is possible to relieve the stress applied to the solder 23 connecting the electronic component 17 due to thermal expansion (thermal contraction) caused by a temperature change or the like.

次に、第２の実施の形態について説明する。図７は、第２の実施の形態にかかる基板４０を示す図で、図７（ａ）は分解斜視図、図７（ｂ）は組立斜視図である。なお、以下の説明において、基板１と同様の機能を奏する構成については、図１等と同様の符号を付し、重複する説明を省略する。   Next, a second embodiment will be described. 7A and 7B are diagrams showing a substrate 40 according to the second embodiment, in which FIG. 7A is an exploded perspective view and FIG. 7B is an assembled perspective view. In the following description, components having the same functions as those of the substrate 1 are denoted by the same reference numerals as those in FIG.

基板４０は、基板１と略同様の構成であるが、プリント基板４１および射出成型基板２の態様が異なる。基板４０には、ダイオードや電解コンデンサなどの大型の電子部品１３ａ、１３ｃが電子部品搭載部７に設置され、電気的に接続される。また、プリント基板搭載部１１には、プリント基板４１が搭載される。   The substrate 40 has substantially the same configuration as the substrate 1, but the printed substrate 41 and the injection-molded substrate 2 are different. Large electronic components 13a and 13c such as diodes and electrolytic capacitors are installed on the electronic component mounting portion 7 and electrically connected to the substrate 40. A printed circuit board 41 is mounted on the printed circuit board mounting unit 11.

プリント基板搭載部１１には、導体露出部として、導体部１０ａが形成される。導体部１０ａは、基板４０の回路に電気的に接続される部位であり、プリント基板４１の上面に設けられる導電部１０ｂと半田等により電子部品１７を介して電気的に接続される部位である。   The printed board mounting portion 11 is formed with a conductor portion 10a as a conductor exposed portion. The conductor portion 10a is a portion that is electrically connected to the circuit of the substrate 40, and is a portion that is electrically connected to the conductive portion 10b provided on the upper surface of the printed board 41 via the electronic component 17 by solder or the like. .

基板４０は、コネクタ４３によって外部の部品・電源・その他の部材と電気的に接続される。図８は、基板４０の内部に、回路導体によって形成されたパターンを示す概念図である。図８に示すように、基板４０内部においては、パターン４７によって、電子部品１３ａ、１３ｃ、プリント基板４１およびコネクタ４３等が電気的に接続されている。   The board 40 is electrically connected to external components, a power source, and other members by a connector 43. FIG. 8 is a conceptual diagram showing a pattern formed by a circuit conductor inside the substrate 40. As shown in FIG. 8, the electronic components 13 a and 13 c, the printed circuit board 41, the connector 43, and the like are electrically connected by the pattern 47 inside the substrate 40.

図９は、プリント基板４１を示す平面図である。プリント基板４１の略中央には、電子部品であるＣＰＵ４５（Ｃｅｎｔｒａｌ Ｐｒｏｃｅｓｓｉｎｇ Ｕｎｉｔ）が設けられる。プリント基板４１にはＣＰＵ４５と接続される回路であるパターン４８が形成される。ＣＰＵ４５は、パターン４８によって、各導体部１０ｂや、その他の電子部品１３ｄ等と接続される。なお、プリント基板４１の背面側にも電子部品をあらかじめ搭載してもよく、また、ＧＮＤ端子等を設けてもよい。   FIG. 9 is a plan view showing the printed circuit board 41. A CPU 45 (Central Processing Unit), which is an electronic component, is provided in the approximate center of the printed circuit board 41. A pattern 48 that is a circuit connected to the CPU 45 is formed on the printed circuit board 41. The CPU 45 is connected to each conductor 10b, other electronic components 13d, and the like by the pattern 48. An electronic component may be mounted in advance on the back side of the printed circuit board 41, or a GND terminal or the like may be provided.

プリント基板４１は、射出成型基板２のプリント基板搭載部１１に搭載されて、各導体部１０ｂが対応する導体部１０ａと電子部品１７を介して電気的に接続される。   The printed circuit board 41 is mounted on the printed circuit board mounting portion 11 of the injection-molded substrate 2, and each conductor portion 10 b is electrically connected to the corresponding conductor portion 10 a via the electronic component 17.

なお、プリント基板４１に応力緩和部を形成してもよい。図１０は、応力緩和部４９を形成したプリント基板４１ａを示す図で、図１０（ａ）は平面図、図１０（ｂ）は背面図である。   Note that a stress relaxation portion may be formed on the printed circuit board 41. 10A and 10B are diagrams showing the printed circuit board 41a on which the stress relaxation portions 49 are formed. FIG. 10A is a plan view and FIG. 10B is a rear view.

