JP2006269555A - Method of producing composite substrate apparatus - Google Patents

Method of producing composite substrate apparatus Download PDF

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JP2006269555A
JP2006269555A JP2005082655A JP2005082655A JP2006269555A JP 2006269555 A JP2006269555 A JP 2006269555A JP 2005082655 A JP2005082655 A JP 2005082655A JP 2005082655 A JP2005082655 A JP 2005082655A JP 2006269555 A JP2006269555 A JP 2006269555A
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Prior art keywords
substrate
solder
electrode terminal
electronic component
mother board
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Akihiro Ogawa
明宏 小川
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TDK Corp
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TDK Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
    • H01L2924/19104—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device on the semiconductor or solid-state device, i.e. passive-on-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Abstract

<P>PROBLEM TO BE SOLVED: To improve the productive efficiency of a composite substrate apparatus composed of a plurality of substrates. <P>SOLUTION: In a first solder application step, cream solder is applied to the part of the electrode terminal 12 on the front surface of a mother board 10. In a substrate loading step, a module substrate 20 is carried in a position where the electrode terminal 12 is disposed opposite to a corresponding electrode terminal 22 on the mother board 10. In the first solder reflow step, the module substrate 20 is carried in the mother board 10. In the second solder application step, the cream solder is applied on the electrode terminals 11 and 21 of the mother board 10 and the module substrate 20, and corresponding electronic parts 13 and 23 are laid on the electrode terminals 11 and 21 at a component installation step. In the second solder reflow step, the mother board 10 and the module substrate 20 are heated in which the electronic parts 13 and 23 are laid, the cream solder is dissolved, and the electrode terminals 11 and 21 and the electronic parts 13 and 23 are connected simultaneously. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、電子部品をそれぞれ載置した複数の基板を備える複合基板装置の製造方法に関する。   The present invention relates to a method for manufacturing a composite substrate device including a plurality of substrates on which electronic components are respectively mounted.

情報処理機器等では、信頼性を確保するために、高周波信号を処理する複数の電子部品を専用のモジュール基板に載置し、そのモジュール基板を、他の電子部品が載置されたマザーボードに搭載することがある。   In information processing equipment, in order to ensure reliability, multiple electronic components that process high-frequency signals are placed on a dedicated module board, and the module board is mounted on a motherboard on which other electronic components are placed. There are things to do.

このようなモジュール基板とマザーボードとを備える複合基板装置を製造する場合には、下記特許文献１に示されたように、予め電子部品が載置されたモジュール基板をはんだのリフローでマザーボードに取り付けている。
特開２００３−１１００５１号公報 When manufacturing a composite substrate device including such a module substrate and a motherboard, as shown in Patent Document 1 below, a module substrate on which electronic components are placed in advance is attached to the motherboard by solder reflow. Yes.
JP 2003-110051 A

しかしながら、マザーボードに電子部品を載置する工程と、モジュール基板に電子部品を載置する工程とが別工程であり、生産効率が悪かった。
一方、モジュール基板やマザーボードに載置する電子部品がはんだのリフローで載置されている場合には、その電子部品への加熱回数が、モジュール基板をマザーボードに搭載する段階で増加する。これにより、電子部品の特性が劣化する危険性があった。また、リフロー推奨回数が例えば１回と決められている電子部品は、モジュール基板やマザーボードに載置できないという問題もあった。
本発明は、複合基板装置の生産効率を向上すると共に、電子部品の信頼性を確保することを目的とする。 However, the process of placing the electronic component on the motherboard and the process of placing the electronic component on the module substrate are separate processes, and production efficiency is poor.
On the other hand, when the electronic component placed on the module substrate or the mother board is placed by solder reflow, the number of times of heating the electronic component increases at the stage of mounting the module substrate on the motherboard. As a result, there is a risk that the characteristics of the electronic component deteriorate. In addition, there is a problem that an electronic component for which the recommended number of reflows is determined to be, for example, 1 cannot be placed on a module substrate or a motherboard.
It is an object of the present invention to improve the production efficiency of a composite substrate device and ensure the reliability of electronic components.

上記目的を達成するために、本発明の観点に係る複合基板装置の製造方法は、
電子部品をそれぞれ載置した複数の基板を備える複合基板装置の製造方法であって、
前記電子部品が接続される電極端子が形成された第１の基板に、前記電子部品が載置される電極端子が形成された第２の基板を搭載する基板搭載工程と、
前記基板搭載工程の前又は後に、前記第１の基板の電極端子及び第２の基板の電極端子にはんだを塗布させる第１のはんだ付着工程と、
前記はんだが塗布された前記第１の基板の電極端子及び第２の基板の電極端子に、対応する前記電子部品を載置する部品載置工程と、
前記部品載置工程が終了した前記第１の基板及び第２の基板を加熱して前記はんだのリフローを行い、前記各電子部品を前記第１の基板の電極端子或いは第２の基板の電極端子に接続するはんだリフロー工程と、
を含むことを特徴とする。 In order to achieve the above object, a method of manufacturing a composite substrate device according to an aspect of the present invention includes:
A method of manufacturing a composite substrate device comprising a plurality of substrates each mounting electronic components,
A substrate mounting step of mounting a second substrate on which the electrode terminal on which the electronic component is mounted is mounted on a first substrate on which the electrode terminal to which the electronic component is connected is formed;
A first solder attaching step of applying solder to the electrode terminals of the first substrate and the electrode terminals of the second substrate before or after the substrate mounting step;
A component mounting step of mounting the corresponding electronic component on the electrode terminal of the first substrate and the electrode terminal of the second substrate coated with the solder;
The first substrate and the second substrate that have completed the component placement process are heated to reflow the solder, and the electronic components are connected to the electrode terminals of the first substrate or the electrode terminals of the second substrate. Solder reflow process to connect to,
It is characterized by including.

