JPH07114141B2 - Terminator card and connector soldering method - Google Patents
Terminator card and connector soldering methodInfo
- Publication number
- JPH07114141B2 JPH07114141B2 JP22929488A JP22929488A JPH07114141B2 JP H07114141 B2 JPH07114141 B2 JP H07114141B2 JP 22929488 A JP22929488 A JP 22929488A JP 22929488 A JP22929488 A JP 22929488A JP H07114141 B2 JPH07114141 B2 JP H07114141B2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- terminator card
- terminator
- card
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Description
【発明の詳細な説明】 〔概 要〕 大型電子機器内の接続配線に使用される同軸ケーブルの
ターミネータカードとコネクタの半田付け方法に関し、 コネクタのリードとターミネータカードの接続パターン
の半田付けが簡単になるとともに、信頼性の高い半田接
合が行えるターミネータカードとコネクタの半田付け方
法の提供を目的とし、 一方にコネクタの絶縁体に成型した溝と係合する係止部
を内側に設けて対向する側壁と、他方のターミネータカ
ードを支える支持面に位置決め用の突起を配した位置決
め治具を備え、上記絶縁体に配列されて対向するリード
間に該ターミネータカードの接続パターン側を挿入し
て、該絶縁体の該溝を上記側壁の係止部に係合するとと
もに、上記支持面の該突起に該ターミネータカードの基
準孔を嵌入することにより、上記位置決め治具で該コネ
クタと該ターミネータカードを保持し、該該ターミネー
タカードを溶融半田に浸漬して上記コネクタの該リード
と上記ターミネータカードの該接続パターンを半田付け
する。DETAILED DESCRIPTION OF THE INVENTION [Overview] A method of soldering a terminator card of a coaxial cable used for connection wiring in a large-sized electronic device and a connector, and a method for easily soldering a lead of a connector and a connection pattern of a terminator card In addition, for the purpose of providing a method for soldering a terminator card and a connector that enables highly reliable solder joining, one side wall is provided with an engaging portion that engages with a groove molded in the insulator of the connector on the inside. And a positioning jig in which a positioning projection is arranged on a support surface that supports the other terminator card, and the connection pattern side of the terminator card is inserted between the leads arranged in the insulator and facing each other, and The groove of the body is engaged with the locking portion of the side wall, and the reference hole of the terminator card is fitted into the protrusion of the supporting surface. Accordingly, holding the connector and the terminator card in the positioning jig for soldering the connection pattern of said leads and said terminator card of the connector is immersed in the solder melting 該該 terminator card.
本発明は、大型電子機器内の接続配線に使用される同軸
ケーブルのターミネータカードとコネクタの半田付け方
法に関する。The present invention relates to a method for soldering a coaxial cable terminator card and a connector used for connection wiring in a large electronic device.
最近、大型電算機においては高密度集積の半導体装置を
高密度に実装した大型プリント板パッケージが装着され
て、そのプリント板パッケージと接続する信号線は外部
からの電波重畳防止と伝送損失の低減を計るために、微
細径の同軸ケーブルを多数本束ねた束線を使用されてい
る。しかし、その束線の端部に設けられる接続用コネク
タはリードが微小ピッチで配列されているので、同軸ケ
ーブルとの接続パターンを設けたプリント配線基板より
なるターミネータカードをコネクタに結合しているため
に、コネクタのリードとターミネータカードの接続パタ
ーンとの結合が容易となるターミネータカードとコネク
タの半田付け方法が要求されている。Recently, large-scale computers are equipped with large-scale printed circuit board packages in which high-density integrated semiconductor devices are mounted at high density, and the signal lines connected to the printed circuit board packages prevent external radio wave superposition and reduce transmission loss. For measurement, a bundle of many fine coaxial cables is used. However, in the connector for connection provided at the end of the bundle, the leads are arranged at a fine pitch, so the terminator card consisting of the printed wiring board provided with the connection pattern with the coaxial cable is connected to the connector. In addition, there is a demand for a method of soldering a terminator card and a connector, which facilitates coupling between a lead of a connector and a connection pattern of a terminator card.
