WO2016060046A1

WO2016060046A1 - Controller and method for manufacturing controller

Info

Publication number: WO2016060046A1
Application number: PCT/JP2015/078500
Authority: WO
Inventors: 貴彦大兼; 文明古塩; 航楠元; 正道石井; 佳央山田; 巌鶴淵
Original assignee: 株式会社ミツバ
Priority date: 2014-10-15
Filing date: 2015-10-07
Publication date: 2016-04-21

Abstract

The resin-molded body (10) of this controller (1) comprises a primary molded part (11) integrated by means of the resin with bus bars (100) which each have one end which functions as a connector terminal that protrudes into a respective connector part (13-15), said primary molded part (11) also forming electronic component placement sections (16a-16d) where electronic components (40) are to be disposed and a power device placement section (17) where a power device (50) is to be disposed; and a secondary molded part (21) that is integrated with the electronic components (40), power device (50), and primary molded part (11) when the electronic components (40) are disposed in the electronic component placement sections (16a-16d) and the power device (50) is disposed in the power device placement section (17).

Description

Controller and controller manufacturing method

The present invention relates to a controller and a method for manufacturing the controller.
This application claims priority based on Japanese Patent Application No. 2014-210620 filed in Japan on October 15, 2014 and Japanese Patent Application No. 2015-085326 filed on April 17, 2015 in Japan, The contents are incorporated here.

Generally, a controller that drives an electrically driven body such as a motor has a configuration that protects an electronic component such as a noise prevention element mounted on a substrate disposed inside, a semiconductor element, and the like. For example, a controller (circuit board unit) described in Patent Document 1 has a substrate sealed with an upper case and a lower case. However, in the case of such a configuration, a waterproof seal structure is required at the joint portion between the upper case and the lower case in order to ensure waterproofness. Further, in the case of the configuration of the controller described in Patent Document 1, since a space is formed inside, as a countermeasure against vibration of the electronic component arranged inside, a fixing structure of the electronic component and a stress relaxation structure of the terminal of the electronic component Was necessary. Furthermore, if there is a space inside, a breathing means for adjusting the pressure difference between the inside and outside of the controller is also required, which increases the number of parts.

For example, a controller (motor drive device) described in Patent Document 2 can improve internal airtightness by molding the entire laminated circuit, which is a power device including electronic components and semiconductor elements, with resin. It is improving.

JP 2014-60206 A JP 2010-112293 A

In the controller described in Patent Document 2, since electronic components are configured in a laminated circuit, variations of the driven body to which the motor driving device can be applied may be limited. Further, it is conceivable to arrange electronic components outside the laminated circuit for this problem. However, it is difficult to mold these electronic components and the laminated circuit integrally because of the mold configuration. Therefore, it may be difficult to provide a controller with excellent waterproofness and durability and high versatility.

The present invention provides a controller that is excellent in waterproofness and durability, and can improve versatility, and a method for manufacturing the controller.

According to the first aspect of the present invention, the controller includes a plurality of terminals, an electronic component connected to the terminal, the terminal connected to the terminal, and supplies electric power to the driven body. A controller in which a power device for controlling driving of a driven body is embedded and a connector portion into which a connector extending from an external device can be fitted is integrally formed, and the resin body is integrated with the terminal by resin. The terminal has one end function as a connector terminal projecting into the connector portion, and a primary molding portion that forms the placement portion of the electronic component and the power device, and the electronic component and the power device in the placement portion In a state where the electronic component, the power device, and the secondary molding unit integrated with the primary molding unit, A.
By configuring as described above, the electronic component and the power device are arranged in the primary molded portion formed by the resin and the terminal, and then the primary molded portion, the electronic component, and the power device are combined by the secondary molded portion. Can be integrated with resin. For this reason, the airtightness inside a controller can be improved. Further, by improving the air tightness with the resin, the heat conductivity of the resin is higher than that of the air, so that the heat dissipation can be improved. In addition, the fixing structure for the electronic component and the power device and the stress relaxation structure for each terminal of the electronic component and the power device are not required, and there is no need to separately take measures against vibration. Furthermore, since the electronic component is provided separately from the power device and the electronic component is set in the primary molding portion, the electronic component can be appropriately changed according to the specification. Therefore, a controller that is excellent in waterproofness and durability and can improve versatility can be obtained.

According to the second aspect of the present invention, in the controller according to the first aspect of the present invention, the secondary molding portion is integrally formed with an attachment portion for fixing the secondary molding portion to the attached member. Has been.
By comprising as mentioned above, the attachment to a to-be-attached member can be performed easily, without providing a separate attachment structure.

According to the third aspect of the present invention, in the controller according to the first aspect or the second aspect of the present invention, the secondary molded part is formed of a heat conductive resin.
By configuring as described above, since the secondary molded part is formed of the heat conductive resin, the heat generated in the electronic component and the power device integrated with the secondary molded part is transmitted through the secondary molded part. Heat can be efficiently radiated to the outside.

According to a fourth aspect of the present invention, in the controller according to the third aspect of the present invention, the secondary molding portion is integrally provided with a heat sink, and the power device and the heat sink are separated from each other. The power device and the heat sink are in contact with each other through the thermally conductive resin.
By comprising as mentioned above, since the heat sink is provided in the secondary shaping | molding part, heat dissipation can be improved, without providing a heat dissipation mechanism separately. Moreover, since the power device and the heat sink are in contact with each other through a heat conductive resin, heat generated in the power device can be transferred to the heat sink without interposing a heat dissipation sheet between the power device and the heat sink. . Therefore, heat dissipation can be improved with a simple configuration.

