JP2012099441A - Circuit board assembly, connector, soldering method - Google Patents

Circuit board assembly, connector, soldering method Download PDF

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JP2012099441A
JP2012099441A JP2010248539A JP2010248539A JP2012099441A JP 2012099441 A JP2012099441 A JP 2012099441A JP 2010248539 A JP2010248539 A JP 2010248539A JP 2010248539 A JP2010248539 A JP 2010248539A JP 2012099441 A JP2012099441 A JP 2012099441A
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Prior art keywords
circuit board
connector
housing
contact
soldering
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JP5550528B2 (en
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Toshiaki Hayashi
利秋 林
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Tyco Electronics Japan GK
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Tyco Electronics Japan GK
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Priority to JP2010248539A priority Critical patent/JP5550528B2/en
Priority to CN201110353062.7A priority patent/CN102544851B/en
Priority to ES11187909.4T priority patent/ES2589156T3/en
Priority to EP11187909.4A priority patent/EP2451257B1/en
Publication of JP2012099441A publication Critical patent/JP2012099441A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/027—Soldered or welded connections comprising means for positioning or holding the parts to be soldered or welded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle

Abstract

PROBLEM TO BE SOLVED: To provide a circuit board assembly, a connector, a soldering method which support a substrate side connector and solders the connector to a circuit board securely in a solder process to enable efficient production.SOLUTION: Support parts 28, 28, protruding at both sides, are provided at a housing 21 of an electric connector 20. In this structure, when a circuit board 30 is transferred in a solder process, the support parts 28, 28 at both ends are positioned on support rails 50, 50, and the electric connector 20 is supported by the support rails 50, 50. In this way, the structure prevents the electric connector 20 from falling from the circuit board 30 in the solder process.

Description

本発明は、コネクタが回路基板から外周側にオーバーハングして設けられる回路基板組立体、コネクタ、およびそのはんだ付け方法に関する。   The present invention relates to a circuit board assembly in which a connector is provided so as to overhang from a circuit board toward the outer periphery, a connector, and a soldering method thereof.

各種制御装置に用いられる回路基板に外部から配線を接続する場合、回路基板に設けられた基板側コネクタと、配線側に設けられた配線側コネクタとを嵌合させているのは周知の通りである。   As is well known, when wiring is connected from the outside to a circuit board used in various control devices, the board-side connector provided on the circuit board and the wiring-side connector provided on the wiring side are fitted. is there.

このような基板側コネクタは、ハウジングと、ハウジングに保持された複数本の端子とを有している。そして、端子の一端を回路基板に形成されたスルーホールに挿入し、スルーホールの周囲に設けられた導電パターンと端子とをはんだ付けすることにより電気的に接続している。   Such a board-side connector has a housing and a plurality of terminals held by the housing. Then, one end of the terminal is inserted into a through hole formed in the circuit board, and the conductive pattern provided around the through hole and the terminal are electrically connected by soldering.

ところで、制御装置の配置は、配線の取り回しの関係から、配線側コネクタを、回路基板の表面に平行な方向に沿って基板側コネクタに挿抜するものがある。その場合、配線側コネクタを挿抜するときの作業性等の観点から、基板側コネクタは回路基板の外周部に設けられ、回路基板の外周側から配線側コネクタを基板側コネクタに挿抜する。   By the way, as for the arrangement of the control device, there is a type in which the wiring side connector is inserted into and removed from the board side connector along a direction parallel to the surface of the circuit board because of the wiring arrangement. In that case, from the viewpoint of workability when inserting / removing the wiring-side connector, the board-side connector is provided on the outer periphery of the circuit board, and the wiring-side connector is inserted into / removed from the outer peripheral side of the circuit board.

このような配置の基板側コネクタは、回路基板上の面積の有効利用のため、ハウジングの一部のみが回路基板の外周部に支持され、ハウジングの残部は、回路基板の外周側にオーバーハングして設けられたものがある（例えば、特許文献１参照。）。   In the board-side connector having such an arrangement, only a part of the housing is supported on the outer peripheral part of the circuit board for effective use of the area on the circuit board, and the remaining part of the housing overhangs on the outer peripheral side of the circuit board. (For example, refer to Patent Document 1).

