JP2016174083A - Injection molding board and method of manufacturing injection molding board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an injection molding board that can withstand a high current, and can form a fine circuit without using a printed board, at a low cost.SOLUTION: An injection molding board 1 is principally constituted of an injection molding module 3, a thin plate circuit conductor 9, an electronic component 11, and the like. The injection molding module 3 integrates a plurality of thick plate circuit conductors 7 while partially covering with a resin 5, and is injection molded. In the injection molding module 3, a conductor exposure part 15 for partially exposing the inner thick plate circuit conductors 7 is formed. The conductor exposure part 15 is a part where the thin plate circuit conductor 9 and electronic component 11 are connected electrically. A groove 13 is formed in the upper surface of the injection molding module 3. The groove 13 is a part where the thin plate circuit conductor 9 is disposed. In a part of the groove 13, the conductor exposure part 15 is disposed. A second circuit conductor, i.e. the thin plate circuit conductor 9, is a member thinner than the thick plate circuit conductor 7.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an injection-molded substrate in which a circuit conductor and a resin are integrally molded.

  Generally, since a circuit is formed on a substrate by plating, etching, or the like, the circuit cannot withstand a large current against a DC-DC converter or the like in which a large current flows. That is, in order to withstand such a large current, it is desirable to set the conductor layer thickness to, for example, 0.4 mm or more. However, in the conventional method, since the conductor layer thickness becomes too thick, it takes time to form the conductor layer. There was a problem that required.

  On the other hand, as such a substrate for large current, there is an injection-molded substrate in which a conductor portion is formed by press working, an insulating portion is formed by injection molding, and an electronic component is mounted. Since a conductor part is comprised by press work, it can also endure a large current like a DC-DC converter, for example.

  However, the injection-molded substrate has an insulating portion formed by an injection mold. Therefore, it is difficult to form a conductor exposed portion on a fine substrate surface. For example, in order to mount a small electronic component such as a ceramic capacitor, it is necessary to form a fine conductor exposed portion connected to the electrode of the capacitor, but injection molding has problems such as resin leakage, It is difficult to form such a fine shape. Further, since it is difficult to process fine conductors by pressing, there is a problem that it is difficult to configure a circuit having a fine pattern. Therefore, it has become a small obstacle of the apparatus.

  On the other hand, a method of mounting a printed circuit board having a fine pattern on an injection molding module is disclosed (Patent Document 1).

JP 2012-114164 A

  However, a general printed circuit board has a resin portion made of glass epoxy resin. For this reason, the thermal expansion coefficient difference between the resin constituting the injection molding module and the printed board is large. Therefore, when a printed circuit board is soldered onto an injection molded module, stress is applied to the solder due to temperature changes, and joint reliability may not be obtained.

  Moreover, since it is necessary to manufacture a printed circuit board separately, manufacturing cost increases.

  The present invention has been made in view of such a problem, and is an injection-molded substrate that can withstand a large current at a low cost and can form a fine circuit without using a printed circuit board. The purpose is to provide.

  In order to achieve the above-described object, the first invention is an injection-molded substrate in which a circuit conductor and a resin are integrated, and the first circuit conductor, and the injection in which the first circuit conductor and the resin are integrated. A molding module; a second circuit conductor disposed in the injection molding module and thinner than the first circuit conductor; and an electronic component disposed in the injection molding module. The injection molding module comprises: A portion of the first circuit conductor has a conductor exposed portion exposed on a surface, and the second circuit conductor and the electronic component are joined to the first circuit conductor at the conductor exposed portion. This is an injection-molded substrate.

  It is desirable that the size of the joint portion of the second circuit conductor joined to the conductor exposed portion is smaller than the conductor exposed portion.

  A protrusion for preventing the flow of solder may be formed in the vicinity of the joint portion of the second circuit conductor with the electronic component.

  A part of the second circuit conductor may be covered with an insulating member.

  According to the first invention, for example, an injection molding module made of a pressed first circuit conductor and a resin molded by injection molding is used. Therefore, the thickness of the first circuit conductor can be increased. it can. Therefore, an injection molded substrate that can withstand use with a large current can be obtained. Further, a finer circuit can be formed by joining the second circuit conductor having a thickness smaller than that of the first circuit conductor to the injection molded module. For this reason, it is not necessary to use another printed circuit board, and there is no problem of a difference in thermal expansion coefficient between the glass epoxy resin and the resin for injection molding.