According to a fifth aspect of the present invention, in the controller according to the fourth aspect of the present invention, the heat sink is electrically connected to the terminal.
By configuring as described above, the terminal can be easily grounded through the exposed portion of the heat sink.

According to a sixth aspect of the present invention, in the controller according to any one of the first to fifth aspects of the present invention, the electronic component is at least one of a noise prevention element and a smoothing capacitor. Is included.
By comprising as mentioned above, a noise prevention circuit and a smooth circuit can be formed inside the resin main body excellent in waterproofness, and the waterproofness and durability of a controller can be improved more.

According to a seventh aspect of the present invention, in the controller according to any one of the first to sixth aspects of the present invention, the electronic component is arranged in the same plane as the power device. Yes.
By comprising as mentioned above, the increase in the thickness of a controller can be suppressed.

According to an eighth aspect of the present invention, in the controller according to any one of the first aspect to the seventh aspect of the present invention, the arrangement unit is configured to accommodate at least a part of the electronic component. Is formed.
By comprising as mentioned above, when forming a secondary shaping | molding part, it can prevent that the position shift of the electronic component arrange | positioned at an arrangement | positioning part arises.

According to a ninth aspect of the present invention, in the controller according to any one of the first to eighth aspects of the present invention, the primary molded part includes the electronic component and the terminal. A window portion for exposing the connection portion is formed.
By comprising as mentioned above, since a space is provided in the circumference | surroundings of a connection part by a window part, an electronic component and a terminal can be easily connected with respect to a primary shaping | molding part via a window part. Moreover, for example, when resistance welding or the like is used as a connection method, workability during welding is improved and the thermal influence of welding on the primary molded portion can be sufficiently suppressed.

According to the tenth aspect of the present invention, in the method for manufacturing a controller, a plurality of terminals, an electronic component connected to the terminal, and the terminal are connected to supply power to the driven body inside the resin body. And a power device for controlling the driving of the driven body, and a method for manufacturing a controller in which a connector portion into which a connector extending from an external device can be fitted is integrally formed, and is integrated with the terminal by resin. A primary molding step of forming one end of the terminal as a connector terminal protruding into the connector portion, and forming a primary molding portion for forming the placement portion of the electronic component and the power device; and In a state where the electronic component and the power device are arranged, the electronic component, the power device, and the primary molding unit Having a secondary molding step of forming an integrated secondary molded part.
By configuring as described above, the electronic component and the power device are arranged in the primary molded portion formed by the resin and the terminal, and then the primary molded portion, the electronic component, and the power device are combined by the secondary molded portion. Can be integrated with resin. For this reason, the airtightness inside a controller can be improved. Further, by improving the air tightness with the resin, the heat conductivity of the resin is higher than that of the air, so that the heat dissipation can be improved. In addition, the fixing structure for the electronic component and the power device and the stress relaxation structure for each terminal of the electronic component and the power device are not required, and there is no need to separately take measures against vibration. Furthermore, since the electronic component is provided separately from the power device and the electronic component is set in the primary molding part, a controller that can appropriately change the electronic component according to the specification can be used without using a complicated mold. Can be manufactured. Therefore, it is possible to easily manufacture a controller that is excellent in waterproofness and durability and can improve versatility.

According to an eleventh aspect of the present invention, in the method for manufacturing a controller according to the tenth aspect of the present invention, the controller disposed in the placement portion between the primary molding step and the secondary molding step. A connecting step of electrically connecting the electronic component and the power device to the terminal;
By comprising as mentioned above, it can electrically connect with respect to a terminal in the state which has arrange | positioned the electronic component and the power device in the arrangement | positioning part of a primary shaping | molding part. Thereby, the position shift of an electronic component and a power device can be suppressed.

According to the above controller, after the electronic component and the power device are arranged in the primary molding portion formed by the resin and the terminal, the primary molding portion, the electronic component, and the power device are collectively made of the resin by the secondary molding portion. Can be integrated. For this reason, the airtightness inside a controller can be improved. Further, by improving the air tightness with the resin, the heat conductivity of the resin is higher than that of the air, so that the heat dissipation can be improved. In addition, the fixing structure for the electronic component and the power device and the stress relaxation structure for each terminal of the electronic component and the power device are not required, and there is no need to separately take measures against vibration. Furthermore, since the electronic component is provided separately from the power device and the electronic component is set in the primary molding portion, the electronic component can be appropriately changed according to the specification. Therefore, a controller that is excellent in waterproofness and durability and can improve versatility can be obtained.

According to the above-described controller manufacturing method, after the electronic component and the power device are arranged in the primary molding portion formed by the resin and the terminal, the primary molding portion, the electronic component, and the power device are put together by the secondary molding portion. Can be integrated with resin. For this reason, the airtightness inside a controller can be improved. Further, by improving the air tightness with the resin, the heat conductivity of the resin is higher than that of the air, so that the heat dissipation can be improved. In addition, the fixing structure for the electronic component and the power device and the stress relaxation structure for each terminal of the electronic component and the power device are not required, and there is no need to separately take measures against vibration. Furthermore, since the electronic component is provided separately from the power device and the electronic component is set in the primary molding part, a controller that can appropriately change the electronic component according to the specification can be used without using a complicated mold. Can be manufactured. Therefore, it is possible to easily manufacture a controller that is excellent in waterproofness and durability and can improve versatility.

