JPH07202121A - Semiconductor device - Google Patents

Abstract

PURPOSE:To collectively insert leads into through holes using the positioning substrate which is used when leads are inserted into the through holes of a substrate on the opposing surface different from the side where the lead of an integrated circuit package is located. CONSTITUTION:The positioning substrates 4 and 5, having a positioning holes to temporary fix positioning dummy leads 3c and 3d, are constituted in such a manner that they are freely detachable to the positioning dummy leads 3c and 3d. In order to assemble the semiconductor device, a lead 3a is inserted into the through hole of a through hole substrate 1, then the dummy leads 3c and 3d are inserted into the through holes of the positioning substrates 4 and 5, and they are temporary fixed. Then, the other lead 3b is inserted into a through hole substrate 2, and the positioning substrates 4 and 5 are removed. Lastly, the through hole substrate 1, the lead 3a, the through hole substrate 2 and the lead 3b are soldered to the through hole part respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a plurality of integrated circuit packages between a pair of through hole substrates.

[0002]

2. Description of the Related Art FIGS. 6, 7, and 8 are a front view, a right side view, and a plan view showing a conventional semiconductor device, in which 1 and 2 are a pair of through-hole substrates and 3 is a plurality of integrated circuits. A circuit package (hereinafter referred to as an IC package).

Further, 3a and 3b are leads projecting from the opposite side surfaces of the IC package 3, and these leads 3a and 3b are provided.
b is inserted into the through holes H of the through hole substrates 1 and 2 and soldered. The IC packages 3 are spaced apart from each other through the through-hole substrates 1 and 2.
They are arranged side by side in the vertical direction.

Next, the operation will be described. The leads 3a and 3b of each IC package 3 are electrically connected to, for example, a circuit pattern or the like on the through-hole substrates 1 and 2 through the through-holes H to input and output various signals.

Further, such a semiconductor device is assembled as follows. That is, first, one lead 3a of the IC package 3 is inserted into the through hole H of the one through hole substrate 1, and then the other lead 3b of the IC package 3 is inserted into the other through hole substrate 2. The through hole H is inserted, and the leads 3a and 3b are soldered at the through hole H portion.

[0006]

Since the conventional semiconductor device is constructed as described above, the IC package 3 described above is used.
It is extremely troublesome to insert each through hole H into each of the through holes substrates 1 and 2 with respect to all the leads 3a and 3b at the same time, so that the assembly time becomes long and the productivity is not improved. There was a problem.

The invention of claim 1 has been made to solve the above-mentioned problems, and enables positioning using dummy leads of an IC package, and a through-hole substrate for many leads of the IC package. It is an object of the present invention to obtain a semiconductor device in which through holes can be easily inserted all at once.

According to a second aspect of the present invention, it is possible to obtain a semiconductor device in which positioning can be performed by using a mold protrusion of an IC package, and through holes of a through hole substrate can be collectively inserted into a large number of leads of the IC package. To aim.

According to a third aspect of the present invention, the dummy leads of the IC package and the heat radiation fins interposed between the IC packages are used to enable positioning, and the through holes of the through hole substrate are provided for the leads of the IC package. An object is to obtain a semiconductor device that can be inserted all at once.

It is an object of the present invention to obtain a semiconductor device capable of aligning a land pattern of a surface mount board with a lead of an IC package by using a positioning jig that supports the IC package at a time.

[0011]

A semiconductor device according to a first aspect of the present invention is used when a through hole of a through hole substrate is inserted into a side surface of an integrated circuit package which is opposite to a side where the lead is located and which is opposite to the side surface of the integrated circuit package. A positioning dummy lead is temporarily provided in a batch by the positioning substrate.

According to another aspect of the semiconductor device of the present invention, the integrated circuit package is collectively packaged on a side opposite to the side where the lead is provided by a positioning substrate used when inserting the through hole of the through hole substrate into the lead. A positioning mold protrusion is provided for temporary fixing.