このような製造方法を講じたことにより、第１の基板と第２の基板とに同時に電子部品が載置される。また、電子部品が１回のはんだのリフローで第１の基板と第２の基板とにそれぞれ載置されるので、電子部品への加熱回数が最小に抑えられる。   By taking such a manufacturing method, the electronic component is simultaneously placed on the first substrate and the second substrate. In addition, since the electronic components are respectively placed on the first substrate and the second substrate by one solder reflow, the number of times of heating the electronic components can be minimized.

尚、前記第１の基板には、凹部が形成され、
前記基板搭載工程では、前記凹部に前記第２の基板を収容してもよい。 The first substrate is formed with a recess,
In the substrate mounting step, the second substrate may be accommodated in the recess.

また、前記複合基板装置は、前記第１の基板の電極端子に接続された電子部品と第２の基板の電極端子に接続された電子部品と前記第１の基板の電極端子及び第２の基板の電極端子の両方の電極端子に接続された共有電子部品とを有し、
前記部品載置工程では、前記はんだが塗布された前記第１の基板の電極端子及び第２の基板の電極端子に、対応する前記電子部品及び共有電子部品を載置し、
前記はんだリフロー工程では、前記はんだのリフローにより、前記各電子部品及び共有電子部品を前記第１の基板の電極端子或いは第２の基板の電極端子に接続してもよい。 The composite substrate device includes an electronic component connected to the electrode terminal of the first substrate, an electronic component connected to the electrode terminal of the second substrate, the electrode terminal of the first substrate, and the second substrate. A common electronic component connected to both electrode terminals of the
In the component mounting step, the corresponding electronic component and shared electronic component are mounted on the electrode terminal of the first substrate and the electrode terminal of the second substrate to which the solder is applied,
In the solder reflow process, each electronic component and shared electronic component may be connected to the electrode terminal of the first substrate or the electrode terminal of the second substrate by reflowing the solder.

本発明によれば、第１の基板と第２の基板とに同時に電子部品が載置されるので、従来にくらべて生産効率が向上する。また、電子部品が１回のはんだのリフローで第１の基板と第２の基板とにそれぞれ載置されるので、電子部品への加熱回数が最小に抑えられ、電子部品の信頼性を確保できると共に、使用できない電子部品を少なくできる。   According to the present invention, since the electronic component is placed on the first substrate and the second substrate at the same time, the production efficiency is improved as compared with the conventional case. In addition, since the electronic components are respectively placed on the first substrate and the second substrate by a single solder reflow, the number of heating times of the electronic components can be minimized and the reliability of the electronic components can be ensured. In addition, the number of electronic components that cannot be used can be reduced.

以下、図面に基づき、本発明の実施の形態について詳細に説明する。
［第１の実施形態］
図１は、本発明の第１の実施形態に係る複合基板装置を示す構成図である。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
FIG. 1 is a configuration diagram showing a composite substrate device according to a first embodiment of the present invention.

この複合基板装置は、マザーボード１０と、マザーボード１０に搭載されたモジュール基板２０とを備えている。
マザーボード１０の表面には、電子部品載置用の複数の電極端子１１が形成されると共に、基板搭載用の複数の電極端子１２が形成されている。電極端子１１には、電子部品１３が載置されて接続されている。電極端子１２は、モジュール基板２０の有する回路とマザーボード１０の持つ回路とを接続するために設けられた端子である。 This composite substrate device includes a motherboard 10 and a module substrate 20 mounted on the motherboard 10.
On the surface of the mother board 10, a plurality of electrode terminals 11 for mounting electronic components are formed, and a plurality of electrode terminals 12 for mounting the substrate are formed. An electronic component 13 is placed and connected to the electrode terminal 11. The electrode terminal 12 is a terminal provided for connecting a circuit included in the module substrate 20 and a circuit included in the mother board 10.

モジュール基板２０の表面には、電子部品載置用の複数の電極端子２１が形成され、モジュール基板２０の裏面には、基板搭載用の複数の電極端子２２が形成されている。電極端子２１に電子部品２３が接続されている。電子部品２３は、モジュール基板２０の回路を構成している。電極端子２２は、モジュール基板２０の回路とマザーボード１０の回路とを接続するためのもので、マザーボード１０の電極端子１２に接続されている。   A plurality of electrode terminals 21 for mounting electronic components are formed on the surface of the module substrate 20, and a plurality of electrode terminals 22 for mounting the substrate are formed on the back surface of the module substrate 20. An electronic component 23 is connected to the electrode terminal 21. The electronic component 23 constitutes a circuit of the module substrate 20. The electrode terminal 22 is for connecting the circuit of the module substrate 20 and the circuit of the motherboard 10, and is connected to the electrode terminal 12 of the motherboard 10.

次に、この複合基板装置の製造方法を説明する。
図２（ａ）〜（ｆ）は、図１の複合基板装置の製造方法の説明図である。
図１の複合基板装置は、図２（ａ）の第１のはんだ塗布工程と、図２（ｂ）の基板搭載工程と、図２（ｃ）の第１のはんだリフロー工程と、図２（ｄ）の第２のはんだ塗布工程と、図２（ｅ）の部品載置工程と、図２（ｆ）の第２のはんだリフロー工程と、を実施することにより、製造可能である。 Next, a method for manufacturing the composite substrate device will be described.
2A to 2F are explanatory views of a method for manufacturing the composite substrate device of FIG.
1 includes a first solder application step in FIG. 2A, a substrate mounting step in FIG. 2B, a first solder reflow step in FIG. 2C, and FIG. Manufacture is possible by performing the second solder application step of d), the component placement step of FIG. 2E, and the second solder reflow step of FIG. 2F.