It is a perspective view of the controller of a 1st embodiment. It is the perspective view which permeate | transmitted the secondary shaping | molding part of the controller of 1st Embodiment. It is the bottom view which permeate | transmitted the primary shaping | molding part and the secondary shaping | molding part of the controller of 1st Embodiment. FIG. 4 is a sectional view taken along line IV-IV in FIG. 1. It is a flowchart which shows the manufacturing method of the controller of 1st Embodiment. It is process drawing which shows the manufacturing method of the controller of 1st Embodiment. It is process drawing which shows the manufacturing method of the controller of 1st Embodiment. It is process drawing which shows the manufacturing method of the controller of 1st Embodiment. It is the perspective view which permeate | transmitted the secondary shaping | molding part of the controller of 2nd Embodiment. FIG. 10 is a cross-sectional view taken along line XX in FIG. 9.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, a motor will be described as an example of the electrically driven body that is driven and controlled by the controller 1.

[First Embodiment]
(controller)
FIG. 1 is a perspective view of the controller of the first embodiment. FIG. 2 is a perspective view through the secondary molding portion of the controller of the first embodiment.
As shown in FIGS. 1 and 2, the controller 1 controls the drive of the motor. The controller 1 is attached to, for example, a motor case (attached member) of a motor. The controller 1 has a resin mold body 10 (resin main body) mainly constituting a main body portion. Inside the resin mold body 10, a plurality of bus bars 100 (terminals), an electronic component 40 connected to the bus bar 100, a power device 50 connected to the bus bar 100, supplying power to the motor and controlling the driving of the motor, , Is buried. Further, the resin mold body 10 has connector portions 13 to 15 (first connector portion 13, second connector portion 14, and third connector portion 15) into which connectors (all not shown) extending from external devices can be fitted. It is integrally molded.

The resin mold body 10 includes a primary molding part 11 and a secondary molding part 21.
As shown in FIG. 2, in the primary molding part 11, a base part 12 and connector parts 13 to 15 protruding from the base part 12 are integrally molded. The primary molding part 11 is integrated with a plurality of bus bars 100, and one end of the bus bar 100 functions as a connector terminal protruding into the connector parts 13-15. In the primary molding portion 11, electronic component placement portions 16a to 16d for placing the electronic component 40 and a power device placement portion 17 for placing the power device 50 are formed.

The base portion 12 is formed in a substantially rectangular plate shape when viewed from the axial direction of the motor, and includes an end side 12b, an end side 12c facing the end side 12b, and a pair of ends orthogonal to the end sides 12b and 12c. And

sides

12d and 12e. In the base portion 12, a plurality of window portions 12a exposing connection portions between the electronic component 40 and the power device 50 and the bus bar 100, and four electronic component placement portions 16a to 16d (first portions) in which the electronic component 40 is placed. 1 arrangement part 16a, 2nd arrangement part 16b, 3rd arrangement part 16c, 4th arrangement part 16d), and power device arrangement part 17 in which power device 50 is arranged are formed.

The window portion 12a is formed in most of the half of the base portion 12, and is formed so as to penetrate in the thickness direction of the base portion 12 (hereinafter simply referred to as "thickness direction").
In the region of the base portion 12 where the window portion 12a is formed, the first placement portion 16a, the second placement portion 16b, and the third placement portion along the end side 12b in order from the end side 12d side to the end side 12e side. The arrangement part 16c and the fourth arrangement part 16d are arranged in parallel. Each of the electronic component placement portions 16a to 16d can accommodate the electronic component 40, and is formed in a concave shape opened to one side in the thickness direction.

The power device arrangement portion 17 is formed in a rectangular plate shape, and is arranged along the entire end side 12c in substantially half of the base portion 12 opposite to the window portion 12a (see FIG. 7). Further, a pair of positioning protrusions 17a are erected toward the one side in the thickness direction at positions corresponding to the pair of

end sides

12d and 12e in the power device placement portion 17. The pair of positioning protrusions 17a positions the power device.

On the outer peripheral edge of the base portion 12, connector portions 13 to 15 protrude along the surface direction of the base portion 12, respectively. Specifically, the 1st connector part 13 is formed in the part near the connection part with the edge 12c on the edge 12e. The 2nd connector part 14 is formed in the part near the connection part with the edge 12b on the edge 12e. The 3rd connector part 15 is formed in the part near the connection part with the edge 12c on the edge 12d.
A plurality of bus bars 100 are embedded in the primary molded part 11 formed in this way.

FIG. 3 is a bottom view of the controller according to the first embodiment that is transmitted through the primary molding portion and the secondary molding portion.
As shown in the figure, the plurality of bus bars 100 are composed of signal system terminal bus bars 101 to 106, power terminal bus bars 111 and 112 (first power terminal bus bar 111, second power terminal bus bar 112), and three-phase. Bus bars 121 to 123 and a power bus bar 131 are provided. Each of the plurality of bus bars 100 is formed in a desired shape by pressing a metal plate material such as copper, for example. The plurality of bus bars 100 are arranged side by side on the same plane without intersecting each other. For this reason, it is comprised so that generation | occurrence | production of the noise by crosstalk may be suppressed.