プリント基板４１ａを前述の通りプリント基板搭載部１１に搭載して接合すると、図１０（ｂ）に示すように、各固定部間の方向に変形が生じる恐れがある（図中矢印Ｓ、Ｔ方向）。プリント基板４１ａでは、パターン４７およびＣＰＵ４５、電子部品１３ｄ等以外の部位に、ガラスエポキシ基板を貫通する応力緩和部４９が形成される。   When the printed circuit board 41a is mounted on and bonded to the printed circuit board mounting portion 11 as described above, there is a risk of deformation in the direction between the fixed portions as shown in FIG. 10B (in the directions of arrows S and T in the figure). ). In the printed board 41a, a stress relaxation portion 49 penetrating the glass epoxy board is formed in a portion other than the pattern 47, the CPU 45, the electronic component 13d, and the like.

応力緩和部４９は、例えば、図に示したように、ＣＰＵ３３の四隅から基板の四隅方向（中心から放射状に）に形成された長孔である。なお、応力緩和部２１ａは、円、正方形などであってもよい。プリント基板４１ａが射出成型基板２に接合されると、プリント基板４１ａの導電部１０ｂが射出成型基板２に対して固定される。一方、プリント基板４１ａ（ガラスエポキシ基板）と射出成型基板２を構成する材料が異なるため、互いの線膨張係数が異なる。したがって、温度変化に伴い、プリント基板４１ａに応力が付与される。   The stress relaxation part 49 is, for example, a long hole formed in the direction from the four corners of the CPU 33 to the four corners of the substrate (radially from the center) as shown in the figure. In addition, the stress relaxation part 21a may be a circle, a square, or the like. When the printed board 41 a is joined to the injection molded board 2, the conductive portion 10 b of the printed board 41 a is fixed to the injection molded board 2. On the other hand, since the materials constituting the printed board 41a (glass epoxy board) and the injection-molded board 2 are different, their linear expansion coefficients are different. Therefore, a stress is applied to the printed circuit board 41a as the temperature changes.

この際、応力緩和部４９が形成されるため、プリント基板４１ａの変形を応力緩和部４９が吸収することができる。このため、プリント基板４１ａの破損や、電極部の接合破断等を防止することができる。   At this time, since the stress relaxation portion 49 is formed, the stress relaxation portion 49 can absorb the deformation of the printed circuit board 41a. For this reason, it is possible to prevent damage to the printed circuit board 41a, bonding breakage of the electrode portion, and the like.

第２の実施の形態によれば、第１の実施の形態と同様の効果を得ることができる。また、プリント基板として、ＣＰＵその他の各種プリント基板を適用することができる。   According to the second embodiment, an effect similar to that of the first embodiment can be obtained. Further, as the printed board, a CPU and other various printed boards can be applied.

以上、添付図を参照しながら、本発明の実施の形態を説明したが、本発明の技術的範囲は、前述した実施の形態に左右されない。当業者であれば、特許請求の範囲に記載された技術的思想の範疇内において各種の変更例または修正例に想到し得ることは明らかであり、それらについても当然に本発明の技術的範囲に属するものと了解される。   As mentioned above, although embodiment of this invention was described referring an accompanying drawing, the technical scope of this invention is not influenced by embodiment mentioned above. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the technical idea described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs.

１、４０………基板
２………射出成型基板
３………トランス
５………チョークコイル
７………電子部品搭載部
９………樹脂
１０ａ、１０ｂ………導体部
１１………プリント基板搭載部
１３ａ、１３ｂ、１３ｃ………電子部品
１５………プリント基板
１７………電子部品
１９………補強板
２１………回路導体
２３………半田
２５………凹部
２７………隙間
２９………孔
３１………位置決めピン
３３………位置決めガイド
４１………プリント基板
４３………コネクタ
４５………ＣＰＵ
４７、４８………パターン
４９………応力緩和部 1, 40... Substrate 2... Injection molded substrate 3... Transformer 5... Choke coil 7 .. Electronic component mounting portion 9 .. Resin 10a, 10b. Printed circuit board mounting portions 13a, 13b, 13c ......... electronic component 15 ......... printed circuit board 17 ......... electronic component 19 ......... reinforcing plate 21 ......... circuit conductor 23 ......... solder 25 ......... concave 27 ... ...... Gap 29 ......... Hole 31 ......... Positioning pin 33 ......... Positioning guide 41 ......... Printed circuit board 43 ......... Connector 45 ......... CPU
47, 48 ... Pattern 49 ... Stress relaxation part

Claims (8)