  Further, the size of the joint portion of the second circuit conductor joined to the conductor exposed portion is made smaller than the size of the conductor exposed portion, so that the joint portion of the second circuit conductor is superimposed on the conductor exposed portion and soldered. When joining, both can be joined reliably.

  Further, by forming a protrusion or a depression for preventing the flow of solder in the vicinity of the joint portion of the second circuit conductor with the electronic component, the solder can flow to other parts on the second circuit conductor. Absent.

  Moreover, the insulation of an injection-molded board | substrate can be ensured because a part of 2nd circuit conductor is coat | covered with insulating resin.

  According to a second aspect of the present invention, there is provided a process of manufacturing an injection molded module by integrating a first circuit conductor and a resin by injection molding, and a second circuit thinner than the first circuit conductor in the injection molded module. An injection molding substrate comprising: a step of arranging a conductor; and a step of arranging an electronic component on the injection molding module and bonding the electronic component and the second circuit conductor to the injection molding module. It is a manufacturing method.

  A plurality of the second circuit conductors are joined and integrated at a temporary joint portion, and after the integrated second circuit conductor is arranged in the injection molding module, the temporary joint portion is cut. The second circuit conductor may be separated into a plurality of pieces.

  According to the second aspect of the present invention, it is possible to obtain a method for manufacturing a substrate that is easy to manufacture, can withstand a large current, and can be reliably placed on the same substrate even if it is a small electronic component. .

  In addition, the second circuit conductor is integrated, and the fine circuit conductor can be easily handled by separating after being arranged on the injection molding module.

  According to the present invention, it is possible to provide an injection molded substrate or the like that can withstand a large current at a low cost and can form a fine circuit without using a printed circuit board.

1 is an exploded perspective view showing an injection molded substrate 1. FIG. 2 is an exploded perspective view showing an injection molded substrate 1 and shows a state in which a thin plate circuit conductor 9 is arranged in an injection molded module 3. FIG. 3 is an assembly perspective view showing the injection molded substrate 1. (A) is a fragmentary top view in the A section of FIG. 3, (b) is a fragmentary sectional view. 4A and 4B are views showing another embodiment, in which FIG. 4A is a partial plan view, FIG. 5B is a cross-sectional view taken along the line C-C in FIG. (A), (b) is sectional drawing which shows other embodiment. The disassembled perspective view which shows the injection molding board | substrate 1a. The assembly perspective view which shows the injection molding board | substrate 1a. The perspective view which shows the state in which the thin-plate circuit conductor 9 was integrated.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is an exploded perspective view of the injection molded module 3, the thin plate circuit conductor 9, and the electronic component 11. FIG. 2 is an exploded perspective view showing a state in which the thin plate circuit conductor 9 is disposed on the injection molded module 3. FIG. 1 is an assembled perspective view showing an injection-molded substrate 1. FIG. The injection-molded substrate of the present invention is not limited to the shape and arrangement of each part as shown in the figure, and other parts can be appropriately mounted, and the arrangement and shape can be appropriately changed. Needless to say.

  The injection-molded substrate 1 is mainly composed of an injection-molded module 3, a thin plate circuit conductor 9, electronic components 11a, 11b, 11c, 11d, and 11e (hereinafter collectively referred to as an electronic component 11). The injection molding module 3 is a module in which a plurality of thick plate circuit conductors 7 are partially covered with a resin 5 and integrated, and is molded by injection molding.

  A part of the thick plate circuit conductor 7 which is the first circuit conductor protrudes from the side surface of the injection molding module 3 and constitutes the terminal 8 of the injection molding substrate 1. In addition, a part of the thick circuit conductor 7 can be protruded from the upper and lower surfaces instead of from the side surfaces. The injection molding module 3 is also formed with a conductor exposed portion 15 where the internal thick plate circuit conductor 7 is partially exposed. The conductor exposed portion 15 is a portion where the thin plate circuit conductor 9 and the electronic component 11 are electrically connected.

  A groove 13 is formed on the upper surface of the injection molding module 3. The groove 13 is a part where the thin plate circuit conductor 9 is disposed. That is, the width and shape of the groove 13 correspond to the thin plate circuit conductor 9. A conductor exposed portion 15 is disposed in a part of the groove 13.