As shown in FIGS. 2 and 3, the signal system terminal bus bars 101 to 106 are arranged in the vicinity of the first connector portion 13. Each of the signal system terminal bus bars 101 to 106 has a power device side end portion 107 protruding into the window portion 12 a of the base portion 12 and a connector side end portion 108 protruding into the first connector portion 13. .

The signal system terminal bus bars 101 to 106 are provided as communication lines with external devices such as an ECU (Engine Control Unit). The signal system terminal bus bars 101 to 106 are mainly used for inputting the target rotational speed of the motor, outputting the rotational speed of the motor, setting the function of the power device 50, and outputting error state information. By providing the signal system terminal bus bars 101 to 106 for setting the function of the power device 50, it is possible to change the setting of the function of the controller 1 even in the product state, thereby improving the development productivity. Further, since the signal system terminal bus bars 101 to 106 are provided for outputting error state information, the error type can be determined when an error occurs, and the efficiency of failure analysis can be improved. Further, by outputting (feedback) the motor rotation speed from the signal system terminal bus bars 101 to 106 to the host ECU, the host ECU can adjust the motor rotation speed as necessary. There is also an effect of suppressing (electricity costs).

The first power terminal bus bar 111 is disposed so as to bypass the first placement portion 16a and the second placement portion 16b in a region extending from the end side 12b to the end side 12d of the base portion 12. The first power terminal bus bar 111 includes a power device side end portion 111a protruding into the window portion 12a of the base portion 12, a connector side end portion 111b protruding into the second connector portion 14, and a pair of end portions 111a, Three tongue pieces 111c projecting into the window portion 12a of the base portion 12 from the connecting portion connecting the 111b.

The second power terminal bus bar 112 is disposed between the signal system terminal bus bars 101 to 106 and the first power terminal bus bar 111 in the base portion 12. The second power terminal bus bar 112 includes a power device side end portion 112a protruding into the window portion 12a of the base portion 12, a connector side end portion 112b protruding into the second connector portion 14, and a pair of end portions 112a, Two tongue pieces 112c projecting into the window portion 12a of the base portion 12 from the connecting portion connecting the 112b.

The three-phase bus bars 121 to 123 are arranged in the vicinity of the third connector portion 15. The three-phase bus bars 121 to 123 each have a power device side end portion 124 protruding into the window portion 12 a of the base portion 12 and a connector side end portion 125 protruding into the third connector portion 15.

The power bus bar 131 is disposed in the base portion 12 between the first power terminal bus bar 111 and the three-phase bus bars 121 to 123. The power bus bar 131 has a power device side end 132 and three tongue pieces 133 protruding into the window portion 12 a of the base portion 12.

On the main surface on one side in the thickness direction of the primary molded portion 11 (base portion 12) in which the plurality of bus bars 100 are thus embedded, the electronic component 40 and the power device 50 are arranged in the same plane. . The electronic component 40 includes a noise prevention element 41 and a pair of smoothing capacitors 45.

The noise prevention element 41 includes an X capacitor 42 and a choke coil 43.
The X capacitor 42 is provided mainly for suppressing radio noise. The X capacitor 42 is, for example, a substantially cylindrical electrolytic capacitor, and is arranged in the fourth arrangement portion 16 d of the base portion 12. The X capacitor 42 is arranged such that the central axis thereof is along the extending direction of the end sides 12 d and 12 e of the base portion 12.

As the X capacitor 42, for example, a ceramic capacitor or the like can be used in addition to an electrolytic capacitor such as an aluminum electrolytic capacitor, a conductive polymer capacitor, or a niobium capacitor.
Here, the aluminum electrolytic capacitor is designed to release a high-temperature gas containing an electrolytic solution by operating a pressure valve when an abnormality such as heat generation occurs and the internal pressure rises. For this reason, it is necessary to provide a space for releasing high-temperature gas around the pressure valve of the aluminum electrolytic capacitor. On the other hand, solid capacitors such as conductive polymer capacitors, niobium capacitors, and ceramic capacitors do not include a pressure valve, so that there is no need to provide a space around them. For this reason, it becomes easy to mold the secondary molding portion 21 described later.

The X capacitor 42 has a pair of lead portions extending from its end face. The pair of lead portions of the X capacitor 42 has tips arranged in the window portion 12a. For example, the tongue piece portion 111c of the first power terminal bus bar 111 and the tongue piece of the second power terminal bus bar 112 are formed by resistance welding or the like. Are electrically connected to each of the portions 112c.

The choke coil 43 is provided mainly for suppressing radio noise. The choke coil 43 is formed by winding a conducting wire around a cylindrical core made of a magnetic material such as ferrite. The choke coil 43 is arranged in the third arrangement part 16 c of the base part 12. The choke coil 43 is disposed such that the central axis thereof is along the extending direction of the end sides 12 b and 12 c of the base portion 12.

The lead wire of the choke coil 43 has a pair of tip portions arranged in the window portion 12a. A pair of tip portions of the conductive wire of the choke coil 43 are electrically connected to the tongue piece portion 112c of the second power terminal bus bar 112 and the tongue piece portion 133 of the power bus bar 131, respectively, by resistance welding, for example. ing.

The pair of smoothing capacitors 45 are provided to suppress a change in voltage caused by driving the motor. The pair of smoothing capacitors 45 are, for example, cylindrical electrolytic capacitors, similarly to the X capacitor 42, and are respectively disposed on the first placement portion 16 a and the second placement portion 16 b of the base portion 12. As with the X capacitor 42, each smoothing capacitor 45 is arranged such that its central axis is along the extending direction of the end sides 12 d and 12 e of the base portion 12.