従来広く使用されているターミネータカードとコネクタ
の半田付け方法は、第２図（ａ）に示すように両端面に
係着用の溝１−1aを設けた合成樹脂によりなる絶縁体１
−１に、微小幅，例えば0.6mm幅からなる多数本ののリ
ード１−２を、微小ピッチ，例えば1.27mmで２列に植設
されたコネクタ１と、小型の絶縁基板に基準孔2aを穿設
して、表裏両面の一端側にコネクタ１のリード１−2,と
接合する微小，例えば0.8mm幅の接続パターン２−１
と、他端側にGNDパターン２−２を形成して、接続パタ
ーン２−１とGNDパターン２−２の表面に薄膜の半田メ
ッキを施したターミネータカード２とを、前記コネクタ
１の対向するリード１−２間にターミネータカード２の
接続パターン２−１側を挿入して、その端面をコネクタ
１の絶縁体１−１に当接させる。Conventionally widely used soldering method for a terminator card and a connector is as shown in FIG. 2 (a), an insulator 1 made of synthetic resin having grooves 1-1a for engagement on both end surfaces.
-1 is a connector 1 in which a large number of leads 1-2 each having a minute width, for example, 0.6 mm width are implanted in two rows with a minute pitch, for example, 1.27 mm, and a reference hole 2a is provided on a small insulating substrate. A connection pattern 2-1 having a small size, for example, 0.8 mm width, which is formed by boring and is joined to the leads 1-2 of the connector 1 on both ends of the front and back surfaces.
And the GND pattern 2-2 formed on the other end side, and the connecting pattern 2-1 and the terminator card 2 having the surface of the GND pattern 2-2 plated with a thin film of solder, the leads facing the connector 1. The connection pattern 2-1 side of the terminator card 2 is inserted between 1-2, and the end face thereof is brought into contact with the insulator 1-1 of the connector 1.
そして、（ｂ）図に示すようにターミネータカード２の
表裏両面の接続パターン２−１とコネクタ１のリード１
−２との位置合わせを行い、それぞれのリード１−２に
対して先端が細い図示していない半田鏝に半田３を供給
しながら順次当接させて摺動しすることにより、ターミ
ネータカード２とコネクタ１が結合されている。Then, as shown in FIG. 2B, the connection pattern 2-1 on the front and back surfaces of the terminator card 2 and the lead 1 of the connector 1 are formed.
-2, and by sequentially abutting and sliding the solder 3 while supplying the solder 3 to a soldering iron (not shown) whose tip is thin with respect to each lead 1-2, the terminator card 2 and The connector 1 is connected.
以上説明した従来の半田付け方法で問題となるのは、コ
ネクタに1.27mmの微小ピッチで植設されたリードと、同
じピッチでターミネータカードの表裏両面に形成された
0.8mm幅の接続パターンとの位置合わせを行った後に、
半田を供給しながら先端が細い半田鏝を微小幅のリード
の上面に当接させた状態で摺動しているので、リードと
接続パターンの位置合わせおよび、リード上面の半田鏝
摺動に細心の注意が必要となって多くの時間を要すると
ともに、半田の供給量により隣接する接続パターンとの
間にブリッジが発生するという問題が生じている。The problem with the conventional soldering method described above is that the leads are implanted in the connector at a minute pitch of 1.27 mm and the leads are formed on both the front and back sides of the terminator card at the same pitch.
After aligning with the 0.8mm wide connection pattern,
Since the soldering iron with a thin tip is in contact with the top surface of the lead with a very small width while supplying solder, the lead and connection pattern are aligned and the soldering iron on the top surface of the lead is slid carefully. Attention is required and it takes a lot of time, and there is a problem that a bridge is generated between adjacent connection patterns due to the amount of solder supplied.
本発明は上記のような問題点に鑑み、コネクタのリード
とターミネータカードの接続パターンとの半田付けが簡
単になるとともに、信頼性の高い半田接合が行えるター
ミネータカードとコネクタの半田付け方法の提供を目的
とする。In view of the above problems, the present invention provides a method for soldering a terminator card and a connector, which facilitates soldering of a connector lead and a connection pattern of a terminator card, and which enables highly reliable solder joining. To aim.