特開２００８−４７４３２号公報JP 2008-47432 A 特開２００７−３２９０４９号公報JP 2007-329049 A

しかしながら、特許文献１に示したような構成の場合、端子の一端を回路基板にはんだ付けする工程において、基板側コネクタ（ハウジング）をいかに固定するかが課題となる。端子の一端を回路基板のスルーホールに挿入しただけでは、ハウジングは回路基板の外周側にオーバーハングしているため、その重心により、基板側コネクタが回路基板から脱落してしまう可能性が高い。また、脱落はしないまでも、基板側コネクタが傾いたままはんだ付け工程を経てしまうと、全ての端子が回路基板に正しくはんだ付けされないこともあり、品質に影響を与える。   However, in the case of the configuration shown in Patent Document 1, the problem is how to fix the board-side connector (housing) in the step of soldering one end of the terminal to the circuit board. By simply inserting one end of the terminal into the through hole of the circuit board, the housing overhangs on the outer peripheral side of the circuit board, and therefore, the board-side connector is likely to fall off the circuit board due to its center of gravity. Moreover, even if it does not fall off, if the soldering process is performed with the board-side connector tilted, all terminals may not be correctly soldered to the circuit board, which affects the quality.

そこで、特許文献２においては、ハウジングを回路基板にボルト等の締結手段により固定している。しかし、このような構成では、はんだ付け工程に先立ち、締結手段によってハウジングを回路基板に固定する必要があり、手間がかかり、生産効率向上の妨げにもなる。また、回路基板上にボルト等で締結するためのスペースが必要であり、回路基板上の面積の有効利用の妨げにもなる。
本発明は、このような技術的課題に基づいてなされたもので、はんだ付け工程において基板側コネクタを支持し、回路基板に確実にはんだ付けして効率よく生産を行うことのできる回路基板組立体、コネクタ、はんだ付け方法を提供することを目的とする。 Therefore, in Patent Document 2, the housing is fixed to the circuit board by fastening means such as bolts. However, in such a configuration, it is necessary to fix the housing to the circuit board by the fastening means prior to the soldering process, which takes time and hinders improvement in production efficiency. In addition, a space for fastening with a bolt or the like is necessary on the circuit board, which hinders effective use of the area on the circuit board.
The present invention has been made based on such a technical problem, and is a circuit board assembly that supports a board-side connector in a soldering process and can be reliably soldered to a circuit board for efficient production. An object is to provide a connector and a soldering method.

かかる目的のもと、本発明は、回路基板と、回路基板の回路パターンを外部の配線ハーネスに接続するため、配線ハーネスの一端に設けられた相手側コネクタが接続されるコネクタと、を備え、コネクタは、一端が回路基板の回路パターンに電気的に接続され、他端が相手側コネクタの相手側コンタクトに電気的に接続される複数のコンタクトと、コンタクトを保持するハウジングと、を備える。そして、ハウジングは、回路基板の外周側に向けてオーバーハングして設けられるとともに、回路基板から外周側に向けてオーバーハングした部分に、オーバーハング方向に直交し、かつ回路基板の表面に沿った方向に向けて突出する突出部が形成されていることを特徴とする。
このような突出部は、回路基板に形成されたスルーホールにコンタクトの一端を挿入し、回路基板の回路パターンとコンタクトの一端とをはんだ付けするときに、ハウジングを保持するためのものである。これにより、はんだ付け時に、ハウジングと回路基板との位置関係を安定して保持することができる。
このため、突出部は、オーバーハング方向におけるコネクタの重心位置近傍に設けるのが好ましい。 For this purpose, the present invention comprises a circuit board, and a connector to which a mating connector provided at one end of the wiring harness is connected in order to connect the circuit pattern of the circuit board to an external wiring harness. The connector includes a plurality of contacts having one end electrically connected to the circuit pattern of the circuit board and the other end electrically connected to the mating contact of the mating connector, and a housing holding the contact. The housing is provided to be overhanged toward the outer peripheral side of the circuit board, at a portion overhanging from the circuit board toward the outer peripheral side, orthogonal to the overhang direction and along the surface of the circuit board. A protrusion that protrudes in the direction is formed.
Such a protrusion is for holding the housing when one end of the contact is inserted into a through hole formed in the circuit board and the circuit pattern of the circuit board and one end of the contact are soldered. Thereby, the positional relationship between the housing and the circuit board can be stably held during soldering.
For this reason, it is preferable to provide the protrusion in the vicinity of the center of gravity of the connector in the overhang direction.