  In addition, a recess is formed in a portion where the electronic component 11 is mounted on the upper surface of the injection molding module 3. That is, the part where the thin plate circuit conductor 9 or the electronic component 11 is disposed is lower than the upper surface of the injection molding module 3 in the other part.

  The injection molding module 3 is manufactured as follows, for example. First, a circuit material, which is a conductor such as a copper plate, is punched out by, for example, a press and is subjected to a necessary bending process to form a desired shape. You may give Sn plating etc. to a copper plate etc. as needed. Next, if necessary, a plurality of circuit materials are welded or joined together via an insulating member or the like to form the thick plate circuit conductor 7. The thick circuit conductor 7 may be formed not only in one layer but also in a plurality of layers.

  The obtained thick plate circuit conductor 7 is fixed to an injection mold with a pin or the like at a predetermined position, and the resin 5 is injected to perform injection molding. At this time, portions other than the conductor exposed portions 15 and the terminals 8 of the thick plate circuit conductor 7 are covered with the resin 5. In this way, the injection molding module 3 is formed.

  The resin 5 is only required to be insulative and injection-moldable. For example, liquid crystal polymer, polyphenylene sulfide, polybutylene terephthalate, polyether sulfone, polyether ether ketone, polyphthalamide, etc. are used. it can.

  Further, as the thick circuit conductor 7, for example, a copper plate having a thickness of 400 μm or more, which is difficult to etch a printed board, is used. If it is less than 400 μm, it is difficult to withstand a large current, and there is a risk of deformation due to the resin pressure during injection molding. In addition, as the thickness of the thick circuit conductor 7, the range of 400 μm to 2 mm is ideal for fitting design. If it is too thick, the cost and weight increase, and it becomes impossible to form a compact substrate.

  The thin plate circuit conductor 9 as the second circuit conductor is a member having a thickness smaller than that of the thick plate circuit conductor 7, and for example, a copper plate of 1.0 mm or less is used. The thin plate circuit conductor 9 is previously cut into a circuit shape. Since the thin circuit conductor 9 is sufficiently thin, a fine circuit pattern can be formed. For example, the thin plate circuit conductor 9 can be processed by pressing, and in this case, the processing can be performed with an accuracy of the same circuit pattern width as the thickness (for example, a pattern width of about 0.5 mm when the thickness is 0.5 mm). . As described above, the thickness of the thick plate circuit conductor 7 and the thin plate circuit conductor 9 may be appropriately designed within the above-mentioned range according to the specifications (current, size, etc.) of the circuit used.

  Although the electronic component 11 is not particularly specified, both an electronic component to which a large current is supplied and an electronic component to which a minute control current is supplied are applied.

  Next, a method for assembling the injection molded substrate 1 will be described. First, as shown in FIG. 2, a predetermined thin plate circuit conductor 9 is arranged in the groove 13 of the injection-molded module 3 that has been molded in advance. As described above, since the groove 13 corresponds to the shape of the thin plate circuit conductor 9, the thin plate circuit conductor 9 is held in the groove 13. The width of the groove 13 is substantially the same as that of the thin circuit conductor 9 so that the thin circuit conductor 9 can be inserted, and functions to position and temporarily fix the thin circuit conductor 9.

  Next, cream solder is applied to a predetermined site using, for example, a mask and a squeegee. Specifically, solder is applied to a portion where the thick plate circuit conductor 7 (conductor exposed portion 15), the thin plate circuit conductor 9 and the electronic component 11 are joined together. In the following drawings, illustration of solder is omitted.

  Next, the electronic component 11 is arranged at a predetermined site. As described above, a recess is formed in the portion where the electronic component 11 of the injection molding module 3 is mounted, and the conductor exposed portion 15 or the thin plate circuit conductor 9 is exposed.

  Next, after the electronic component 11 is disposed, the parts are joined together by passing the injection-molded substrate 1 through a reflow furnace and melting the solder.

  For example, the electronic component 11 a is mounted so as to straddle the conductor exposed portion 15 and the thin plate circuit conductor 9 joined to the conductor exposed portion 15. In addition, the electronic component 11 a is mounted so as to straddle the pair of conductor exposed portions 15. The electronic component 11c is mounted so as to straddle the pair of thin circuit conductors 9. Further, the electronic components 11 d and 11 e are mounted so as to straddle between the thin plate circuit conductors 9 joined to the conductor exposed portion 15. Thus, the electronic component 11 can be joined to any conductor. An electronic component having three or more terminals may be mounted.

