EP2845452A1 - Injection moulded circuit carrier having an integrated circuit board - Google Patents
Injection moulded circuit carrier having an integrated circuit boardInfo
- Publication number
- EP2845452A1 EP2845452A1 EP12733626.1A EP12733626A EP2845452A1 EP 2845452 A1 EP2845452 A1 EP 2845452A1 EP 12733626 A EP12733626 A EP 12733626A EP 2845452 A1 EP2845452 A1 EP 2845452A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- electronic unit
- injection
- plastic mold
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
Definitions
- the invention relates to an electronic unit with a printed circuit board integrated in an injection-molded conductor carrier, and to a hearing device with such an electronic unit.
- An injection-molded conductor support also called "molded inter- connect device” (MID) is known, consists of a spritzgegos ⁇ Senen resistant plastic mold whose surface is provided with conductor tracks.
- MID molded inter- connect device
- the injection molding process basically allows the shape of the plastic molded free to choose.
- injection-molded conductor support can be conductively connected to other electronic components, in particular a printed circuit board, and forms an electronic unit together with them.
- electronic components in particular a printed circuit board
- a hearing aid amplifies acoustic signals, which requires multiple electronic components, and all electronic components must be on a small volume be packaged, since the housing of the hearing aid for cosmetic reasons should be as small as possible.
- the production of an electronic unit, in particular a hearing aid the lowest possible cost verur- things.
- an electric machine comprising a gear housing for receiving Getriebebau ⁇ share and a printed circuit board, wherein the gear housing is made of a plastic material and tracks are integrated into the gear housing to an electrical Ver ⁇ bond with the circuit board manufacture, wherein the conductor track by means of MID technology integrated into the transmission housing is, wherein contact surfaces are arranged on at least one of the narrow side surfaces of the circuit board.
- the object of the invention is to reduce the complexity and size of an electronic unit comprising an injection-molded conductor carrier and a printed circuit board.
- the object is achieved by a device according to claim 1.
- the invention is based on the idea of a printed circuit board in an injection-molded conductor carrier in the form of a solid
- the conductor track of the printed circuit board and the conductor track of the injection-molded conductor carrier are connected by soldering and / or with the aid of electrically conductive adhesive, whereby the compound has a particularly high electrical conductivity and robustness.
- the printed circuit board is attached to the plastic mold by means of a chemical or mechanical fastening means, whereby the printed circuit board is connected to the plastic mold in a particularly robust manner.
- an electronic component is mounted directly to the plastics molding and elekt ⁇ driven conductively connected to a conductor track of the injection-molded conductor support. This approach erdale the electronic unit highly integrated and compact decor with dark ⁇ th, which simplifies their production.
- At least one surface mountable component is mounted on the printed circuit board and electrically conductively connected thereto, whereby the degree of integration of the electronic unit is further increased.
- At least one surface-mounted component is an integrated circuit, which makes it possible to electrically connect even integrated circuits with very closely spaced electrical contacts in a simple manner with a spritzgegosse ⁇ nen line carrier.
- the printed circuit board with the integrated circuit is formed as an amplifier, which may ⁇ by the electronic unit performing the function of a Verstär ⁇ kers, in particular in a hearing aid.
- at least one microphone is mounted directly to the plastics molding and is electrically conductively connected to a conductor track of the injection-molded conductor support, whereby the electronic unit can be used as micro ⁇ fonmodul, in particular in a hearing aid.
- At least one loudspeaker is attached directly to the plastic mold and electrically conductively connected to a conductor track of the injection-molded line carrier, whereby the electronic unit can be used as a loudspeaker module, in particular in a hearing aid.
- it is a hearing device, comprising an electronic unit in one of the aforementioned embodiments, whereby the degree of integration of the hearing aid is increased and it can be constructed in a particularly compact form.
- the plastic mold of the electronic unit is formed as a part of the housing of Hörge ⁇ Raets. Due to the dual function of the injection-molded cable carrier as a housing and as an essential component of the electronic unit, the hearing aid can be made particularly compact.
- Fig. 2 shows a cross section of the integrated electronic
- Fig. 3 shows a cross section through a hearing aid.