また、はんだ付けは、フロー式、リフロー式のいずれを用いても良いが、リフロー式の場合、支持レール上に回路基板とコネクタを支持するために、突出部の下面を、回路基板のはんだ付け面と略同一面内に位置するよう設けるのが好ましい。
突出部は、いかなる位置に設けても良いが、安定的に支持するために、少なくともハウジングの両側に設けるのが好ましい。 In addition, either the flow type or the reflow type may be used for soldering. In the case of the reflow type, in order to support the circuit board and the connector on the support rail, the lower surface of the protrusion is soldered to the circuit board. It is preferable to provide it so as to be located in substantially the same plane as the plane.
The protrusions may be provided at any position, but are preferably provided at least on both sides of the housing for stable support.

本発明は、回路基板の外周部からオーバーハングして設けられるコネクタであって、回路基板の回路パターンに電気的に接続されるコンタクトと、コンタクトを保持するハウジングと、を備え、ハウジングは、回路基板から外周側に向けてオーバーハングする部分に、回路基板の回路パターンとコンタクトの一端とをはんだ付けするときに、ハウジングを保持するための保持突起が形成されていることを特徴とすることもできる。   The present invention is a connector that is provided overhanging from an outer peripheral portion of a circuit board, and includes a contact that is electrically connected to a circuit pattern of the circuit board, and a housing that holds the contact. A holding projection for holding the housing when soldering the circuit pattern of the circuit board and one end of the contact is formed on a portion overhanging from the board toward the outer peripheral side. it can.

さらに、本発明は、上記のようなコネクタと回路基板とをはんだ付けする方法とすることもでき、回路基板の外周部に、回路基板の回路パターンに電気的に接続されるコンタクトを保持したハウジングを、当該回路基板から外周側にオーバーハングさせた状態に仮り組みし、ハウジングに形成された保持突起と、回路基板とを、はんだ付け装置の支持部材上に支持させる工程と、支持部材上に支持された回路基板の配線パターンとコンタクトの一端とをはんだ付けする工程と、を備えることを特徴とする。   Furthermore, the present invention can also be a method of soldering the connector and the circuit board as described above, and a housing that holds contacts that are electrically connected to the circuit pattern of the circuit board on the outer periphery of the circuit board. Is temporarily assembled in a state overhanging from the circuit board to the outer peripheral side, and the holding projection formed on the housing and the circuit board are supported on the support member of the soldering apparatus, and the support member And a step of soldering the wiring pattern of the supported circuit board and one end of the contact.

本発明によれば、回路基板の回路パターンとコンタクトの一端とをはんだ付けするときに、突出部、保持突起により、ハウジングと回路基板との位置関係を安定して保持することができる。これにより、回路基板に確実にはんだ付けをすることができる。また、ハウジングの突出部、保持突起を、はんだ付け装置側の支持レール等に載せるだけでよいので、手間もかからず、効率よく生産を行うことができる。   According to the present invention, when the circuit pattern of the circuit board and one end of the contact are soldered, the positional relationship between the housing and the circuit board can be stably held by the protrusion and the holding protrusion. Thereby, it can solder reliably to a circuit board. Further, since the protruding portion and the holding protrusion of the housing need only be placed on a support rail or the like on the soldering device side, production can be performed efficiently without taking time and effort.

本実施の形態における回路基板組立体を示す斜視図である。It is a perspective view which shows the circuit board assembly in this Embodiment. 回路基板組立体の側断面図である。It is a sectional side view of a circuit board assembly. 回路基板組立体の平面図である。It is a top view of a circuit board assembly. 電気コネクタを、基板に設置される側から見た斜視図である。It is the perspective view which looked at the electrical connector from the side installed in a board | substrate.