  Next, details of the electronic component mounting portion will be described. 4A is a partial plan view (a perspective view of the electronic component 11a and the solder 16) in the A part of FIG. 3, and FIG. 4B is a cross-sectional view taken along the line BB of FIG. 4A. is there. As described above, the part on which the electronic component 11 is mounted is a recess with respect to the other parts. At this time, the bottom surface of the recess and the top surface of the conductor exposed portion 15 are formed in the same plane. In addition, it is desirable that the edge of the concave portion of the portion where the electronic component 11 is mounted and joined by the solder 16 has a tapered shape.

  When the conductor exposed portion 15 and the thin plate circuit conductor 9 are joined, the size of the joint portion of the thin plate circuit conductor 9 joined to the conductor exposed portion 15 (E in the drawing) rather than the exposed size of the conductor exposed portion 15 (E in the figure). F) in the figure is smaller. That is, when the thin plate circuit conductor 9 is arranged on the conductor exposed portion 15 and the thin plate circuit conductor 9 is overlapped on the conductor exposed portion 15, the conductor exposed portion 15 is exposed at least at a part around the thin plate circuit conductor 9. That is, the conductor exposed portion 15 can be visually recognized around the thin plate circuit conductor 9 in plan view. In the drawing, gaps are formed in three directions around the thin circuit conductor 9 with respect to the end of the conductor exposed portion 15, but one or two ends of the conductor exposed portion 15 and the thin plate circuit are formed. The position with the end of the conductor 9 may be aligned.

  By doing in this way, when applying the solder 16 over the entire area of the conductor exposed portion 15 from the top, the solder 16 can be reliably applied to the conductor exposed portion 15 and the thin plate circuit conductor 9.

  In addition, when the terminal (electrode) of the electronic component 11 is joined to the thin plate circuit conductor 9, the joint portion of the terminal (electrode) of the electronic component 11 is larger than the joint size (F in the drawing) of the thin plate circuit conductor 9. The size (G in the figure) may be reduced. That is, when the terminals (electrodes) of the electronic component 11 are arranged so as to overlap the thin plate circuit conductor 9 on the conductor exposed portion 15, the terminals (electrodes) of the electronic component 11 and the thin plate exposed to the periphery thereof are seen in plan view. All of the circuit conductor 9 and the conductor exposed portion 15 exposed around the thin circuit conductor 9 can be visually recognized. Further, when the terminal (electrode) of the electronic component 11 is directly joined to the conductor exposed portion 15, the size of the joint portion of the terminal (electrode) of the electronic component 11 is made smaller than the exposed size of the conductor exposed portion 15. Good.

  As described above, according to this embodiment, since the board is manufactured by injection molding using the thick circuit conductor 7, the injection molded board 1 that is excellent in manufacturability and can withstand a large current can be obtained. . Further, since the fine circuit is formed by bonding the thin plate circuit conductor 9 to the injection molding module 3, no other printed circuit board is required. For this reason, the stress accompanying the difference in thermal expansion coefficient between the glass epoxy resin and the resin 5 does not occur in the solder joint portion.

  Further, since the size of the conductor exposed portion 15 is larger than the size of the joint portion of the thin plate circuit conductor 9, when the solder is applied to the thin plate circuit conductor 9 from above, the conductor exposed portion 15 and the thin plate circuit conductor 9 are surely attached. On the other hand, solder can be reliably applied. For this reason, both can be securely soldered and the amount of solder can be increased.

  In addition, the thin circuit conductor 9 alone does not have sufficient rigidity, but the injection molded module 3 formed integrally with the thick circuit conductor 7 has sufficient rigidity, so that a reinforcing plate or the like is unnecessary. Moreover, since the thin-plate circuit conductor 9 can be formed with a press etc., manufacturability is favorable.

  Next, a second embodiment will be described. FIG. 5A is a partial plan view (a diagram corresponding to FIG. 4A) showing details of the electronic component mounting portion according to the second embodiment, and FIG. FIG. 5C is a sectional view taken along the line CC of FIG. 5A, and FIG. 5C is a sectional view taken along the line DD of FIG. In the following description, components having the same functions as those in the first embodiment are denoted by the same reference numerals as those in FIGS. 1 to 4, and redundant descriptions are omitted.