According to a third aspect of the present invention, there is provided a semiconductor device in a horizontal direction used when inserting a through hole of the through hole substrate into the lead on a side surface of the integrated circuit package opposite to the side where the lead is provided. Positioning dummy leads, which are temporarily fixed collectively by inserting the positioning pins, are provided, and heat radiation fins for vertically positioning the integrated circuit packages are interposed between the integrated circuit packages.

According to a fourth aspect of the present invention, a semiconductor device is mounted on a surface mount board between integrated circuit packages in which one lead is inserted into a through hole of a through hole board, and these are mounted in a vertical direction and a horizontal direction. A positioning hole into which a positioning pin of a positioning jig for positioning is removably inserted is provided.

[0015]

In the semiconductor device according to the present invention, one lead of the integrated circuit package is inserted into the through hole of the one through hole substrate, and then the positioning dummy lead is temporarily fixed to the positioning substrate so that the other of the other leads is inserted. It facilitates and speeds insertion of the other through-hole board into the through-hole for the lead.

In the semiconductor device according to the second aspect of the present invention, the positioning mold protrusion is temporarily fixed to the positioning substrate to facilitate and speed up the insertion of the lead into the through hole of the through hole substrate.

In the semiconductor device of the third aspect of the present invention, the positioning pins are inserted into the positioning holes of the positioning dummy leads so that the horizontal positions of the integrated circuit packages are aligned with each other, and the heat radiation fins are installed between the integrated circuit packages. By aligning these vertical positions, it is easy to insert each lead into the through hole of the through hole board at once.
To speed up.

According to another aspect of the semiconductor device of the present invention, after inserting the lead into the through hole portion of the through hole substrate, the integrated circuit package is temporarily fixed with a fixing jig and the other bent lead portion is positioned. By doing
This facilitates the alignment between the lead bend lead and the land pattern of the other surface-mounting substrate, and shortens the manufacturing work time.

[0019]

EXAMPLES Example 1. An embodiment of the invention of claim 1 will be described below with reference to the drawings. In FIG. 1, reference numerals 1 and 2 have the same through holes as those shown in FIG. 8, and a pair of through hole substrates 3 and 3 are arranged to face each other. A plurality of integrated circuit packages (hereinafter referred to as IC packages).

Leads 3a and 3b are provided at both ends of each IC package 3, and these leads are inserted into the through holes and soldered. Further, 3c and 3d are positioning dummy leads provided on the opposite side surfaces of each IC package 3 different from the side where the leads 3a and 3a are located.

Numerals 4 and 5 are positioning substrates having positioning holes for temporarily fixing these positioning dummy leads 3c and 3d, respectively.
It has a detachable structure with respect to 3d.

Next, the operation will be described. The leads 3a and 3b of each IC package 3 are electrically connected to, for example, a circuit package or the like on each of the through hole substrates 1 and 2 through through holes. Inputs and outputs various signals.

Further, such a semiconductor device is assembled as follows. That is, first, the through-hole substrate 1
Lead 3a is inserted into the through hole, and then dummy leads 3c and 3d are inserted into the through holes of the positioning substrates 4 and 5,
Temporarily fix. Next, the other lead 3b is inserted into the through hole of the through hole substrate 2, and the positioning substrates 4 and 5 are removed. Finally, the through hole substrate 1 and the leads 3a,
The through hole substrate 2 and the lead 3b are soldered at the through hole portions.

Example 2. In the first embodiment, each I
The one in which the positioning dummy lead is used to position the C package 3 by the positioning substrate is shown in FIG.
Instead of this, positioning mold protrusions 3e and 3f that are integrally provided in the package body of each IC package 3 may be used, and the same effect as that of the first embodiment is obtained.