以下、添付図面に示す実施の形態に基づいてこの発明を詳細に説明する。
図１〜図３に示すように、電子制御装置１０は、電気コネクタ２０と回路基板３０とからなる回路基板組立体を備えている。
ここで、回路基板３０は、種々の電子部品が実装され、電子制御装置としての所定の動作を実行する制御回路として機能する。
電気コネクタ２０は、外部から回路基板３０に電源を供給したり、電気信号を入出力するためのもので、具体的には、配線ハーネスの一端に設けられた相手側コネクタが外部から接続される。 Hereinafter, the present invention will be described in detail based on embodiments shown in the accompanying drawings.
As shown in FIGS. 1 to 3, the electronic control device 10 includes a circuit board assembly including an electrical connector 20 and a circuit board 30.
Here, the circuit board 30 is mounted with various electronic components and functions as a control circuit that executes a predetermined operation as an electronic control device.
The electrical connector 20 is for supplying power to the circuit board 30 from the outside and for inputting and outputting electrical signals. Specifically, a mating connector provided at one end of the wiring harness is connected from the outside. .

電気コネクタ２０は、樹脂製のハウジング２１と、導電性材料からなる複数のコンタクト２２とからなる。   The electrical connector 20 includes a resin housing 21 and a plurality of contacts 22 made of a conductive material.

ハウジング２１は、回路基板３０の外周端部に設けられる。ハウジング２１には、複数のコンタクト２２を保持する保持孔を有した板状のコンタクト保持プレート部２３が、回路基板３０の表面に直交する面内に位置するよう形成されている。
各コンタクト２２は、コンタクト保持プレート部２３の一方の側から他方の側に貫通するよう、保持孔に圧入されている。ここで、各コンタクト２２は、コンタクト保持プレート部２３に対し、回路基板３０側において、９０°に折り曲げられ、その一端２２ａが、回路基板３０に形成されたスルーホール３１に挿入されている。そして、コンタクト２２の一端２２ａは、スルーホール３１の内周面およびその周囲に形成された導電パターンに対し、はんだ付けにより電気的に接続されている。 The housing 21 is provided at the outer peripheral end of the circuit board 30. In the housing 21, a plate-like contact holding plate portion 23 having a holding hole for holding a plurality of contacts 22 is formed so as to be positioned in a plane orthogonal to the surface of the circuit board 30.
Each contact 22 is press-fitted into the holding hole so as to penetrate from one side of the contact holding plate portion 23 to the other side. Here, each contact 22 is bent at 90 ° on the circuit board 30 side with respect to the contact holding plate portion 23, and one end 22 a thereof is inserted into a through hole 31 formed in the circuit board 30. One end 22a of the contact 22 is electrically connected to the inner peripheral surface of the through hole 31 and the conductive pattern formed on the periphery thereof by soldering.

各コンタクト２２は、その他端２２ｂが、コンタクト保持プレート部２３から、回路基板３０の表面に沿った方向に、回路基板３０の外周側に向けて延びるよう形成されている。
ハウジング２１には、コンタクト保持プレート部２３から、コンタクト２２の他端２２ｂが位置する側に延びる筒状のフード部２４が形成されており、このフード部２４により、複数本のコンタクト２２の他端２２ｂが囲われている。なお、本実施形態においては、フード部２４は大きさの異なるものが二つ設けられている。
このフード部２４には、電子制御装置に接続される図示しない配線ハーネスの先端に設けられた相手側コネクタ（雄コネクタ：図示無し）が挿入され、フード部２４内でコンタクト２２の他端２２ｂに、配線コードの相手側コネクタに保持された相手側コンタクト（雌コンタクト：図示無し）が嵌合して電気的な接続がなされる。 Each contact 22 is formed such that the other end 22 b extends from the contact holding plate portion 23 toward the outer peripheral side of the circuit board 30 in the direction along the surface of the circuit board 30.
The housing 21 is formed with a cylindrical hood portion 24 that extends from the contact holding plate portion 23 to the side where the other end 22 b of the contact 22 is located. The hood portion 24 allows the other end of the plurality of contacts 22 to be formed. 22b is enclosed. In the present embodiment, two hood portions 24 having different sizes are provided.
A mating connector (male connector: not shown) provided at the front end of a wiring harness (not shown) connected to the electronic control device is inserted into the hood portion 24, and is connected to the other end 22 b of the contact 22 in the hood portion 24. The mating contact (female contact: not shown) held by the mating connector of the wiring cord is fitted to be electrically connected.