As the smoothing capacitor 45, a ceramic capacitor or the like can be used in addition to an electrolytic capacitor such as an aluminum electrolytic capacitor, a conductive polymer capacitor, or a niobium capacitor, similarly to the X capacitor 42. However, in general, a conductive polymer capacitor, a niobium capacitor, a ceramic capacitor, and the like tend to have a smaller capacitance than an aluminum electrolytic capacitor of the same size. Therefore, when a conductive polymer capacitor, niobium capacitor, ceramic capacitor, or the like is used as the smoothing capacitor, it is desirable to moderate the change in voltage (current) by controlling the motor with sinusoidal drive control or wide-angle energization drive control. In addition, when using a conductive polymer capacitor, niobium capacitor, ceramic capacitor, etc. as a smoothing capacitor, the change in voltage can be suppressed by using multiple capacitors that have the same capacitance as when using an aluminum electrolytic capacitor. Is also possible.

Each smoothing capacitor 45 has a pair of lead portions extending from its end face. The pair of lead portions of each smoothing capacitor 45 have tips arranged in the window portion 12a. For example, the tongue piece portion 111c of the first power terminal bus bar 111 and the tongue piece portion 133 of the power bus bar 131 are formed by resistance welding or the like. And are electrically connected to each other.

The power device 50 arranged in the power device arrangement unit 17 of the base unit 12 is formed in a rectangular plate shape. The power device 50 is placed on the power device placement portion 17 of the base portion 12 so that the longitudinal direction thereof is along the extending direction of the end 12 c of the base portion 12. The power device 50 includes, for example, an electronic element including a switching element such as an FET (Field Effect Transistor) or an IGBT (Insulated Gate Bipolar Transistor) in a mold body such as an epoxy resin. The mounted circuit board is built-in.

Further, a terminal row 51 is provided on one side surface of the power device 50. Each terminal constituting the terminal row 51 protrudes into the window portion 12a and electrically connects the power device

side end portions

107, 111a, 112a, 124, 132 of the bus bar 100, respectively.

As shown in FIG. 2, a heat sink 55 is placed on the main surface on one side in the thickness direction of the power device 50 via a heat dissipating sheet (not shown). The heat sink 55 is formed in a rectangular shape that is slightly larger than the power device 50 when viewed from the thickness direction. The heat sink 55 has a plurality of pin-type heat radiation fins erected along the thickness direction on the main surface on one side in the thickness direction. Further, notches 55 a are formed on the pair of short sides of the heat sink 55. The heat sink 55 is placed on the power device 50 in a state where the pair of notches 55a are engaged with the pair of positioning protrusions 17a of the power device placement portion 17, respectively. The power device 50 and the heat sink 55 are fixed to each other with a heat dissipation sheet sandwiched between a pair of fastening members 53 (see FIG. 3). By sandwiching the heat dissipating sheet, the adhesion between the heat dissipating sheet and the power device 50 and the heat sink 55 is improved, and heat generated by the power device 50 is easily transmitted to the heat sink 55.

4 is a cross-sectional view taken along line IV-IV in FIG.
As shown in FIGS. 2 to 4, the heat sink 55 is formed with a grounding portion 56. The grounding portion 56 protrudes from the side surface of the heat sink 55 on the end 12b side of the base portion 12. The grounding portion 56 is fixed to the first power terminal bus bar 111 by a fastening member 57 having conductivity, and is electrically connected to the first power terminal bus bar 111.

As shown in FIGS. 1 and 2, the secondary molding unit 21 arranges the electronic components 40 in the electronic component placement units 16 a to 16 d of the primary molding unit 11, and the power device 50 and the heat sink 55 in the power device placement unit 17. The electronic component 40, the power device 50, and the primary molding unit 11 are integrated with each other. More specifically, the secondary molding part 21 is formed in a substantially rectangular plate shape. The thickness direction of the secondary molding portion 21 is the same as the thickness direction of the base portion 12. The secondary molded portion 21 is formed so as to cover the portions of the primary molded portion 11, the electronic component 40, the power device 50, and the heat sink 55 except for the surfaces of the connector portions 13 to 15 and the heat sink 55 having the heat radiation fins. Yes.

Further, a pair of attachment portions 23 are integrally formed with the secondary molding portion 21. The pair of attachment portions 23 fix the controller 1 to the motor case. The attachment portion 23 protrudes from the side surface at a position corresponding to the end sides 12 b and 12 c of the base portion 12. Pipe-shaped collar members 24 each formed of a metal material are insert-molded in the attachment portion 23.

(Manufacturing method of controller)
Next, a method for manufacturing the controller 1 of the present embodiment will be described based on FIG. 1 and FIGS.
FIG. 5 is a flowchart showing a method for manufacturing the controller of the first embodiment. 6 to 8 are process diagrams showing the method of manufacturing the controller of the first embodiment.

As shown in FIG. 5, the manufacturing method of the controller 1 includes a primary molding step S10 for forming the primary molding part 11, and electronic components 40 arranged in the electronic component arrangement parts 16a to 16d of the primary molding part 11. And a connecting step S20 for electrically connecting the power device 50 arranged in the power device arranging portion 17 to the bus bar 100, and a secondary forming step S30 for forming the secondary forming portion 21.