第１のはんだ塗布工程では、電極端子１１，１２の形成されたマザーボード１０の表面の電極端子１２の部分にクリームはんだＳを塗布する。このクリームはんだＳの塗布は、メタルマスクを用いた印刷でクリームはんだＳを塗布してもよいし、他の適宜な方法で塗布してもよい。   In the first solder application step, cream solder S is applied to the portion of the electrode terminal 12 on the surface of the mother board 10 on which the electrode terminals 11 and 12 are formed. The cream solder S may be applied by printing using a metal mask, or may be applied by another appropriate method.

基板搭載工程では、電極端子２１，２２の形成されたモジュール基板２０の裏面をマザーボード１０の表面側に向け、電極端子１２と対応する電極端子２２とが対向する位置に、位置合わせを行いつつ、マザーボード１０上にモジュール基板２０を搭載する。   In the substrate mounting process, the back surface of the module substrate 20 on which the electrode terminals 21 and 22 are formed is directed to the front surface side of the mother board 10, and the electrode terminal 12 and the corresponding electrode terminal 22 are opposed to each other while performing alignment. A module substrate 20 is mounted on the motherboard 10.

第１のはんだリフロー工程では、モジュール基板２０が載置されたマザーボード１０をはんだリフロー炉に入れて加熱し、その後冷却する。加熱により、クリームはんだＳが融解し、冷却により、固形化して電極端子１２と電極端子２２とが接続される。以上により、モジュール基板２０がマザーボード１０に搭載されて一体化される。   In the first solder reflow process, the mother board 10 on which the module substrate 20 is placed is heated in a solder reflow furnace, and then cooled. The cream solder S is melted by the heating, and solidified by the cooling, so that the electrode terminal 12 and the electrode terminal 22 are connected. As described above, the module substrate 20 is mounted on the motherboard 10 and integrated.

第２のはんだ塗布工程では、一体化された状態のマザーボード１０及びモジュール基板２０の電極端子１１，２１の上に、クリームはんだＳを塗布する。このクリームはんだＳの塗布は、メタルマスクを用いた印刷で塗布してもよいし、他の適宜な方法で塗布してもよい。   In the second solder application step, cream solder S is applied onto the integrated mother board 10 and electrode terminals 11 and 21 of the module substrate 20. The cream solder S may be applied by printing using a metal mask or may be applied by another appropriate method.

部品載置工程では、クリームはんだＳが塗布された電極端子１１，２１の上に、対応する電子部品１３，２３を載置する。   In the component placing step, the corresponding electronic components 13 and 23 are placed on the electrode terminals 11 and 21 to which the cream solder S is applied.

第２のはんだリフロー工程では、電子部品１３，２３が載置されたマザーボード１０及びモジュール基板２０をはんだリフロー炉に入れて加熱し、その後冷却する。加熱により、クリームはんだＳが融解し、冷却により、固形化して電極端子１１，２１と電子部品１３，２３とが接続される。以上により、マザーボード１０及びモジュール基板２０に電子部品用１３，２３が載置され、図１の複合基板装置が形成される。   In the second solder reflow process, the mother board 10 and the module substrate 20 on which the electronic components 13 and 23 are placed are heated in a solder reflow furnace and then cooled. The cream solder S is melted by heating, and solidified by cooling, and the electrode terminals 11 and 21 and the electronic components 13 and 23 are connected. As described above, the electronic component parts 13 and 23 are placed on the mother board 10 and the module substrate 20 to form the composite substrate device of FIG.

以上の工程で製造される図１の複合基板装置は、次のような利点を有する。
（１） 電子部品１３，２３が、第２のはんだリフロー工程で同時に載置されるので、別工程でマザーボード１０やモジュール基板２０に電子部品１３，２３を載置する必要がなく、生産効率が向上している。 The composite substrate apparatus of FIG. 1 manufactured by the above process has the following advantages.
(1) Since the electronic components 13 and 23 are simultaneously placed in the second solder reflow process, it is not necessary to place the electronic components 13 and 23 on the mother board 10 and the module substrate 20 in a separate process, and the production efficiency is improved. It has improved.

（２） 電子部品１３，２３が加熱される工程が、第２のはんだリフロー工程だけであり、電子部品１３，２３の特性劣化を防ぐことができる。即ち、信頼性を確保できる。   (2) The process of heating the electronic components 13 and 23 is only the second solder reflow process, and the characteristic deterioration of the electronic components 13 and 23 can be prevented. That is, reliability can be ensured.

（３） 電子部品１３，２３が加熱される工程が、第２のはんだリフロー工程だけであり、例えばリフロー推奨回数が１回の電子部品１３，２３も、マザーボード１０及びモジュール基板２０に載置できる。即ち、使用部品の制限が緩和される。   (3) The process of heating the electronic components 13 and 23 is only the second solder reflow process. For example, the electronic components 13 and 23 having a recommended reflow count of 1 can also be placed on the motherboard 10 and the module substrate 20. . That is, the restriction on the parts used is relaxed.