本発明は、第１図に示すように一方にコネクタ１の絶縁
体１−１に成型した溝１−1aと係合する係止部14−1aを
内側に設けた対向する側壁14−１を形成し、他方のター
ミネータカード２を支える支持面14−２に位置決め用の
突起14−2aを形成した位置決め治具14を備え、 上記絶縁体１−１に配列されて対向するリード１−２間
にターミネータカード２の接続パターン２−１側を挿入
して、その絶縁体１−１の溝１−1aを前記側壁14−１の
係止部14−1aに係合するともに、位置決め用突起14−2a
にターミネータカード２の基準孔2aを嵌入して位置決め
治具14により保持し、その保持状態で半田槽15の溶融半
田３にターミネータカード２の接続パターン２−１が浸
漬するまで挿入することにより、コネクタ１のそれぞれ
リード１−２とターミネータカード２の各接続パターン
２−１が半田付けされる。According to the present invention, as shown in FIG. 1, an opposite side wall 14-1 having an engaging portion 14-1a which engages with a groove 1-1a formed in the insulator 1-1 of the connector 1 is provided on one side. The positioning jig 14 is provided with a positioning protrusion 14-2a formed on the supporting surface 14-2 that supports the other terminator card 2. Between the leads 1-2 arranged in the insulator 1-1 and facing each other. The connection pattern 2-1 side of the terminator card 2 is inserted into the groove, and the groove 1-1a of the insulator 1-1 is engaged with the locking portion 14-1a of the side wall 14-1 and the positioning protrusion 14 is inserted. −2a
By inserting the reference hole 2a of the terminator card 2 into and holding it by the positioning jig 14, and inserting it into the molten solder 3 in the solder bath 15 until the connection pattern 2-1 of the terminator card 2 is immersed, The leads 1-2 of the connector 1 and the connection patterns 2-1 of the terminator card 2 are soldered.
本発明では、その絶縁体１−１の溝１−1aを位置決め治
具14の側壁14−１に設けた係止部14−1aに係合させ、タ
ーミネータカード２の基準孔2aを支持面14−２の突起14
−2aに嵌入すると、コネクタ１のリード１−２とターミ
ネータカード２の接続パターン２−１の位置が自動的に
合致してその調整作業が不要となるとともに、その位置
決め治具14により保持した状態で所定温度に上昇した溶
融半田３に浸漬しているために、ターミネータカードと
コネクタの半田付け作業が簡単となる。また、接合する
それぞれのリード１−２と接続パターン２−１に半田３
の付着量が必要最低限となって、隣接する接続パターン
２−１間の半田ブリッジ発生を防止することが可能とな
る。In the present invention, the groove 1-1a of the insulator 1-1 is engaged with the locking portion 14-1a provided on the side wall 14-1 of the positioning jig 14 so that the reference hole 2a of the terminator card 2 is supported by the support surface 14. -2 protrusion 14
When it is fitted into −2a, the position of the lead 1-2 of the connector 1 and the position of the connection pattern 2-1 of the terminator card 2 are automatically matched to eliminate the need for the adjustment work, and are held by the positioning jig 14. Since it is immersed in the molten solder 3 that has risen to a predetermined temperature, the soldering work of the terminator card and the connector is simplified. Also, solder 3 is attached to each lead 1-2 and connection pattern 2-1 to be joined.
It becomes possible to prevent the occurrence of solder bridges between the adjacent connection patterns 2-1 by minimizing the amount of adhered solder.
以下図面に示した実施例に基づいて本発明を詳細に説明
する。The present invention will be described in detail below based on the embodiments shown in the drawings.
第１図の（ａ）および（ｂ）図は本実施例によるターミ
ネータカードとコネクタの半田付け方法を示し、図中に
おいて、第３図と同一部材には同一記号が付してある
が、その他の14はターミネータカードとコネクタの位置
決めして保持する治具,15はディップ用の半田槽であ
る。FIGS. 1 (a) and 1 (b) show a method of soldering a terminator card and a connector according to this embodiment. In the figure, the same members as those in FIG. Reference numeral 14 is a jig for positioning and holding the terminator card and the connector, and 15 is a dip solder bath.