- Fig. 1 shows an integrated electronic unit 2 in ⁇ view, comprising the following components: an integrated circuit 8, mounted on a printed circuit board 7, surface-mountable components 9, which are also mounted on the Leiterplat ⁇ te 7, and an injection molded Kaussträ ⁇ ger 1 in the form of a solid plastic mold 6 with traces 4 on the surface of the plastic mold 6.
- the circuit board 7 is embedded in the plastic mold 6 and electrically connected by solder 3 with traces 4 of the injection molded conductor carrier 1.
- a microphone 5 is mounted on the plastic mold 6 and electrically connected to a conductor track 4 of the injection-molded conductor carrier 1 conductively connected so that the coming of the microphone 5 electrical signals to the electronic unit 2 happenge ⁇ leads and can be processed by this.
- an electronic unit 2 Comp ⁇ component is generally a Signalverarbei ⁇ processing unit, the tert coming from the microphone 5 and amplified signals fil ⁇ to then wei ⁇ terzu meeting to the speaker 18th
- the electronic unit 2 can therefore also be referred to as an amplifier.
- Such an amplifier typically has at least one integrated circuit 8.
- the integrated circuit 8 can be electrically connected to the circuit board 7, for example, by the flip-chip technique or wire bonding.
- further surface-mountable component 9 can be ⁇ placed on the circuit board 7, and are electrically conductively connected to it, play as examples resistors, capacitors or inductances. Additional components allow, by interconnection with the integrated circuit 8, a greater flexibility in the design of the characteristics of the amplifier. However, it is also possible to mount microphones 5, loudspeakers 18, coils or other components on the printed circuit board 7.
- At least one conductor track of the printed circuit board 16 is electrically conductively connected to at least one conductor 4 mounted on the surface of the plastic mold 6.
- This compound can be prepared for example by solder 3 or by means of electrically conductive adhesive. A wire or cable connection between circuit board te 7 and the interconnects 4 of the injection-molded conductor carrier 1 is therefore not necessary.
- the printed circuit board 7 is let into the plastic mold 6 such that the surface closes one side of the printed circuit board 7 substantially flush with the surface of the plastic mold 6 along one side of the printed circuit board 7.
- the upper ⁇ surface of the circuit board 7 is then directly with the angren ⁇ collapsing surface of the injection-molded conductor support essen- sentlichen 1 in one plane.
- the printed circuit board 7 can be easily electrically connected by flush closing with the tracks 4.
- a solder connection ⁇ upon impact, that is, without overlapping or through rings of the parts to be soldered is easily possible here because the solder joint is exposed to only low loads.
- the temperature of the built-in electronic unit 2 is exposed in a hearing aid 20 by the low elekt ⁇ generic performance and constant ambient temperature only minor fluctuations. Therefore, when soldering to the electrical connection of printed conductors of the printed circuit board 16 and on the surface of the plastic mold 6 mounted printed conductors 4 in particular no hairline cracks of the solder joint, so the solder 3 itself or between solder and conductor to be feared during regular use of the hearing aid 20.
- all common soldering methods can be used, in particular wave soldering and remelting, also known as reflow soldering.
- Injection-molded conductor supports 1 are based on a plastic mold 6, which usually consists of a thermoplastic. There ⁇ nen but coming Kings also elastomers and thermosets and when Mehrkom ⁇ -component injection molding different plastics for the production of the plastic mold 6 used. Insbesonde- re the respective plastics can be provided with metallic Additi ⁇ ven.
- the injection molding process allows great freedom in the design of the plastic mold 6, in particular it can be used as part of the housing 17 of a plastic mold. be formed bilfunkauss or a hearing aid 20. Due to the free, three-dimensional shaping injection-molded Lei ⁇ carrier 1, it is also possible to connect electronic components functionally together on a very small volume. In particular, molds with recesses in the form of a recess 10 for the admission of other components, such as a printed circuit board 7, easily made who ⁇ the.
- the printed conductors 4 can be produced, for example, by hot embossing,
- Mask exposure or laser direct structuring on the plastic mold 6 are applied.
- the laser direct structuring the areas of the surface which is provided with me ⁇ -metallic additives for plastic molding 6 with a laser serstrahl processed to serve as conductor tracks 4 later.