図４に示すように、コンタクト保持プレート部２３において、回路基板３０側には、回路基板３０の実装面３０ａに突き当たるストッパ部２５が一体に形成されている。ここで、ストッパ部２５は、幅方向（回路基板３０の表面に沿った方向）の両端部にそれぞれ設けられている。このストッパ部２５により、コンタクト２２の一端２２ａのスルーホール３１への挿入寸法を規制できる。   As shown in FIG. 4, in the contact holding plate portion 23, a stopper portion 25 that abuts against the mounting surface 30 a of the circuit board 30 is integrally formed on the circuit board 30 side. Here, the stopper portions 25 are respectively provided at both end portions in the width direction (the direction along the surface of the circuit board 30). With this stopper portion 25, the insertion dimension of the one end 22a of the contact 22 into the through hole 31 can be regulated.

また、ハウジング２１において、幅方向の両端部には、幅方向外方に向けて突出するサポート部（突出部、保持突起）２８がそれぞれ形成されている。
サポート部２８は、その先端面（下面）２８ａが、回路基板３０の実装面３０ａをストッパ部２５の先端面に突き当てた状態で、回路基板３０のはんだ付け面３０ｂと同一面内に位置するよう形成されている。 In the housing 21, support portions (protruding portions and holding projections) 28 that protrude outward in the width direction are formed at both ends in the width direction.
The support portion 28 has a front end surface (lower surface) 28 a located in the same plane as the soldering surface 30 b of the circuit board 30 in a state where the mounting surface 30 a of the circuit board 30 is abutted against the front end surface of the stopper portion 25. It is formed as follows.

図２に示したように、サポート部２８は、コンタクト２２の他端２２ｂの延出方向に沿った方向において、電気コネクタ２０の重心位置Ｇと合致する位置に設けるのが好ましい。
また、サポート部２８は、ハウジング２１の幅方向のそれぞれの端部に、コンタクト２２の他端２２ｂの延出方向に沿った方向に間隔を隔てて複数設けても良い。 As shown in FIG. 2, the support portion 28 is preferably provided at a position that matches the gravity center position G of the electrical connector 20 in the direction along the extending direction of the other end 22 b of the contact 22.
In addition, a plurality of support portions 28 may be provided at respective end portions in the width direction of the housing 21 at intervals in a direction along the extending direction of the other end 22 b of the contact 22.

このような電気コネクタ２０を回路基板３０の外周部に実装するには、まず、電気コネクタ２０を回路基板３０に仮り組みする。仮り組みは、電気コネクタ２０を、回路基板３０に対し、コンタクト２２の一端２２ａをスルーホール３１に挿入し、ストッパ部２５を回路基板３０の実装面３０ａに突き当てた状態とする。   In order to mount such an electrical connector 20 on the outer periphery of the circuit board 30, first, the electrical connector 20 is temporarily assembled to the circuit board 30. In the temporary assembly, the electrical connector 20 is in a state in which one end 22 a of the contact 22 is inserted into the through hole 31 with respect to the circuit board 30 and the stopper portion 25 is abutted against the mounting surface 30 a of the circuit board 30.

次いで、この状態で、回路基板３０の導電パターンと、コンタクト２２の一端２２ａとを、はんだ付け装置によりはんだ付けする。
このとき、はんだ付け装置としてリフロー式のものを用いる。
はんだ付け装置には、はんだ付け対象物となる基板を、はんだ槽の上方に支持しながら移動させる支持レール（支持部材）５０、５０が設けられている。これら支持レール５０、５０上には、回路基板３０の両端部と、両側のサポート部２８が位置するようになっている。 Next, in this state, the conductive pattern of the circuit board 30 and the one end 22a of the contact 22 are soldered by a soldering apparatus.
At this time, a reflow type soldering apparatus is used.
The soldering apparatus is provided with support rails (support members) 50 and 50 that move a substrate to be soldered while supporting the substrate above the solder bath. On these support rails 50, 50, both end portions of the circuit board 30 and support portions 28 on both sides are located.