［第２の実施形態］
図３は、本発明の第２の実施形態に係る複合基板装置を示す構成図である。
この複合基板装置は、マザーボード３０と、マザーボード３０に搭載されたモジュール基板４０とを備えている。 [Second Embodiment]
FIG. 3 is a block diagram showing a composite substrate apparatus according to the second embodiment of the present invention.
This composite substrate device includes a mother board 30 and a module board 40 mounted on the mother board 30.

マザーボード３０は、電子部品載置用の複数の電極端子３１が表面に形成されている。マザーボード３０には、さらに、モジュール基板４０を収容する凹部３２が形成され、その凹部３２の底部に、基板搭載用の複数の電極端子３３が形成されている。電極端子３１には、電子部品３４が接続されて載置されている。電極端子３３は、モジュール基板４０の有する回路とマザーボード３０の持つ回路とを接続するために設けられた端子である。   The mother board 30 has a plurality of electrode terminals 31 for mounting electronic components formed on the surface thereof. The motherboard 30 further has a recess 32 for accommodating the module substrate 40, and a plurality of electrode terminals 33 for mounting the substrate are formed at the bottom of the recess 32. An electronic component 34 is connected to and placed on the electrode terminal 31. The electrode terminal 33 is a terminal provided for connecting a circuit included in the module substrate 40 and a circuit included in the mother board 30.

モジュール基板４０の表面には、電子部品載置用の複数の電極端子４１が形成され、モジュール基板４０の裏面には、基板搭載用の複数の電極端子４２が形成されている。電極端子４１に電子部品４３が接続されている。電子部品４３は、モジュール基板４０の回路を構成している。電極端子４２は、モジュール基板４０の回路とマザーボード３０の回路とを接続するためのものである。   A plurality of electrode terminals 41 for mounting electronic components are formed on the surface of the module substrate 40, and a plurality of electrode terminals 42 for mounting the substrate are formed on the back surface of the module substrate 40. An electronic component 43 is connected to the electrode terminal 41. The electronic component 43 constitutes a circuit of the module substrate 40. The electrode terminal 42 is for connecting the circuit of the module substrate 40 and the circuit of the mother board 30.

モジュール基板４０は、マザーボード３０の凹部３２に収容されて、低背化され、モジュール基板４０の表面の高さが、マザーボード３０の表面の高さとほぼ等しくなっている。電極端子３３と電極端子４２とが接続されている。電極端子４１に電子部品４３が接続されている。   The module substrate 40 is accommodated in the recess 32 of the mother board 30 and has a low profile, and the height of the surface of the module substrate 40 is substantially equal to the height of the surface of the mother board 30. The electrode terminal 33 and the electrode terminal 42 are connected. An electronic component 43 is connected to the electrode terminal 41.

次に、この複合基板装置の製造方法を説明する。
図４（ａ）〜（ｆ）は、図３の複合基板装置の製造方法の説明図である。
図３の複合基板装置は、図４（ａ）の第１のはんだ塗布工程と、図４（ｂ）の基板搭載工程と、図４（ｃ）の第１のはんだリフロー工程と、図４（ｄ）の第２のはんだ塗布工程と、図４（ｅ）の部品載置工程と、図４（ｆ）の第２のはんだリフロー工程と、を実施することにより、製造される。 Next, a method for manufacturing the composite substrate device will be described.
4A to 4F are explanatory views of a method for manufacturing the composite substrate device of FIG.
3 includes a first solder application step in FIG. 4A, a substrate mounting step in FIG. 4B, a first solder reflow step in FIG. 4C, and FIG. The second solder application process of d), the component placement process of FIG. 4 (e), and the second solder reflow process of FIG. 4 (f) are performed.

第１のはんだ塗布工程では、電極端子３１，３３の形成されたマザーボード３０の電極端子３３の部分にクリームはんだＳを塗布する。このクリームはんだＳの塗布は、任意の方法で塗布してよい。   In the first solder application step, cream solder S is applied to the electrode terminal 33 portion of the mother board 30 on which the electrode terminals 31 and 33 are formed. The cream solder S may be applied by any method.

基板搭載工程では、電極端子４１，４２の形成されたモジュール基板４０の裏面をマザーボード３０の表面側に向け、対応する電極端子３３と電極端子４２とが対向する位置に、位置合わせを行いつつ、マザーボード３０の凹部３２にモジュール基板４０を挿入して搭載する。   In the substrate mounting step, the module substrate 40 on which the electrode terminals 41 and 42 are formed is directed to the front surface side of the mother board 30, and the corresponding electrode terminal 33 and the electrode terminal 42 are positioned so as to face each other. The module substrate 40 is inserted and mounted in the recess 32 of the mother board 30.

第１のはんだリフロー工程では、モジュール基板４０が載置されたマザーボード３０をはんだリフロー炉に入れて加熱し、その後冷却する。加熱により、クリームはんだＳが融解し、冷却により固形化して電極端子３３と電極端子４２とが接続される。以上により、モジュール基板４０がマザーボード３０に搭載されて一体化される。   In the first solder reflow process, the mother board 30 on which the module board 40 is placed is heated in a solder reflow furnace and then cooled. By heating, the cream solder S is melted and solidified by cooling, and the electrode terminal 33 and the electrode terminal 42 are connected. As described above, the module substrate 40 is mounted on the mother board 30 and integrated.