- the conductor tracks 4 are formed by a copper bath in which a conductive copper film is formed in the laser-processed areas. This can be further coated with other conductive materials, in particular with gold.
- various electronic components can be mounted on the injection-molded conductor carrier 1, for example, a microphone 5, or a speaker 18, but also SPU len or integrated circuits 8, whereby the electronic ⁇ specific unit 2 is compact and has a higher integration ⁇ degrees.
- the electronic components can be fixed by übli ⁇ che method on the injection-molded cable carrier 1, for example by soldering, wire bonding or connectors.
- the recess 10 in the plastic mold 6 for the circuit board 7 is designed so that the circuit board 7, the recess 10 fills the exact fit. This has the advantage that the circuit board 7 is pre-fixed in position. Furthermore, one side of the printed circuit board 7 essentially closes. Chen flush with the surrounding surface of the plastic mold 6, whereby the electrical connection of the circuit board 7 is facilitated with the injection-molded conductor carrier 1. In particular, a soldering on impact, so without overlapping or
- the printed circuit board 7 is additionally connected by adhesive 11 to the plastic mold 6.
- recess 10 for the circuit board 7 in turn recesses for adhesive 11 are formed. If these formations are filled with the correct adhesive volume, this ensures that only defined parts of the guide plate 7 are in contact with the adhesive 11. Natuer ⁇ Lich bonding of the lead plate 7 can also be made easily without the ones shown, recesses for the adhesive.
- Adhesive 11 can also be adhesive strips or mechanical fastening means such as
- Screws, wires, nails, plug or clamp connections and solder joints are used. Different fastening means can also be combined with one another.
- FIG. 3 shows a cross section through a hearing aid 20, which is designed as a behind-the-ear hearing device.
- the hearing aid 20 has an electronic unit 2, which is designed as an amplifier, and which is connected to a power source in the form of a battery 19 and two microphones 5 and a Lautspre ⁇ cher 18.
- the electronic unit 2 amplifies and filters the signals coming from the microphones 5 and forwards them to the loudspeaker 18. These electronic components are enclosed by a housing 17.
- the hearing device 20 can be equipped with an integrated device in an injection-molded conductor carrier 1.
- Strengthen unit both a behind-the-ear hearing aid as well as an in-ear hearing aid.
- it may be a Conchaieri or a so- ⁇ -called “in the canal” in an in-ear hearing aid (ITC) device, or a so-called “completely in the canal” (CIC) acting device.
- ITC in-ear hearing aid
- CIC completely in the canal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Neurosurgery (AREA)
- Otolaryngology (AREA)
- Structure Of Printed Boards (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
Claims
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2012/061805 WO2013189531A1 (en) | 2012-06-20 | 2012-06-20 | Injection moulded circuit carrier having an integrated circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2845452A1 true EP2845452A1 (en) | 2015-03-11 |
Family
ID=46506318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12733626.1A Withdrawn EP2845452A1 (en) | 2012-06-20 | 2012-06-20 | Injection moulded circuit carrier having an integrated circuit board |
Country Status (4)
Country | Link |
---|---|
US (1) | US9374891B2 (en) |
EP (1) | EP2845452A1 (en) |
CN (1) | CN104396352A (en) |
WO (1) | WO2013189531A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2910034B1 (en) | 2012-10-22 | 2016-10-19 | Sivantos Pte. Ltd. | Routing building block for complex mid structures in hearing instruments |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015205431A1 (en) * | 2015-03-25 | 2016-09-29 | Sivantos Pte. Ltd. | Method for producing a circuit |
EP4159144A1 (en) | 2019-03-25 | 2023-04-05 | Erbe Elektromedizin GmbH | Fluid control assembly for a medical device |
CN117013285B (en) * | 2023-09-28 | 2023-12-22 | 武汉嘉晨电子技术有限公司 | High-low voltage integrated connecting piece, BDU and processing method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3046341A1 (en) * | 1979-12-10 | 1981-08-27 | Sony Corp., Tokyo | ELECTRICAL CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR |
US20080150811A1 (en) * | 2006-12-20 | 2008-06-26 | Tomoko Honda | Electronic apparatus |
JP2012114164A (en) * | 2010-11-22 | 2012-06-14 | Furukawa Electric Co Ltd:The | Board and method of manufacturing board |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4891687A (en) | 1987-01-12 | 1990-01-02 | Intel Corporation | Multi-layer molded plastic IC package |
JP3323958B2 (en) * | 1993-06-14 | 2002-09-09 | ポリプラスチックス株式会社 | Manufacturing method of molded electric parts |
US6490168B1 (en) | 1999-09-27 | 2002-12-03 | Motorola, Inc. | Interconnection of circuit substrates on different planes in electronic module |
JP3888228B2 (en) * | 2002-05-17 | 2007-02-28 | 株式会社デンソー | Sensor device |
DK1532842T3 (en) * | 2002-07-10 | 2013-11-04 | Oticon As | Hearing aid or similar audio device and method for manufacturing a hearing aid |
EP1317163B1 (en) | 2002-10-22 | 2012-08-29 | Phonak Ag | Hearing aid |
DE10260303B3 (en) | 2002-12-20 | 2004-06-17 | Siemens Audiologische Technik Gmbh | Microphone module for hearing aid, has several microphones attached to common carrier and electrically connected via 3-dimensional conductor paths |
DE102004057463A1 (en) | 2004-11-29 | 2006-06-01 | Robert Bosch Gmbh | Electric machine with conductor tracks integrated in the housing |
US20060233412A1 (en) | 2005-04-14 | 2006-10-19 | Siemens Audiologische Technik Gmbh | Microphone apparatus for a hearing aid |
DE102006017630A1 (en) | 2006-04-12 | 2007-10-18 | Lpkf Laser & Electronics Ag | Method for producing a printed conductor structure and a printed conductor structure produced in this way |
DE102007041892A1 (en) | 2007-09-04 | 2009-03-05 | Robert Bosch Gmbh | Electrical switching arrangement with a MID circuit carrier and a connection interface connected thereto |
DE102008035420A1 (en) | 2008-07-29 | 2010-02-04 | Continental Teves Ag & Co. Ohg | Modular circuit arrangement for use in safety-critical system in motorvehicle, has circuit carrier body electro-conductively, directly and fixedly connected to printed circuit board by soldering connection |
DE102008038212A1 (en) | 2008-08-18 | 2009-12-10 | Siemens Medical Instruments Pte. Ltd. | Switching device for hearing aid, has switches fastened to switch frame that is adapted to contour of hearing aid housing, where frame comprises two arms with angle of less than or equal to one hundred and seventy degree Celsius |
DE102009054236A1 (en) | 2009-11-21 | 2011-05-26 | Bayerische Motoren Werke Aktiengesellschaft | Electronic component manufacturing method for automobile, involves electrically connecting electronic parts to conductor track structure by connecting medium, and processing connecting medium at temperature of less than preset value |
-
2012
- 2012-06-20 EP EP12733626.1A patent/EP2845452A1/en not_active Withdrawn
- 2012-06-20 WO PCT/EP2012/061805 patent/WO2013189531A1/en active Application Filing
- 2012-06-20 CN CN201280074044.8A patent/CN104396352A/en active Pending
- 2012-06-20 US US14/410,280 patent/US9374891B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3046341A1 (en) * | 1979-12-10 | 1981-08-27 | Sony Corp., Tokyo | ELECTRICAL CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR |
US20080150811A1 (en) * | 2006-12-20 | 2008-06-26 | Tomoko Honda | Electronic apparatus |
JP2012114164A (en) * | 2010-11-22 | 2012-06-14 | Furukawa Electric Co Ltd:The | Board and method of manufacturing board |
Non-Patent Citations (1)
Title |
---|
See also references of WO2013189531A1 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2910034B1 (en) | 2012-10-22 | 2016-10-19 | Sivantos Pte. Ltd. | Routing building block for complex mid structures in hearing instruments |
Also Published As
Publication number | Publication date |
---|---|
US9374891B2 (en) | 2016-06-21 |
WO2013189531A1 (en) | 2013-12-27 |
CN104396352A (en) | 2015-03-04 |
US20150208497A1 (en) | 2015-07-23 |
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Inventor name: BARTULEC, ROMAN Inventor name: NAUMANN, FRANK Inventor name: KRAL, HOLGER |
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RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: SIVANTOS PTE. LTD. |
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