  The second embodiment has substantially the same configuration as the first embodiment, but differs in that a protrusion 17 is formed on a part of the thin plate circuit conductor 9. The protrusion 17 is, for example, a protrusion formed when the thin plate circuit conductor 9 is pressed. The protrusion 17 is formed in the width direction of the thin plate circuit conductor 9. In addition, the protrusion 17 does not need to be formed to the full width in the width direction as illustrated, or may be formed to the full width. However, considering the shape retention (flatness) of the thin plate circuit conductor 9 after press working, it is desirable to form the protrusions 17 only in part of the width direction.

  The protrusion 17 is formed so as to divide a portion of the thin circuit conductor 9 that is joined to the electronic component 11 or the conductor exposed portion 15 from another portion. That is, it is formed at the boundary portion between the recess or conductor exposed portion 15 where the electronic component 11 is mounted and the groove 13 where only the thin plate circuit conductor 9 is disposed.

  By forming the protrusions 17 in this way, it is possible to prevent the solder 16 from flowing out from the joint portion onto the thin circuit conductor 9 during the solder joint. That is, the protrusion 17 functions as a solder flow prevention portion.

  According to the second embodiment, an effect similar to that of the first embodiment can be obtained. Further, it is possible to efficiently prevent the solder from flowing out from the joint.

  In place of the protrusion 17, a recess may be formed in the same part. 6 (a) and 6 (b) are diagrams corresponding to FIGS. 5 (b) and 5 (c), respectively, and show an example in which a recess 17a is provided. When the thin circuit circuit conductor 9 is disposed on the resin 5, a protrusion is formed on the back surface side (resin 5 side) of the thin circuit circuit conductor 9 corresponding to the recess 17 a, so that interference with the protrusion is present at this position of the resin 5. What is necessary is just to form the recessed part 18 which avoids. Similarly, when the thin plate circuit conductor 9 is disposed on the thick plate circuit conductor 7, a concave portion 18 a that avoids interference with the protrusion may be formed at a corresponding position of the thick plate circuit conductor 7. By providing the recess, the thick circuit conductor 7 and the thin circuit conductor 9 can be positioned. At this time, as the solder connection, if it is free solder, the wettability is poor, and therefore the connection of the solder 16 can be surely ensured regardless of the protrusion 17 or the depression 17a.

  Further, by providing the resin 5 side with the recesses 18 and 18a that fit into the protrusions, it can be used as a positioning mechanism for the thin circuit conductor 9.

  Furthermore, a protrusion may be formed on the upper surface in a direction perpendicular to the illustrated protrusion 17 in a portion excluding the joint portion with the other member of the thin plate circuit conductor 9. Since the thin circuit conductor 9 has a thin plate thickness and easily bends, this bending can be suppressed by forming ribs in the longitudinal direction at portions other than the joints.

  Also in this case, the protrusion may be formed on the lower surface instead of forming the protrusion on the upper surface. Further, when the protrusion is formed on the lower surface, a concave portion that fits the protrusion is provided on the resin 5 side, so that it can be used as a positioning mechanism for the thin circuit conductor 9.

  Next, a third embodiment will be described. FIG. 7 is an exploded perspective view of an injection-molded substrate 1a according to the third embodiment, and FIG. 8 is an assembled perspective view. The injection-molded substrate 1a has substantially the same configuration as the injection-molded substrate 1, but differs in that an insulating resin 19 is disposed on the upper surface of the substrate. That is, the injection-molded substrate 1 a is configured by bonding the insulating resin 19 to the upper surface of the injection-molded substrate 1.

  The insulating resin 19 that is an insulating member covers, for example, portions other than the solder joint and the electronic component 11. That is, the thin circuit circuit conductor 9 other than the solder joint is covered with the insulating resin 19. For this reason, the insulation of the injection-molded substrate 1a can be obtained. The insulating resin 19 does not need to cover the entire upper surface of the injection-molded substrate 1 and only needs to cover a desired portion of the thin circuit conductor 9.

  The insulating resin 19 can be bonded to the injection-molded substrate 1 with an adhesive, for example. Further, a fixing mechanism (not shown) may be formed between the insulating resin 19 and the injection molded substrate 1.