第２のはんだ塗布工程では、一体化された状態のマザーボード３０及びモジュール基板４０の電極端子３１，４１の上に、クリームはんだＳを塗布する。このクリームはんだＳの塗布は、メタルマスクを用いた印刷で塗布してもよいし、他の適宜な方法で塗布してもよい。   In the second solder application step, cream solder S is applied on the mother board 30 and the electrode terminals 31 and 41 of the module substrate 40 in an integrated state. The cream solder S may be applied by printing using a metal mask or may be applied by another appropriate method.

部品載置工程では、クリームはんだＳが塗布された電極端子３１，４１の上に、対応する電子部品３４，４３を載置する。   In the component placing step, the corresponding electronic components 34 and 43 are placed on the electrode terminals 31 and 41 to which the cream solder S is applied.

第２のはんだリフロー工程では、電子部品３４，４３が載置されたマザーボード３０及びモジュール基板４０をはんだリフロー炉に入れて加熱し、その後冷却する。加熱により、クリームはんだＳが融解し、冷却により固形化して電極端子３１，４１と電子部品３４，４３とが接続される。以上により、マザーボード３０及びモジュール基板４０に電子部品用３４，４３が載置され、図３の複合基板装置が形成される。   In the second solder reflow process, the mother board 30 and the module substrate 40 on which the electronic components 34 and 43 are placed are heated in a solder reflow furnace and then cooled. By heating, the cream solder S is melted and solidified by cooling, and the electrode terminals 31 and 41 and the electronic components 34 and 43 are connected. As described above, the electronic component parts 34 and 43 are placed on the mother board 30 and the module board 40, and the composite board apparatus of FIG. 3 is formed.

以上の工程で製造される図３の複合基板装置は、次のような利点を有する。
（４） 電子部品３４，４３が、第２のはんだリフロー工程で同時に載置されるので、別工程でマザーボード３０やモジュール基板４０に電子部品３４，４３を載置する必要がなく、生産効率が向上している。
（５） 電子部品３４，４３が加熱される工程が、第２のはんだリフロー工程だけであり、電子部品３４，４３の特性劣化を防ぐことができる。即ち、信頼性を確保できる。 The composite substrate device of FIG. 3 manufactured by the above process has the following advantages.
(4) Since the electronic components 34 and 43 are simultaneously placed in the second solder reflow process, it is not necessary to place the electronic components 34 and 43 on the mother board 30 and the module substrate 40 in a separate process, and the production efficiency is improved. It has improved.
(5) The process of heating the electronic components 34 and 43 is only the second solder reflow process, and the characteristic deterioration of the electronic components 34 and 43 can be prevented. That is, reliability can be ensured.

（６） 電子部品３４，４３が加熱される工程が、第２のはんだリフロー工程だけであり、例えばリフロー推奨回数が１回の電子部品３４，４３も、マザーボード３０及びモジュール基板４０に載置できる。即ち、使用部品の制限が緩和される。   (6) The process of heating the electronic components 34 and 43 is only the second solder reflow process. For example, the electronic components 34 and 43 whose recommended number of reflows is one can also be placed on the motherboard 30 and the module substrate 40. . That is, the restriction on the parts used is relaxed.

（７） マザーボード３０の凹部３２にモジュール基板４０が収容されて低背化されるので、複合基板装置全体が低背化される。   (7) Since the module substrate 40 is accommodated in the concave portion 32 of the mother board 30 and reduced in height, the entire composite substrate device is reduced in height.

（８） マザーボード３０の凹部３２にモジュール基板４０が収容されて低背化されるので、第２のはんだ塗布工程におけるクリームはんだＳの塗布が容易になる。   (8) Since the module substrate 40 is accommodated in the concave portion 32 of the mother board 30 and the height thereof is reduced, the application of the cream solder S in the second solder application process is facilitated.

［第３の実施形態］
図５は、本発明の第３の実施形態に係る複合基板装置を示す構成図である。
この複合基板装置は、マザーボード５０と、マザーボード５０に搭載されたモジュール基板６０とを備えている。 [Third Embodiment]
FIG. 5 is a block diagram showing a composite substrate apparatus according to the third embodiment of the present invention.
The composite board device includes a mother board 50 and a module board 60 mounted on the mother board 50.

マザーボード５０は、電子部品載置用の複数の電極端子５１ａと複数の電極端子５１ｂとが表面に形成されている。マザーボード５０には、さらに、モジュール基板６０を収容する凹部５２が形成され、その凹部５２の底部に、基板搭載用の複数の電極端子５３が形成されている。電極端子５１ａには、電子部品５４が載置されて接続されている。電極端子５３は、モジュール基板６０の有する回路或いはグランドとマザーボード５０の持つ回路又はグランドとを接続するために設けられた端子である。   The mother board 50 has a plurality of electrode terminals 51a and a plurality of electrode terminals 51b for mounting electronic components on the surface. The motherboard 50 further includes a recess 52 that accommodates the module substrate 60, and a plurality of electrode terminals 53 for mounting the substrate are formed at the bottom of the recess 52. An electronic component 54 is placed and connected to the electrode terminal 51a. The electrode terminal 53 is a terminal provided to connect a circuit or ground included in the module substrate 60 and a circuit or ground included in the mother board 50.

モジュール基板６０の表面には、電子部品載置用の複数の電極端子６１ａと複数の電極端子６１ｂとが形成され、モジュール基板６０の裏面には、基板搭載用の複数の電極端子６２が形成されている。電極端子６１ａに電子部品６３が接続されている。電子部品６３は、モジュール基板６０の回路を構成している。電極端子６２は、モジュール基板６０の回路又はグランドとマザーボード５０の回路又はグランドとを接続するためのものである。   A plurality of electrode terminals 61 a and a plurality of electrode terminals 61 b for mounting electronic components are formed on the surface of the module substrate 60, and a plurality of electrode terminals 62 for mounting the substrate are formed on the back surface of the module substrate 60. ing. An electronic component 63 is connected to the electrode terminal 61a. The electronic component 63 constitutes a circuit of the module substrate 60. The electrode terminal 62 is for connecting the circuit or ground of the module substrate 60 and the circuit or ground of the mother board 50.