そして、電気コネクタ２０を仮り組みした回路基板３０を、支持レール５０、５０上に載せ、支持レール５０、５０に沿って移動させながら温風を当てる。これによって回路基板３０に予め塗布しておいたはんだペーストが溶融し、スルーホール３１に挿入されたコンタクト２２の一端２２ａが、回路基板３０の配線パターンにはんだ付けされる。   Then, the circuit board 30 on which the electrical connector 20 is temporarily assembled is placed on the support rails 50, 50, and hot air is applied while being moved along the support rails 50, 50. As a result, the solder paste previously applied to the circuit board 30 is melted, and the one end 22 a of the contact 22 inserted into the through hole 31 is soldered to the wiring pattern of the circuit board 30.

このようにして支持レール５０、５０で回路基板３０を支持しながら搬送するとき、電気コネクタ２０は、両端のサポート部２８、２８が支持レール５０、５０上に位置しているので、電気コネクタ２０が支持レール５０、５０によって支持されている。これにより、電気コネクタ２０と回路基板３０との位置関係を維持することができ、はんだ付け工程において電気コネクタ２０が回路基板３０から脱落してしまうのを防ぐことができる。したがって、コンタクト２２の一端２２ａを回路基板３０の配線パターンに確実にはんだ付けすることができ、高い品質を維持することができる。
また、ボルト等の締結手段を用いる必要も無く、確実なはんだ付けが行えることから、手間を軽減することができ、生産効率を向上させることもできる。また、ボルト等を締結するためのスペースも不要となることから、回路基板３０上の面積を有効利用できる。 When the circuit board 30 is supported while being supported by the support rails 50 and 50 in this way, the electrical connector 20 has the support portions 28 and 28 at both ends positioned on the support rails 50 and 50. Is supported by support rails 50, 50. Thereby, the positional relationship between the electrical connector 20 and the circuit board 30 can be maintained, and the electrical connector 20 can be prevented from dropping off from the circuit board 30 in the soldering process. Therefore, the one end 22a of the contact 22 can be reliably soldered to the wiring pattern of the circuit board 30, and high quality can be maintained.
In addition, since it is not necessary to use fastening means such as bolts and reliable soldering can be performed, labor can be reduced and production efficiency can be improved. Further, since a space for fastening bolts or the like is not necessary, the area on the circuit board 30 can be used effectively.

さらに、サポート部２８は、コンタクト２２の他端２２ｂの延出方向に沿った方向において、電気コネクタ２０の重心位置Ｇと合致する位置に設けられているので、コンタクト２２自体を安定して搬送することができる。   Further, since the support portion 28 is provided at a position that coincides with the gravity center position G of the electrical connector 20 in the direction along the extending direction of the other end 22b of the contact 22, the contact 22 itself is stably conveyed. be able to.

なお、上記実施の形態では、リフロー式のはんだ付け装置を用いたが、リフロー式に代えてフロー式のはんだ付け装置を用いることもできる。その場合、治具（支持部材）上に、回路基板３０の両端部と、両側のサポート部２８が位置する。そして、この治具をはんだ槽の上方に沿って移動させる。すると、回路基板３０のはんだ付け面３０ｂ側に、はんだ槽内の噴流はんだが接触し、スルーホール３１に挿入されたコンタクト２２の一端２２ａが、回路基板３０の配線パターンにはんだ付けされる。
また、フロー式の場合、サポート部２８の先端面２８ａは、必ずしも回路基板３０のはんだ付け面３０ｂと略同一面に形成する必要は無い。治具側に形成された保持部に対応した高さ・位置に先端面２８ａを形成すれば良い。 In the above embodiment, a reflow soldering apparatus is used. However, a flow soldering apparatus may be used instead of the reflow soldering apparatus. In that case, both ends of the circuit board 30 and the support portions 28 on both sides are positioned on the jig (support member). Then, the jig is moved along the upper part of the solder bath. Then, the jet solder in the solder bath comes into contact with the soldering surface 30 b side of the circuit board 30, and one end 22 a of the contact 22 inserted into the through hole 31 is soldered to the wiring pattern of the circuit board 30.
In the case of the flow type, the front end surface 28 a of the support portion 28 is not necessarily formed on the substantially same surface as the soldering surface 30 b of the circuit board 30. What is necessary is just to form the front end surface 28a in the height and position corresponding to the holding | maintenance part formed in the jig | tool side.