First, the primary molding step S10 is performed.
As shown in FIG. 6, in the primary molding step S <b> 10, a plurality of bus bars 100 are set in a mold (not shown) for molding the primary molding portion 11. At this time, the plurality of bus bars 100 may be connected to each other by a connecting portion (not shown). Thus, the several bus-bar 100 can be easily set to a metal mold | die by setting the several bus-bar 100 to the mutually connected state.
Next, as shown in FIG. 7, the resin is poured into a mold in which the bus bar 100 is set, and the primary molding portion 11 is molded. At this time, when the plurality of bus bars 100 are connected by the connecting portions as described above, the connecting portions may be cut when the mold cavity mold and the core mold are clamped, or the primary forming portion. The window part for cut | disconnecting a connection part may be formed in 11, and you may make it cut | disconnect a connection part via this window part. Thereby, the primary shaping | molding part 11 integrated with the some bus-bar 100 is shape | molded, and primary shaping | molding process S10 is completed.

Next, connection process S20 is performed.
As shown in FIG. 8, in the connection step S <b> 20, the electronic component 40 and the power device 50 are arranged in the primary molding unit 11 in which a plurality of bus bars 100 are integrated, and those terminals are electrically connected to the bus bar 100. .
Specifically, the smoothing capacitors 45 are arranged in the first arrangement part 16a and the second arrangement part 16b of the base part 12, respectively. The ends of the pair of lead portions extending from the smoothing capacitors 45 are electrically connected to the tongue piece portion 111c of the first power terminal bus bar 111 and the tongue piece portion 133 of the power bus bar 131, respectively, by resistance welding or the like. Connect.

Further, the choke coil 43 is arranged in the third arrangement portion 16c. Then, the pair of leading end portions of the conducting wire of the choke coil 43 is welded to the tongue piece portion 112c of the second power terminal bus bar 112 and the tongue piece portion 133 of the power bus bar 131 by resistance welding or the like.
Further, the X capacitor 42 is arranged in the fourth arrangement unit 16d. Then, the tips of the pair of lead portions extending from the X capacitor 42 are respectively connected to the tongue piece portion 111c of the first power terminal bus bar 111 and the tongue piece portion 112c of the second power terminal bus bar 112 by resistance welding or the like. Weld.

Further, the power device 50 is arranged in the power device arrangement unit 17. Furthermore, a heat sink 55 is disposed on the power device 50 via a heat dissipation sheet (not shown). At this time, the heat sink 55 can be accurately placed on the power device 50 by engaging the pair of notches 55a of the heat sink 55 with the pair of positioning protrusions 17a of the power device placement portion 17, respectively. Next, the power device 50 and the heat sink 55 are fixed by the pair of fastening members 53 with the heat dissipation sheet sandwiched therebetween. Thereafter, the grounding portion 56 of the heat sink 55 is fastened and fixed to the first power terminal bus bar 111 by a fastening member 57 (see FIG. 3). And each terminal of the terminal row | line | column 51 extended from the power device 50 is each welded to each power device

side edge part

107, 111a, 112a, 124, 132 of the bus bar 100 by resistance welding etc. (refer FIG. 3). The heat sink 55 may be disposed on the power device 50 after the power device 50 and the bus bar 100 are welded.
Thereby, connection process S20 is completed.

Next, the secondary forming step S30 is performed.
In the secondary molding step S30, the primary molding unit 11 in which the electronic component 40 and the power device 50 are integrated in a mold (not shown) for molding the secondary molding unit 21, and the color member 24 (FIG. 2). (See). And resin is poured into a metal mold | die and the secondary shaping | molding part 21 is shape | molded. Thereby, the secondary molding step S30 is completed, and the controller 1 shown in FIG. 1 is manufactured.

As described above, the controller 1 according to the present embodiment allows the resin mold body 10 to be integrated with the bus bar 100 by resin, and allows one end of the bus bar 100 to function as a connector terminal protruding into the connector portions 13 to 15, as well as an electronic component. The electronic component placement portions 16a to 16d for placing the power device 40 and the primary molding portion 11 that forms the power device placement portion 17 for placing the power device 50; and the electronic components 40 are placed in the electronic component placement portions 16a to 16d, and the power device In a state where the power device 50 is arranged in the arrangement unit 17, the electronic component 40, the power device 50, and the secondary molding unit 21 integrated with the primary molding unit 11 are included.

According to this configuration, after the electronic component 40 and the power device 50 are arranged in the primary molding portion 11 formed by the resin and the terminal, the primary molding portion 11, the electronic component 40, and the power device are arranged by the secondary molding portion 21. 50 can be integrated with resin. For this reason, the airtightness inside the controller 1 can be improved.
Further, by improving the air tightness with the resin, the heat conductivity of the resin is higher than that of the air, so that the heat dissipation can be improved. Further, the fixing structure of the electronic component 40 and the power device 50 and the stress relaxation structure of each terminal of the electronic component 40 and the power device 50 are not necessary, and it is not necessary to take a countermeasure against vibration separately.

Furthermore, since the electronic component 40 is provided separately from the power device 50 and the electronic component 40 is set in the primary molding portion 11, the electronic component 40 can be appropriately changed according to the specifications. Therefore, the controller 1 which is excellent in waterproofness and durability and can improve versatility can be obtained.
Moreover, in this embodiment, since the power device 50 is sealed by the resin mold body, such as an epoxy resin, exposure of joint locations, such as a solder joint part, is suppressed. Thereby, formation of the secondary molding part 21 by insert molding becomes easier.