位置決め治具14は、（ａ）図に示すようにコネクタ１の
リード１−２を内側にしてその絶縁体１−１が挿入でき
るように側壁14−１を設け、その絶縁体１−１の溝１−
1aと係合する突出した係止部14−1aを対向する側壁14−
１の内面に形成して、他方側にコネクタ１のリード１−
２間に挿入したターミネータカード２を支える支持面14
−２を設けて、その支持面14−２をターミネータカード
２の基準孔2aに挿入して位置決めする突起14−2aを配し
た耐熱材よりなる治具である。The positioning jig 14 is provided with a side wall 14-1 so that the lead 1-2 of the connector 1 can be placed inside and the insulator 1-1 can be inserted, as shown in FIG. Groove 1-
A side wall 14-
1 formed on the inner surface of the connector 1 and the lead 1 of the connector 1 on the other side
Support surface 14 that supports the terminator card 2 inserted between the two
-2 is provided, and the support surface 14-2 is inserted into the reference hole 2a of the terminator card 2 and the projection 14-2a for positioning is arranged.
半田槽15は、低部に半田３を溶融する図示していない加
熱手段を配した汎用の半田ディップ槽である。The solder bath 15 is a general-purpose solder dip bath provided with a heating means (not shown) for melting the solder 3 in the lower portion.
上記治具と装置を使用したターミネータカードとコネク
タの半田付け方法は、（ａ）図の２点鎖線で示すように
コネクタ１の絶縁体１−１に配列された対向するリード
１−２間に、ターミネータカード２の接続パターン２−
１側側縁を挿入した状態で、上記位置決め治具14に形成
した側壁14−１の係止部14−1aに絶縁体１−１の溝１−
1aを係合させる同時に、ターミネータカード２に穿設し
た基準孔2aを支持面14−２に配した突起14−2aに嵌入し
て、位置決め治具14によりコネクタ１とターミネータカ
ード２を保持する。The soldering method of the terminator card and the connector using the above jig and device is performed between the opposing leads 1-2 arranged in the insulator 1-1 of the connector 1 as shown by the chain double-dashed line in FIG. , The connection pattern 2-of the terminator card 2
With the side edge of the first side inserted, the groove 1- of the insulator 1-1 is formed in the locking portion 14-1a of the side wall 14-1 formed on the positioning jig 14.
At the same time when the 1a is engaged, the reference hole 2a formed in the terminator card 2 is fitted into the projection 14-2a arranged on the support surface 14-2, and the connector 1 and the terminator card 2 are held by the positioning jig 14.
そして、位置決め治具14で保持したターミネータカード
２の接続パターン２−１が半田槽15の溶融した半田３に
浸漬するまで挿入して、コネクタ１に配列されたそれぞ
れのリード１−２と、ターミネータカード２に形成した
各接続パターン２−１を半田付けしている。Then, the connecting pattern 2-1 of the terminator card 2 held by the positioning jig 14 is inserted until it is immersed in the molten solder 3 in the solder bath 15, and each lead 1-2 arranged in the connector 1 and the terminator. Each connection pattern 2-1 formed on the card 2 is soldered.
その結果、コネクタ１のリード１−２のターミネータカ
ード２の接続パターン２−１の位置調整が不要となると
ともに半田付け作業が簡単となり、また、接合するそれ
ぞれのリード１−２と接続パターン２−１に半田３の付
着量が必要最低限となって半田ブリッジの発生を防止す
ることができる。As a result, it becomes unnecessary to adjust the position of the connection pattern 2-1 of the terminator card 2 of the lead 1-2 of the connector 1, the soldering work is simplified, and the respective leads 1-2 and the connection pattern 2-to be joined are connected. It is possible to prevent the occurrence of a solder bridge by minimizing the amount of the solder 3 attached to the first layer.
以上、図示実施例に基づき説明したが、本発明は上記実
施例の態様のみに限定されるものでなく、例えばターミ
ネータカード２の裏面に形成された接続パターンに対し
て、溶融半田３の流れ込みを容易にするための孔を位置
決め治具14の前記接続パターンと対向する位置に穿設し
て良い。Although the present invention has been described above based on the illustrated embodiment, the present invention is not limited to the embodiment described above, and the molten solder 3 may flow into the connection pattern formed on the back surface of the terminator card 2, for example. A hole for facilitating may be formed at a position facing the connection pattern of the positioning jig 14.