また、サポート部２８は、ハウジング２１の両側に設けたが、これ以外の位置に設けることも可能である。例えば、複数配列されたコンタクト２２の間、つまりハウジング２１の幅方向中間部等に設けることも可能である。   Moreover, although the support part 28 was provided in the both sides of the housing 21, it can also be provided in positions other than this. For example, it is also possible to provide between a plurality of contacts 22, that is, in the intermediate portion in the width direction of the housing 21.

さらに、上記実施形態では、ハウジング２１にストッパ部２５が設けられ、このストッパ部２５が回路基板３０の実装面３０ａに突き当たる構成としたが、このストッパ部２５は必須ではない。コンタクト２２の一端２２ａを回路基板３０のスルーホール３１に挿入する以外は、ハウジング２１を含め電気コネクタ２０の他の部分を回路基板３０に非接触とする構成としても良い。この場合でも、はんだ付け時には、サポート部２８がはんだ付け装置側に支持されることで、電気コネクタ２０を安定的に保持してはんだ付けを行うことができる。
そして、このような場合、ストッパ部２５を回路基板３０の実装面３０ａに突き当てるためのスペースが不要となることから、回路基板３０上の面積のさらなる有効利用が図れる。
これ以外にも、本発明の主旨を逸脱しない限り、上記実施の形態で挙げた構成を取捨選択したり、他の構成に適宜変更することが可能である。 Furthermore, in the said embodiment, although the stopper part 25 was provided in the housing 21 and this stopper part 25 was set as the structure which abuts against the mounting surface 30a of the circuit board 30, this stopper part 25 is not essential. Other than inserting the one end 22 a of the contact 22 into the through hole 31 of the circuit board 30, other parts of the electrical connector 20 including the housing 21 may be configured not to contact the circuit board 30. Even in this case, at the time of soldering, the support portion 28 is supported on the soldering device side, so that the electrical connector 20 can be stably held and soldered.
In such a case, a space for abutting the stopper portion 25 against the mounting surface 30a of the circuit board 30 is not necessary, so that the area on the circuit board 30 can be further effectively used.
In addition to this, as long as it does not depart from the gist of the present invention, the configuration described in the above embodiment can be selected or changed to another configuration as appropriate.

１０…電子制御装置、２０…電気コネクタ、２１…ハウジング、２２…コンタクト、２５…ストッパ部、２８…サポート部（突出部、保持突起）、２８ａ…先端面（下面）、３０…回路基板、３０ａ…実装面、３０ｂ…はんだ付け面、３１…スルーホール、５０…支持レール（支持部材）、Ｇ…重心位置   DESCRIPTION OF SYMBOLS 10 ... Electronic control apparatus, 20 ... Electric connector, 21 ... Housing, 22 ... Contact, 25 ... Stopper part, 28 ... Support part (protrusion part, holding protrusion), 28a ... Tip surface (lower surface), 30 ... Circuit board, 30a ... Mounting surface, 30b ... Soldering surface, 31 ... Through hole, 50 ... Support rail (support member), G ... Center of gravity position

Claims (8)