この複合基板装置には、さらに、マザーボード５０の回路とモジュール基板６０の回路とを接続するための共有電子部品５５を備えている。共有電子部品５５は、マザーボード５０の電極端子５１ｂとモジュール基板６０の電極端子６１ｂとの両方に接続されている。   The composite board device further includes a shared electronic component 55 for connecting the circuit of the mother board 50 and the circuit of the module board 60. The shared electronic component 55 is connected to both the electrode terminal 51 b of the mother board 50 and the electrode terminal 61 b of the module substrate 60.

モジュール基板６０は、マザーボード５０の凹部５２に収容されて、低背化され、モジュール基板６０の表面の高さが、マザーボード５０の表面の高さとほぼ等しくなっている。電極端子５３と電極端子６２とが接続されている。電極端子６１に電子部品６３が接続されている。   The module substrate 60 is accommodated in the recess 52 of the mother board 50 to reduce the height, and the height of the surface of the module substrate 60 is substantially equal to the height of the surface of the mother board 50. The electrode terminal 53 and the electrode terminal 62 are connected. An electronic component 63 is connected to the electrode terminal 61.

次に、この複合基板装置の製造方法を説明する。
図６（ａ）〜（ｆ）は、図５の複合基板装置の製造方法の説明図である。
図５の複合基板装置は、図６（ａ）の第１のはんだ塗布工程と、図６（ｂ）の基板搭載工程と、図６（ｃ）の第１のはんだリフロー工程と、図６（ｄ）の第２のはんだ塗布工程と、図６（ｅ）の部品載置工程と、図６（ｆ）の第２のはんだリフロー工程と、を実施することにより、製造される。 Next, a method for manufacturing the composite substrate device will be described.
6A to 6F are explanatory views of a method for manufacturing the composite substrate device of FIG.
The composite substrate device of FIG. 5 includes a first solder application step of FIG. 6A, a substrate mounting step of FIG. 6B, a first solder reflow step of FIG. 6C, and FIG. The second solder application process of d), the component placement process of FIG. 6 (e), and the second solder reflow process of FIG. 6 (f) are performed.

第１のはんだ塗布工程では、電極端子５１ａ，５１ｂ，５３の形成されたマザーボード５０の電極端子５３の部分にクリームはんだＳを塗布する。このクリームはんだＳの塗布は、任意の方法で塗布してよい。   In the first solder application step, the cream solder S is applied to the electrode terminal 53 portion of the mother board 50 where the electrode terminals 51a, 51b, 53 are formed. The cream solder S may be applied by any method.

基板搭載工程では、電極端子６１ａ，６１ｂ，６２の形成されたモジュール基板６０の裏面をマザーボード５０の表面側に向け、対応する電極端子５３と電極端子６２とが対向する位置に、位置合わせを行いつつ、マザーボード５０の凹部５２にモジュール基板６０を挿入して搭載する。   In the substrate mounting step, the module substrate 60 on which the electrode terminals 61a, 61b, 62 are formed is directed to the front surface side of the mother board 50, and the corresponding electrode terminal 53 and the electrode terminal 62 are aligned with each other. Meanwhile, the module substrate 60 is inserted and mounted in the recess 52 of the mother board 50.

第１のはんだリフロー工程では、モジュール基板６０が搭載されたマザーボード５０をはんだリフロー炉に入れて加熱し、その後冷却する。加熱により、クリームはんだＳが融解し、冷却により、固形化して電極端子５３と電極端子６２とが接続される。以上により、モジュール基板６０がマザーボード５０に搭載されて一体化される。   In the first solder reflow process, the mother board 50 on which the module substrate 60 is mounted is placed in a solder reflow furnace, heated, and then cooled. By heating, the cream solder S is melted and solidified by cooling, and the electrode terminal 53 and the electrode terminal 62 are connected. As described above, the module substrate 60 is mounted on the mother board 50 and integrated.

第２のはんだ塗布工程では、一体化された状態のマザーボード５０及びモジュール基板６０の電極端子５１ａ，５１ｂ，６１ａ，６１ｂの上に、クリームはんだＳを塗布する。このクリームはんだＳの塗布は、メタルマスクを用いた印刷で塗布してもよいし、他の適宜な方法で塗布してもよい。   In the second solder application step, the cream solder S is applied onto the mother board 50 and the electrode terminals 51a, 51b, 61a and 61b of the module substrate 60 in an integrated state. The cream solder S may be applied by printing using a metal mask or may be applied by another appropriate method.

部品載置工程では、クリームはんだＳが塗布された電極端子５１ａ，５１ｂ，６１ａ，６１ｂの上に、対応する電子部品５４，６３及び共有電子部品５５を載置する。   In the component placing step, the corresponding electronic components 54 and 63 and the shared electronic component 55 are placed on the electrode terminals 51a, 51b, 61a and 61b to which the cream solder S is applied.