Moreover, since the attachment part 23 is integrally molded in the secondary shaping | molding part 21, attachment to a motor case can be easily performed, without providing an attachment structure separately.
Moreover, since the surface which has the radiation fin of the heat sink 55 is exposed and provided from the secondary shaping | molding part 21, heat dissipation can be improved, without providing a separate heat dissipation mechanism.

Further, since the heat sink 55 is electrically connected to the bus bar 100 (first power terminal bus bar 111), the bus bar 100 can be easily grounded via the exposed portion of the heat sink 55.
In addition, since the electronic component 40 includes the noise prevention element 41 and the smoothing capacitor 45, the noise prevention circuit and the smoothing circuit can be formed inside the resin mold body 10 having excellent waterproof properties. The sex can be further improved.

Moreover, since the electronic component 40 is arrange | positioned in the same plane as the power device 50, the increase in the thickness of the controller 1 can be suppressed.
Further, since the electronic component placement portions 16a to 16d are formed so as to accommodate at least a part of the electronic component 40, they are placed on the electronic component placement portions 16a to 16d when the secondary molding portion 21 is formed. It is possible to prevent the electronic component 40 from being displaced.

Further, the primary molding portion 11 is formed with a window portion 12a that exposes a connection portion between the electronic component 40 and the power device 50 and the bus bar 100. For this reason, the electronic component 40, the power device 50, and the bus bar 100 can be easily connected to the primary molding part 11 via the window part 12a. Moreover, when using resistance welding etc. as a connection method, for example, the workability | operativity at the time of welding improves, and the heat influence of the welding to the primary shaping | molding part 11 can fully be suppressed.

The manufacturing method of the controller 1 of the present embodiment is integrated with the bus bar 100, and functions as a connector terminal that projects one end of the bus bar 100 into the connector parts 13 to 15 and also arranges the electronic component 40a. The primary molding step S10 for forming the primary molding part 11 for forming the power device placement part 17 for placing the power devices 50 to 16d and the power device 50, and placing the electronic component 40 in the electronic part placement parts 16a to 16d In a state where the power device 50 is disposed in the portion 17, the secondary molding step S <b> 30 is formed to form the secondary molding portion 21 integrated with the electronic component 40, the power device 50, and the primary molding portion 11.

According to this method, after the electronic component 40 and the power device 50 are arranged in the primary molding portion 11, the primary molding portion 11, the electronic component 40, the power device 50, and the heat sink 55 are put together by the secondary molding portion 21. Can be integrated with resin. For this reason, the airtightness inside the controller 1 can be improved.
Further, since the resin has a higher thermal conductivity than the air, the heat dissipation can be improved by improving the airtightness with the resin. Further, the fixing structure of the electronic component 40 and the power device 50 and the stress relaxation structure of each terminal of the electronic component 40 and the power device 50 are not necessary, and it is not necessary to take a countermeasure against vibration separately.
Furthermore, since the electronic component 40 is provided separately from the power device 50 and the electronic component 40 is set in the primary molding unit 11, a controller that can appropriately change the electronic component 40 according to the specifications is provided with a complicated gold Can be manufactured without using a mold. Therefore, the controller 1 which is excellent in waterproofness and durability and can improve versatility can be easily manufactured.

Further, between the primary molding step S10 and the secondary molding step S30, the electronic component 40 arranged in the electronic component arrangement portions 16a to 16d and the power device 50 arranged in the power device arrangement portion 17 are connected to the bus bar 100. A connecting step S20 for electrically connecting to.
According to this method, the bus bar 100 is disposed in a state where the electronic component 40 is disposed in the electronic component placement portions 16a to 16d of the primary molding portion 11 and the power device 50 is disposed in the power device placement portion 17 of the primary molding portion 11. Can be electrically connected. Thereby, the position shift of the electronic component 40 and the power device 50 can be suppressed.

[Second Embodiment]
(controller)
FIG. 9 is a perspective view that is transmitted through a secondary molding portion of the controller of the second embodiment. 10 is a cross-sectional view taken along line XX of FIG. The same configurations as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and detailed description thereof is omitted.
Here, in the first embodiment, the power device 50 and the heat sink 55 are in contact with each other via a heat dissipation sheet (not shown). However, as shown in FIG. 10, in the second embodiment, the power device 50 and the heat sink 55 are in contact with each other through the secondary molding portion 221. This is different from the first embodiment described above.

More specifically, as shown in FIGS. 9 and 10, the secondary molded portion 221 of the controller 201 is formed of a heat conductive resin. The heat conductive resin desirably has high thermal conductivity and high insulation and heat resistance. For example, polybutylene terephthalate, polyphenylene sulfide, liquid crystal polymer, or the like can be used.

The power device 50 and the heat sink 55 are spaced apart from each other in the thickness direction. In the gap G between the power device 50 and the heat sink 55, a thermally conductive resin that forms the secondary molded portion 221 is disposed. The power device 50 and the heat sink 55 are in contact with each other through a heat conductive resin.

In such a configuration, when forming the secondary molding portion 221, first, the power device 50 is placed on the power device placement portion 17. Next, each terminal of the terminal row 51 extending from the power device 50 is welded to each power device

side end portion

107, 111a, 112a, 124, 132 of the bus bar 100 by resistance welding or the like. Further, the grounding portion 56 of the heat sink 55 is fastened and fixed to the first power terminal bus bar 111 by the fastening member 57. In this way, the power device 50 and the heat sink 55 are integrated with the primary molding unit 11 in a state where they are separated in the thickness direction.