回路基板と、前記回路基板の回路パターンを外部の配線ハーネスに接続するため、前記配線ハーネスの一端に設けられた相手側コネクタが接続されるコネクタと、を備え、
前記コネクタは、
一端が前記回路基板の回路パターンに電気的に接続され、他端が前記相手側コネクタの相手側コンタクトに電気的に接続される複数のコンタクトと、
前記コンタクトを保持するハウジングと、を備え、
前記ハウジングは、前記回路基板の外周側に向けてオーバーハングして設けられるとともに、
前記回路基板から外周側に向けてオーバーハングした部分に、オーバーハング方向に直交し、かつ前記回路基板の表面に沿った方向に向けて突出する突出部が形成されていることを特徴とする回路基板組立体。 A circuit board and a connector to which a mating connector provided at one end of the wiring harness is connected in order to connect the circuit pattern of the circuit board to an external wiring harness;
The connector is
A plurality of contacts having one end electrically connected to the circuit pattern of the circuit board and the other end electrically connected to the mating contact of the mating connector;
A housing for holding the contact,
The housing is provided in an overhang toward the outer peripheral side of the circuit board,
A circuit characterized in that a protruding portion that is orthogonal to the overhanging direction and protrudes in a direction along the surface of the circuit board is formed in a portion overhanging from the circuit board toward the outer peripheral side. Board assembly. 前記突出部は、前記回路基板に形成されたスルーホールに前記コンタクトの一端を挿入し、前記回路基板の前記回路パターンと前記コンタクトの一端とをはんだ付けするときに、前記ハウジングを保持するためのものであることを特徴とする請求項１に記載の回路基板組立体。   The protruding portion is for inserting the one end of the contact into a through hole formed in the circuit board, and holding the housing when soldering the circuit pattern of the circuit board and the one end of the contact. The circuit board assembly according to claim 1, wherein the circuit board assembly is one. 前記突出部は、前記オーバーハング方向における前記コネクタの重心位置近傍に設けられていることを特徴とする請求項１または２に記載の回路基板組立体。   The circuit board assembly according to claim 1, wherein the protruding portion is provided in the vicinity of the center of gravity of the connector in the overhang direction. 前記突出部の下面が、前記回路基板のはんだ付け面と略同一面内に位置するよう設けられていることを特徴とする請求項１から３のいずれか一項に記載の回路基板組立体。   4. The circuit board assembly according to claim 1, wherein a lower surface of the projecting portion is provided so as to be positioned in substantially the same plane as a soldering surface of the circuit board. 5. 前記突出部は、前記ハウジングの両側に設けられていることを特徴とする請求項１から４のいずれか一項に記載の回路基板組立体。   The circuit board assembly according to any one of claims 1 to 4, wherein the protrusions are provided on both sides of the housing. 回路基板の外周部からオーバーハングして設けられるコネクタであって、
前記回路基板の回路パターンに電気的に接続されるコンタクトと、
前記コンタクトを保持するハウジングと、を備え、
前記ハウジングは、前記回路基板から外周側に向けてオーバーハングする部分に、前記回路基板の前記回路パターンと前記コンタクトの一端とをはんだ付けするときに、前記ハウジングを保持するための保持突起が形成されていることを特徴とするコネクタ。 A connector that is provided overhanging from the outer periphery of the circuit board,
A contact electrically connected to the circuit pattern of the circuit board;
A housing for holding the contact,
The housing is formed with a holding projection for holding the housing when soldering the circuit pattern of the circuit board and one end of the contact in a portion overhanging from the circuit board toward the outer peripheral side. Connector characterized by being. 請求項６に記載のコネクタを用いて前記コネクタと回路基板とをはんだ付けする方法であって、
前記回路基板の外周部に、前記回路基板の回路パターンに電気的に接続されるコンタクトを保持したハウジングを、当該回路基板から外周側にオーバーハングさせた状態に仮り組みし、前記ハウジングに形成された保持突起と、前記回路基板とを、はんだ付け装置の支持部材上に支持させる工程と、
前記支持部材上に支持された前記回路基板の配線パターンと前記コンタクトの一端とをはんだ付けする工程と、
を備えることを特徴とするはんだ付け方法。 A method of soldering the connector and a circuit board using the connector according to claim 6,
A housing that holds contacts electrically connected to the circuit pattern of the circuit board on the outer periphery of the circuit board is temporarily assembled in a state of being overhanged from the circuit board to the outer periphery, and is formed on the housing. Supporting the holding protrusion and the circuit board on a support member of a soldering device;
Soldering the wiring pattern of the circuit board supported on the support member and one end of the contact;
A soldering method comprising: 前記はんだ付けは、リフロー式で行うことを特徴とする請求項７に記載のはんだ付け方法。   The soldering method according to claim 7, wherein the soldering is performed by a reflow method.
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