JP2012081618A - モールド剥離装置 - Google Patents
モールド剥離装置 Download PDFInfo
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- JP2012081618A JP2012081618A JP2010228499A JP2010228499A JP2012081618A JP 2012081618 A JP2012081618 A JP 2012081618A JP 2010228499 A JP2010228499 A JP 2010228499A JP 2010228499 A JP2010228499 A JP 2010228499A JP 2012081618 A JP2012081618 A JP 2012081618A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/006—Handling moulds, e.g. between a mould store and a moulding machine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
- B29C33/442—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles with mechanical ejector or drive means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0003—Discharging moulded articles from the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
- B29C43/222—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/3697—Moulds for making articles of definite length, i.e. discrete articles comprising rollers or belts cooperating with non-rotating mould parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3483—Feeding the material to the mould or the compression means using band or film carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
- B29C2043/3647—Membranes, diaphragms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
- B29C2043/3652—Elastic moulds or mould parts, e.g. cores or inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
【解決手段】転写装置5から離れた箇所に位置しお互いがくっついているモールドMAと被成型品Wとのうちの被成型品Wを保持する被成型品保持体19と、被成型品保持体19で保持された被成型品Wに貼り付いているモールドMAが巻き掛けられ被成型品保持体19に対して移動することで、被成型品WからモールドMAを剥がす剥離ローラ23とを有するモールド剥離装置7である。
【選択図】図1
Description
前記モールドの張力を調整する張力調整部を有するモールド剥離装置である。
7 モールド剥離装置
19 被成型品保持体
23 剥離ローラ
25 モールド保持部
27 張力調整部
39 下側ローラ
41 上側ローラ
53 上側クランプ体
55 下側クランプ体
MA シート状モールド
MB 転写パターン
W 被成型品
Claims (3)
- シート状のモールドに形成されている微細な転写パターンを平板状の被成型品に転写した後、前記被成型品に貼り付いている前記モールドを前記被成型品から剥がすモールド剥離装置において、
前記転写がなされる転写箇所から離れた箇所に位置し、お互いがくっついている前記モールドと前記被成型品とのうちの前記被成型品を保持する被成型品保持体と、
前記被成型品保持体で保持された前記被成型品に貼り付いている前記モールドが巻き掛けられ、前記被成型品保持体に対して移動することで、前記被成型品から前記モールドを剥がす剥離ローラと、
を有することを特徴とするモールド剥離装置。 - 請求項1に記載のモールド剥離装置において、
前記転写がなされる転写箇所と前記被成型品保持体との間で前記モールドを保持するモールド保持部を有することを特徴とするモールド剥離装置。 - 請求項1または請求項2に記載のモールド剥離装置において、
前記モールドの張力を調整する張力調整部を有することを特徴とするモールド剥離装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010228499A JP5593190B2 (ja) | 2010-10-08 | 2010-10-08 | モールド剥離装置 |
PCT/JP2011/072633 WO2012046660A1 (ja) | 2010-10-08 | 2011-09-30 | モールド剥離装置 |
US13/878,144 US9415537B2 (en) | 2010-10-08 | 2011-09-30 | Demolding device |
KR1020137008643A KR101421396B1 (ko) | 2010-10-08 | 2011-09-30 | 몰드 박리 장치 |
DE112011103391.5T DE112011103391B4 (de) | 2010-10-08 | 2011-09-30 | Entformungseinrichtung |
TW100136469A TWI436878B (zh) | 2010-10-08 | 2011-10-07 | Mold stripping device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010228499A JP5593190B2 (ja) | 2010-10-08 | 2010-10-08 | モールド剥離装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012081618A true JP2012081618A (ja) | 2012-04-26 |
JP2012081618A5 JP2012081618A5 (ja) | 2013-10-03 |
JP5593190B2 JP5593190B2 (ja) | 2014-09-17 |
Family
ID=45927656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010228499A Active JP5593190B2 (ja) | 2010-10-08 | 2010-10-08 | モールド剥離装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9415537B2 (ja) |