第２のはんだリフロー工程では、電子部品５４，６３及び共有電子部品５５が載置されたマザーボード５０及びモジュール基板６０をはんだリフロー炉に入れて加熱し、その後冷却する。加熱により、クリームはんだＳが融解し、冷却により固形化して電子部品５４，６３及び共有電子部品５５と電極端子５１ａ，５１ｂ，６１ａ，６１ｂとが接続される。以上により、マザーボード５０及びモジュール基板６０に電子部品５４，６３及び共有電子部品５５が載置され、図５の複合基板装置が形成される。   In the second solder reflow process, the mother board 50 and the module substrate 60 on which the electronic components 54 and 63 and the shared electronic component 55 are placed are heated in a solder reflow furnace and then cooled. The cream solder S is melted by heating and solidified by cooling, and the electronic components 54, 63 and the shared electronic component 55 are connected to the electrode terminals 51a, 51b, 61a, 61b. Thus, the electronic components 54 and 63 and the shared electronic component 55 are placed on the mother board 50 and the module substrate 60, and the composite substrate device of FIG. 5 is formed.

以上の工程で製造される図５の複合基板装置は、次のような利点を有する。
（９） 電子部品５４，６３及び共有電子部品５５が、第２のはんだリフロー工程で同時に載置されるので、別工程でマザーボード５０やモジュール基板６０に電子部品５４，６３及び共有電子部品５５を載置する必要がなく、生産効率が向上している。 The composite substrate device of FIG. 5 manufactured by the above process has the following advantages.
(9) Since the electronic components 54 and 63 and the shared electronic component 55 are simultaneously placed in the second solder reflow process, the electronic components 54 and 63 and the shared electronic component 55 are mounted on the mother board 50 and the module substrate 60 in a separate process. There is no need for mounting, and production efficiency is improved.

（１０） 電子部品５４，６３及び共有電子部品５５が加熱される工程が、第２のはんだリフロー工程だけであり、電子部品５４，６３及び共有電子部品５５の特性劣化を防ぐことができる。即ち、信頼性を確保できる。   (10) The process of heating the electronic components 54 and 63 and the shared electronic component 55 is only the second solder reflow process, and the characteristic deterioration of the electronic components 54 and 63 and the shared electronic component 55 can be prevented. That is, reliability can be ensured.

（１１） 電子部品５４，６３及び共有電子部品５５が加熱される工程が、第２のはんだリフロー工程だけであり、例えばリフロー推奨回数が１回の電子部品５４，６３及び共有電子部品５５も、マザーボード５０及びモジュール基板６０に載置できる。即ち、使用部品の制限が緩和される。   (11) The process of heating the electronic components 54 and 63 and the shared electronic component 55 is only the second solder reflow process. For example, the electronic components 54 and 63 and the shared electronic component 55 whose recommended number of reflows is 1 It can be placed on the mother board 50 and the module substrate 60. That is, the restriction on the parts used is relaxed.

（１２） マザーボード５０の凹部５２にモジュール基板６０が収容されて低背化されるので、複合基板装置全体が低背化される。   (12) Since the module substrate 60 is accommodated in the concave portion 52 of the mother board 50 and reduced in height, the entire composite substrate device is reduced in height.

（１３） マザーボード５０の凹部５２にモジュール基板６０が収容されて低背化されるので、第２のはんだ塗布工程におけるクリームはんだＳの塗布が容易になる。   (13) Since the module substrate 60 is housed in the concave portion 52 of the mother board 50 and the height thereof is reduced, the application of the cream solder S in the second solder application process is facilitated.

尚、本発明は、上記実施形態に限定されず、種々の変形が可能である。その変形例としては、例えば次のものが考えられる。
（ｉ）第３の実施形態の複合基板装置は、凹部５２の電極端子５３とモジュール基板６０の裏面の電極端子６２とを介して、マザーボード５０とモジュール基板６０とを接続しているが、これらの接続がない場合にも、本発明は適用できる。
（ｉｉ）共有電子部品５５を備える第３の実施形態の複合基板装置では、凹部５２をマザーボード５０に形成して低背化されているが、凹部５２を形成せず、第１の実施形態のように、マザーボード５０上にモジュール基板６０を搭載してもよい。この場合、モジュール基板６０の側面に端面電極を形成して、共有部品５５をその端面電極とマザーボード５０の電極端子５１ｂとの間に接続してもよい。 In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. As the modification, for example, the following can be considered.
(I) The composite substrate device according to the third embodiment connects the mother board 50 and the module substrate 60 via the electrode terminals 53 of the recess 52 and the electrode terminals 62 on the back surface of the module substrate 60. The present invention can also be applied when there is no connection.
(Ii) In the composite substrate device of the third embodiment including the shared electronic component 55, the concave portion 52 is formed on the mother board 50 to reduce the height, but the concave portion 52 is not formed, and the first embodiment is not provided. As described above, the module substrate 60 may be mounted on the mother board 50. In this case, an end face electrode may be formed on the side surface of the module substrate 60, and the shared component 55 may be connected between the end face electrode and the electrode terminal 51 b of the mother board 50.

（ｉｉｉ） 第１の実施形態のマザーボード１０、第２の実施形態のマザーボード３０及び第３の実施形態のマザーボード５０は、両面基板で構成しても良いし、４層基板或いは８層基板等の多層基板で構成しても良い。   (Iii) The mother board 10 of the first embodiment, the mother board 30 of the second embodiment, and the mother board 50 of the third embodiment may be configured by double-sided boards, such as a four-layer board or an eight-layer board. You may comprise with a multilayer substrate.