回路導体の表面に対して樹脂が射出成型された射出成型基板と、
プリント基板と、
第１の電子部品と、
を具備し、
前記射出成型基板には、第２の電子部品が搭載されるプリント基板搭載部が形成され、
前記プリント基板が、前記プリント基板搭載部に搭載された状態で、前記プリント基板の上面に露出するプリント基板側導体部と、前記射出成型基板の上面に露出する射出成型基板側導体部とが、前記第１の電子部品を介して電気的に接合されることを特徴とする基板。 An injection-molded substrate in which resin is injection-molded on the surface of the circuit conductor;
A printed circuit board,
A first electronic component;
Comprising
The injection-molded substrate is formed with a printed board mounting portion on which the second electronic component is mounted,
In a state where the printed circuit board is mounted on the printed circuit board mounting portion, a printed circuit board side conductor portion exposed on the upper surface of the printed circuit board, and an injection molded substrate side conductor portion exposed on the upper surface of the injection molded substrate, A substrate characterized in that it is electrically bonded via the first electronic component. 前記射出成型基板側導体部には、半田を載せるための凹部が形成されることを特徴とする請求項１記載の基板。   The substrate according to claim 1, wherein the injection molded substrate side conductor portion has a recess for placing solder. 前記凹部の大きさは、接続対象となる前記プリント基板側導体部の大きさ以上であることを特徴とする請求項２記載の基板。   The board | substrate of Claim 2 whose magnitude | size of the said recessed part is more than the magnitude | size of the said printed circuit board side conductor part used as connection object. 前記プリント基板は、周囲に隙間を空けた状態で前記プリント基板搭載部に搭載され、
前記プリント基板搭載部には、前記プリント基板の位置決め用の位置決め部材が設けられることを特徴とする請求項１から請求項３のいずれかに記載の基板。 The printed circuit board is mounted on the printed circuit board mounting portion with a gap around it,
The board according to claim 1, wherein the printed board mounting portion is provided with a positioning member for positioning the printed board. 前記プリント基板は、略矩形であり、前記プリント基板と前記射出成型基板とを接続する前記第１の電子部品が、前記プリント基板の対向する辺にそれぞれ設けられる場合において、対向する辺のそれぞれの前記第１の電子部品が、互いにずれた位置に配置されることを特徴とする請求項１から請求項４のいずれかに記載の基板。   The printed circuit board is substantially rectangular, and when the first electronic components that connect the printed circuit board and the injection-molded circuit board are provided on opposite sides of the printed board, respectively, The board according to claim 1, wherein the first electronic components are arranged at positions shifted from each other. 前記射出成型基板の内部には、前記プリント基板搭載部をまたがるように、補強板が設けられることを特徴とする請求項１から請求項５のいずれかに記載の基板。   The substrate according to any one of claims 1 to 5, wherein a reinforcing plate is provided inside the injection-molded substrate so as to straddle the printed circuit board mounting portion. 導体である回路素材を接合して、回路導体を形成し、
前記回路導体の表面に対して樹脂を射出成型して、表面にプリント基板搭載部を有する射出成型基板を成型し、
前記プリント基板搭載部にプリント基板を設置し、
前記プリント基板の上面に露出するプリント基板側導体部と、前記射出成型基板の上面に露出する射出成型基板側導体部とに、それぞれ半田と、第１の電子部品を設置し、
リフロー炉において、前記第１の電子部品を、前記プリント基板側導体部と前記射出成型基板側導体部とに同時にはんだ付けして、前記第１の電子部品によって前記プリント基板を前記射出成型基板に接合することを特徴とする基板の製造方法。 Joining circuit materials that are conductors to form circuit conductors,
Resin is injection-molded on the surface of the circuit conductor to mold an injection-molded substrate having a printed circuit board mounting portion on the surface,
Installing a printed circuit board on the printed circuit board mounting section;
Solder and a first electronic component are installed on the printed circuit board side conductor portion exposed on the upper surface of the printed circuit board and the injection molded substrate side conductor portion exposed on the upper surface of the injection molded substrate,
In a reflow furnace, the first electronic component is simultaneously soldered to the printed board side conductor and the injection molded board side conductor, and the printed board is attached to the injection molded board by the first electronic component. A method for manufacturing a substrate, comprising bonding. 前記プリント基板の上に、複数の第２の電子部品と半田を配置し、前記第１の電子部品のはんだ付けと同時に、前記第２の電子部品を前記プリント基板上に接合することを特徴とする請求項７記載の基板の製造方法。   A plurality of second electronic components and solder are arranged on the printed circuit board, and the second electronic components are joined onto the printed circuit board simultaneously with the soldering of the first electronic components. A method for manufacturing a substrate according to claim 7.
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EP11768652.7A EP2560466A4 (en) 2010-04-15 2011-01-26 Board and method for manufacturing board
CN201180018513XA CN102835193A (en) 2010-04-15 2011-01-26 Board and method for manufacturing board
PCT/JP2011/051412 WO2011129130A1 (en) 2010-04-15 2011-01-26 Board and method for manufacturing board
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CN104396352A (en) * 2012-06-20 2015-03-04 西门子医疗器械公司 Injection moulded circuit carrier having integrated circuit board
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