Next, the primary molded part 11 integrated with the electronic component 40, the power device 50, and the heat sink 55 is set in the mold together with the collar member 24, and the heat conductive resin is poured into the mold. At this time, the molten heat conductive resin flows between the power device 50 and the heat sink 55, and the heat conductive resin adheres to the power device 50 and the heat sink 55.

According to this configuration, since the secondary molding part 221 is formed of a heat conductive resin, the heat generated in the electronic component 40 and the power device 50 integrated with the secondary molding part 221 is transferred to the secondary molding part. Heat can be efficiently radiated to the outside through 221.

Further, the power device 50 and the heat sink 55 are in contact with each other through a heat conductive resin (secondary molding portion 221). Therefore, heat generated in the power device 50 can be transferred to the heat sink 55 without interposing a heat dissipation sheet between the power device 50 and the heat sink 55. For this reason, in 1st Embodiment shown in FIG. 3, the fastening member 53 used in order to insert | pinch a thermal radiation sheet between the power device 50 and the heat sink 55 becomes unnecessary. Therefore, heat dissipation can be improved with a simple configuration.

The present invention is not limited to the above-described embodiment described with reference to the drawings, and various modifications can be considered within the technical scope thereof.
For example, in the above-described embodiment, the first power terminal bus bar 111 is grounded by being connected to the heat sink 55, but is not limited thereto. For example, the first power terminal bus bar 111 may be connected to the collar member 24 exposed to the outside at the mounting portion 23. Then, the first power terminal bus bar 111 can be grounded via the collar member 24 by connecting the collar member 24 to a motor case or the like.

Further, in the above embodiment, the heat sink has the heat radiating fins. However, the present invention is not limited to this. For example, the heat sink has a flat surface without providing the heat radiating fin, and the surface is directly attached to a housing such as a motor. You may make it heat-dissipate through a housing | casing by making it contact | abut.

Moreover, in the said embodiment, although the connection with the bus-bar 100, the electronic component 40, and the power device 50 was performed by resistance welding, you may perform not only this but arc welding, such as TIG welding, laser welding, etc., for example. .

In addition, it is possible to appropriately replace the constituent elements in the above-described embodiments with known constituent elements without departing from the spirit of the present invention.

1,201 Controller 10 Resin mold body (Resin body)
11 Primary molding part 12a Window part 13 1st connector part (connector part)
14 Second connector part (connector part)
15 Third connector part (connector part)
16a, 16b, 16c, 16d Electronic component placement section (placement section)
17 Power device placement section (placement section)
21, 221 Secondary molding part 23 Mounting part 40 Electronic component 41 Noise prevention element 45 Smoothing capacitor 50 Power device 55 Heat sink 100 Bus bar (terminal)

Claims

A plurality of terminals, an electronic component connected to the terminal, and a power device connected to the terminal and supplying power to the driven body and controlling the driving of the driven body are embedded in the resin body. A controller in which a connector portion into which a connector extending from an external device can be fitted is integrally formed,
The resin body is
A primary molded part that is integrated with the terminal by resin, functions as a connector terminal protruding into the connector part at one end of the terminal, and forms an arrangement part of the electronic component and the power device;
In a state where the electronic component and the power device are arranged in the arrangement portion, a secondary molding portion integrated with the electronic component, the power device, and the primary molding portion,
Having a controller.
2. The controller according to claim 1, wherein an attachment portion for fixing the secondary molding portion to a member to be attached is integrally formed on the secondary molding portion.
The controller according to claim 1 or 2, wherein the secondary molded part is formed of a heat conductive resin.
The secondary molded part is integrally provided with a heat sink,
The power device and the heat sink are spaced apart;
The controller according to claim 3, wherein the power device and the heat sink are in contact with each other through the thermally conductive resin.
The controller according to claim 4, wherein the heat sink is electrically connected to the terminal.
The controller according to any one of claims 1 to 5, wherein the electronic component includes at least one of a noise prevention element and a smoothing capacitor.
The controller according to any one of claims 1 to 6, wherein the electronic component is disposed in the same plane as the power device.
The controller according to any one of claims 1 to 7, wherein the placement unit is formed to accommodate at least a part of the electronic component.
The controller according to any one of claims 1 to 8, wherein a window portion that exposes a connection portion between the electronic component and the terminal is formed in the primary molding portion.
A plurality of terminals, an electronic component connected to the terminal, and a power device connected to the terminal and supplying power to the driven body and controlling the driving of the driven body are embedded in the resin body. A controller manufacturing method in which a connector portion into which a connector extending from an external device can be fitted is integrally formed,
Primary molding that is integrated with the terminal by resin and that functions as a connector terminal that projects one end of the terminal into the connector portion, and that forms a primary molding portion that forms an arrangement portion for the electronic component and the power device. Process,
A secondary molding step of forming a secondary molding unit integrated with the electronic component, the power device, and the primary molding unit in a state where the electronic component and the power device are arranged in the arrangement unit;
A method for manufacturing a controller.
The controller according to claim 10, further comprising a connecting step of electrically connecting the electronic component and the power device arranged in the arrangement portion to the terminal between the primary forming step and the secondary forming step. Manufacturing method.