JP (1) | JP5593190B2 (ja) |
KR (1) | KR101421396B1 (ja) |
DE (1) | DE112011103391B4 (ja) |
TW (1) | TWI436878B (ja) |
WO (1) | WO2012046660A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014040070A (ja) * | 2012-08-23 | 2014-03-06 | Toshiba Mach Co Ltd | 転写装置および被成形体 |
JP2014213552A (ja) * | 2013-04-26 | 2014-11-17 | 株式会社日立産機システム | ナノインプリント方法及びそのための装置 |
WO2015072572A1 (ja) * | 2013-11-18 | 2015-05-21 | Scivax株式会社 | 離型装置及び離型方法 |
JP2017195357A (ja) * | 2016-04-20 | 2017-10-26 | 奇景光電股▲ふん▼有限公司 | インプリント装置およびインプリント方法 |
JP2018500764A (ja) * | 2014-12-22 | 2018-01-11 | オブダカット・アーベー | 搭載及び離型デバイス |
JP6359167B1 (ja) * | 2017-10-25 | 2018-07-18 | 東芝機械株式会社 | 転写装置および転写方法 |
JP2019531921A (ja) * | 2016-09-05 | 2019-11-07 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | マイクロパターンおよび/またはナノパターンをエンボス加工するための装置および方法 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5593092B2 (ja) | 2010-02-26 | 2014-09-17 | 東芝機械株式会社 | 転写システムおよび転写方法 |
JP5603621B2 (ja) | 2010-03-08 | 2014-10-08 | 東芝機械株式会社 | シート状モールド位置検出装置、転写装置および転写方法 |
JP5520642B2 (ja) | 2010-03-15 | 2014-06-11 | 東芝機械株式会社 | 転写装置 |
JP5597420B2 (ja) * | 2010-03-16 | 2014-10-01 | 東芝機械株式会社 | シート状モールド移送位置決め装置 |
JP5940940B2 (ja) | 2012-08-31 | 2016-06-29 | 東芝機械株式会社 | 転写装置および転写方法 |
KR101703811B1 (ko) * | 2015-02-02 | 2017-02-09 | 주식회사 에이앤디코퍼레이션 | 나노 임프린트용 몰드 이형장치 |
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JP6837352B2 (ja) * | 2017-02-28 | 2021-03-03 | 芝浦機械株式会社 | 転写装置および転写方法 |
JP6397553B1 (ja) * | 2017-10-25 | 2018-09-26 | 東芝機械株式会社 | 転写装置 |
CN113751615B (zh) * | 2021-09-28 | 2022-03-22 | 江苏科瑞智能装备有限公司 | 一种数控转塔冲床的自动脱模装置 |
CN114670270B (zh) * | 2022-03-14 | 2023-09-08 | 广西科技师范学院 | 一种物联网电子设备生产用材料切割装置 |
CN115122577A (zh) * | 2022-07-05 | 2022-09-30 | 王宏英 | 一种可自动出料连续生产的注塑机 |
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2010
- 2010-10-08 JP JP2010228499A patent/JP5593190B2/ja active Active
-
2011
- 2011-09-30 KR KR1020137008643A patent/KR101421396B1/ko active IP Right Grant
- 2011-09-30 WO PCT/JP2011/072633 patent/WO2012046660A1/ja active Application Filing
- 2011-09-30 US US13/878,144 patent/US9415537B2/en active Active
- 2011-09-30 DE DE112011103391.5T patent/DE112011103391B4/de active Active
- 2011-10-07 TW TW100136469A patent/TWI436878B/zh active
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JP2004288783A (ja) * | 2003-03-20 | 2004-10-14 | Hitachi Ltd | ナノプリント装置、及び微細構造転写方法 |
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014040070A (ja) * | 2012-08-23 | 2014-03-06 | Toshiba Mach Co Ltd | 転写装置および被成形体 |
JP2014213552A (ja) * | 2013-04-26 | 2014-11-17 | 株式会社日立産機システム | ナノインプリント方法及びそのための装置 |
WO2015072572A1 (ja) * | 2013-11-18 | 2015-05-21 | Scivax株式会社 | 離型装置及び離型方法 |
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TW201221329A (en) | 2012-06-01 |
DE112011103391T5 (de) | 2013-07-11 |
KR101421396B1 (ko) | 2014-07-18 |
US9415537B2 (en) | 2016-08-16 |
WO2012046660A1 (ja) | 2012-04-12 |
KR20130051001A (ko) | 2013-05-16 |
DE112011103391B4 (de) | 2021-07-22 |
TWI436878B (zh) | 2014-05-11 |
US20130323347A1 (en) | 2013-12-05 |
JP5593190B2 (ja) | 2014-09-17 |
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