（ｉｖ） 第１の実施形態のモジュール基板２０、第２の実施形態のモジュール基板４０及び第３の実施形態のモジュール基板６０は、両面基板で構成しても良いし、４層基板或いは８層基板等の多層基板で構成しても良い。   (Iv) The module substrate 20 of the first embodiment, the module substrate 40 of the second embodiment, and the module substrate 60 of the third embodiment may be configured by a double-sided substrate, a four-layer substrate, or an eight-layer substrate. You may comprise with multilayer substrates, such as a board | substrate.

本発明の第１の実施形態に係る複合基板装置を示す構成図である。It is a block diagram which shows the composite substrate apparatus which concerns on the 1st Embodiment of this invention. 図１の複合基板装置の製造方法の説明図である。It is explanatory drawing of the manufacturing method of the composite substrate apparatus of FIG. 本発明の第２の実施形態に係る複合基板装置を示す構成図である。It is a block diagram which shows the composite substrate apparatus which concerns on the 2nd Embodiment of this invention. 図３の複合基板装置の製造方法の説明図である。It is explanatory drawing of the manufacturing method of the composite substrate apparatus of FIG. 本発明の第３の実施形態に係る複合基板装置を示す構成図である。It is a block diagram which shows the composite substrate apparatus which concerns on the 3rd Embodiment of this invention. 図５の複合基板装置の製造方法の説明図である。It is explanatory drawing of the manufacturing method of the composite substrate apparatus of FIG.

符号の説明Explanation of symbols

１０，３０，５０ マザーボード
１１，１２，２１，２２，３１，３３，４１，４２，５１ａ，５１ｂ，５３，６１ａ，６１ｂ，６２ 電極端子
１３，２３，３４，４３，５４，６３ 電子部品
２０，４０，６０ モジュール基板
３２，５２ 凹部
５５ 共有電子部品 10, 30, 50 Motherboard 11, 12, 21, 22, 31, 33, 41, 42, 51a, 51b, 53, 61a, 61b, 62 Electrode terminal 13, 23, 34, 43, 54, 63 Electronic component 20, 40, 60 Module substrate 32, 52 Recessed portion 55 Shared electronic component

Claims (3)

電子部品をそれぞれ搭載した複数の基板を備える複合基板装置の製造方法であって、
前記電子部品が接続される電極端子が形成された第１の基板に、前記電子部品が載置される電極端子が形成された第２の基板を搭載する基板搭載工程と、
前記基板搭載工程の前又は後に、前記第１の基板の電極端子及び第２の基板の電極端子にはんだを塗布する第１のはんだ塗布工程と、
前記はんだが塗布された前記第１の基板の電極端子及び第２の基板の電極端子に、対応する前記電子部品を載置する部品載置工程と、
前記部品載置工程が終了した前記第１の基板及び第２の基板を加熱して前記はんだのリフローを行い、前記各電子部品を前記第１の基板の電極端子或いは第２の基板の電極端子に接続するはんだリフロー工程と、
を含むことを特徴とする複合基板装置の製造方法。 A method of manufacturing a composite substrate device comprising a plurality of substrates each mounted with an electronic component,
A substrate mounting step of mounting a second substrate on which the electrode terminal on which the electronic component is mounted is mounted on a first substrate on which the electrode terminal to which the electronic component is connected is formed;
Before or after the substrate mounting step, a first solder application step of applying solder to the electrode terminals of the first substrate and the electrode terminals of the second substrate;
A component mounting step of mounting the corresponding electronic component on the electrode terminal of the first substrate and the electrode terminal of the second substrate coated with the solder;
The first substrate and the second substrate that have completed the component placement process are heated to reflow the solder, and the electronic components are connected to the electrode terminals of the first substrate or the electrode terminals of the second substrate. Solder reflow process to connect to,
The manufacturing method of the composite substrate apparatus characterized by including. 前記第１の基板には、凹部が形成され、
前記基板搭載工程では、前記凹部に前記第２の基板を収容することを特徴とする請求項１に記載の複合基板装置の製造方法。 A recess is formed in the first substrate,
The method for manufacturing a composite substrate device according to claim 1, wherein in the substrate mounting step, the second substrate is accommodated in the recess. 前記複合基板装置は、前記第１の基板の電極端子に接続された電子部品と第２の基板の電極端子に接続された電子部品と前記第１の基板の電極端子及び第２の基板の電極端子の両方の電極端子に接続された共有電子部品とを有し、
前記部品載置工程では、前記はんだが塗布された前記第１の基板の電極端子及び第２の基板の電極端子に、対応する前記電子部品及び共有電子部品を載置し、
前記はんだリフロー工程では、前記はんだのリフローにより、前記各電子部品及び共有電子部品を前記第１の基板の電極端子或いは第２の基板の電極端子に接続することを特徴とする請求項１又は２に記載の複合基板装置の製造方法。
The composite substrate device includes an electronic component connected to the electrode terminal of the first substrate, an electronic component connected to the electrode terminal of the second substrate, the electrode terminal of the first substrate, and the electrode of the second substrate. A shared electronic component connected to both electrode terminals of the terminal,
In the component mounting step, the corresponding electronic component and shared electronic component are mounted on the electrode terminal of the first substrate and the electrode terminal of the second substrate to which the solder is applied,
The said solder reflow process connects each said electronic component and a shared electronic component to the electrode terminal of a said 1st board | substrate, or the electrode terminal of a 2nd board | substrate by the reflow of the said solder, The Claim 1 or 2 characterized by the above-mentioned. A method for manufacturing a composite substrate device according to claim 1.
JP2005082655A 2005-03-22 2005-03-22 Method of producing composite substrate apparatus Pending JP2006269555A (en)

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