  The insulating resin 19 is desirably the same material as the resin 5. By doing so, there is no difference in thermal expansion coefficient between the two, and warpage of the injection-molded substrate 1a due to a temperature change can be prevented. Further, the insulating resin 19 is not necessarily a molded product, and may be formed by spraying or coating the injection molded substrate 1, for example.

  According to the third embodiment, an effect similar to that of the first embodiment can be obtained. Further, it is possible to ensure the insulation of the injection molded substrate 1a.

  Next, a fourth embodiment will be described. FIG. 9 is an exploded perspective view of the injection-molded substrate 1 according to the fourth embodiment. In FIG. 9, illustration of the electronic component 11 is omitted. In the present embodiment, a plurality of thin plate circuit conductors 9 arranged in the injection molding module 3 are integrally formed.

  The plurality of thin plate circuit conductors 9 are joined to each other at the temporary joining portion 21. The temporary joining portion 21 is narrower than the thin circuit conductor 9 and can be easily cut. In addition, you may make the thickness of the temporary junction part 21 thin with respect to the thin-plate circuit conductor 9. FIG.

  In the present embodiment, when the thin plate circuit conductors 9 are arranged in the injection molding module 3, the plurality of thin plate circuit conductors 9 are arranged in a lump rather than individually. After disposing the integrated thin plate circuit conductor 9 in the injection molding module 3, the temporary joint is cut with a press or the like. For example, the temporary joining portion 21 is punched together with the injection molding module 3. By doing so, the thin circuit conductor 9 can be separated and placed in the injection molding module 3.

  According to the fourth embodiment, an effect similar to that of the first embodiment can be obtained. In addition, since the thin plate circuit conductor 9 having low rigidity is integrated, individual deformation can be suppressed, and manufacturability and handleability are excellent. Further, since the integrated thin plate circuit conductors 9 are arranged in the injection molding module 3, the individual thin plate circuit conductors 9 can be easily positioned.

  As mentioned above, although embodiment of this invention was described referring an accompanying drawing, the technical scope of this invention is not influenced by embodiment mentioned above. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the technical idea described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs.

DESCRIPTION OF SYMBOLS 1, 1a ..... Injection-molded board | substrate 3 .... Injection-molded module 5 ......... Resin 7 ......... Thick board circuit conductor 8 ......... Terminal 9 ..... Thin board circuit conductor 11, 11a, 11b, 11c, 11d 11e ......... Electronic component 13 ......... groove 15 ......... conductor exposed portion 16 ......... solder 17 ......... projection 17a ......... depression 18, 18a ......... concave 19 ......... insulating resin 21 ... ... Temporary joint

Claims (6)

An injection molded substrate in which a circuit conductor and resin are integrated,
A first circuit conductor;
An injection molding module in which the first circuit conductor and the resin are integrated;
A second circuit conductor disposed in the injection molding module and thinner than the first circuit conductor;
Electronic components arranged in the injection molding module;
Comprising
The injection molding module has a conductor exposed portion where a part of the first circuit conductor is exposed on the surface,
The injection molded substrate, wherein the second circuit conductor and the electronic component are joined to the first circuit conductor at the conductor exposed portion.   The injection-molded substrate according to claim 1, wherein the size of the joint portion of the second circuit conductor joined to the conductor exposed portion is smaller than that of the conductor exposed portion.   3. The injection according to claim 1, wherein a protrusion or a depression for preventing a solder flow is formed in the vicinity of a joint portion of the second circuit conductor with the electronic component. Molded substrate.   The injection-molded substrate according to any one of claims 1 to 3, wherein a part of the second circuit conductor is covered with an insulating member. Integrating the first circuit conductor and the resin by injection molding to produce an injection molding module;
Disposing a second circuit conductor thinner than the first circuit conductor in the injection molding module;
Placing electronic components on the injection molded module, and joining the electronic components and the second circuit conductor to the injection molded module;
The manufacturing method of the injection-molded board | substrate characterized by comprising. A plurality of the second circuit conductors are joined and integrated at a temporary joining portion,
6. The second circuit conductor according to claim 5, wherein the integrated second circuit conductor is disposed in the injection molding module, and then the temporary joint portion is cut to separate the second circuit conductor into a plurality of parts. Manufacturing method of injection-molded substrate.

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