Example 3. 3 and 4 are a front view and a plan view showing an embodiment of the invention of claim 3, respectively. This is because the positioning dummy leads 6 and 7 having the positioning holes 6a and 7a are provided on opposite side surfaces of the IC packages 3 opposite to the side where the leads 3a and 3b are located, and the positioning holes 6a and 7a and the positioning dummy leads 6 and 7a are provided. The horizontal position of each IC package 3 is collectively determined by inserting one positioning pin 8 or 9.

In this case, it is assumed that the dimensional control of the positioning dummy leads 6 and 7 and the leads 3a and 3b is performed in advance. In addition, one radiating fin 10 whose size is controlled in advance is provided between each of the IC packages 3 so as to keep these intervals constant.

Therefore, the leads 3 of each IC package 3
Since the a and 3b are positioned in the vertical direction, the insertion of the through holes of the through hole substrates 1 and 2 into the leads 3a and 3b can be facilitated and ensured.

Example 4. FIG. 5 shows an embodiment of the invention of claim 4. This is one lead 3 of each IC package 3.
a is inserted into a through hole of the through hole substrate 1 and soldered, and the other lead 1 whose tip is bent in an L shape
One end is joined to the land pattern on the surface mounting substrate 12 by soldering.

This semiconductor device is assembled as shown in FIG. That is, first, the leads 3a of each IC package 3 are sequentially inserted into the through holes H of the through hole substrate 1, and all the IC packages 3 are supported by the through hole substrate 1 while the above IC packages 3 are being supported. The positioning jig 14 having a plurality of positioning blocks 13 for positioning the vertical and horizontal directions is moved to move each positioning block 13 into each IC package 3, 3
Insert them in between to have them supported.

Next, with respect to the plurality of positioning pins 15 horizontally projected on the positioning jig 14 for positioning each IC package 3 as described above, the positioning holes preliminarily drilled in the surface mounting substrate 12 are provided. 16 are respectively inserted, and the surface mounting board 12 is positioned with respect to the positioning jig 14, that is, with respect to each IC package 3.

Therefore, the land patterns 17 at the set positions with respect to the positioning holes 16 accurately abut on the tips of the leads 11, and the semiconductor devices are assembled by soldering them. Further, after the soldering work, the positioning jig 14 is horizontally moved so that the positioning pin 15 is pulled out from the positioning hole 16, and further the positioning block 13 is pulled out from between the IC packages 3 and 3. The tool 14 can be moved.

In the first, second, and third embodiments, the positioning dummy leads 3c, 3d, 6, 7 and the positioning mold protrusions 3e, 3f are provided one on each side of the IC package 3 facing each other. However, the arrangement and the number thereof can be arbitrarily selected.

[0033]

As described above, according to the first aspect of the present invention, the positioning used when inserting the through hole of the through hole substrate on the side surface of the integrated circuit package opposite to the side where the lead is present Since the positioning dummy leads that are temporarily fixed together by the substrate are provided, it is possible to easily and reliably insert the through holes of the through hole substrate into a large number of leads of the integrated circuit package. is there.

According to the second aspect of the present invention, the integrated circuit package is temporarily fixed to the opposite side surface different from the side where the leads are provided by the positioning board used when inserting the through holes of the through hole boards into the leads. Since it is configured to provide a positioning mold projection, the through holes of the through-hole board can be inserted into multiple leads of the integrated circuit package at the same time by using this molding projection. There is an effect that a hole can be accurately positioned.

According to the third aspect of the present invention, a horizontal positioning pin used when inserting the through hole of the through hole substrate into the lead on the opposite side surface of the integrated circuit package different from the side where the lead is present. By providing positioning dummy leads that are temporarily fixed collectively by inserting
Since the radiation fins for vertically positioning the integrated circuit packages are interposed between the integrated circuit packages, the radiation fins interposed between the dummy leads of the integrated circuit package and the integrated circuit are used. The through holes of the through hole substrate can be inserted into the leads of the integrated circuit package at a time, and the leads and the through holes can be accurately positioned easily.