以上の説明から明らかなように本発明によれば極めて簡
単な方法で、コネクタとターミネータカードの半田付け
が簡単になるとともに半田により短絡が減少する等の利
点があり、著しい経済的及び、信頼性向上の効果が期待
できるターミネータカードとコネクタの半田付け方法を
提供することができる。As is apparent from the above description, according to the present invention, there is an advantage that the soldering of the connector and the terminator card is simplified and the short circuit is reduced by the solder by an extremely simple method, and it is extremely economical and reliable. It is possible to provide a method of soldering a terminator card and a connector, which can be expected to be improved.
第１図は本発明の一実施例によるターミネータカードと
コネクタの半田付け方法を示す図、 第２図は従来の半田付け方法を示す斜視図である。 図において、 １はコネクタ、 １−１は絶縁体、１−1aは溝、 １−２はリード、 ２はターミネータカード、 2aは基準孔、 ２−１は接続パターン、 ３は半田、 14は位置決め治具、 14−１は側壁、14−1aは係止部、 14−２は支え面、14−2aは突起、 15は半田槽、 を示す。FIG. 1 is a view showing a method of soldering a terminator card and a connector according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional soldering method. In the figure, 1 is a connector, 1-1 is an insulator, 1-1a is a groove, 1-2 is a lead, 2 is a terminator card, 2a is a reference hole, 2-1 is a connection pattern, 3 is solder, and 14 is positioning. A jig, 14-1 is a side wall, 14-1a is a locking portion, 14-2 is a supporting surface, 14-2a is a protrusion, and 15 is a solder bath.
Claims (1)
に成型した溝（１−1a）と係合する係止部（14−1a）を
内側に設けて対向する側壁（14−１）と、他方のターミ
ネータカード（２）を支える支持面（14−２）に位置決
め用の突起（14−2a）を配した位置決め治具（14）を備
え、 上記絶縁体（１−１）に配列されて対向するリード（１
−２）間に該ターミネータカード（２）の接続パターン
（２−１）側を挿入して、該絶縁体（１−１）の該溝
（１−1a）を上記側壁（14−１）の係止部（14−1a）に
係合するとともに、上記支持面（14−２）の該突起（14
−2a）に該ターミネータカード（２）の基準孔（2a）を
嵌入することにより、上記位置決め治具（14）で該コネ
クタ（１）と該ターミネータカード（２）を保持し、該
該ターミネータカード（２）を溶融半田（３）に浸漬し
て上記コネクタ（１）の該リード（１−２）と上記ター
ミネータカード（２）の該接続パターン（２−１）を接
合してなることを特徴とするターミネータカードとコネ
クタの半田付け方法。1. An insulator (1-1) of a connector (1) on one side
Side walls (14-1) facing each other with a locking portion (14-1a) which engages with the groove (1-1a) molded in the inside, and a supporting surface (14-for supporting the other terminator card (2)). 2) is provided with a positioning jig (14) in which positioning protrusions (14-2a) are arranged, and the leads (1) arranged and opposed to the insulator (1-1) are arranged.
-2) insert the connection pattern (2-1) side of the terminator card (2) between the groove (1-1a) of the insulator (1-1) and the side wall (14-1) of the insulator (1-1). The protrusion (14) of the support surface (14-2) is engaged with the locking portion (14-1a).
-2a) by inserting the reference hole (2a) of the terminator card (2) to hold the connector (1) and the terminator card (2) by the positioning jig (14). (2) is immersed in molten solder (3) to join the lead (1-2) of the connector (1) and the connection pattern (2-1) of the terminator card (2). And how to solder the terminator card and connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22929488A JPH07114141B2 (en) | 1988-09-12 | 1988-09-12 | Terminator card and connector soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22929488A JPH07114141B2 (en) | 1988-09-12 | 1988-09-12 | Terminator card and connector soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0278172A JPH0278172A (en) | 1990-03-19 |
| JPH07114141B2 true JPH07114141B2 (en) | 1995-12-06 |
Family
ID=16889878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22929488A Expired - Lifetime JPH07114141B2 (en) | 1988-09-12 | 1988-09-12 | Terminator card and connector soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07114141B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5550528B2 (en) * | 2010-11-05 | 2014-07-16 | タイコエレクトロニクスジャパン合同会社 | Circuit board assembly, connector, soldering method |
-
1988
- 1988-09-12 JP JP22929488A patent/JPH07114141B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0278172A (en) | 1990-03-19 |
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