According to the invention of claim 4, when the land pattern of the surface mount board is soldered to the other lead of the integrated circuit package in which one lead is inserted into the through hole of the through hole board, Since the surface mounting board is provided with a positioning hole which is interposed between the circuit packages and is detachably inserted into a positioning pin on a positioning jig for positioning the circuit package in the vertical and horizontal directions, the IC package is configured. There is an effect that it is possible to easily and surely align the land pattern of the surface mounting board with the leads of the IC package via the positioning jig that collectively supports the IC package.

[Brief description of drawings]

FIG. 1 is a plan view showing a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a plan view showing a semiconductor device according to an embodiment of the invention of claim 2;

FIG. 3 is a front view showing a semiconductor device according to an embodiment of the invention of claim 3;

FIG. 4 is a plan view of the semiconductor device shown in FIG.

FIG. 5 is a front view showing a semiconductor device according to an embodiment of the invention of claim 4;

6 is an assembly explanatory diagram showing a procedure for assembling the semiconductor device shown in FIG. 5;

FIG. 7 is a front view showing a conventional semiconductor device.

FIG. 8 is a side view of the semiconductor device shown in FIG.

9 is a plan view of the semiconductor device shown in FIG. 7. FIG.

[Explanation of symbols]

 1, 2 through-hole substrate 3 IC package (integrated circuit package) 3a, 3b Leads 3c, 3d Positioning dummy lead 3e, 3f Positioning mold protrusion 4,5 Positioning substrate 6,7 Positioning dummy lead 8,9 Positioning pin 10 Radiating Fin 11 Lead 12 Surface Mounted Board 14 Positioning Jig 15 Positioning Pin 16 Positioning Hole 17 Land Pattern

─────────────────────────────────────────────────── ───Continued from the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical indication H05K 1/18 S 7128-4E

Claims (4)

[Claims] 1. A pair of through-hole substrates which are arranged to face each other, and are juxtaposed at a constant interval between the through-hole substrates, and leads at both ends are inserted into the through-holes of the through-hole substrates and soldered. In a semiconductor device having a plurality of integrated circuit packages provided, on the opposite side surface different from the side where the leads of the integrated circuit package are,
A semiconductor device comprising a positioning dummy lead, which is temporarily fixed together by a positioning substrate used when inserting the through hole of the through hole substrate into the lead. 2. A pair of through-hole substrates arranged opposite to each other, and the through-hole substrates are juxtaposed at a constant interval, and the leads at both ends are inserted into the through-holes of the through-hole substrates and soldered. In a semiconductor device having a plurality of integrated circuit packages formed on the opposite side surface different from the side where the leads of the integrated circuit package are,
A semiconductor device, comprising: a positioning mold protrusion that is temporarily temporarily fixed to the lead by a positioning substrate used when inserting the through hole of the through hole substrate. 3. A pair of through-hole substrates which are arranged opposite to each other, and the through-hole substrates are juxtaposed at a constant interval, and the leads at both ends are inserted into the through-holes of the through-hole substrates and soldered. In a semiconductor device having a plurality of integrated circuit packages formed on the opposite side surface different from the side where the leads of the integrated circuit package are,
A positioning dummy lead which is temporarily fixed collectively by inserting a horizontal positioning pin used when inserting the through hole of the through hole substrate into the lead;
A semiconductor device comprising: a heat radiation fin interposed between the integrated circuit packages to vertically position the integrated circuit packages. 4. A through-hole substrate and a surface-mounting substrate which are arranged opposite to each other, and one lead is inserted into a through-hole of the through-hole substrate, with the through-hole substrate and the surface-mounting substrate being juxtaposed at a constant interval. A plurality of integrated circuit packages in which the other lead is soldered and the other lead is soldered to the land pattern of the surface-mounting substrate. And a positioning hole which is inserted between the integrated circuit packages in which the leads of the above are inserted and into which the positioning pins of a positioning jig for positioning these leads in the vertical and horizontal directions are detachably inserted. apparatus.